Shell and photoelectric sensor

Abstract

The utility model provides a shell and a photoelectric sensor, and belongs to the technical field of laser radar heat dissipation, a heat dissipation filling part is tightly embedded into a filling groove to absorb heat at the filling groove, the heat dissipation effect at the filling groove of a support can be improved, a heat dissipation filling layer is connected with the heat dissipation filling part, and the heat dissipation filling layer is attached to a shell, so that the heat dissipation effect is improved. The heat around the heat dissipation device can be quickly led out through the heat dissipation filling layer and the shell, and the heat dissipation efficiency and the heat dissipation uniformity of the heat dissipation device are improved. The heat dissipation filling layer is attached to the support and the shell at the same time, the space between the support and the shell is filled with the heat dissipation filling part, and on one hand, the heat dissipation filling part and the heat dissipation filling layer are used for conducting heat, so that the shell structure almost has no noise during heat dissipation; and on the other hand, the heat dissipation filling part and the heat dissipation filling layer are filled between the bracket and the shell, so that a structure supporting effect can be achieved, the structure is simple, the shell structure can have better mechanical properties, and the service life of the shell is prolonged.

Description

Technical Field

[0001] This application belongs to the technical field of lidar heat dissipation, and particularly relates to a housing and an optoelectronic sensor. Background Art

[0002] As an optoelectronic sensor, the heat dissipation efficiency of a lidar is closely related to its performance. Existing lidars generally use heat dissipation methods such as air cooling and water cooling, which arrange cold channels or set fins in the housing to dissipate heat from the housing. This not only generates high heat dissipation noise but also has poor heat dissipation uniformity, making it difficult to meet actual usage requirements. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technologies.

[0004] To this end, a first aspect of the utility model provides a housing.

[0005] A second aspect of the utility model provides an optoelectronic sensor.

[0006] In view of this, according to the first aspect of the embodiments of the present application, a housing is proposed, including:

[0007] A bracket;

[0008] A filling groove, which is arranged on the first side surface of the bracket;

[0009] A heat dissipation filling part, which is embedded in the filling groove;

[0010] A heat dissipation filling layer, which is connected to the heat dissipation filling part and is attached to the first side surface of the bracket;

[0011] A housing body, which is arranged on the side of the heat dissipation filling layer away from the bracket, is connected to the bracket, and wraps and adheres to the heat dissipation filling layer.

[0012] In a feasible implementation manner, a housing further includes:

[0013] A heat dissipation boss, which is arranged on the second side surface of the bracket, and the size of the heat dissipation boss is adapted to the size of the heat dissipation device.

[0014] In a feasible implementation manner, the heat dissipation boss and the filling groove are formed by a pressing process on the bracket, and the heat dissipation boss and the filling groove are in one-to-one correspondence.

[0015] In a feasible implementation manner, the filling groove at least includes a first groove and a second groove, and the depths of the first groove and the second groove are different.

[0016] In a feasible implementation manner, the bracket includes:

[0017] A first support plate and a first frame, the first frame is wound around the outside of the first support plate, and the first frame is connected to the first support plate; a filling groove is provided on the first support plate, and the first support plate is attached to the first side surface of the heat dissipation filling layer.

[0018] In a feasible implementation manner, the housing includes:

[0019] A first outer plate and a second frame, the second frame is wound around the outside of the first outer plate, and the second frame is connected to the first outer plate; the first outer plate is attached to the second side surface of the heat dissipation filling layer; wherein, after the housing is connected to the bracket, the second frame is attached to the first frame.

[0020] In a feasible implementation manner, the heat dissipation filling part is made of a mixture of aluminum foam powder and a phase change material; the heat dissipation filling layer is made of a mixture of aluminum foam powder and a phase change material; wherein, the heat dissipation filling part and the heat dissipation filling layer are an integrally formed structure.

[0021] In a feasible implementation manner, the heat dissipation filling part is made of a mixture of aluminum foam powder, paraffin wax and expanded graphite; the heat dissipation filling layer is made of a mixture of aluminum foam powder, paraffin wax and expanded graphite.

[0022] In a feasible implementation manner, the ratio of the total mass of paraffin wax and expanded graphite to the mass of aluminum foam powder is 5:95; the ratio of the mass of paraffin wax to the mass of expanded graphite is 93:7.

