High-thermal-conductivity underfill processing device

By introducing a stirring rod and a motor into the high-thermal conductivity underfill processing device, uniform heating and accelerated gelation of the rubber particles are achieved, and the problem of uneven heating of the rubber particles in the prior art is solved, and the efficiency and quality of the rubber particles are improved.

CN222943455UActive Publication Date: 2025-06-06TIANJIN REAINS TECH CO LTD
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Patent Information

Application Number
CN202421814631.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-30
Publication Date
2025-06-06
Estimated Expiration
2034-07-30

AI Technical Summary

Technical Problem

When used in the existing high-thermal conductivity underfill processing device, the glue particles are prone to uneven heating, and it is impossible to ensure the sufficient melting of the glue particles.

Method used

A processing device including a filler processing cylinder, a stirring bar rod and a motor is designed. By rotating the stirrer rod in the filler processing cylinder, the particles in the filler processing cylinder are stirred to make the glue particles uniformly heated and accelerate the gelation process.

Benefits of technology

Through uniform heating and stirring, the glue particles are fully melted and gelled, the glue filling process is accelerated, and the product quality is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

A high-thermal-conductivity underfill processing device comprises a filling processing barrel, vertical supporting legs, a heating ring rod, a circular side cover, a circular side baffle, a positioning shaft rod, a stirring strip rod, a motor, a vertical push-pull rod, a positioning ring and a rotating clamping plate, the lower portion of the filling processing barrel is connected with the vertical supporting legs, and the multiple vertical supporting legs are distributed at the bottom of the filling processing barrel; the upper portion of the glue filling processing cylinder is provided with a feeding hopper, the upper portion of the feeding hopper is connected with a feeding hopper cover, a plurality of heating ring rods are inserted into and connected with the interior of the glue filling processing cylinder, the round side covers are connected with the glue filling processing cylinder, the round side covers are symmetrically arranged at the two ends of the glue filling processing cylinder, and the round side covers and the glue filling processing cylinder are the same in outer diameter. The circular side baffles are matched with the glue filling processing barrel, the circular side baffles are inserted into the glue filling processing barrel and rotate in the glue filling processing barrel, the stirring bar is connected with the circular side baffles, and the circular side baffles are symmetrically arranged on the two sides of the stirring bar.
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Description

Technical Field

[0001] The utility model relates to the field of high thermal conductivity bottom filling glue, in particular to a high thermal conductivity bottom filling glue processing device. Background Art

[0002] High thermal conductivity bottom fill has high fluidity and low thermal expansion coefficient properties, and is widely used for filling and reinforcing chips on PLC carriers. However, the existing filling requires the glue particles to be melted during processing. However, the existing processing equipment is prone to uneven heating of the glue particles during use, and it is impossible to ensure that the glue particles are fully melted, which needs to be improved. Summary of the invention

[0003] The utility model aims at the above-mentioned deficiencies in the prior art and provides a high thermal conductivity bottom glue processing device, in which a stirring bar rotates in a glue processing cylinder to stir particles in the glue processing cylinder, so that the glue particles in the glue processing cylinder are evenly heated and the gelling of the particles is accelerated.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A high thermal conductivity bottom glue filling processing device comprises a glue filling processing cylinder, vertical support feet, a heating ring rod, a circular side cover, a circular side baffle, a positioning shaft rod, a stirring bar rod, a motor, a vertical push-pull rod, a positioning ring, and a rotating clamping plate. The lower part of the glue filling processing cylinder is connected to the vertical support feet, and multiple vertical support feet are distributed at the bottom of the glue filling processing cylinder. The upper part of the glue filling processing cylinder is provided with a feeding hopper, and the upper part of the feeding hopper is connected to the feeding hopper cover. Multiple heating ring rods are inserted into and connected to the inside of the glue filling processing cylinder, the circular side cover is connected to the glue filling processing cylinder, the circular side cover is symmetrically arranged at both ends of the glue filling processing cylinder, the circular side cover has the same outer diameter as the glue filling processing cylinder, the side of the circular side cover has a side cover boss, the circular side baffle is adapted to the glue filling processing cylinder, the circular side baffle is inserted into the glue filling processing cylinder, the circular side baffle rotates in the glue filling processing cylinder, the stirring bar rod is connected to the circular side baffle, and the circular side baffle is symmetrically arranged on both sides of the stirring bar rod.

