Paster type lamp bead support with good heat dissipation effect

Abstract

The utility model relates to a patch type lamp bead support with a good heat dissipation effect, which belongs to the field of lamp bead supports and comprises a lamp bead support, a lamp bead body is arranged in the lamp bead support, a heat conduction outer frame is arranged outside the lamp bead support, a plurality of heat dissipation fins are embedded in the heat conduction outer frame, and the heat dissipation fins are embedded in the heat conduction outer frame. An arc-shaped through groove located in the side wall of the lamp bead support is formed in the heat conduction outer frame, and a first heat dissipation disc and a second heat dissipation disc are arranged at the bottom of the lamp bead support. According to the patch type lamp bead support with the good heat dissipation effect, the heat conduction outer frame is arranged outside the lamp bead support, the heat dissipation fins arranged on the heat conduction outer frame can effectively conduct out heat in the lamp bead support, and therefore the heat dissipation effect is improved, the heat dissipation disc is divided into two parts, the problem that in a special scheme, at least two kinds of chips are needed to be bipolar is solved, and the heat dissipation effect is improved. And the distance between the first heat dissipation disc and the second heat dissipation disc is increased, so that the problem of tin overlapping can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of lamp bead brackets, in particular to a patch lamp bead bracket with good heat dissipation effect. Background Technique

[0002] As the base material of lamp beads, the patch lamp bead bracket is an important material for patch lamp beads and a carrier for LED chips. The bracket is responsible for heat dissipation and conduction, and the quality of its design directly affects the use effect and service life of LED lamps.

[0003] At present, a heat dissipation plate is usually arranged at the bottom of the high-power patch lamp bead package to dissipate the heat generated when the lamp bead works. However, the heat dissipation plate is usually an integral structure, and there are requirements for the polarity of the chip in special applications, resulting in the inability to meet the application requirements. In addition, the contact area between the heat dissipation plate and the environment is small, and the heat dissipation performance is relatively poor in extreme environments. Therefore, a patch lamp bead bracket with good heat dissipation effect is proposed. Content of the Utility Model

[0004] In view of the deficiencies of the prior art, the utility model provides a patch lamp bead bracket with good heat dissipation effect, which has the advantages of good heat dissipation effect and so on.

[0005] To achieve the above object, the utility model provides the following technical solution: A patch lamp bead bracket with good heat dissipation effect, including a lamp bead bracket, a lamp bead body is arranged inside the lamp bead bracket, a heat-conducting outer frame is arranged outside the lamp bead bracket, a plurality of heat dissipation fins are embedded inside the heat-conducting outer frame, an arc-shaped through groove located on the side wall of the lamp bead bracket is opened inside the heat-conducting outer frame, and a first heat dissipation plate and a second heat dissipation plate are arranged at the bottom of the lamp bead bracket.

[0006] Further, a certain distance is left between the first heat dissipation plate and the second heat dissipation plate, pins are arranged on the side wall of the lamp bead bracket, and pin pads integrally fixed with the pins are arranged at the bottom of the lamp bead bracket.

[0007] Further, the arc-shaped through groove is a wavy structure, and the arc-shaped through groove is located at the four side positions of the lamp bead bracket.

[0008] Further, one end of the heat dissipation fin contacts the outer wall of the lamp bead bracket, and the end of the heat dissipation fin far from the lamp bead bracket penetrates through the heat-conducting outer frame and extends to the outside.

[0009] Further, two connecting plates are fixed on the side wall of the heat-conducting outer frame, a connecting groove is opened on the side wall of the heat-conducting outer frame far from the connecting plates, and the connecting plates are adapted to the connecting groove.

[0010] Further, the connecting plate is a "T" - shaped plate, the connecting groove is a "T" - shaped groove, and the width of the connecting plate is greater than the width of the connecting groove.

[0011] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0012] For the patch - type lamp bead bracket with good heat dissipation effect, by arranging a heat - conducting outer frame outside the lamp bead bracket, a plurality of heat - dissipating fins arranged on the heat - conducting outer frame can effectively conduct the heat in the lamp bead bracket, thereby improving the heat - dissipation effect. Dividing the heat - dissipation plate into two parts solves the problem that at least two chips need to be bipolar in a special solution, and increasing the distance between the first heat - dissipation plate and the second heat - dissipation plate can reduce the problem of solder bridging. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is the front view of the lamp bead bracket of the structure of the present utility model;

[0014] Figure 2 is the structure of the present utility model Figure 1 of the top view;

[0015] Figure 3 is the bottom view of the lamp bead bracket of the structure of the present utility model separated from the heat - conducting outer frame;

[0016] Figure 4 is the three - dimensional view of the connecting plate of the structure of the present utility model.

[0017] In the figure: 1, lamp bead bracket; 2, heat - conducting outer frame; 3, connecting plate; 4, pin; 5, lamp bead body; 6, heat - dissipating fin; 7, arc - shaped through - slot; 8, connecting groove; 9, first heat - dissipation plate; 10, second heat - dissipation plate; 11, pin pad. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0019] Please refer to Figures 1 to 4 , a patch - type lamp bead bracket with good heat - dissipation effect in this embodiment includes a lamp bead bracket 1, a lamp bead body 5 is arranged inside the lamp bead bracket 1, a heat - conducting outer frame 2 is arranged outside the lamp bead bracket 1, a plurality of heat - dissipating fins 6 are embedded inside the heat - conducting outer frame 2, an arc - shaped through - slot 7 located on the side wall of the lamp bead bracket 1 is opened inside the heat - conducting outer frame 2, and a first heat - dissipation plate 9 and a second heat - dissipation plate 10 are arranged at the bottom of the lamp bead bracket 1.

