LED lead frame

Abstract

The utility model relates to the technical field of LEDs, in particular to an LED lead frame, which comprises an LED wafer, a substrate and a bonding pad arranged on the substrate. The positive electrode and the negative electrode of the LED wafer are electrically connected with the corresponding positive electrode bonding pad and the corresponding negative electrode bonding pad respectively; the plurality of LED wafers are uniformly arranged on the substrate along the X direction and the Y direction respectively; the polarities of the adjacent LED wafers in the X direction are arranged in opposite directions; the polarities of the adjacent LED wafers in the Y direction are arranged in the same direction; and the bonding pads of the adjacent LED wafers in the Y direction are connected in series. The beneficial effects of the utility model are that the novel LED lead frame is designed, and the internal structure of a multi-surface light-emitting LED can be cut into a plurality of electric connection schemes such as single crystal, double crystal series connection, four crystal series connection, six crystal series connection and the like according to the requirements of different powers of the LED.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to an LED lead frame. Background Art

[0002] As a new type of solid semiconductor device, LEDs have been widely used in various industries due to their advantages of small size, light weight, high luminous efficiency, energy conservation and environmental protection. Currently, in the application of backlight POB products, in order to meet the requirement of reducing the mixing light distance of the TV backlight and making the TV body thinner and lighter, a larger angle of LED light emission is required.

[0003] Such as Figure 1 shown, for the commonly used molded multi-faceted light-emitting LEDs, although the light-emitting angle is larger than that of the LEDs with single-plane light emission, different types of molds need to be used separately for different models of molding, and the number of molds pressed each time by each device is also very limited. This results in low production efficiency of the molding process and high mold input costs. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide an LED lead frame, which can obtain LEDs with different powers by using one kind of LED lead frame.

[0005] To solve the above technical problem, the technical solution adopted by the utility model is to provide an LED lead frame, including an LED chip, a substrate and pads arranged on the substrate; the positive and negative electrodes of the LED chip are electrically connected to the corresponding positive and negative pads respectively;

[0006] A plurality of the LED chips are uniformly arranged on the substrate along the X direction and the Y direction respectively;

[0007] The polarities of the adjacent LED chips in the X direction are arranged in reverse; the polarities of the adjacent LED chips in the Y direction are arranged in the same direction;

[0008] The pads of the adjacent LED chips in the Y direction are connected in series;

[0009] For every other row of LED chips in the Y direction, the pads of the adjacent LED chips in the X direction are connected in series;

[0010] The adjacent LED chips with pads connected in series along the X direction are the first LED chip and the second LED chip; neither the first LED chip nor the second LED chip is connected in series with the pads of the adjacent LED chips along the X direction any more.

[0011] Further, in the above LED lead frame, 16 LED chips are arranged in a 4*4 matrix on the substrate along the X direction and the Y direction.

[0012] Further, in the above LED lead frame, 100 LED wafers are arranged in a 10*10 matrix along the X direction and the Y direction on the substrate.

[0013] Further, in the above LED lead frame, 400 LED wafers are arranged in a 20*20 matrix along the X direction and the Y direction on the substrate.

[0014] Further, in the above LED lead frame, the LED wafers are flip-chip mounted on the substrate.

[0015] Further, in the above LED lead frame, an encapsulation adhesive layer is provided on the LED wafer, and the encapsulation adhesive layer is silicone resin.

[0016] Further, the above LED lead frame includes a concave cup formed by etching the substrate to sink for accommodating the encapsulation colloid.

[0017] Further, the above LED lead frame includes a concave bowl cup formed by using dam adhesive in a dam process on the substrate for accommodating the encapsulation colloid.

[0018] The beneficial effects of the present utility model are as follows: The present utility model designs a new type of LED lead frame. After etching a circuit structure for multiple wafers by sinking the substrate and then dispensing, encapsulating, curing, and cutting. This LED lead frame can not only be encapsulated by a dispensing process with higher production efficiency, but also cut the internal structure of the multi-sided lighting LED into various electrical connection schemes such as single crystal, double crystal in series, four crystals in series, six crystals in series, etc. according to the requirements for different powers of the LED, solving the repeated design of the lead frame and mold opening due to different power requirements, simplifying the production process, and reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of an existing LED lead frame;

[0020] Figure 2 is a schematic cross-sectional structural diagram of an LED lead frame according to a specific embodiment of the present utility model;

[0021] Figure 3 is a schematic structural diagram of another LED lead frame according to a specific embodiment of the present utility model;