[0006] The side surface of the circular side baffle is fitted with the circular side cover, the side surface of the circular side baffle is connected to the positioning shaft rod, the positioning shaft rod is adapted to the side cover boss, the positioning shaft rod is inserted into the side cover boss, the positioning shaft rod rotates in the side cover boss, the motor mounting plate is connected to the circular side cover, the lower part of the motor is connected to the motor mounting plate, and the motor shaft is connected to the positioning shaft rod through a docking sleeve.

[0007] The bottom of the glue filling processing cylinder is provided with a discharge pipe, a positioning ring is adapted to the discharge pipe, the positioning ring is inserted into the discharge pipe, the positioning ring is connected to the discharge pipe, a vertical push-pull rod is adapted to the positioning ring, the vertical push-pull rod is inserted into the positioning ring, the vertical push-pull rod slides in the positioning ring, the vertical push-pull rod is inserted into the discharge pipe, and the upper part of the vertical push-pull rod is connected to an arc baffle.

[0008] The arc-shaped baffle is placed in the glue filling processing cylinder, and the lower surface of the arc-shaped baffle is in contact with the glue filling processing cylinder. The side of the vertical push-pull rod is provided with a push-pull rod side plate, and the upper surface of the rotating clamping plate is in contact with the glue filling processing cylinder. The connecting shaft passes through the rotating clamping plate to connect the glue filling processing cylinder, and the connecting shaft rotates in the rotating clamping plate. The lower part of the rotating clamping plate is provided with a rotating clamping plate lower plate, and the lower surface of the rotating clamping plate lower plate is in contact with the push-pull rod side plate. Beneficial Effects

[0009] 1. The two ends of the glue filling processing cylinder of the utility model are connected with symmetrical circular side covers. The glue filling processing cylinder and the circular side covers form a sol cylinder. In the glue filling processing of the high thermal conductivity bottom, multiple heating ring rods are distributed inside the glue filling processing cylinder to heat and melt the glue particles in the glue filling processing cylinder. The positioning shaft rod passes through the side cover boss to connect the circular side cover. The positioning shaft rod supports the circular side baffle. The positioning shaft rod drives the circular side cover to rotate. When the circular side cover rotates, the stirring bar rod rotates in the glue filling processing cylinder. The rotation of the stirring bar rod in the glue filling processing cylinder stirs the particles in the glue filling processing cylinder, so that the glue particles in the glue filling processing cylinder are evenly heated and the gelation of the particles is accelerated. The motor is installed and fixed on the motor mounting plate. The motor drives the positioning shaft rod to rotate, so that the stirring bar rod stirs in the glue filling processing cylinder. The vertical push-pull rod passes through the positioning ring to connect the arc baffle. The positioning ring straightens the vertical push-pull rod so that the vertical push-pull rod is centered in the discharge pipe.

[0010] 2. The utility model has a rotating card plate fixed at the bottom of the glue filling processing cylinder by a connecting shaft, and the rotating card plate can rotate. When the rubber particles are heated, the lower surface of the lower plate of the rotating card plate fits with the discharge pipe. At this time, the arc-shaped baffle blocks the discharge pipe. When the rubber particles need to be discharged after gelation, the rotating card plate is rotated to disconnect the lower plate of the rotating card plate from the side plate of the push-pull rod. At this time, the vertical push-pull rod is pushed upward to disconnect the arc-shaped baffle from the glue filling processing cylinder until the upper surface of the side plate of the push-pull rod fits with the glue filling processing cylinder. At this time, the rotating card plate is rotated to make the lower surface of the side plate of the push-pull rod fit with the rotating card plate. The rotating card plate positions the vertical push-pull rod, thereby ensuring the disconnected state between the arc-shaped baffle and the glue filling processing cylinder. In the high thermal conductivity bottom glue filling processing, the glue in the glue filling processing cylinder flows downward along the arc-shaped baffle and the discharge pipe. It is easy to use and operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure of the glue filling processing cylinder, the vertical push-pull rod and the rotating clamping plate described in the utility model.

