Liquid-cooled formation and capacity grading power supply

Abstract

The utility model provides a liquid-cooled formation capacity grading power supply, which comprises a shell, a power supply circuit and a liquid cooling module, wherein the power supply circuit and the liquid cooling module are positioned in the shell, and a first heating source and a second heating source are distributed on the power supply circuit; the liquid cooling module comprises a main heat conduction piece, an auxiliary heat conduction piece, a heat conduction substrate and a liquid cooling radiator. The radiator is close to the first heating source. The main heat conduction piece is connected with the first heating source and at least part of the heat conduction substrate. The auxiliary heat conduction piece is connected with the main heat conduction piece and at least part of the second heating source. The liquid cooling radiator is covered with a cooling liquid loop on at least part of the heat conduction substrate, and the cooling liquid loop is provided with a liquid inlet and a liquid outlet on the side wall of the shell. According to the scheme, reasonable heat conduction path design is carried out based on a concentrated heating part and a dispersed heating part in the power supply, the advantages of liquid cooling heat dissipation are fully utilized for heat dissipation of all main heating points in the capacity grading power supply, the heat dissipation performance is better, the lower working temperature can be maintained, and the service life of the power supply is prolonged. And the miniaturization and integration design of the formation and capacity grading power supply is facilitated.

Description

Technical Field

[0001] The utility model relates to the field of formation and grading power supplies, and particularly relates to a liquid-cooled formation and grading power supply. Background Art

[0002] The formation and grading power supply is a precision power supply device specifically designed for the "formation" process in battery manufacturing. Formation and grading, that is, the formation process of the battery, is a key step in the production of secondary batteries such as lithium-ion batteries and nickel-metal hydride batteries. It involves the first charging of the battery to activate the electrode material, form a stable electrochemical reaction layer, and ensure that the battery can be normally charged and discharged subsequently and reach the expected performance.

[0003] When the formation and grading power supply is working, a large amount of heat will be generated due to the power loss of internal electronic components. Therefore, the requirements for the heat dissipation system are very high to ensure the stable, safe, and long-term operation of the device. The existing formation and grading power supplies generally use air cooling for heat dissipation, and heat exchange is achieved by arranging air ducts inside the power supply. However, the efficiency of air cooling is relatively low. Especially in the application environment of formation and grading power supplies with high power density and high heat flux density, air cooling may be difficult to quickly and effectively remove a large amount of heat, resulting in heat accumulation, which may affect the stability and service life of the formation and grading power supply. Moreover, the fan operation will inhale dust in the air, and the dust will deposit inside the formation and grading power supply. Over time, it will affect the heat dissipation efficiency, increase the maintenance frequency, and in severe cases, it may also affect the insulation performance of the circuit board, leading to problems such as short circuits. In addition, the air duct design requires reserving installation space for the fan and air circulation space inside the formation and grading power supply, resulting in an increase in the overall volume of the formation and grading power supply. Summary of the Utility Model

[0004] Aiming at the above deficiencies in the prior art, the utility model provides a liquid-cooled formation and grading power supply to solve at least one of the above technical problems.

[0005] A liquid-cooled formation and grading power supply includes a housing and a power circuit and a liquid cooling module located in the housing. The power circuit is distributed with a first heat source with concentrated heat generation and a plurality of second heat sources with scattered heat generation. The heat generation amount of the first heat source is higher than that of a single second heat source.

[0006] The liquid cooling module includes a main heat conducting member, a secondary heat conducting member, a heat conducting substrate, and a liquid cooling radiator.

[0007] The radiator is fixedly arranged inside the housing near the first heat source. The main heat conducting member is respectively connected to the first heat source and at least part of the heat conducting substrate, and is used for transferring the heat of the first heat source to the heat conducting substrate; the secondary heat conducting member is respectively connected to the main heat conducting member and at least part of the second heat source, and is used for transferring the heat of the second heat source to the heat conducting substrate via the main heat conducting member;

[0008] The liquid cooling radiator covers a coolant circuit at at least part of the heat conducting substrate, and the coolant circuit forms a liquid inlet and a liquid outlet at the side wall of the housing.