[0023] According to the second aspect of the embodiments of the present application, an optoelectronic sensor is provided, including: a housing as described in any of the above technical solutions.

[0024] A housing of the present application, compared with the prior art, has the beneficial effects that:

[0025] A shell provided in an embodiment of the present application includes a bracket, a filling groove, a heat dissipation filling part, a heat dissipation filling layer and a shell. The filling groove is arranged at a position on the bracket close to the heat dissipation device. By making the heat dissipation filling part tightly embedded in the filling groove and absorbing the heat at the filling groove, the heat dissipation effect at the bracket filling groove can be improved. The heat dissipation filling layer is connected to the heat dissipation filling part, and the heat dissipation filling layer is fitted with the shell, so that the heat around the heat dissipation device can be quickly discharged through the heat dissipation filling layer and the shell, thereby improving the heat dissipation efficiency and heat dissipation uniformity of the heat dissipation filling part, and then improving the heat dissipation efficiency and heat dissipation uniformity of the heat dissipation device; after the shell is connected to the bracket, the heat dissipation filling layer is fitted with the bracket and the shell at the same time, and the heat dissipation filling part is filled between the bracket and the shell. On the one hand, by utilizing the heat conduction of the heat dissipation filling part and the heat dissipation filling layer, the shell structure itself can be almost noiseless when dissipating heat; on the other hand, the heat dissipation filling part and the heat dissipation filling layer are filled between the bracket and the shell to play a structural support role. Compared with the traditional heat dissipation structure, it is not only simple in structure and lighter in weight, but also can make the shell structure have better mechanical properties, thereby extending the service life of the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0027] Figure 1 A schematic structural diagram of a housing according to an embodiment of the present application;

[0028] Figure 2 A schematic structural diagram of a first angle of a bracket of a housing according to an embodiment of the present application;

[0029] Figure 3 A schematic structural diagram of a bracket of a housing at a second angle according to an embodiment of the present application;

[0030] in, Figures 1 to 3 The corresponding relationship between the reference numerals and component names in the figure is:

[0031] 10. bracket; 11. filling groove; 12. heat dissipation filling part; 13. heat dissipation filling layer; 14. shell; 15. heat dissipation boss;

[0032] 101, first support plate; 102, first frame; 111, first groove; 112, second groove; 141, first outer plate; 142, second frame. DETAILED DESCRIPTION

[0033] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. These terms are only used for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present application.

[0034] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0035] In the present application, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0036] The preferred embodiments of the present application will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present application and are not used to limit the present application.

[0037] As Figures 1 to 3 shown, according to the first aspect of the embodiments of the present application, a housing is proposed, including: a bracket 10, a filling groove 11, a heat dissipation filling part 12, a heat dissipation filling layer 13, and a housing 14; the filling groove 11 is arranged on the first side surface of the bracket 10; the heat dissipation filling part 12 is embedded in the filling groove 11; the heat dissipation filling layer 13 is connected to the heat dissipation filling part 12, and the heat dissipation filling layer 13 is attached to one side surface of the bracket 10; the housing 14 is arranged on the side of the heat dissipation filling layer 13 away from the bracket 10, the housing 14 is connected to the bracket 10, and the housing 14 wraps the heat dissipation filling layer 13 and is attached to the heat dissipation filling layer 13.

[0038] A housing provided in an embodiment of the present application includes a bracket 10, a filling groove 11, a heat dissipation filling part 12, a heat dissipation filling layer 13 and a shell 14. The filling groove 11 is arranged at a position on the bracket 10 close to the heat dissipation device. By making the heat dissipation filling part 12 tightly embedded in the filling groove 11, the heat of the electronic components in contact with the filling groove 11 is absorbed, and the heat dissipation effect of the electronic components at the filling groove 11 of the bracket 10 can be improved. The heat dissipation filling layer 13 is connected to the heat dissipation filling part 12, and the heat dissipation filling layer 13 is attached to the shell 14, so that the heat around the heat dissipation device can be quickly discharged through the heat dissipation filling layer 13 and the shell 14, thereby improving the heat dissipation efficiency of the heat dissipation filling part 12 and The uniformity of heat dissipation can improve the heat dissipation efficiency of the sensor; after the shell 14 is connected to the bracket 10, the heat dissipation filling layer 13 is simultaneously attached to the bracket 10 and the shell 14, and the heat dissipation filling part 12 is filled between the bracket 10 and the shell 14. On the one hand, the heat dissipation filling part 12 and the heat dissipation filling layer 13 are used for heat conduction, so that the shell structure itself dissipates heat almost without noise; on the other hand, the heat dissipation filling part 12 and the heat dissipation filling layer 13 are filled between the bracket 10 and the shell 14 to play a structural support role. Compared with the traditional heat dissipation structure, it is not only simple in structure and lighter in weight, but also can make the shell structure have better mechanical properties, thereby extending the service life of the shell 14.

