Liquid cooling assembly and electronic equipment
By setting the first heat dissipation column and connecting rib strip on the heat dissipation plate of the liquid-cooled assembly, the problem that the existing liquid-cooled assembly cannot meet the efficient heat dissipation of high-power devices is solved, and more efficient heat dissipation effect and lower production costs are achieved.
Patent Information
- Application Number
- CN202420774734.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-04-11
AI Technical Summary
The existing liquid-cooled components have simple structures and cannot meet the efficient heat dissipation needs of high-power devices such as IGBT modules, resulting in increased production costs and reduced price competitiveness.
A liquid-cooled assembly is designed, by providing a first heat dissipation column and a connecting rib strip on the heat dissipation plate, the contact area between the coolant and the heat dissipation plate is increased, and the flow channel groove is separated by a heat exchanger to improve the heat dissipation effect.
It improves the heat dissipation efficiency of liquid-cooled components, can meet the efficient heat dissipation needs of IGBT modules, reduces production costs, and improves price competitiveness.
Smart Images
Figure CN222941079U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation, and particularly to a liquid cooling component and an electronic device. Background Art
[0002] Currently, for some high-power devices used in electric vehicle controllers, such as IGBT (Insulated Gate Bipolar Transistor) modules, IGBT modules with a self-contained Pin-Fin structure are adopted. The Pin-Fin structure is a columnar structure for heat dissipation. When the Pin-Fin structure is arranged in the heat dissipation flow channel of the liquid cooling component, the thermal conduction thermal resistance between the coolant and the IGBT module can be reduced, and the heat dissipation capacity of the IGBT module can be improved.
[0003] The unit price of the IGBT module with a self-contained Pin-Fin structure is relatively high, resulting in a significant increase in the production cost of the electric vehicle controller and reducing the price competitiveness. Moreover, the heat dissipation flow channel structure of the traditional liquid cooling component is simple, and the heat dissipation effect is poor. When the IGBT module does not have a Pin-Fin structure, the heat dissipation requirements of the IGBT module cannot be met. Summary of the Utility Model
[0004] In view of the problems existing in the background art, the purpose of the present application is to provide a liquid cooling component and an electronic device, which overcome or at least partially solve the above problems.
[0005] According to the first aspect of the present application, a liquid cooling component is provided, including: a base and a heat dissipation plate. The base is provided with a flow channel groove, a liquid inlet and a liquid outlet. The flow channel groove is communicated with the liquid inlet and the liquid outlet, and the flow channel groove is used for the coolant to flow through. The heat dissipation plate includes a bottom plate and a plurality of heat exchange members. The bottom plate covers the flow channel groove, and the bottom plate closes the notch of the flow channel groove. The heat exchange members are arranged on the surface of the bottom plate facing the flow channel groove. The heat exchange members divide the flow channel groove into a plurality of heat dissipation flow channels for the coolant to flow through. The heat exchange members include at least two first heat dissipation columns and connecting rib strips connected between adjacent first heat dissipation columns. The at least two first heat dissipation columns are arranged in sequence along the extending direction of the heat dissipation flow channel.
[0006] In one or more of the above optional embodiments, the cross-section of the first heat dissipation column is elliptical.
[0007] In one or more of the above optional embodiments, along the width direction of the flow channel groove, a plurality of the heat dissipation flow channels are arranged in sequence.
[0008] In one or more of the above optional embodiments, the first heat dissipation columns are arranged in an array.
[0009] In one or more of the above optional embodiments, the heat dissipation flow channel includes an acceleration area and a slow flow area, and the distribution density of the first heat dissipation columns in the slow flow area is less than the distribution density of the first heat dissipation columns in the acceleration area.
[0010] In one or more of the above optional embodiments, the liquid inlet and the liquid outlet are arranged side by side. One end of the flow channel groove communicates with the liquid inlet, and after the other end of the flow channel groove extends along a first direction and then bends and extends along a second direction, it communicates with the liquid outlet, where the first direction is a direction opposite to the second direction.
[0011] In one or more of the above optional embodiments, the slow flow area includes a first slow flow area and a second slow flow area, and along the first direction, the first slow flow area, the acceleration area, and the second slow flow area are arranged in sequence.
[0012] In one or more of the above optional embodiments, along the extending direction of the flow channel groove from the liquid inlet to the liquid outlet, a plurality of the heat exchange elements are arranged at intervals in sequence. The bottom of the flow channel groove is provided with second heat dissipation columns, and along the extending direction of the flow channel groove from the liquid inlet to the liquid outlet, the second heat dissipation columns are arranged between adjacent heat exchange elements.
