Liquid cooling server and cabinet

Abstract

The utility model discloses a liquid cooling server and a cabinet. The liquid cooling server comprises a first node, a second node and a liquid cooling heat dissipation module, the first node and the second node are arranged side by side in the first direction, and the liquid cooling heat dissipation module is used for dissipating heat for the first node and the second node, the liquid cooling heat dissipation module comprises a front-end heat dissipation module, a middle heat dissipation module and a rear-end heat dissipation module which are sequentially arranged in the second direction, and the front-end heat dissipation module, the middle heat dissipation module and the rear-end heat dissipation module are connected through a pipeline assembly; the first node and the second node respectively comprise a plurality of CPU modules, a hard disk module and an expansion module, the front-end heat dissipation module is used for dissipating heat for the hard disk module, the middle heat dissipation module is used for dissipating heat for the CPU modules, and the rear-end heat dissipation module is used for dissipating heat for the expansion module; the first direction is perpendicular to the second direction. The liquid cooling server is high in heat dissipation efficiency, and the heat dissipation requirement of a high-power server is met.

Description

Technical Field

[0001] This application relates to the technical field of server heat dissipation, and particularly to a liquid-cooled server and a cabinet. Background Art

[0002] With the explosive growth of data volume, the power consumption of servers has gradually increased, resulting in an increasing power density of a single cabinet. When using the traditional air-cooling method to dissipate heat from servers, local hot spots are likely to occur in the equipment, affecting the heat exchange performance. Therefore, the air-cooling heat dissipation technology has been difficult to meet the heat dissipation requirements of high-power servers. Therefore, there is an urgent need to provide a server with higher heat dissipation efficiency. Summary of the Utility Model

[0003] The embodiments of this application provide a liquid-cooled server and a cabinet, which have higher heat dissipation efficiency and meet the heat dissipation requirements of high-power servers.

[0004] In a first aspect, a liquid-cooled server provided by an embodiment of this application includes a first node, a second node, and a liquid-cooled heat dissipation module. The first node and the second node are arranged side by side along a first direction. The liquid-cooled heat dissipation module is used to dissipate heat from the first node and the second node. Among them, the liquid-cooled heat dissipation module includes a front-end heat dissipation module, a middle heat dissipation module, and a rear-end heat dissipation module arranged in sequence along a second direction. The front-end heat dissipation module, the middle heat dissipation module, and the rear-end heat dissipation module are connected through a pipeline assembly. The first node and the second node respectively include a plurality of CPU modules, hard disk modules, and expansion modules. The front-end heat dissipation module is used to dissipate heat from the hard disk module. The middle heat dissipation module is used to dissipate heat from the CPU module. The rear-end heat dissipation module is used to dissipate heat from the expansion module. The first direction is perpendicular to the second direction.

[0005] In the above embodiment, the first node and the second node refer to two independent computing nodes in the server. The hardware configurations and structures of the two nodes can be the same, and each includes a plurality of CPU modules, hard disk modules, and expansion modules. Moreover, the number of CPU modules, the number of hard disk modules, the number of expansion modules, and the layout of the two nodes are the same. The liquid-cooled server of this application has dual nodes, and the dual nodes can cooperate to complete various data processing tasks, thus having higher computing performance and better fault tolerance. The liquid-cooled server of this application adopts a full liquid-cooling heat dissipation mode, which can dissipate heat from various heating devices in the server, and has a good heat dissipation effect. The first node, the second node, and the liquid-cooled heat dissipation module are respectively independently arranged, so that the first node, the second node, and the liquid-cooled heat dissipation module can be modularly installed respectively, which is convenient for assembly and has a compact layout.

[0006] In one embodiment, the middle heat dissipation module includes a plurality of first cold plates and a plurality of second cold plates. Each of the first cold plates is thermally connected to one of the CPU modules in the first node, and each of the second cold plates is thermally connected to one of the CPU modules in the second node. Each CPU module is equipped with a cold plate, which improves the heat dissipation efficiency.

[0007] In one embodiment, the front-end heat dissipation module includes a liquid distributor, and the liquid distributor includes a first liquid distributor and a second liquid distributor, which are in communication with each other; the plurality of hard disk module components in the first node are respectively thermally connected to the first liquid distributor, and the plurality of hard disk module components in the second node are respectively thermally connected to the second liquid distributor. As a part of the liquid cooling heat dissipation module, the liquid distributor can dissipate heat from the hard disk module and improve the heat dissipation efficiency of the hard disk module.

[0008] In one embodiment, each of the hard disk modules includes a housing, a phase change type cold plate and a hard disk. The phase change type cold plate and the hard disk are stacked. The housing has a receiving groove, and the phase change type cold plate and the hard disk are installed in the receiving groove. One end of the housing facing the middle heat dissipation module has an opening, and the phase change type cold plate extends from the opening to the outside of the housing and is thermally connected to the first liquid distributor or the second liquid distributor. The phase change type cold plate can dissipate heat from the hard disk, and the phase change type cold plate is thermally connected to the liquid distributor. The liquid distributor further uses the circulating coolant in the liquid cooling heat dissipation module to dissipate heat from the phase change type cold plate, which improves the heat dissipation efficiency of the hard disk module.

[0009] In one embodiment, a first flexible heat conducting pad is provided between the phase change type cold plate and the liquid distributor. When the server vibrates, the first flexible heat conducting pad can reduce the separation of the phase change type cold plate and the liquid distributor due to vibration, which affects heat transfer. The first flexible heat conducting pad improves the reliability of heat transfer and can also provide a shock absorption effect.

[0010] In one embodiment, the expansion module includes a power supply module, a PCIe module and an OCP module; the rear-end heat dissipation module includes a first liquid cooling component and a second liquid cooling component, and the first liquid cooling component and the second liquid cooling component have the same structure. The first liquid cooling component includes a power supply cold plate and a liquid passing cold plate module that are in communication with each other. The power supply cold plate and the liquid passing cold plate module are arranged along the first direction. The power supply module is thermally connected to the power supply cold plate. Along the third direction, the liquid passing cold plate module is located between the PCIe module and the OCP module. The first direction, the second direction and the third direction are perpendicular to each other. The first liquid cooling component and the second liquid cooling component can dissipate heat from the power supply module, the PCIe module and the OCP module and improve the heat dissipation efficiency.