[0012] Figure 2 This is a front and sectional view of a high thermal conductivity bottom filling glue processing device described in the utility model.

[0013] Figure 3 The utility model is a top cross-sectional view of a high thermal conductivity bottom filling glue processing device.

[0014] Figure 4The utility model is a side sectional view of a high thermal conductivity bottom filling glue processing device. DETAILED DESCRIPTION

[0015] The utility model is further described in detail below according to the accompanying drawings and embodiments:

[0016] Embodiment 1:

[0017] A high thermal conductivity bottom filling glue processing device, comprising a filling glue processing cylinder 01, a vertical support leg 02, a heating ring rod 03, a circular side cover 04, a circular side baffle 06, a positioning shaft rod 07, a stirring bar rod 08, a motor 12, a vertical push-pull rod 15, a positioning ring 17, and a rotating clamping plate 19. The lower part of the filling glue processing cylinder 01 is connected to the vertical support leg 02, and a plurality of vertical support legs 02 are distributed at the bottom of the filling glue processing cylinder 01. The upper part of the filling glue processing cylinder 01 is provided with a feeding hopper 09, and the upper part of the feeding hopper 09 is connected to the feeding hopper cover 10. A plurality of heating ring rods 03 are inserted into and connected to the inside of the filling glue processing cylinder 01. The circular side cover 04 is connected to the filling glue processing cylinder 01. The circular side cover 04 is aligned at both ends of the filling glue processing cylinder 01. It is called a setting, two ends of the glue filling processing cylinder 01 are connected to symmetrical circular side covers 04, the glue filling processing cylinder 01 and the circular side covers 04 form a sol cylinder, in the high thermal conductivity bottom filling processing, multiple heating ring rods 03 are distributed inside the glue filling processing cylinder 01 to heat and melt the glue particles in the glue filling processing cylinder 01, the circular side cover 04 has the same outer diameter as the glue filling processing cylinder 01, the side of the circular side cover 04 has a side cover boss 05, the circular side baffle 06 is adapted to the glue filling processing cylinder 01, the circular side baffle 06 is inserted into the glue filling processing cylinder 01, the circular side baffle 06 rotates in the glue filling processing cylinder 01, the stirring bar rod 08 is connected to the circular side baffle 06, and the circular side baffle 06 is symmetrically arranged on both sides of the stirring bar rod 08.

[0018] Embodiment 2:

[0019] The circular side baffle 06 of the utility model is fitted with the circular side cover 04, the circular side baffle 06 is connected to the positioning shaft 07 on the side, the positioning shaft 07 is adapted to the side cover boss 05, the positioning shaft 07 is inserted into the side cover boss 05, the positioning shaft 07 rotates in the side cover boss 05, the positioning shaft 07 passes through the side cover boss 05 to connect the circular side cover 04, the positioning shaft 07 supports the circular side baffle 06, the positioning shaft 07 drives the circular side cover 04 to rotate, and when the circular side cover 04 rotates, the stirring bar 08 is filled with glue during the processing The stirring bar 08 rotates in the glue filling processing cylinder 01, and the rotation of the stirring bar 08 in the glue filling processing cylinder 01 stirs the particles in the glue filling processing cylinder 01, so that the rubber particles in the glue filling processing cylinder 01 are evenly heated, and the gelation of the particles is accelerated. The motor mounting plate 13 is connected to the circular side cover 04, and the lower part of the motor 12 is connected to the motor mounting plate 13. The rotating shaft of the motor 12 is connected to the positioning shaft 07 through the docking sleeve 11. The motor 12 is installed and fixed on the motor mounting plate 13. The motor 12 drives the positioning shaft 07 to rotate, so that the stirring bar 08 stirs in the glue filling processing cylinder 01.