[0022] Figure 4 is Figure 3 a schematic diagram of the internal structure of an LED obtained by cutting the LED lead frame;

[0023] Figure 5 is Figure 3 a schematic diagram of the internal structure of an LED obtained by cutting the LED lead frame;

[0024] Figure 6 Schematic diagram of the internal structure of an LED obtained by cutting an LED lead frame Figure 3 for

[0025] Figure 7 Schematic diagram of the internal structure of an LED obtained by cutting an LED lead frame Figure 3 for

[0026] Figure 8 Schematic diagram of the internal structure of an LED obtained by cutting an LED lead frame Figure 3 for

[0027] Figure 9 Schematic diagram of the internal structure of an LED obtained by cutting an LED lead frame Figure 3 for

[0028] Label description:

[0029] 1. LED chip; 2. Substrate; 3. Pad; 4. Encapsulation colloid; 5. X direction; 6. Y direction. Specific implementation mode

[0030] To describe in detail the technical content, achieved purpose and effect of the present invention, the following is described in conjunction with the implementation mode and with reference to the drawings.

[0031] Please refer to Figure 2-3 , the present invention provides an LED lead frame, including an LED chip 1, a substrate 2 and pads 3 provided on the substrate 2; the positive and negative electrodes of the LED chip 1 are electrically connected to the corresponding positive and negative pads 3 respectively;

[0032] A plurality of the LED chips 1 are uniformly arranged on the substrate 2 along the X direction 5 and the Y direction 6 respectively;

[0033] The polarities of the adjacent LED chips 1 in the X direction 5 are arranged in reverse; the polarities of the adjacent LED chips 1 in the Y direction 6 are arranged in the same direction;

[0034] The pads of the adjacent LED chips 1 in the Y direction 6 are connected in series;

[0035] For every other row of LED chips 1 in the Y direction 6, the pads of the adjacent LED chips 1 in the X direction 5 are connected in series;

[0036] The adjacent LED chips 1 whose pads are connected in series along the X direction 5 are the first LED chip 1 and the second LED chip 1; neither the first LED chip nor the second LED chip is connected in series with the pads of the adjacent LED chips along the X direction.

[0037] The beneficial effects of the present utility model are as follows: By designing a novel LED lead frame, the present utility model etches the circuit structures of multiple wafers by sinking on the substrate, and then performs dotting, encapsulation, curing, and cutting. This LED lead frame can not only be encapsulated by a dotting process with higher production efficiency, but also cut the internal structure of the multi-sided lighting LED into various electrical connection schemes such as single crystal, double crystal in series, four crystals in series, and six crystals in series according to the requirements of different LED powers, solving the repeated design of the lead frame and the mold opening due to the requirements of different powers, simplifying the production process and reducing the production cost.

[0038] Further, in the above-mentioned LED lead frame, 16 LED wafers arranged in a 4*4 matrix are provided on the substrate along the X direction and the Y direction.

[0039] Further, in the above-mentioned LED lead frame, 100 LED wafers arranged in a 10*10 matrix are provided on the substrate along the X direction and the Y direction.

[0040] Further, in the above-mentioned LED lead frame, 400 LED wafers arranged in a 20*20 matrix are provided on the substrate along the X direction and the Y direction.

[0041] Further, in the above-mentioned LED lead frame, the LED wafers are flip-chip mounted on the substrate.

[0042] Further, in the above-mentioned LED lead frame, an encapsulation glue layer is provided on the LED wafers, and the encapsulation glue layer is silicone resin.

[0043] Further, the above-mentioned LED lead frame includes a concave cup formed by etching the substrate to sink for accommodating the encapsulation colloid.

[0044] Further, the above-mentioned LED lead frame includes a concave bowl cup formed by using dam glue in a dam process on the substrate for accommodating the encapsulation colloid.

[0045] Embodiment 1

[0046] Please refer to Figure 2-9 , this embodiment discloses an LED lead frame, including an LED wafer 1, a substrate 2, and pads 3 provided on the substrate 2; the positive and negative electrodes of the LED wafer 1 are respectively electrically connected to the corresponding positive and negative pads 3;

[0047] A plurality of the LED wafers 1 are uniformly arranged on the substrate 2 along the X direction 5 and the Y direction 6 respectively;

[0048] The polarities of the adjacent LED wafers 1 in the X direction 5 are arranged in reverse; the polarities of the adjacent LED wafers 1 in the Y direction 6 are arranged in the same direction;

[0049] The pads of adjacent LED wafers 1 in the Y direction 6 are connected in series;

[0050] For every other row of LED wafers 1 in the Y direction 6, the pads of adjacent LED wafers 1 in the X direction 5 are connected in series;

[0051] The adjacent LED wafers 1 with pads connected in series in the X direction 5 are the first LED wafer 1 and the second LED wafer 1; neither the first LED wafer nor the second LED wafer is connected in series with the pads of adjacent LED wafers in the X direction.