[0011] In one embodiment, a second flexible heat-conducting pad is provided between the OCP module and the liquid-cooled plate module, a third flexible heat-conducting pad is provided between the PCIe module and the liquid-cooled plate module, and a fourth flexible heat-conducting pad is provided between the power supply module and the power supply cold plate. The second flexible heat-conducting pad, the third flexible heat-conducting pad and the fourth flexible heat-conducting pad can improve the heat-conducting effect and at the same time provide a shock-absorbing effect.

[0012] In one embodiment, the liquid-cooled server further includes a chassis. The first node, the second node and the liquid-cooled heat dissipation module are installed in the chassis. Along the third direction, the chassis has a preset height, and the first direction, the second direction and the third direction are perpendicular to each other. The chassis provides an accommodation space for the first node, the second node and the liquid-cooled heat dissipation module.

[0013] In one embodiment, the preset height of the chassis is 1U. The chassis size of the liquid-cooled server meets the requirements of server standardized installation.

[0014] In one embodiment, the chassis includes a front-end area, a middle area and a rear-end area arranged in sequence along the second direction; a plurality of hard disk bays are provided in the front-end area, one hard disk module is installed in one hard disk bay, the CPU module is installed in the middle area, and the expansion module is installed in the rear-end area. The hard disk module, the CPU module and the expansion module are installed in the chassis according to the area, making the internal layout of the liquid-cooled server compact and reasonable, and having a good heat dissipation effect.

[0015] In one embodiment, the liquid-cooled server further includes a first water-blocking strip. The front-end heat dissipation module includes a liquid distributor. The first water-blocking strip is installed on the bottom plate of the chassis, and the first water-blocking strip is located between the liquid distributor and the hard disk bay. The first water-blocking strip isolates the hard disk module and the IO module from the liquid-cooled heat dissipation module, and can avoid the situation that the hard disk module and the IO module are damaged when the liquid-cooled heat dissipation module leaks.

[0016] In one embodiment, an installation slot and a sliding slot are provided in the rear-end area. The expansion module includes a power supply module and an OCP module. The power supply module is installed in the installation slot, and the OCP module is installed in the sliding slot; a second water-blocking strip is provided on the periphery of the installation slot, and a third water-blocking strip is provided on the periphery of the sliding slot. The second water-blocking strip can prevent the leaked liquid from entering the installation slot and short-circuiting the power supply module. The third water-blocking strip can prevent the leaked liquid from entering the sliding slot and affecting the OCP module.

[0017] In one embodiment, a liquid leakage diversion groove is provided in the rear-end area. The liquid leakage diversion groove is used to discharge the leaked liquid when the liquid-cooled heat dissipation module leaks, avoiding the situation of liquid accumulation in the chassis.

[0018] In one embodiment, the pipeline assembly includes a first pipeline assembly, a second pipeline assembly, and a third pipeline assembly that are arranged in a first direction and communicate with each other. The second pipeline assembly is installed between the first node and the second node, separating the first node and the second node. The first pipeline assembly communicates with the plurality of first cold plates, and the third pipeline assembly communicates with the plurality of second cold plates.

[0019] On the other hand, an embodiment of the present application further provides a cabinet, which includes the above-mentioned liquid-cooled server and a cabinet frame. The liquid-cooled server is slidably installed in the cabinet frame along the second direction. Based on the advantage that the above-mentioned liquid-cooled server has a better heat dissipation effect, the cabinet of the present application also has a good heat dissipation effect.

[0020] In one embodiment, the cabinet frame includes a track and a middle frame. The middle frame is located at the rear end of the track. The liquid-cooled server is installed on the track. The liquid-cooled server is provided with positioning holes, and the middle frame is provided with first guiding columns adapted to the positioning holes. The track provides a primary guiding for the installation of the liquid-cooled server, making the installation of the liquid-cooled server reliable.

[0021] In one embodiment, the liquid-cooled server includes a liquid-cooled connector, which is located at the rear end of the liquid-cooled server. A liquid-cooled distribution device is provided on the side of the middle frame facing away from the liquid-cooled server. The side of the liquid-cooled distribution device facing the liquid-cooled server has second guiding columns adapted to the liquid-cooled connector. The middle frame provides a secondary guiding for the installation of the liquid-cooled server, and the liquid-cooled distribution device provides a tertiary guiding for the installation of the liquid-cooled connector, making the installation of the liquid-cooled server reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic structural diagram of a liquid-cooled server provided by an embodiment of the present application;

[0023] Figure 2 It is an exploded view of a liquid-cooled heat dissipation module, a first node, and a second node provided by an embodiment of the present application;

[0024] Figure 3 It is an assembly diagram of a liquid-cooled server provided by an embodiment of the present application;

[0025] Figure 4 It is a structural diagram of a hard disk module provided by an embodiment of the present application;

[0026] Figure 5 It is an exploded view of a hard disk module provided by an embodiment of the present application;

[0027] Figure 6 It is an assembly diagram of a hard disk module and a first flexible heat conducting pad provided by an embodiment of the present application;

[0028] Figure 7 Explosion diagram of a liquid-cooled server provided for an embodiment of the present application;

[0029] Figure 8 Schematic diagram of the assembly relationship between a PCIe module and a liquid-cooling module provided for an embodiment of the present application;

[0030] Figure 9 Schematic diagram of the structure of a chassis provided for an embodiment of the present application;

[0031] Figure 10 Schematic diagram of the assembly relationship between a hard disk module and a chassis provided for an embodiment of the present application;

[0032] Figure 11 Schematic diagram of the assembly relationship between an OCP module and a chassis provided for an embodiment of the present application;

[0033] Figure 12 Exploded view of a cabinet provided for an embodiment of the present application.