[0039] Furthermore, the heat dissipation filling part 12 and the heat dissipation filling layer 13 are an integrated structure, and the heat dissipation filling part 12 and the heat dissipation filling layer 13 are made by a foaming process. When making the heat dissipation filling part 12 and the heat dissipation filling layer 13, the bracket 10 is placed on the bottom surface of the mold, and a proper amount of foaming material is filled into the filling groove 11, and the shell 14 is covered. The shell 14 and the bracket 10 can be combined into one by metallurgy or glue bonding, etc., and the mold is put into a foaming furnace for foaming, and the foaming time and temperature are controlled to ensure that the foaming rate of the foaming material reaches at least 80%, and they are interconnected, so that after the foaming material is foamed, a heat dissipation filling layer 13 is formed between the bracket 10 and the shell 14, and a heat dissipation filling part 12 is formed in the filling groove 11. One-time molding avoids multiple inlay processes, and is suitable for filling grooves 11 of any shape, so as to effectively fill the heat dissipation material according to the heat dissipation requirements of the heat power consumption device, and it is highly practical.

[0040] like Figure 1 and Figure 2 As shown, in a feasible implementation manner, a housing further includes: a heat dissipation boss 15; the heat dissipation boss 15 is arranged on the second side surface of the bracket 10, and the size of the heat dissipation boss 15 is adapted to the size of the heat dissipation device.

[0041] In this technical solution, by providing heat dissipation bosses 15 on the second side of the bracket 10 and making the size of the heat dissipation bosses 15 match the size of the heat dissipation device, on the one hand, the heat dissipation bosses 15 protrude towards the heat dissipation device, capable of conducting heat to the heat dissipation device, helping the heat dissipation device dissipate heat in a timely manner. At the same time, the design of the heat dissipation bosses 15 increases the heat dissipation area of the bracket 10, improves the uniformity of heat dissipation, and enhances the heat dissipation efficiency of the bracket 10. On the other hand, the heat dissipation bosses 15 can play a role in limiting the heat dissipation device, helping to maintain the stability of the heat dissipation device after installation and improving the reliability of the overall structure of the lidar.

[0042] Furthermore, the shape of the heat dissipation bosses 15 is designed to be conformal according to the height of the heat dissipation device to ensure the adaptability of the heat dissipation bosses 15 to the heat dissipation device.

[0043] As Figures 1 to 3 shown, in a feasible implementation, the heat dissipation bosses 15 and the filling grooves 11 are formed by a pressing process on the bracket 10, and the heat dissipation bosses 15 and the filling grooves 11 correspond one by one.

[0044] In this technical solution, when the bracket 10 is subjected to a pressing process to form the filling grooves 11 on the first side of the bracket 10, the corresponding heat dissipation bosses 15 are simultaneously formed on the second side of the bracket 10, that is, the inside of the heat dissipation bosses 15 is hollow. By embedding the heat dissipation filling part 12 into the filling grooves 11, the inside of the heat dissipation bosses 15 is filled with the heat dissipation filling part 12, so as to conduct heat through the heat dissipation filling part 12, accelerate the heat dissipation of the heat dissipation bosses 15, improve the heat dissipation efficiency of the heat dissipation bosses 15 themselves, and further improve the heat dissipation efficiency of the heat dissipation bosses 15 for the heat dissipation device, ensuring the timeliness of heat dissipation of the heat dissipation device.

[0045] As Figure 3 shown, in a feasible implementation, the filling grooves 11 at least include a first groove 111 and a second groove 112, and the depths of the first groove 111 and the second groove 112 are different.