[0020] In this embodiment, there is a certain distance between the first heat dissipation plate 9 and the second heat dissipation plate 10. The side wall of the lamp bead bracket 1 is provided with pins 4, and the bottom of the lamp bead bracket 1 is provided with pin pads 11 integrally fixed with the pins 4.

[0021] By arranging a heat-conducting outer frame 2 outside the lamp bead bracket 1, a plurality of heat dissipation fins 6 arranged on the heat-conducting outer frame 2 can effectively conduct the heat inside the lamp bead bracket 1, thereby improving the heat dissipation effect. Dividing the heat dissipation plate into two parts solves the problem that at least two types of chips need to be bipolar in a special solution, and increasing the distance between the first heat dissipation plate 9 and the second heat dissipation plate 10 can reduce the problem of solder bridging.

[0022] It is worth mentioning that leaving a gap between the first heat dissipation plate 9 and the second heat dissipation plate 10 can reduce the problem of solder bridging and is not easy to be pasted crookedly.

[0023] Please refer to Figure 2 , the arc-shaped through groove 7 is a wavy structure. The arc-shaped through groove 7 is located at the four side positions of the lamp bead bracket 1. One end of the heat dissipation fin 6 is in contact with the outer wall of the lamp bead bracket 1, and the end of the heat dissipation fin 6 far from the lamp bead bracket 1 penetrates through the heat-conducting outer frame 2 and extends to the outside.

[0024] By arranging the arc-shaped through groove 7, the contact area between the heat dissipation fin 6 and the environment can be enlarged, thereby improving the heat dissipation effect.

[0025] Among them, one end of the heat dissipation fin 6 is in contact with the lamp bead bracket 1 and the other end extends into the environment. The heat dissipation fin 6 contacts the air flow in the environment to achieve a heat exchange effect, thereby improving the heat dissipation effect.

[0026] Please refer to Figure 2 , Figure 4 , in this example, two connecting plates 3 are fixed on the side wall of the heat-conducting outer frame 2. A connecting groove 8 is formed on the side wall of the heat-conducting outer frame 2 far from the connecting plates 3. The connecting plates 3 are adapted to the connecting groove 8. The connecting plates 3 are "T"-shaped plates, the connecting groove 8 is a "T"-shaped groove, and the width of the connecting plates 3 is greater than the width of the connecting groove 8.

[0027] It should be noted that by clamping the connecting plates 3 into the inside of the connecting groove 8 on the adjacent lamp bead heat-conducting outer frame 2 from top to bottom, a positioning effect can be achieved, making it not easy to be skewed during soldering.

[0028] The working principle of the above embodiments is as follows: By setting a heat-conducting outer frame 2 outside the lamp bead bracket 1, the multiple heat-dissipating fins 6 provided on the heat-conducting outer frame 2 can effectively conduct the heat in the lamp bead bracket 1, thereby improving the heat-dissipating effect. The setting of the connecting plate 3 and the connecting groove 8 has a positioning effect on the adjacent lamp bead brackets, making it not easy for the surface-mounted lamp beads to be pasted crookedly. Dividing the heat-dissipating plate into two parts solves the problem that at least two types of chips are required for special solutions and are bipolar, and increasing the distance between the first heat-dissipating plate 9 and the second heat-dissipating plate 10 can reduce the problem of solder bridging.

[0029] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0030] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A SMD lamp bead bracket with good heat dissipation effect, comprising a lamp bead bracket (1), characterized in that: A lamp bead body (5) is arranged inside the lamp bead bracket (1), a heat-conducting outer frame (2) is arranged outside the lamp bead bracket (1), a plurality of heat-dissipating fins (6) are embedded inside the heat-conducting outer frame (2), an arc-shaped through groove (7) located on the side wall of the lamp bead bracket (1) is opened inside the heat-conducting outer frame (2), and a first heat-dissipating plate (9) and a second heat-dissipating plate (10) are arranged at the bottom of the lamp bead bracket (1).

2. According to claim 1, a SMD lamp bead bracket with good heat dissipation effect is characterized in that: A certain distance is left between the first heat sink (9) and the second heat sink (10); a pin (4) is provided on the side wall of the lamp bead bracket (1); and a pin soldering pad (11) fixed integrally with the pin (4) is provided on the bottom of the lamp bead bracket (1).

3. According to claim 1, a SMD lamp bead bracket with good heat dissipation effect is characterized in that: The arc-shaped through groove (7) is a wave-shaped structure, and the arc-shaped through groove (7) is located at the four side positions of the lamp bead bracket (1).

4. According to claim 1, a SMD lamp bead bracket with good heat dissipation effect is characterized in that: One end of the heat dissipation fin (6) contacts the outer wall of the lamp bead bracket (1), and one end of the heat dissipation fin (6) away from the lamp bead bracket (1) penetrates the heat-conducting outer frame (2) and extends to the outside.

5. According to claim 1, a SMD lamp bead bracket with good heat dissipation effect is characterized in that: Two connecting plates (3) are fixed to the side wall of the heat-conducting outer frame (2), a connecting groove (8) is provided on a side wall of the heat-conducting outer frame (2) away from the connecting plates (3), and the connecting plates (3) are adapted to fit the connecting groove (8).

6. A SMD lamp bead bracket with good heat dissipation effect according to claim 5, characterized in that: The connecting plate (3) is a "T"-shaped plate, the connecting groove (8) is a "T"-shaped groove, and the width of the connecting plate (3) is greater than the width of the connecting groove (8).

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