[0034] Reference numerals:

[0035] 1 - First node; 2 - Second node; 00 - Liquid cooling heat dissipation module; 01 - Front-end heat dissipation module; 02 - Middle heat dissipation module; 03 - Rear-end heat dissipation module; 04 - Pipeline assembly; 100 - Hard disk module; 200 - CPU module; 300 - Expansion module; X - First direction; Y - Second direction; 021 - First cold plate; 022 - Second cold plate; 400 - Motherboard; 401 - First motherboard; 011 - Liquid distributor; 0111 - First liquid distributor; 0112 - Second liquid distributor; 101 - Outer casing; 102 - Phase change cold plate; 103 - Hard disk; 3 - First screw; 4 - Second screw; 5 - First flexible heat conducting pad; 104 - Handle; 301 - Power supply module; 302 - PCIe module; 303 - OCP module; 031 - First liquid cooling component; 032 - Second liquid cooling component; 0311 - Power supply cold plate; 0312 - Liquid-cooled plate module; 9 - Chassis; 9001 - First chassis ear; 9002 - Second chassis ear; 901 - Bottom plate; E - Front-end area; F - Middle area; G - Rear-end area; 10 - IO module; 91 - Hard disk compartment; 92 - Slide groove; 93 - Installation groove; 21 - Second water baffle; 22 - Third water baffle; 902 - Front panel; 903 - Rear panel; 9021 - Hard disk socket; 9022 - Output socket; 9023 - Information card slot; 90231 - Information card; 9031 - OCP module socket; 90311 - Top beam; 30 - Management network port module; 40 - Power supply terminal; 904 - First side panel; 905 - Second side panel; 9032 - First opening; 9033 - Second opening; 9034 - Third opening; 9035 - Positioning hole; 9036 - Thimble; 9037 - Leakage liquid diversion groove; 4001 - Liquid cooling connector; 402 - First pipeline assembly; 403 - Second pipeline assembly; 404 - Third pipeline assembly; 405 - First interconnection pipeline connector; 406 - Second interconnection pipeline connector; 407 - Fourth pipeline; 906 - Liquid cooling pipe clamp; 907 - Cross beam; 908 - Limiting plate; 1001 - Liquid cooling server; 1002 - Tray rail; 1003 - Middle frame; 10031 - First guide post; 1004 - Liquid cooling distribution device; 4010 - Guide hole; 10041 - Second guide post; 10032 - Guide through hole. Detailed implementation manners

[0036] To make the objectives, technical solutions and advantages of the present application clearer, the following takes embodiments in conjunction with the accompanying drawings to further elaborate on the present application in detail.

[0037] Liquid cooling is an emerging cooling technology. This cooling technology removes the heat of heating components by adopting the flow mode of liquid cooling working medium, replacing the heat dissipation mode of air heat exchange in air cooling. Compared with air cooling, liquid cooling can better support the heat dissipation of high-power chips, keep the chips running at a low temperature, and extend their service life. Since air cooling heat exchange requires adding fans to accelerate the air flow, while liquid cooling heat exchange does not use fans, it can reduce the noise of the data center. Moreover, it can also utilize external cold sources for cooling, reduce the energy efficiency index (PUE, Power Usage Effectiveness) of the data center, and improve the environmental adaptability of the data center.

[0038] In conventional cold plate liquid cooling servers, most of the cold plate structures only dissipate heat for high-power heating components such as CPUs and GPUs, and the remaining components are often cooled by air cooling as an auxiliary. The server needs to be equipped with two sets of cooling components, namely cold plates and fans. This makes the data center need to provide two sets of cooling systems, a liquid cooling system (CDU) and air conditioners, resulting in a relatively large cooling power consumption, which is not conducive to energy conservation and environmental protection.

[0039] To solve the above problems, this application provides a liquid cooling server and a cabinet. This liquid cooling server adopts all-liquid cooling for heat dissipation, with relatively high heat dissipation efficiency and energy savings at the same time.

[0040] Figure 1 The structural schematic diagram of the liquid cooling server provided by an embodiment of this application is as Figure 1 shown. An embodiment of this application provides a liquid cooling server, which includes a first node 1, a second node 2, and a liquid cooling heat dissipation module 00. The first node 1 and the second node 2 are arranged side by side along the first direction X. The liquid cooling heat dissipation module 00 is used to dissipate heat for the first node 1 and the second node 2. Among them, the liquid cooling heat dissipation module 00 includes a front-end heat dissipation module 01, a middle heat dissipation module 02, and a rear-end heat dissipation module 03 arranged in sequence along the second direction Y. The front-end heat dissipation module 01, the middle heat dissipation module 02, and the rear-end heat dissipation module 03 are connected through a pipeline assembly 04, so that the liquid working medium (coolant) in the liquid cooling heat dissipation module 00 can circulate among the front-end heat dissipation module 01, the middle heat dissipation module 02, and the rear-end heat dissipation module 03. The first node 1 and the second node 2 respectively include a plurality of hard disk modules 100, CPU modules 200, and expansion modules 300. The front-end heat dissipation module 01 is used to dissipate heat for the hard disk modules 100, the middle heat dissipation module 02 is used to dissipate heat for the CPU modules 200, and the rear-end heat dissipation module 03 is used to dissipate heat for the expansion modules 300. In this application, the above-mentioned first direction X is perpendicular to the second direction Y. The first direction X can be the width direction of the liquid cooling server, and the second direction Y can be the length direction of the liquid cooling server.