[0013] In one or more of the above optional embodiments, the central axis of the connecting rib coincides with the connection line between the midpoints of two adjacent first heat dissipation columns.
[0014] According to a second aspect of the present application, there is provided an electronic device including the liquid cooling component as described above.
[0015] The beneficial effects of the embodiments of the present application are as follows: The liquid cooling component provided by the embodiments of the present application increases the contact area between the heat dissipation plate and the coolant flowing through the flow channel groove by setting the first heat dissipation columns and the connecting ribs, improves the heat dissipation effect, and compared with the method of only setting a plurality of first heat dissipation columns, the connecting ribs can further increase the outer surface area of the heat exchange element in the flow channel groove, and further improve the heat dissipation effect to meet the heat dissipation requirements of the IGBT module. Description of the Drawings
[0016] In order to more clearly illustrate the technical solutions in the specific embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts do not necessarily draw according to the actual ratio.
[0017] Figure 1 Schematic diagram of an IGBT module with a built-in pin-fin structure;
[0018] Figure 2 Exploded view of a liquid cooling component provided by an embodiment of the present application;
[0019] Figure 3 Schematic diagram of a heat dissipation plate of a liquid cooling component provided by an embodiment of the present application;
[0020] Figure 4 Schematic diagram of a cross-section of a liquid cooling component provided by an embodiment of the present application;
[0021] Figure 5 For Figure 4 Partial enlarged view of;
[0022] Figure 6 Schematic diagram of a cross-section of a heat exchange component of a liquid cooling component provided by an embodiment of the present application. Detailed implementation manners
[0023] For ease of understanding the present application, the following provides a more detailed description of the present application in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween. The terms "vertical", "horizontal", "left", "right", "inner", "outer" and similar expressions used in this specification are only for the purpose of illustration.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not used to limit the present application. The term "and / or" used in this specification includes any and all combinations of one or more of the related listed items.
[0025] In the description of this specification, unless otherwise clearly specified and limited, the terms "connected", "connected to", "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0026] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0027] The liquid cooling component of the current electric vehicle controller includes a housing, and the housing is provided with a flow channel groove. The liquid cooling component is used in cooperation with an IGBT module M with a pin-fin structure. As Figure 1 shown, the pin-fin structure P is a plurality of columnar bodies arranged in an array. During installation, the surface of the IGBT module M with the pin-fin structure P is covered on the notch of the flow channel groove, and the surface of the IGBT module M with the pin-fin structure P closes the notch of the flow channel groove. The pin-fin structure P in the flow channel groove increases the contact surface area between the IGBT module M and the coolant flowing through the flow channel groove, so as to improve the heat conduction and heat dissipation efficiency. However, compared with a general IGBT module (without a pin-fin structure), the IGBT module M with a pin-fin structure P is expensive, which greatly increases the manufacturing cost of the electric vehicle controller applying such an IGBT module M and reduces the price competitiveness in the market. Therefore, how to provide a liquid cooling component with high heat dissipation efficiency and capable of meeting the heat dissipation requirements of a general IGBT module is an urgent problem to be solved by those skilled in the art.
[0028] In view of this, please refer to Figure 2 , an embodiment of the present application provides a liquid cooling component 1000, including a base 1 and a heat dissipation plate 2. The base 1 is provided with a flow channel groove 1a, a liquid inlet 1b and a liquid outlet 1c. The flow channel groove 1a is communicated with the liquid inlet 1b and the liquid outlet 1c. The flow channel groove 1a is used for the coolant to flow through. The heat dissipation plate 2 closes the notch of the flow channel groove 1a. One end of the heat dissipation plate 2 facing the flow channel groove 1a is used for heat exchange with the coolant flowing through the flow channel groove 1a, and one end of the heat dissipation plate 2 facing away from the flow channel groove 1a is used for connecting with a heating device to be cooled, so as to dissipate heat from the heating device in a contact heat dissipation manner.
[0029] Please refer to Figures 3 - 5 , in some embodiments, the heat dissipation plate 2 includes a bottom plate 21 and a plurality of heat exchange members 22. The bottom plate 21 covers the notch of the flow channel groove 1a, and the bottom plate 21 closes the notch of the flow channel groove 1a. The heat exchange members 22 are arranged on the surface of the bottom plate 21 facing the flow channel groove 1a, and the heat exchange members 22 divide the flow channel groove 1a into a plurality of heat dissipation channels 1d for the coolant to flow through.