[0046] In this technical solution, the filling grooves 11 include several grooves, and at least two of the grooves have different shapes and depths. Through the integral molding of the filling grooves 11 and the heat dissipation filling part 12, it is possible to meet the situation where the depths of the grooves are inconsistent in actual use, that is, to meet the situation where the heights of the heat dissipation bosses 15 are inconsistent, making the overall structure more adaptable and practical. At the same time, the volume of the heat dissipation filling part 12 changes with the depth and shape of the grooves, which can improve the uniformity of heat dissipation of the bracket 10 for each heat dissipation device.

[0047] It can be understood that through the one-piece molding of the heat dissipation filling part 12 and the heat dissipation filling layer 13, it is also possible to meet the situation where there are curved surface structures on the heat dissipation boss 15 and the corresponding groove, so as to facilitate the heat dissipation of heat dissipation devices of different shapes without additional machining, thereby reducing the processing difficulty of the outer shell structure and making the outer shell structure more adaptable, practical and economical.

[0048] In some examples, the bracket 10 and the shell 14 are made of metal material, and the heat dissipation filling layer 13 can be filled at places with higher temperature gradients according to actual heat dissipation requirements. Metal solid structures can still be used in places where heat dissipation is not required or where screw holes need to be avoided to meet the requirements of different characteristics of the bracket 10 and the shell 14.

[0049] like Figure 1 As shown, in a feasible embodiment, the bracket 10 includes: a first support plate 101 and a first frame 102, the first frame 102 is arranged around the outside of the first support plate 101, and the first frame 102 is connected to the first support plate 101; the filling groove 11 is arranged on the first support plate 101, and the first support plate 101 is in contact with the first side surface of the heat dissipation filling layer 13.

[0050] In this technical solution, a first frame 102 is arranged on the first support plate 101 along the circumference of the first support plate 101, and the first frame 102 is combined with the shell 14 to improve the connection strength between the bracket 10 and the shell 14; a heat dissipation filling layer 13 is formed between the first support plate 101 and the shell 14, and the heat dissipation efficiency of the first support plate 101 is improved by the heat dissipation filling layer 13, thereby improving the heat dissipation effect of the shell structure on the heat dissipation device.

[0051] like Figure 1 As shown, in a feasible embodiment, the shell 14 includes: a first outer plate 141 and a second frame 142, the second frame 142 is wrapped around the outer side of the first outer plate 141, and the second frame 142 is connected to the first outer plate 141; the first outer plate 141 is in contact with the second side surface of the heat dissipation filling layer 13; wherein, after the shell 14 is connected to the bracket 10, the second frame 142 is in contact with the first frame 102.

[0052] In this technical solution, a second frame 142 is arranged on the first outer plate 141 along the circumference of the first outer plate 141, and the second frame 142 is combined with the first frame 102 to improve the connection strength between the bracket 10 and the shell 14; the heat dissipation filling layer 13 is formed between the first support plate 101 and the first outer plate 141, so that the heat dissipation filling layer 13 is dissipated through the first outer plate 141, so that the heat absorbed by the heat dissipation filling layer 13 can be discharged through the first outer plate 141, thereby improving the heat dissipation effect and uniformity of the heat dissipation device.

[0053] In a feasible implementation, the heat dissipation filling part 12 is made of a mixture of aluminum foam powder and a phase change material; the heat dissipation filling layer 13 is made of a mixture of aluminum foam powder and a phase change material; wherein, the heat dissipation filling part 12 and the heat dissipation filling layer 13 are of an integrally formed structure.

[0054] In this technical solution, a phase change material is added to the aluminum foam powder, and through the foaming of the aluminum foam powder, the integrally formed heat dissipation filling part 12 and heat dissipation filling layer 13 are formed. At the same time, the addition of the phase change material improves the latent heat storage capacity of the heat dissipation filling part 12 and the heat dissipation filling layer 13, enabling the heat dissipation filling part 12 and the heat dissipation filling layer 13 to absorb or release a large amount of heat within a small volume, achieving an efficient heat dissipation effect; moreover, the phase change material has a large heat capacity, can buffer temperature changes, ensure the uniformity of heat dissipation, contribute to maintaining the temperature stability of the heat dissipation device, and does not require additional energy support, being more reliable during use and not easily suffering from heat dissipation failures or heat dissipation inefficiencies, which helps to ensure the stability of lidar operation.