[0009] In some specific embodiments, the liquid outlet is communicated with an external heat energy recovery device for recovering the heat energy in the coolant.

[0010] In some specific embodiments, there is a part of the secondary heat conducting member connected to the heat conducting substrate for directly transferring the heat of the second heat source to the heat conducting substrate.

[0011] In some specific embodiments, the heat conducting substrate connected to the main heat conducting member is the main heat conducting substrate, and the heat conducting substrate connected to the second heat source is the secondary heat conducting substrate; the main heat conducting substrate is communicated with or separated from each secondary heat conducting substrate, and the secondary heat conducting substrates are communicated with or separated from each other.

[0012] In some specific embodiments, the first heat source is fixedly connected to the heat conducting substrate through the main heat conducting member to realize the fixation of the first heat source inside the housing.

[0013] In some specific embodiments, the heat conducting substrate is an aluminum plate.

[0014] In some specific embodiments, the main heat conducting member and / or the secondary heat conducting member is a copper sheet.

[0015] In some specific embodiments, the main heat conducting member is fixedly connected to the heat conducting substrate through one or more heat conducting bases, and the heat conducting bases are used for uniformly transferring the heat of the main heat conducting member to the heat conducting substrate.

[0016] In some specific embodiments, the heat conducting bases are formed by laminating a plurality of copper sheets; the thickness of the heat conducting bases is greater than the thicknesses of the main heat conducting member and the secondary heat conducting member. In order to achieve uniform heat dissipation, the heat conducting bases need a certain thickness, and the heat conducting members only need to conduct heat, and a relatively narrow metal strip can be used.

[0017] In some specific embodiments, the liquid cooling module further includes a substrate heat conducting member, and the substrate heat conducting member is connected to the main heat conducting substrate and / or the secondary heat conducting substrate for realizing the heat transfer between the heat conducting substrates.

[0018] Beneficial effects: The present utility model provides a liquid-cooled formation and grading power supply. In view of the characteristics of high power density and high heat flux density of the formation and grading power supply, liquid-cooled heat dissipation is adopted to replace the traditional air-cooled heat dissipation. Based on the reasonable design of the heat conduction path for the concentrated heat-generating part and the dispersed heat-generating part inside the power supply, the advantages of liquid-cooled heat dissipation are fully utilized to dissipate heat for each main heat-generating point inside the formation and grading power supply. The heat dissipation performance is better, and a lower working temperature can be maintained, which is beneficial to the miniaturization and integration design of the formation and grading power supply. Brief Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 Schematic diagram of the overall structure of the liquid-cooled formation and grading power supply of the present utility model;

[0021] Figure 2 Schematic diagram of the internal structure of the liquid-cooled formation and grading power supply of the present utility model;

[0022] Figure 3 Side view of the internal structure of the liquid-cooled formation and grading power supply of the present utility model;

[0023] Figure 4 Schematic diagram of the distribution of the heat-conducting substrates of the present utility model;

[0024] Figure 5 Example diagram of the heat-conducting base and the heat-conducting substrate of the present utility model.

[0025] Reference numerals: 1 - housing; 11 - liquid inlet / outlet; 21 - first heat source; 22 - second heat source; 31 - main heat-conducting part; 32 - secondary heat-conducting part; 33 - heat-conducting substrate; 34 - liquid-cooled radiator; 35 - heat-conducting base; 331 - main heat-conducting substrate; 332 - secondary heat-conducting substrate. Detailed Embodiments

[0026] The following will clearly and completely describe the concept, specific structure and generated technical effects of the present utility model in combination with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present utility model.

[0027] In the following, various embodiments of the present utility model will be described more comprehensively. The present utility model can have various embodiments, and adjustments and changes can be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present utility model to the specific embodiments disclosed herein, but the present utility model should be understood to cover all adjustments, equivalents, and / or alternative solutions that fall within the spirit and scope of the various embodiments of the present utility model.