[0030] In some embodiments, the heat exchange member 22 includes at least two first heat dissipation columns 221 and connecting ribs 222 connected between adjacent first heat dissipation columns 221. The at least two first heat dissipation columns 221 are arranged in sequence along the extension direction of the heat dissipation flow channel 1d, and the connecting ribs 222 extend along the extension direction of the heat dissipation flow channel 1d.
[0031] The liquid cooling assembly 1000 provided by the embodiments of the present application, by arranging the first heat dissipation columns 221 and the connecting ribs 222, increases the contact area between the heat dissipation plate 2 and the coolant flowing through the flow channel groove 1a, improves the heat dissipation effect, and compared with the method of only arranging a plurality of first heat dissipation columns 221 (similar to the pin-fin structure of IGBT), the connecting ribs 222 can further increase the outer surface area of the heat exchange member 22 in the flow channel groove 1a, thereby further improving the heat dissipation effect to meet the heat dissipation requirements of the IGBT module.
[0032] It can be understood that the surface area of the connecting ribs 222 is related to the shape and size of the connecting ribs 222, the surface area of the first heat dissipation columns 221 is related to the shape and size of the first heat dissipation columns 221, the specific shape dimensions and arrangement of the connecting ribs 222 and the first heat dissipation columns 221 are related to the heat dissipation effect of the heat exchange member 22, and the heat dissipation effect can be obtained through simulation experiments using simulation software. Furthermore, the specific shape dimensions and arrangement of the connecting ribs 222 and the first heat dissipation columns 221 can be determined based on the results obtained from the simulation.
[0033] In some embodiments, the heat dissipation effect of the heat exchange member 22 is obtained according to the simulation results of the Flotherm software.
[0034] Please refer to Figure 6 , in some embodiments, the cross-section of the first heat dissipation column 221 is elliptical, where the cross-section of the first heat dissipation column 221 is a section along the direction perpendicular to the axis of the first heat dissipation column 221. Compared with the embodiment in which the cross-section of the first heat dissipation column 221 is circular, setting the cross-section shape of the first heat dissipation column 221 to be elliptical enables the first heat dissipation column 221 to have a larger surface area for contacting the coolant.
[0035] Please refer to Figure 5 , in some embodiments, the first heat dissipation columns 221 are arranged in an array. It can be understood that according to the actual situation, the array in the entire flow channel groove 1a can be an array with the same interval between adjacent first heat dissipation columns 221, or an array with several intervals having different distances between the first heat dissipation columns 221.
[0036] Please refer to Figure 6 , in some embodiments, the central axis z of the connecting rib 222 coincides with the connection line L between the midpoints of two adjacent first heat dissipation columns 221.
[0037] In some embodiments, the cross-section of the first heat dissipation column 221 is the same along the height direction.
[0038] In some embodiments, the cross-section of the connecting rib 222 is the same along the height direction.
[0039] Please refer to Figure 3 , in some embodiments, the height h1 of the first heat dissipation column 221 is equal to the height h2 of the connecting rib 222.
[0040] Please refer to Figure 6 , in some embodiments, for the first heat dissipation column 221 with an elliptical cross-section, the length of the major axis of the cross-section is a, and the length of the minor axis of the cross-section is b, and a:b = 3:2.
[0041] Please refer to Figure 6 , in some embodiments, within a preset area of the flow channel groove 1a, the major axes a of the cross-sections of two adjacent first heat dissipation columns 221 of the heat exchange member 22 coincide with a straight line, and the cross-section of the connecting rib 222 between two adjacent first heat dissipation columns 221 is symmetrically arranged about the straight line, and the distance from any point on the edge of the cross-section of the connecting rib 222 to the straight line is equal. The width of the cross-section of the connecting rib 222 is c, and the distance between two adjacent first heat dissipation columns 221 is d, and a:b:c:d = 3:2:1:5.
[0042] In some embodiments, a = 3mm, b = 2mm, c = 1mm, d = 5mm, h1 = h2 = 6mm.
[0043] In some embodiments, the heat dissipation plate 2 is made of a metal material.
[0044] In some embodiments, the heat dissipation plate 2 is obtained by die-casting or forging.
[0045] Please refer to Figure 5 , in some embodiments, along the width direction of the flow channel groove 1a, a plurality of heat dissipation channels 1d are arranged in sequence, and the heat dissipation channels 1d extend along the extension direction of the flow channel groove 1a from the liquid inlet 1b to the liquid outlet 1c. Figure 5 The dotted line with an arrow in [[ ]] shows the flow direction of the coolant when flowing in the flow channel groove 1a along the heat dissipation channel 1d.