[0055] In a feasible implementation, the heat dissipation filling part 12 is made of a mixture of aluminum foam powder, paraffin wax, and expanded graphite; the heat dissipation filling layer 13 is made of a mixture of aluminum foam powder, paraffin wax, and expanded graphite.

[0056] In this technical solution, the melting point of paraffin wax is close to the optimal operating temperature of the electronic components, making the surface temperature of the heat dissipation device more uniform, improving the uniformity of heat dissipation of the heat dissipation device, and achieving the effect of rapidly cooling the heat dissipation device.

[0057] In a feasible implementation, the ratio of the total mass of paraffin wax and expanded graphite to the mass of aluminum foam powder is 5:95; the ratio of the mass of paraffin wax to the mass of expanded graphite is 93:7.

[0058] In this technical solution, the ratio of the total mass of paraffin wax and expanded graphite to the mass of aluminum foam powder being 5:95 enables the heat dissipation filling part 12 and the heat dissipation filling layer 13 to simultaneously have sufficient heat dissipation performance and mechanical properties, that is, the heat dissipation filling part 12 and the heat dissipation filling layer 13 are more stable, durable, and have a certain heat dissipation and energy storage capacity; the ratio of the mass of paraffin wax to the mass of expanded graphite being 93:7, with paraffin wax as the main phase change material having sufficient latent heat to store a large amount of heat, and the good thermal conductivity of expanded graphite enabling the heat stored in the paraffin wax to be effectively transferred out quickly, achieving the efficient heat dissipation of the heat dissipation filling part 12 and the heat dissipation filling layer 13.

[0059] According to the second aspect of the present application, an optoelectronic sensor is proposed, including: a housing as described in any one of the above technical solutions.

[0060] The optoelectronic sensor provided by the embodiment of the present application includes a housing as described in any of the above technical solutions. Therefore, the optoelectronic sensor has all the beneficial effects of a housing as described in the above technical solutions, which will not be elaborated here.

[0061] Specifically, the optoelectronic sensor may include a lidar.

[0062] It is easy for those skilled in the art to understand that, on the premise of no conflict, the above advantageous ways can be freely combined and superimposed.

[0063] The above are only the preferred embodiments of the present application, and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application. The above is only the preferred implementation manner of the present application. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present application, several improvements and modifications can also be made, and these improvements and modifications should also be regarded as the protection scope of the present application.

Claims

1. A housing, characterized in that: include: Bracket; a filling slot, the filling slot being disposed on a first side surface of the bracket; a heat dissipation filling portion, the heat dissipation filling portion being embedded in the filling groove; A heat dissipation filling layer, the heat dissipation filling layer is connected to the heat dissipation filling portion, and the heat dissipation filling layer is in contact with the first side surface of the bracket; The shell is arranged on a side of the heat dissipation filling layer away from the bracket, the shell is connected to the bracket, and the shell wraps the heat dissipation filling layer and fits with the heat dissipation filling layer.

2. A housing according to claim 1, characterized in that: Also includes: A heat dissipation boss is arranged on the second side surface of the bracket, and the size of the heat dissipation boss is matched with the size of the heat dissipation device.

3. A housing according to claim 2, characterized in that: The heat dissipation bosses and the filling grooves are formed by performing a press molding process on the bracket, and the heat dissipation bosses correspond to the filling grooves one by one.

4. A housing according to claim 3, characterized in that: The filling groove includes at least a first groove and a second groove, and the first groove and the second groove have different depths.

5. A housing according to claim 1, characterized in that: The support comprises: A first support plate and a first frame, wherein the first frame is arranged around the outer side of the first support plate, and the first frame is connected to the first support plate; the filling groove is arranged on the first support plate, and the first support plate is fitted with the first side surface of the heat dissipation filling layer.

6. A housing according to claim 5, characterized in that: The housing comprises: A first outer plate and a second frame, wherein the second frame is arranged around the outer side of the first outer plate, and the second frame is connected to the first outer plate; the first outer plate is in contact with the second side surface of the heat dissipation filling layer; After the shell is connected to the bracket, the second frame fits the first frame.

7. A photoelectric sensor, characterized in that: It comprises a housing as claimed in any one of claims 1 to 6.

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