[0028] In the following, the term "comprising" or "may comprise" that can be used in various embodiments of the present utility model indicates the presence of the disclosed functions, operations, or elements, and does not limit the addition of one or more functions, operations, or elements. In addition, as used in various embodiments of the present utility model, the terms "comprising", "having", and their cognates are only intended to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing items, and should not be construed as precluding the existence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing items.

[0029] In various embodiments of the present utility model, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the recited words. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0030] Expressions (such as "first", "second", etc.) used in various embodiments of the present utility model may modify various components in the various embodiments, but do not limit the corresponding components. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present utility model, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0031] It should be noted that in the present utility model, unless otherwise clearly defined, terms such as "installed", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] In the present utility model, those of ordinary skill in the art need to understand that the terms indicating orientation or positional relationship in the text are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model.

[0033] The terms used in the various embodiments of the present utility model are only for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present utility model. As used herein, the singular forms are also intended to include the plural forms unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments of the present utility model belong. The terms (such as those defined in a general use dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present utility model.

[0034] The present utility model provides a liquid-cooled formation and grading power supply, in which a liquid-cooled heat dissipation module is integrated. The advantages of liquid-cooled heat dissipation are fully utilized to dissipate heat for the formation and grading power supply, with better heat dissipation performance, and it is beneficial to the miniaturization and integrated design of the formation and grading power supply. The module schematic diagram of the liquid-cooled formation and grading power supply is as shown in the appendix Figure 1 shown, and the specific structure is as Figures 2 to 5 shown. The specific solution is as follows:

[0035] A liquid-cooled formation and grading power supply includes a housing 1 and a power circuit and a liquid-cooled module located in the housing 1. The overall structure schematic diagram of the liquid-cooled formation and grading power supply is as shown in the appendix Figure 1 shown. In this application, the power circuit mainly refers to the circuit structure inside the liquid-cooled formation and grading power supply, including various circuits and electronic components. The heat sources are mainly distributed on the power circuit. The liquid-cooled module is used to dissipate heat for the power circuit.

[0036] In the present utility model, according to whether the heat sources generate heat concentratedly and the magnitude of the heat generation, the first heat source 21 and the second heat source 22 are divided. Specifically, on the power circuit, there are distributed the first heat source 21 that generates heat concentratedly and multiple second heat sources 22 that generate heat scattered. The heat generation amount of the first heat source 21 is higher than that of a single second heat source 22. The first heat source 21 includes the regions where devices such as power semiconductor devices and large-capacity capacitors are located, and the heat generation situation in this region is relatively serious. The second heat source 22 is mainly the regions where single components such as microprocessors, logic chips, and auxiliary power supplies have relatively small heat generation amounts, with relatively scattered heat generation and small heat generation amounts.

[0037] Specifically, the liquid cooling module includes a main heat conducting component 31, a secondary heat conducting component 32, a heat conducting substrate 33, and a liquid cooling radiator 34. The heat conducting substrate 33 is in direct contact with the liquid cooling radiator 34. The first heat source 21 transfers heat to the heat conducting substrate 33 through the main heat conducting component 31, and the second heat source 22 transfers heat to the heat conducting substrate 33 through the secondary heat conducting component 32 and the main heat conducting component 31. Inside the formation and grading power supply, the first heat source 21 generates a relatively large amount of heat and the heat generation area is relatively concentrated. The liquid cooling radiator is fixedly arranged inside the housing 1 near the first heat source 21, facilitating the heat transfer between the first heat source 21 and the liquid cooling radiator 34 and better realizing the heat dissipation of the main heat source. Exemplarily, in the appendix Figure 2 and 3 shown, the liquid cooling radiator 34 is located between the first heat source 21 and the inner side wall of the housing, and the liquid cooling radiator 34 is directly below the first heat source.

[0038] Specifically. The liquid cooling radiator 34 is covered with a coolant circuit at at least part of the heat conducting substrate 33, and the coolant circuit forms an inlet and an outlet at the side wall of the housing 1. The positions of the inlet and the outlet are as shown in the appendix Figure 1 shown. In some embodiments, the outlet is connected to an external thermal energy recovery device for recovering the thermal energy in the coolant. The outlet is connected to a water pump for pumping the coolant in the liquid cooling radiator 34 and transporting the coolant to a structure that needs to be heated, realizing the recycling of heat.