[0046] Please refer to Figure 2 and Figure 5 , in some embodiments, the liquid inlet 1b and the liquid outlet 1c are arranged side by side. One end of the flow channel groove 1a is communicated with the liquid inlet 1b. After the other end of the flow channel groove 1a extends along the first direction X and then bends and extends along the second direction Y, it is communicated with the liquid outlet 1c, where the first direction is the direction opposite to the second direction.
[0047] Please refer to Figure 5 Figure 5 , in some embodiments, the heat dissipation channel 1d includes an acceleration zone A and a flow retardation zone B. The distribution density of the first heat dissipation columns 221 located in the flow retardation zone B is less than that of the first heat dissipation columns 221 located in the acceleration zone A. Wherein, the distribution density of the first heat dissipation columns 221 is the number of the first heat dissipation columns 221 in the area divided by the area of the area. By changing the distribution density of the first heat dissipation columns 221 in the area, the heat dissipation efficiency in the area can be changed. Increasing the distribution density of the first heat dissipation columns 221 includes reducing the distance d1 between the center points of adjacent first heat dissipation columns 221 along the extending direction of the heat dissipation channel 1d, and / or reducing the distance d2 between the center points of adjacent first heat dissipation columns 221 along the direction perpendicular to the extending direction of the heat dissipation channel 1d. Reducing the distribution density of the first heat dissipation columns 221 includes increasing the distance d1 between the center points of adjacent first heat dissipation columns 221 along the extending direction of the heat dissipation channel 1d, and / or increasing the distance d2 between the center points of adjacent first heat dissipation columns 221 along the direction perpendicular to the extending direction of the heat dissipation channel 1d. By increasing the distribution density of the first heat dissipation columns 221 in the area, more first heat dissipation columns 221 can be arranged in the same area, thus playing a role in improving the heat dissipation efficiency. In the embodiments of the present application, by making the distribution density of the first heat dissipation columns 221 in the flow retardation zone B less than that of the first heat dissipation columns 221 in the acceleration zone A, the heat dissipation efficiency of the acceleration zone A of the liquid cooling assembly 1000 is higher than that of the flow retardation zone B, so that the liquid cooling assembly 1000 can dissipate heat with different efficiencies for the heating devices with temperature differences in each part, and thus the temperatures of each part of the heating devices tend to be uniform.
[0048] It can be understood that the acceleration zone A can be set such that the distribution density of the first heat dissipation columns 221 in each unit area is greater than that of the flow retardation zone B, or the distribution density of the first heat dissipation columns 221 in some areas is greater than that of the flow retardation zone B.
[0049] Taking the liquid cooling assembly 1000 for dissipating heat from the IGBT module as an example, the IGBT module includes a U phase, a V phase, and a W phase arranged in sequence. During operation, the temperature of the V phase is higher than the temperatures of the U phase and the W phase. Please refer to Figure 5 Figure 5 , in some embodiments, the flow retardation zone B includes a first flow retardation zone B1 and a second flow retardation zone B2. Along the first direction X, the first flow retardation zone B1, the acceleration zone A, and the second flow retardation zone B2 are arranged in sequence. When the IGBT module is installed, the U phase, the V phase, and the W phase of the IGBT module are respectively arranged corresponding to the first flow retardation zone B1, the acceleration zone A, and the second flow retardation zone B2. In this way, the liquid cooling assembly 1000 can make the temperatures between the three phases of the IGBT module more uniform.
[0050] In some embodiments, along the extending direction of the flow channel groove 1a from the liquid inlet 1b to the liquid outlet 1c, several heat exchange elements 22 are arranged at intervals in sequence. Since in practical applications, it is difficult to machine an integrally formed heat exchange element 22 that extends along the extending direction of the flow channel groove 1a from the liquid inlet 1b to the liquid outlet 1c. Especially when there are bent turning points in the flow channel groove 1a, the processing cost will increase significantly. In the embodiments of the present application, the heat dissipation plate 2 is configured to have several heat exchange elements 22 separately distributed in the extending direction of the flow channel groove 1a to facilitate processing.
[0051] In some embodiments, a second heat dissipation column 11 is provided at the bottom of the flow channel groove 1a. Along the extending direction of the flow channel groove 1a from the liquid inlet 1b to the liquid outlet 1c, the second heat dissipation column 11 is arranged between adjacent heat exchange elements 22. By providing the second heat dissipation column 11, the heat dissipation effect at the gap between adjacent heat exchange elements 22 along the extending direction of the flow channel groove 1a from the liquid inlet 1b to the liquid outlet 1c can be increased.