[0041] In the above embodiments, the first node 1 and the second node 2 refer to two independent computing nodes in the server. The hardware configurations and structures of the two nodes can be the same, and each includes a plurality of CPU modules 200, hard disk modules 100, and expansion modules 300. Moreover, the number of CPU modules 200, the number of hard disk modules 100, the number of expansion modules 300, and the layout of the two nodes are the same. The liquid-cooled server of the present application has dual nodes, and the dual nodes can cooperate to complete various data processing tasks, thereby having higher computing performance and better fault tolerance. Even if one of the nodes fails, the other node can still continue to work, thus greatly improving the reliability of the server. Compared with traditional single-node servers, dual-node servers have obvious advantages in terms of performance, scalability, and reliability. The liquid-cooled server of the present application adopts a full liquid-cooled heat dissipation mode, which can dissipate heat for various heat-generating devices in the server, and has a good heat dissipation effect. The first node 1, the second node 2, and the liquid-cooled heat dissipation module 00 are respectively independently arranged, so that the first node 1, the second node 2, and the liquid-cooled heat dissipation module 00 can be modularly installed respectively, which is convenient for assembly and has a compact layout.

[0042] Figure 2 This is an exploded view of the liquid-cooled heat dissipation module, the first node, and the second node provided by an embodiment of the present application. As shown in FIG. 2, in one embodiment, the above-mentioned middle heat dissipation module 02 includes a plurality of first cold plates 021 and a plurality of second cold plates 022, and a coolant flows through both the first cold plates 021 and the second cold plates 022. The first cold plates 021 and the second cold plates 022 are arranged in parallel. This parallel arrangement means that the first cold plates 021 and the second cold plates 022 are connected in parallel. Each first cold plate 021 is thermally connected to one CPU module 200 in the first node 1, and each second cold plate 022 is thermally connected to one CPU module 200 in the second node 2. Specifically, both the first node 1 and the second node 2 include a main board 400 and a CPU module 200 installed on the main board 400, and the two main boards 400 are arranged in parallel along the first direction X. The first cold plate 021 is arranged above the CPU module 200 in the first node 1 and is thermally connected thereto, and the second cold plate 022 is arranged above the CPU module 200 in the second node 2 and is thermally connected thereto. The thermal connection can be that the cold plate is in direct contact with the surface of the CPU module 200 for heat transfer, or there is a thermal conductive medium (such as thermal conductive silicone grease, etc.) between the surface of the cold plate and the CPU module 200 for heat transfer.

[0043] In a specific embodiment, the liquid-cooled server includes two mainboards 400 and four CPU modules 200. Among them, taking the first node 1 as an example, the first node 1 includes a first mainboard 401, and two CPU modules 200 are arranged at intervals along the second direction Y on the first mainboard 401. Correspondingly, the middle heat dissipation module 02 includes two first cold plates 021 arranged at intervals along the second direction Y, and each first cold plate 021 corresponds to a CPU module 200 to dissipate heat for it. The structure of the second node 2 is the same as that of the above-mentioned first node 1, and the setting method of the second cold plate 022 is also the same as that of the first cold plate 021, which will not be elaborated in this application.

[0044] In other embodiments, the liquid-cooled server with two nodes may also include six CPU modules 200, eight CPU modules 200, etc., and this application does not make specific restrictions.

[0045] Figure 3 For the assembly diagram of the liquid-cooled server provided by an embodiment of this application, combined with Figures 2 - 3 , in one embodiment, the front-end heat dissipation module 01 includes a liquid distributor 011, and the liquid distributor 011 is interconnected with the first cold plate 021 and the second cold plate 022. The liquid distributor 011 includes a first liquid distributor 0111 and a second liquid distributor 0112, and the first liquid distributor 0111 and the second liquid distributor 0112 are also interconnected with each other. Along the second direction Y, the liquid distributor 011 is located between the hard disk module 100 and the mainboard 400. The front-end heat dissipation module 01 is used to dissipate heat for multiple hard disk modules 100. In this embodiment, each node includes two hard disk modules 100, and the two hard disk modules 100 are arranged along the first direction X. The two hard disk modules 100 of the first node 1 are respectively thermally connected to the first liquid distributor 0111, and the two hard disk modules 100 of the second node 2 are respectively thermally connected to the second liquid distributor 0112.

[0046] Figure 4 For the structure diagram of the hard disk module provided by an embodiment of this application, Figure 5 For the exploded view of the hard disk module provided by another embodiment of this application. As Figure 4 and Figure 5As shown, in one embodiment, the hard disk module 100 is a 2.5-inch hard disk module. Each hard disk module 100 includes a housing 101, a phase change type cold plate 102, and a hard disk 103. The phase change type cold plate 102 and the hard disk 103 are stacked. The housing 101 has a receiving groove, and the phase change type cold plate 102 and the hard disk 103 are installed in the receiving groove. When assembling the hard disk module 100, first fix the phase change type cold plate 102 to the top plate of the housing 101 with the first screw 3, and then install the hard disk 103 on the side of the phase change type cold plate 102 away from the top plate of the housing 101, and fix the hard disk 103 to the side plate of the housing 101 with the second screw 4. The insertion directions of the first screw 3 and the second screw 4 are perpendicular to each other. This fixing method enables the phase change type cold plate 102 to be in close contact with the hard disk 103 and not easily come loose, and there is no easy generation of a gap between the phase change type cold plate 102 and the hard disk 103. In this way, when the server vibrates, the situation where the hard disk 103 and the phase change type cold plate 102 move away from each other, affecting heat conduction, can be reduced. One end of the housing 101 facing the middle heat dissipation module 02 has an opening, and the phase change cold plate extends from the opening to the outside of the housing 101 and is thermally connected to the liquid distributor 011.

[0047] Figure 6 It is an assembly diagram of the hard disk module and the first flexible heat conducting pad provided by an embodiment of the present application. As Figure 6 shown, in one embodiment, a first flexible heat conducting pad 5 may be provided between the above-mentioned phase change type cold plate 102 and the liquid distributor 011. The first flexible heat conducting pad 5 can deform under the extrusion of the phase change type cold plate 102 and the liquid distributor 011. In this way, the phase change type cold plate 102 and the liquid distributor 011 are respectively in full contact with the first flexible heat conducting pad 5, which can reduce the situation where the phase change type cold plate 102 and the liquid distributor 011 are separated during server vibration, affecting heat transfer. The first flexible heat conducting pad 5 improves the reliability of heat transfer.