[0039] Specifically, the main heat conducting component 31 is respectively connected to the first heat source 21 and at least part of the heat conducting substrate 33 for transferring the heat of the first heat source 21 to the heat conducting substrate 33; the secondary heat conducting component 32 is respectively connected to the main heat conducting component 31 and at least part of the second heat source 22 for transferring the heat of the second heat source 22 to the heat conducting substrate 33 via the main heat conducting component 31. The heat conducting substrate 33, the main heat conducting component 31, and the secondary heat conducting component 32 all have the ability to transfer heat. The heat conducting substrate 33 is equivalent to a heat aggregation structure, and the main heat conducting component 31 and the secondary heat conducting component 32 are equivalent to heat flow transfer paths. The heat of the heat source is aggregated on the heat conducting substrate 33, and heat dissipation is achieved through the heat exchange between the liquid cooling radiator 34 and the heat conducting substrate 33.

[0040] The main function of the heat-conducting substrate 33 is to quickly and evenly disperse the heat generated centrally or locally, and then transfer it to the liquid-cooled radiator 34 through the heat dissipation mechanism. The heat-conducting substrate 33 has high thermal conductivity and can achieve uniform heat dissipation. In some specific embodiments, the heat-conducting substrate 33 is made of a metal material, such as copper, aluminum, etc. However, the heat-conducting substrate 33 requires a relatively large area, and the density cost and density of copper are relatively high. Preferably, the heat-conducting substrate 33 is an aluminum plate to reduce the heat dissipation cost. In addition, the heat-conducting substrate 33 can also be made of a composite material, such as an aluminum-based composite material, a copper-based composite material, etc. By adding reinforcing materials such as carbon fibers and ceramic particles to the metal substrate, the strength and thermal conductivity are improved while the weight is reduced.

[0041] The main heat-conducting component 31 is responsible for transferring the heat of the first heat source 21 to the heat-conducting substrate 33, and the secondary heat-conducting component 32 is responsible for transferring the heat of the second heat source 22 to the main heat-conducting component 31. The first heat source 21 is relatively close to the liquid-cooled radiator 34 and has a relatively high heat generation rate. A thicker or wider metal sheet can be selected to achieve sufficient heat transfer. In some embodiments, there is a part of the secondary heat-conducting component 32 connecting to the heat-conducting substrate 33 for directly transferring the heat of the second heat source 22 to the heat-conducting substrate 33. The secondary heat-conducting component 32 needs to transfer the heat of each dispersed second heat source 22 to the heat-conducting substrate 33, which can be transferred via the main heat-conducting component 31 or directly. Therefore, the secondary heat-conducting component 32 connects to the heat-conducting substrate 33 and / or the main heat-conducting component 31. The main heat-conducting component 31 and the secondary heat-conducting component 32 should be made of materials with high thermal conductivity, such as copper, aluminum, graphite, thermal conductive silicone, thermal conductive gasket, etc. Copper has the highest thermal conductivity, but its cost and weight are also relatively large; although the thermal conductivity of aluminum is slightly lower, it is lighter and has a lower cost; the thermal conductivity of graphite material is particularly high in the two-dimensional direction and is suitable for specific applications. Moreover, it is necessary to ensure good contact between the heat-conducting components and the heat source, between the heat-conducting components, and between the heat-conducting components and the heat-conducting substrate 33 to reduce voids. When selecting, the shape, size, and surface treatment (such as flatness, roughness) should be considered. When necessary, thermal paste or gaskets can be used to fill the tiny gaps. In addition, the heat-conducting components need to withstand a certain amount of mechanical stress, especially when they need to fix or support other components. Considering mechanical strength and durability, the main heat-conducting component 31 and the secondary heat-conducting component 32 are selected as copper bars.