[0052] In some embodiments, the cross-section of the second heat dissipation column 11 is circular.
[0053] In some embodiments, several third heat dissipation columns 23 are further provided on the surface of the bottom plate 21 facing the flow channel groove 1a. The third heat dissipation columns 23 are located in the gaps between adjacent heat exchange elements 22, and / or the third heat dissipation columns 23 are located in the gaps between the heat exchange elements 22 and the side walls of the flow channel groove 1a. In areas with relatively low heat dissipation efficiency requirements in the flow channel groove 1a, such as in the slow flow area B, the heat exchange elements 22 and the third heat dissipation columns 23 can be arranged in an alternating and spaced manner. In the bent area of the flow channel groove 1a, due to space limitations, it is difficult to arrange heat exchange elements 22, and the heat dissipation efficiency of the heat dissipation plate 2 can be increased by providing the third heat dissipation columns 23.
[0054] In some embodiments, the shape and size of the third heat dissipation column 23 are the same as those of the first heat dissipation column 221.
[0055] In some embodiments, strip-shaped heat dissipation ribs 24 are further provided on the surface of the bottom plate 21 facing the flow channel groove 1a. Along the width direction of the flow channel groove 1a, the strip-shaped heat dissipation ribs 24 are located between the heat exchange elements 22 at the edge and the side walls of the flow channel groove 1a. When it is impossible to accommodate additional heat exchange elements 22 due to space limitations between the heat exchange elements 22 at the edge and the side walls of the flow channel groove 1a, the heat dissipation efficiency of the heat dissipation plate 2 can be increased by providing the strip-shaped heat dissipation ribs 24.
[0056] Based on the same inventive concept, the present application further provides an electronic device, including the liquid cooling component 1000 in any of the above embodiments. Among them, the electronic device includes, but is not limited to, a controller of an electric vehicle.
[0057] The above are only embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structural or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.
Claims
1. A liquid cooling component, characterized in that: include: The base is provided with a flow channel, a liquid inlet and a liquid outlet, wherein the flow channel is connected with the liquid inlet and the liquid outlet, and the flow channel is used for cooling liquid to flow through; The heat sink comprises a base plate and a plurality of heat exchange components, wherein the base plate cover is arranged on the flow channel groove, the base plate closes the notch of the flow channel groove, the heat exchange component is arranged on a side of the base plate facing the flow channel groove, the heat exchange component divides the flow channel groove into a plurality of heat dissipation channels for coolant to flow through, the heat exchange component comprises at least two first heat dissipation columns and connecting ribs connected between adjacent first heat dissipation columns, and the at least two first heat dissipation columns are arranged in sequence along the extension direction of the heat dissipation channel.
2. The liquid cooling assembly according to claim 1, characterized in that: The cross section of the first heat dissipation column is elliptical.
3. The liquid cooling assembly according to claim 1, characterized in that: Along the width direction of the flow channel groove, a plurality of the heat dissipation flow channels are arranged in sequence.
4. The liquid cooling assembly according to claim 1, characterized in that: The first heat dissipation columns are arranged in an array.
5. The liquid cooling assembly according to claim 4, characterized in that: The heat dissipation channel includes an acceleration zone and a slow flow zone, and the distribution density of the first heat dissipation columns in the slow flow zone is smaller than the distribution density of the first heat dissipation columns in the acceleration zone.
6. The liquid cooling assembly according to claim 5, characterized in that: The liquid inlet and the liquid outlet are arranged side by side, one end of the flow channel is connected to the liquid inlet, and the other end of the flow channel extends along a first direction, bends and extends in a second direction, and is connected to the liquid outlet, wherein the first direction is opposite to the second direction.
7. The liquid cooling assembly according to claim 6, characterized in that: The slow flow area includes a first slow flow area and a second slow flow area. Along the first direction, the first slow flow area, the acceleration area and the second slow flow area are arranged in sequence.
8. The liquid cooling assembly according to claim 1, characterized in that: Along the extension direction of the flow channel from the liquid inlet to the liquid outlet, a plurality of the heat exchange elements are sequentially arranged at intervals; A second heat dissipation column is arranged at the bottom of the flow channel groove, and along the extension direction of the flow channel groove from the liquid inlet to the liquid outlet, the second heat dissipation column is arranged between adjacent heat exchange components.
9. The liquid cooling assembly according to claim 1, characterized in that: The central axis of the connecting rib coincides with a line connecting the midpoints of two adjacent first heat dissipation columns.
10. An electronic device, characterized in that: Comprising a liquid cooling assembly as described in any one of claims 1-9.