[0048] In one embodiment, a handle 104 is provided at one end of the housing 101 of the hard disk module 100 away from the middle heat dissipation module 02, which is convenient for the staff to perform hot plugging and unplugging operations on the hard disk module 100.

[0049] Figure 7 It is an exploded view of the liquid-cooled server provided by an embodiment of the present application, Figure 8 It is a schematic diagram of the assembly relationship between the PCIe module and the liquid-cooled heat dissipation module provided by an embodiment of the present application. Combining Figure 8 and Figure 9, in one embodiment, the above-mentioned expansion module 300 includes a power supply module 301, a PCIe module 302, and an OCP module 303. PCIe is a high-speed serial computer expansion bus standard, and the PCIe module is used for high-speed data transmission. The OCP (Open Compute Project) module can specifically be a high-performance computing card for data center servers. The rear heat dissipation module 03 includes a first liquid cooling component 031 and a second liquid cooling component 032, and the structures of the first liquid cooling component 031 and the second liquid cooling component 032 are the same. The first liquid cooling component 031 is used to dissipate heat from the expansion module of the first node, and the second liquid cooling component 032 is used to dissipate heat from the expansion module of the second node. Among them, the first liquid cooling component 031 includes a power supply cold plate 0311 and a liquid-cooled plate module 0312 that are interconnected. The power supply cold plate 0311 and the liquid-cooled plate module 0312 are arranged along the first direction X. The power supply module 301 is thermally connected to the power supply cold plate 0311. Along the third direction Z, the liquid-cooled plate module 0312 is located between the PCIe module 302 and the OCP module 303. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. The power supply module 301 is located at the rear end of the main board 400. During assembly, first install the main board 400 in the chassis 9 of the server, and then install the liquid cooling and heat dissipation module 00 so that the power supply cold plate 0311 is located above the power supply module. Then install the PCIe module 302 so that the PCIe module 302 is located above the liquid-cooled plate module 0312. Finally, insert the OCP module 303 into the slot at the rear of the chassis 9 from below the liquid-cooled plate module 0312.

[0050] In one embodiment, a second flexible thermal pad (not shown in the figure) is provided between the above-mentioned OCP module 303 and the liquid-cooled plate module 0312. The second flexible thermal pad makes the upper surface of the OCP module 303 in close contact with the lower surface of the liquid-cooled plate module 0312, improving the reliability of heat transfer.

[0051] In one embodiment, a third flexible thermal pad (not shown in the figure) is provided between the above-mentioned PCIe module 302 and the liquid-cooled plate module 0312. The third flexible thermal pad makes the lower surface of the PCIe module 302 in close contact with the upper surface of the liquid-cooled plate module 0312, improving the reliability of heat transfer.

[0052] In one embodiment, a fourth flexible thermal pad (not shown in the figure) is provided between the above-mentioned power supply module 301 and the power supply cold plate 0311. The fourth flexible thermal pad makes the upper surface of the power supply module 301 in close contact with the lower surface of the power supply cold plate 0311, improving the reliability of heat transfer.

[0053] The flexible thermal pads in some of the above embodiments can also play a buffering role. When the liquid-cooled server vibrates, the flexible thermal pads can weaken the impact force between components, reduce the occurrence of component damage, and improve the reliability and stability of the device.

[0054] Figure 9 The following is a schematic structural diagram of a chassis provided by an embodiment of the present application. In one embodiment, the liquid-cooled server includes a chassis 9, and the above-mentioned first node 1, second node 2, and liquid-cooled heat dissipation module 00 are all installed in the chassis 9. The chassis 9 has a preset height along the third direction Z. The preset height is 1U. 1U = 1.75 inches = 44.45 mm. The chassis 9 is installed in a standard 19-inch cabinet, and the width of the chassis 9 is adapted to the cabinet. First box ears 9001 and second box ears 9002 are provided on both sides of the chassis 9, and the first box ears 9001 and the second box ears 9002 may be respectively provided with flip handles to facilitate pulling the chassis 9 out of the cabinet for maintenance.

[0055] In one embodiment, the above-mentioned chassis 9 includes a front-end area E, a middle area F, and a rear-end area G. The above-mentioned hard disk module 100 is installed in the front-end area E. The liquid-cooled server further includes an IO module 10, and the IO module 10 is installed between the hard disk modules 100 of the first node 1 and the second node 2. The IO module 10 is used for data transmission and storage access of the server. The motherboards 400 of the first node 1 and the second node 2 are installed in the middle area F, and the power supply module 301, the PCIe module 302, and the OCP module 303 are installed in the rear-end area G.

[0056] In one embodiment, a hard disk compartment 91 is provided in the front-end area E, and the hard disk module 100 is installed in the hard disk compartment 91. The hard disk module 100 is detachably connected to the chassis 9 of the server. When assembling the hard disk module 100 with the chassis 9, the hard disk module 100 is inserted into the hard disk compartment 91 of the chassis 9 from the front end of the chassis 9 along the second direction Y. The liquid distributor 011 is installed at the rear end of the hard disk compartment 91, and the rear end refers to the end facing the middle area F. The liquid-cooled heat dissipation module 00 is installed in the middle area F and the rear-end area G. Two sets of sliding grooves 92 are provided on the bottom plate 901 of the chassis 9 in the rear-end area G, and the sliding grooves 92 extend in the second direction Y. The two sets of sliding grooves 92 are used for installing the OCP module 303. Two installation slots 93 are further provided on the bottom plate 901 of the rear-end area G, and each installation slot 93 is used for installing a power supply module 301. The installation slot 93 is adapted to the shape of the power supply module 301, and may specifically be a quadrilateral. One installation slot 93 is arranged at an interval from one set of sliding grooves 92.