[0042] The liquid cooling module is used to achieve liquid cooling for heat sources, including a heat dissipation part and a heat conduction part. The heat dissipation part performs liquid cooling, and the heat conduction part is responsible for transferring the heat of each heat source to the heat dissipation part. The utility model adopts liquid cooling instead of traditional air cooling, which has many advantages. Liquid cooling directly contacts or is very close to the heat generating elements through liquid circulation. Compared with air cooling, the heat capacity of the liquid is much larger than that of air, and it can absorb and carry away heat more efficiently. It is especially suitable for the formation and grading power supply with high power density and high heat flux density, which helps to maintain a lower working temperature and improve system stability. Moreover, the liquid cooling system usually does not require a high-speed fan or does not require a fan at all, so it can greatly reduce the operating noise and improve the working environment, especially suitable for occasions with strict requirements for noise control. In addition, the liquid cooling system is not very sensitive to the fluctuation of the ambient temperature and can maintain good heat dissipation performance even in a high-temperature environment, unlike air cooling which is easily affected by the ambient temperature and air quality. Furthermore, the liquid cooling system can be designed to be more compact because there is no need to reserve a large amount of air circulation space like air cooling, which is beneficial to the miniaturization and integration design of the formation and grading power supply.

[0043] In some specific embodiments, some of the second heat sources 22 are directly connected to the heat conducting substrate 33. Further, the heat conducting substrate 33 connected to the main heat conducting member 31 is the main heat conducting substrate 331, and the heat conducting substrate 33 connected to the second heat source 22 is the secondary heat conducting substrate 332; the main heat conducting substrate 331 and each secondary heat conducting substrate 332 are connected or separated from each other, and the secondary heat conducting substrates 332 are connected or separated from each other. The main heat conducting substrate 331 and the secondary heat conducting substrate 332 can be an integral heat conducting substrate 33, or can be multiple mutually separated heat conducting substrates 33, which are connected by specific heat conducting members. For example, at some of the second heat sources 22, there is a secondary heat conducting substrate 332, which directly transfers the heat of the second heat source 22 to the secondary heat conducting substrate 332. There is no liquid cooling radiator 34 at the secondary heat conducting substrate 332, and heat dissipation is achieved through the liquid cooling radiator 34 at the main heat conducting substrate 331. Further preferably, the liquid cooling module further includes a substrate heat conducting member, which is connected to the main heat conducting substrate 331 and / or the secondary heat conducting substrate 332 and is used to achieve heat transfer between the heat conducting substrates 33. The substrate heat conducting member can select the same material as the substrate and complete the heat transfer between the heat conducting substrates 33 through a strip structure. The distribution of the main heat conducting substrate 331 and the secondary heat conducting substrate 332 is as shown in the appendix Figure 4 as shown.

[0044] In some specific embodiments, the first heat source 21 is fixedly connected to the heat conducting substrate 33 through the main heat conducting member 31 to achieve the fixation of the first heat source 21 inside the housing 1. For example, the main heat conducting member 31 selects a relatively thick copper bar, and the fixation between the first heat source 21 and the heat conducting substrate 33 is achieved through bending.

[0045] In some specific embodiments, the main heat-conducting component 31 is fixedly connected to the heat-conducting substrate 33 through one or more heat-conducting bases 35, and the heat-conducting bases 35 are used to evenly transfer the heat of the main heat-conducting component 31 to the heat-conducting substrate 33; the thickness of the heat-conducting bases 35 is greater than the thicknesses of the main heat-conducting component 31 and the secondary heat-conducting component 32. The structure of the heat-conducting bases 35 is as shown in the appendix Figure 5 shown. Further preferably, the heat-conducting bases 35 are formed by laminating a plurality of copper sheets. The heat-conducting bases 35 composed of multiple copper sheets can provide more heat conduction paths, accelerate the heat transfer speed from the heating element to the cooling system, contribute to the uniform distribution of heat energy, reduce local overheating phenomena, thereby effectively reducing the temperature at the heat source and improving the overall heat dissipation efficiency. In addition, the heat-conducting bases 35 with a laminated design can adjust the number, thickness, and arrangement of the copper sheets according to different application requirements.