[0052] 100 LED wafers are arranged in a 10*10 matrix on the substrate in the X and Y directions.

[0053] On the front of the substrate of the above LED lead frame, a first circuit layer is provided by a sinking etching technique and combined with the periphery of the substrate to form a concave bowl cup. The first circuit layer includes multiple groups of positive and negative pad groups. A second circuit layer is provided in the middle layer of the substrate. The second circuit layer connects and conducts specific parts of the positive and negative pads of the first circuit layer. A third circuit layer is provided on the back of the substrate. The third circuit layer includes multiple groups of positive and negative pad groups that are conductively connected to the positive and negative pad groups of the first layer circuit layer one by one. The LED wafers are respectively electrically connected to a group of positive and negative pads on the front of the substrate.

[0054] The encapsulation colloid of the above LED lead frame is encapsulated and cured by a dispensing process. After curing, it is cut and formed. The cutting includes the following methods:

[0055] 1. Cutting along the cutting lines corresponding to the 1-11 notches in the X and Y directions can obtain a multi-faceted light-emitting LED with a single LED wafer structure as Figure 4 ;

[0056] 2. Cutting along the cutting lines corresponding to the 1-11 notches in the Y direction and the cutting lines corresponding to the 3rd, 5th, 7th, 9th, and 11th notches in the X direction can obtain a multi-faceted light-emitting LED with a double-crystal series internal structure as Figure 5 ;

[0057] 3. Cutting along the cutting line corresponding to the 3rd notch in the Y direction and the cutting line corresponding to the 3rd notch in the X direction can obtain a multi-faceted light-emitting LED with a four-crystal series internal structure as Figure 6 ;

[0058] 4. Cutting along the cutting line corresponding to the 3rd notch in the Y direction and the cutting line corresponding to the 5th notch in the X direction can obtain a multi-faceted light-emitting LED with a six-crystal series internal structure as Figure 7 ;

[0059] And so on, a multi-faceted light-emitting LED with an internal structure such as Figure 8 eight-crystal series can be obtained. Figure 9Multi-faceted light-emitting LEDs with various arrangements such as ten crystals in series.

[0060] The above are only embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent transformation made by using the content of the specification and drawings of the present invention, or directly or indirectly applied in the related technical fields, shall be included in the patent protection scope of the present invention by the same token.

Claims

1. An LED lead frame, characterized in that: It includes an LED chip, a substrate and a solder pad arranged on the substrate; the positive and negative electrodes of the LED chip are electrically connected to the corresponding positive and negative solder pads respectively; The plurality of LED chips are evenly arranged on the substrate along the X direction and the Y direction respectively; The polarities of the adjacent LED chips in the X direction are arranged in opposite directions; the polarities of the adjacent LED chips in the Y direction are arranged in the same direction; The pads of the adjacent LED chips in the Y direction are connected in series; Every other row of LED chips in the Y direction, the pads of the adjacent LED chips in the X direction are connected in series; The adjacent LED chips with solder pads connected in series along the X direction are the first LED chip and the second LED chip; the first LED chip and the second LED chip are no longer connected in series with the solder pads of the adjacent LED chips along the X direction.

2. The LED lead frame according to claim 1, characterized in that: 16 LED chips arranged in a 4*4 matrix are arranged on the substrate along the X direction and the Y direction.

3. The LED lead frame according to claim 1, characterized in that: 100 LED chips arranged in a 10*10 matrix are arranged on the substrate along the X direction and the Y direction.

4. The LED lead frame according to claim 1, characterized in that: 400 LED chips arranged in a 20*20 matrix are arranged on the substrate along the X direction and the Y direction.

5. The LED lead frame according to claim 1, characterized in that: The LED chip is flip-chip mounted on the substrate.

6. The LED lead frame according to claim 1, characterized in that: A packaging adhesive layer is arranged on the LED chip, and the packaging adhesive layer is silicone resin.

7. The LED lead frame according to claim 6, characterized in that: The method comprises etching the substrate downward to form a concave cup for accommodating the encapsulation colloid.

8. The LED lead frame according to claim 6, characterized in that: The invention comprises adopting dam glue to form a concave cup on a substrate to accommodate the packaging colloid by a dam process.

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