[0057] In one embodiment, the liquid-cooled server further includes a first water baffle 20. The first water baffle 20 is installed on the bottom plate 901 of the chassis 9, and the first water baffle 20 is located between the liquid distributor 011 and the hard disk compartment 91. When the hard disk module 100 is plugged into the hard disk compartment 91, the height of the first water baffle (not shown in the figure) is lower than the lower surface of the phase change cold plate 102, so that the rear end of the phase change cold plate 102 can contact the liquid distributor 011. The first water baffle 20 separates the front-end area E and the middle area F, and is used to isolate the hard disk module 100 and the IO module 10 from the liquid-cooled heat dissipation module 00 when the liquid-cooled heat dissipation module 00 accidentally leaks liquid.

[0058] In one embodiment, the liquid-cooled server further includes a second water baffle 21 and a third water baffle 22. The second water baffle 21 is installed on the periphery of each installation slot 93 to prevent leaked liquid from entering the installation slot 93 and short-circuiting the power supply module 301. The third water baffle 22 is installed on the periphery of the sliding slot 92 to prevent leaked liquid from entering the sliding slot 92 and affecting the OCP module 303.

[0059] Figure 10 Schematic diagram of the assembly relationship between the hard disk module and the chassis provided by an embodiment of the present application. Combining Figure 9 and Figure 10 In one embodiment, the chassis 9 further includes a front panel 902 and a rear panel 903 that are oppositely arranged. The front panel 902 is connected to the front-end edge of the bottom plate 901 of the chassis 9, and the rear panel 903 is connected to the rear-end edge of the bottom plate 901 of the chassis 9. The front panel 902 is provided with two groups of hard disk sockets 9021 and output sockets 9022. The two groups of hard disk sockets 9021 respectively correspond to the positions of the hard disk compartments 91 of the first node 1 and the second node 2, and the output socket 9022 corresponds to the position of the IO module 10. The front panel 902 is further provided with an information card slot 9023. The information card slot 9023 is located below the output socket 9022 and is used to insert the information card 90231 of the server. The information card 90231 records the information of the liquid-cooled server.

[0060] The rear panel 903 is provided with two OCP module sockets 9031. Each OCP module socket 9031 corresponds to the position of a group of sliding slots 92. The OCP module 303 can be inserted into the sliding slot 92 from the OCP module socket 9031. The top beam 90311 of the OCP socket can also be used to limit the PCIe module 302 and restrict the installation height of the PCIe module 302.

[0061] Figure 11 Schematic diagram of the assembly relationship between the OCP module and the chassis provided by an embodiment of the present application. Combining Figure 7 , Figure 9 and Figure 11, the liquid-cooled server further includes a management network port module 30 and a power supply terminal 40. The power supply terminal 40 is electrically connected to the power module 301. The chassis 9 further includes a first side plate 904 and a second side plate 905. The first side plate 904 and the second side plate 905 are oppositely arranged, and both ends of the first side plate 904 and the second side plate 905 are respectively connected to the front plate 902 and the rear plate 903. The rear plate 903 is further provided with a first opening 9032 and a second opening 9033. The first opening 9032 is located at one end of the rear plate 903 close to the first side plate 904, and the second opening 9033 is located at one end of the rear plate 903 close to the second side plate 905. The first opening 9032 is used to install the management network port module 30, and the second opening 9033 is used to install the power supply terminal 40.

[0062] It should be noted that the above-mentioned power supply terminal 40 is installed in the second opening 9033, and along the first direction X, the power supply terminal 40 has a floating amount of about 2 mm in the second opening 9033. When the liquid-cooled server is installed in the cabinet, the power supply terminal 40 and this floating amount can improve the reliability when the liquid-cooled server is docked with the cabinet.

[0063] The middle of the rear plate 903 is further provided with a third opening 9034, and the third opening 9034 is used to install the liquid-cooling connector 4001 of the liquid-cooling heat dissipation module 00. The rear plate 903 is further provided with a positioning hole 9035 and a thimble 9036. The middle frame 1003 of the cabinet is provided with a guiding column adapted to the positioning hole 9035. When the liquid-cooled server is docked with the cabinet, the guiding column is inserted into the positioning hole 9035 to realize the positioning of the liquid-cooled server and the cabinet. The thimble 9036 is used to trigger the cabinet to send out a server-in-place recognition signal.

[0064] In an embodiment, a liquid leakage diversion groove 9037 is provided in the rear-end area G of the chassis 9. The liquid leakage diversion groove 9037 is used to drain the leaked liquid when the liquid-cooling heat dissipation module 00 leaks. Specifically, a liquid leakage diversion groove 9037 is provided at the edge where the rear plate 903 intersects with the bottom plate 901, and the rear plate 903 is provided with a through hole corresponding to the liquid leakage diversion groove 9037. The leaked liquid in the chassis 9 can flow into the liquid leakage diversion groove 9037 from this through hole, and thus be discharged outside the chassis 9.

[0065] Combined Figure 2 and Figure 3, in one embodiment, the pipeline assembly 04 includes a liquid cooling connector 4001, a first pipeline assembly 402, a second pipeline assembly 403, and a third pipeline assembly 404 that are arranged along the second direction and communicate with each other. The second pipeline assembly 403 is installed between the first node 1 and the second node 2. The first pipeline assembly 402 communicates with a plurality of first cold plates 021, and the third pipeline assembly 404 communicates with a plurality of second cold plates 022. The above-mentioned second pipeline assembly 403 can be regarded as the main pipeline of the liquid cooling heat dissipation module 00, and this main pipeline can be an inlet pipe or an outlet pipe. The pipeline assembly also includes an interconnection pipeline connector for shunting or confluence. The interconnection pipeline connector includes a first interconnection pipeline connector 405. The first interconnection pipeline connector 405 is located at the front end of the second pipeline assembly 403, and the rear end of the second pipeline assembly 403 is connected to the liquid cooling connector 4001. When the second pipeline assembly 403 is an inlet pipe, the first interconnection pipeline connector 405 shunts the coolant in the second pipeline assembly 403 into the first pipeline assembly 402 and the third pipeline assembly 404; or, when the second pipeline assembly 403 is an outlet pipe, the first interconnection pipeline connector 405 confluences the coolant in the first pipeline assembly 402 and the third pipeline assembly 404 into the second pipeline assembly 403. A first liquid distributor 0111 is installed between the first interconnection pipeline connector 405 and the first pipeline assembly 402, and a second liquid distributor 0112 is installed between the first interconnection pipeline connector 405 and the third pipeline assembly 404.