[0046] In some specific embodiments, for the liquid-cooled formation and grading power supply, the main heat-conducting component 31 and the secondary heat-conducting component 32 form a plurality of heat-conducting branches, and each heat-conducting branch is connected to at least one first heat source 21 and at least one second heat source 22. In the appendix Figure 4 shown, the main heat-conducting component 31 includes two copper bars, each copper bar is connected to the heat-conducting base 35 below and the heating electronic components, and the secondary heat-conducting component 32 is connected to the corresponding main heat-conducting component 31 to construct a heat-conducting branch. The setting of the heat-conducting branches can be adjusted according to the position of the heat source, facilitating the formation of a more efficient heat transfer path.

[0047] The present utility model provides a liquid-cooled formation and grading power supply. In view of the characteristics of high power density and high heat flux density of the formation and grading power supply, liquid-cooling is used instead of traditional air-cooling for heat dissipation. Based on the reasonable design of heat conduction paths for the concentrated heat-generating part and the dispersed heat-generating part inside the power supply, the advantages of liquid-cooling are fully utilized to dissipate heat for each main heat-generating point inside the formation and grading power supply. The heat dissipation performance is better, the working temperature can be maintained lower, which is beneficial to the miniaturization and integration design of the formation and grading power supply.

[0048] The above is a specific description of the preferred embodiments of the present utility model, but the creation of the present utility model is not limited to the described embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present utility model, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A liquid-cooled fractional capacity power supply, characterized in that: It comprises a housing, a power supply circuit and a liquid cooling module located in the housing, wherein a first heat source for concentrated heat generation and a plurality of second heat sources for scattered heat generation are distributed on the power supply circuit, and the heat generation of the first heat source is higher than the heat generation of a single second heat source; The liquid cooling module comprises a main heat conducting member, a secondary heat conducting member, a heat conducting substrate and a liquid cooling radiator; The heat sink is fixedly arranged inside the housing near the first heat source, and the main heat-conducting member is respectively connected to the first heat source and at least a part of the heat-conducting substrate, and is used to transfer the heat of the first heat source to the heat-conducting substrate; The secondary heat-conducting member is respectively connected to the primary heat-conducting member and at least a part of the second heat source, and is used to transfer the heat of the second heat source to the heat-conducting substrate via the primary heat-conducting member; The liquid-cooled radiator is covered with a cooling liquid circuit at least partially on the heat-conducting substrate, and the cooling liquid circuit is formed with a liquid inlet and a liquid outlet on the side wall of the shell.

2. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: The liquid outlet is connected to an external heat energy recovery device for recovering heat energy in the coolant.

3. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: A portion of the secondary heat-conducting member is connected to the heat-conducting substrate, and is used to directly transfer the heat of the second heat source to the heat-conducting substrate.

4. The liquid-cooled fractional capacity power supply according to claim 3, characterized in that: The heat-conducting substrate connected to the main heat-conducting element is the main heat-conducting substrate, and the heat-conducting substrate connected to the second heat source is the secondary heat-conducting substrate; The main heat-conducting substrate is connected to or separated from each of the sub-heat-conducting substrates, and the sub-heat-conducting substrates are connected to or separated from each other.

5. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: The first heat source is fixedly connected to the heat-conducting substrate through the main heat-conducting member, so as to fix the first heat source inside the housing.

6. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: The heat-conducting substrate is an aluminum plate.

7. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: The main heat conducting member and / or the secondary heat conducting member is a copper sheet.

8. The liquid-cooled fractional capacity power supply according to claim 1, characterized in that: The main heat-conducting component is fixedly connected to the heat-conducting base via one or more heat-conducting bases, and the heat-conducting base is used to uniformly transfer the heat of the main heat-conducting component to the heat-conducting base.

9. The liquid-cooled fractional capacity power supply according to claim 8, characterized in that: The heat-conducting base is formed by stacking and connecting a plurality of copper sheets; the thickness of the heat-conducting base is greater than the thickness of the main heat-conducting member and the secondary heat-conducting member.

10. The liquid-cooled fractional capacity power supply according to claim 4, characterized in that: The liquid cooling module further comprises a substrate heat conducting member, wherein the substrate heat conducting member is connected to the main heat conducting substrate and / or the slave heat conducting substrate to realize heat transfer between the heat conducting substrates.

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