[0066] The interconnection pipeline connector further includes a second interconnection pipeline connector 406, and the pipeline assembly 04 further includes a fourth pipeline 407. The two ends of the fourth pipeline 407 are respectively connected to the liquid cooling connector 4001 and the second interconnection pipeline connector 406. A first liquid cooling component 031 is installed between the second interconnection pipeline connector 406 and the first pipeline assembly 402, and a second liquid cooling component 032 is installed between the second interconnection pipeline connector 406 and the third pipeline assembly 404. When the second pipeline assembly 403 is an inlet pipe, the fourth pipeline 407 is an outlet pipe. When the second pipeline assembly 403 is an outlet pipe, the fourth pipeline 407 is an inlet pipe.

[0067] The second pipeline assembly 403 can be used as the inlet pipe of the liquid cooling heat dissipation module 00, and the fourth pipeline 407 can be used as the outlet pipe of the liquid cooling heat dissipation module 00; or, the second pipeline assembly 403 can be used as the outlet pipe of the liquid cooling heat dissipation module 00, and the fourth pipeline 407 can be used as the inlet pipe of the liquid cooling heat dissipation module 00.

[0068] The above-mentioned liquid cooling connector 4001 can specifically be a liquid cooling blind plug connector, and the liquid cooling connector 4001 is used to connect the liquid cooling distribution unit (CDU) of the cabinet.

[0069] In one embodiment, the bottom plate 901 of the chassis 9 is provided with a plurality of liquid cooling pipe clamps 906, which are located in the middle of the bottom plate 901 and arranged at intervals along the second direction Y. The plurality of liquid cooling pipe clamps 906 are used to fix the second pipeline assembly 403 to prevent its shaking from interfering with the first node 1 and the second node 2.

[0070] Combined with Figure 2 and Figure 9 , in one embodiment, a cross beam 907 is provided at a position in the middle region F of the bottom plate 901 close to the front end region E. The cross beam 907 can be used to fix the liquid distributor 011. The liquid distributor 011 is located between the cross beam 907 and the hard disk compartment 91. The pipeline assembly 04 connected to the liquid distributor 011 is arranged above the cross beam 907 and extends towards the rear end of the liquid cooling server. The bottom plate 901 is also provided with a plurality of limiting plates 908. The limiting plate 908 at the front end and the limiting plate 908 at the rear end form a card slot. After the liquid cooling heat dissipation module 00 is installed in the chassis 9, the middle heat dissipation module 02 is clamped between the limiting plate 908 at the front end and the limiting plate 908 at the rear end. The limiting plate 908 plays a limiting role on the middle heat dissipation module 02 along the second direction Y. After the liquid cooling heat dissipation module 00 is installed in the chassis 9, the fin group 0230 of the cold heat dissipation module is fixed to the first side plate 904 and the second side plate 905 of the chassis 9 by screws along the first direction X.

[0071] Figure 12 is an exploded view of the cabinet provided by an embodiment of the present application. As Figure 12 shown, an embodiment of the present application also provides a cabinet, which includes a cabinet frame and the above-mentioned liquid cooling server 1001. The liquid cooling server 1001 is slidably installed in the cabinet frame along the second direction Y.

[0072] Combined with Figure 11 and Figure 12 , in one embodiment, the above-mentioned cabinet frame includes a track 1002 and a middle frame 1003. The track 1002 extends in the second direction Y. The liquid cooling server 1001 is installed on the track 1002 and can slide along the track 1002. The track 1002 provides guidance for the liquid cooling server and can play a supporting role. The guidance provided by the track 1002 can be regarded as the primary guidance. The middle frame 1003 is located at the rear end of the track 1002. The middle frame 1003 is provided with a first guiding column 10031 adapted to the positioning hole 9035 of the liquid cooling server. The first guiding column 10031 provides secondary guidance for the installation of the liquid cooling server. The liquid cooling connector 4001 of the liquid cooling server has two guiding holes 4010 arranged along the third direction Z. On the side of the middle frame 1003 facing away from the liquid cooling server, there is a liquid cooling distribution device 1004 ( Figure 12In the exploded view of the cabinet, the positions of the middle frame, the liquid cooling distribution device, and the support rail are not directly opposite. During actual installation, they should be directly opposite. On the side of the liquid cooling distribution device 1004 facing the liquid cooling server, there are second guiding columns 10041 adapted to the two guiding holes 4010 of the liquid cooling connector 4001. The middle frame 1003 is provided with a guiding through hole 10032 for the liquid cooling connector 4001 to pass through. After the liquid cooling connector 4001 passes through the guiding through hole 10032, it is docked with the second guiding column 10041 of the liquid cooling distribution device 1004 located at the rear end of the middle frame 1003. The second guiding column 10041 provides three - level guiding for the installation of the liquid cooling server.

[0073] When the liquid cooling server 1001 is installed on the cabinet frame, first, the support rail 1002 provides the first - level guiding for the liquid cooling server 1001, enabling the liquid cooling server 1001 to gradually approach the middle frame 1003 along the extension direction of the support rail 1002. At this time, the first guiding column 10031 on the middle frame 1003 is inserted into the positioning hole 9035 to complete the second - level guiding. Then, the second guiding column 10041 is inserted into the guiding hole to complete the third - level guiding. The cabinet frame of the present application can provide three - level guiding for the liquid cooling server 1001, improving the reliability of the installation of the liquid cooling server 1001, and thus providing the reliability of the cabinet.

[0074] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0075] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these changes and modifications.

Claims

1. A liquid cooling server, characterized in that: It includes a first node, a second node and a liquid cooling heat dissipation module, wherein the first node and the second node are arranged in parallel along a first direction, and the liquid cooling heat dissipation module is used to dissipate heat for the first node and the second node, wherein: The liquid cooling heat dissipation module comprises a front heat dissipation module, a middle heat dissipation module and a rear heat dissipation module which are sequentially arranged along the second direction, and the front heat dissipation module, the middle heat dissipation module and the rear heat dissipation module are connected by a pipeline assembly; The first node and the second node respectively include a plurality of CPU modules, hard disk modules and expansion modules, the front-end heat dissipation module is used to dissipate heat for the hard disk module, the middle heat dissipation module is used to dissipate heat for the CPU module, and the back-end heat dissipation module is used to dissipate heat for the expansion module; The first direction is perpendicular to the second direction.

2. The liquid cooling server according to claim 1, characterized in that: The middle heat dissipation module includes a plurality of first cold plates and a plurality of second cold plates, each of the first cold plates is thermally connected to one of the CPU modules in the first node, and each of the second cold plates is thermally connected to one of the CPU modules in the second node.

3. The liquid cooling server according to claim 1, characterized in that: The front-end heat dissipation module includes a liquid distributor, and the liquid distributor includes a first liquid distributor and a second liquid distributor, and the first liquid distributor and the second liquid distributor are connected to each other; The multiple hard disk modules of the first node are thermally connected to the first liquid distributor respectively, and the multiple hard disk modules of the second node are thermally connected to the second liquid distributor respectively.

4. The liquid cooling server according to claim 3, characterized in that: Each of the hard disk modules includes a shell, a phase change cold plate and a hard disk, the phase change cold plate and the hard disk are stacked, the shell has a receiving slot, the phase change cold plate and the hard disk are installed in the receiving slot, the shell has an opening at one end facing the middle heat dissipation module, the phase change cold plate extends from the opening to the outside of the shell, and is thermally connected to the first liquid distributor or the second liquid distributor.

5. The liquid cooling server according to claim 4, characterized in that: A first flexible heat-conducting pad is provided between the phase-change cold plate and the liquid dispenser.

6. The liquid cooling server according to claim 1, characterized in that: The expansion module includes a power module, a PCIe module and an OCP module; The rear-end heat dissipation module includes a first liquid cooling component and a second liquid cooling component with the same structure. The first liquid cooling component includes a power cold plate and a liquid cold plate module that are interconnected. The power cold plate and the liquid cold plate module are arranged along the first direction. The power module is thermally connected to the power cold plate. Along the third direction, the liquid cold plate module is located between the PCIe module and the OCP module. The first direction, the second direction and the third direction are perpendicular to each other.

7. The liquid cooling server according to claim 6, characterized in that: A second flexible thermal pad is provided between the OCP module and the liquid-through cold plate module, a third flexible thermal pad is provided between the PCIe module and the liquid-through cold plate module, and a fourth flexible thermal pad is provided between the power module and the power cold plate.

8. The liquid cooling server according to any one of claims 1 to 7, characterized in that: The liquid-cooled server also includes a chassis, in which the first node, the second node and the liquid-cooled heat dissipation module are installed. The chassis has a preset height along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

9. The liquid cooling server according to claim 8, characterized in that: The preset height is 1U.

10. The liquid cooling server according to claim 8, characterized in that: The chassis comprises a front region, a middle region and a rear region sequentially arranged along the second direction; The front-end area is provided with a plurality of hard disk bays, one hard disk module is installed in one of the hard disk bays, the CPU module is installed in the middle area, and the expansion module is installed in the rear-end area.

11. The liquid cooling server according to claim 10, characterized in that: The liquid cooling server further includes a first water retaining bar, the front end heat dissipation module includes a liquid distributor, the first water retaining bar is installed on the bottom plate of the chassis, and the first water retaining bar is located between the liquid distributor and the hard disk bay.

12. The liquid cooling server according to claim 10, characterized in that: The rear end area is provided with a mounting groove and a slide groove, the expansion module includes a power module and an OCP module, the power module is installed in the mounting groove, and the OCP module is installed in the slide groove; A second water retaining strip is disposed on the peripheral side of the installation groove, and a third water retaining strip is disposed on the peripheral side of the slide groove.

13. The liquid cooling server according to claim 10, characterized in that: The rear end region is provided with a liquid leakage guide groove, and the liquid leakage guide groove is used to discharge the leaked liquid when the liquid cooling heat dissipation module leaks liquid.

14. The liquid cooling server according to claim 2, characterized in that: The pipeline assembly includes a first pipeline assembly, a second pipeline assembly and a third pipeline assembly which are arranged along the first direction and connected to each other, the second pipeline assembly is installed between the first node and the second node, the first pipeline assembly is connected to the multiple first cold plates, and the third pipeline assembly is connected to the multiple second cold plates.

15. A cabinet, characterized in that: It comprises the liquid cooling server and the cabinet frame according to any one of claims 1 to 14, wherein the liquid cooling server is slidably installed on the cabinet frame along the second direction.

16. The cabinet according to claim 15, characterized in that: The cabinet frame includes a support rail and a middle frame. The middle frame is located at the rear end of the support rail along the second direction. The liquid cooling server is installed on the support rail. The liquid cooling server is provided with a positioning hole. The middle frame is provided with a first guide column adapted to the positioning hole.

17. The cabinet according to claim 16, characterized in that: The liquid-cooled server includes a liquid-cooled connector, which is located at the rear end of the liquid-cooled server. A liquid-cooled distribution device is provided on the side of the middle frame facing away from the liquid-cooled server. The liquid-cooled distribution device has a second guide column adapted to the liquid-cooled connector on the side facing the liquid-cooled server.

Images