[0020] Embodiment 3:

[0021] The bottom of the glue filling processing cylinder 01 of the utility model is provided with a discharge pipe 14, a positioning ring 17 adapted to the discharge pipe 14, the positioning ring 17 is inserted into the discharge pipe 14, the positioning ring 17 is connected to the discharge pipe 14, a vertical push-pull rod 15 adapted to the positioning ring 17, the vertical push-pull rod 15 is inserted into the positioning ring 17, the vertical push-pull rod 15 slides in the positioning ring 17, the positioning ring 17 straightens the vertical push-pull rod 15 so that the vertical push-pull rod 15 is centered in the discharge pipe 14, the vertical push-pull rod 15 is inserted into the discharge pipe 14, and the upper part of the vertical push-pull rod 15 is connected to an arc-shaped baffle plate 16.

[0022] Embodiment 4:

[0023] The arc baffle 16 of the utility model is placed in the glue filling processing cylinder 01, the lower surface of the arc baffle 16 is in contact with the glue filling processing cylinder 01, the side of the vertical push-pull rod 15 is provided with a push-pull rod side plate 18, the upper surface of the rotating clamping plate 19 is in contact with the glue filling processing cylinder 01, the connecting shaft 20 passes through the rotating clamping plate 19 to connect the glue filling processing cylinder 01, the connecting shaft 20 rotates in the rotating clamping plate 19, the lower part of the rotating clamping plate 19 is provided with a rotating clamping plate lower plate 21, the lower surface of the rotating clamping plate lower plate 21 is in contact with the push-pull rod side plate 18, the rotating clamping plate 19 is fixed to the bottom of the glue filling processing cylinder 01 through the connecting shaft 20, the rotating clamping plate 19 is rotatable, and when the rubber particles are heated, the lower surface of the rotating clamping plate lower plate 21 is in contact with the discharge pipe 148, at this time, the arc baffle 1 6 The discharge pipe 14 is blocked. When the rubber particles need to be discharged after gelation, the rotating clamping plate 19 is rotated to disconnect the lower plate 21 of the rotating clamping plate from the push-pull rod side plate 18. At this time, the vertical push-pull rod 15 is pushed upward to disconnect the arc baffle 16 from the glue filling processing cylinder 01 until the upper surface of the push-pull rod side plate 18 fits with the glue filling processing cylinder 01. At this time, the rotating clamping plate 19 is rotated to make the lower surface of the push-pull rod side plate 18 fit with the rotating clamping plate 19. The rotating clamping plate 19 positions the vertical push-pull rod 15, thereby ensuring the disconnection state between the arc baffle 16 and the glue filling processing cylinder 01. In the high thermal conductivity bottom glue filling processing, the glue in the glue filling processing cylinder 01 flows downward along the arc baffle 16 and the discharge pipe 14, which is easy to use and operate.

[0024] Embodiment 5:

[0025] The installation steps of the utility model are as follows: first, insert the discharge pipe 14 into and connect the discharge pipe 14, pass the vertical push-pull rod 15 through the positioning ring 17 to connect the arc baffle 16, install the heating ring rod 03 in the glue filling processing cylinder 01, connect the two ends of the stirring bar rod 08 to the circular side baffle 06, connect the positioning shaft rod 07 to the circular side baffle 06, connect the circular side cover 04 to the glue filling processing cylinder 01, pass the positioning shaft rod 07 through the side cover boss 05, connect the upper part of the feeding hopper 09 to the feeding hopper cover 10, connect the discharge pipe 143 to the glue filling processing cylinder 01, connect the rotating shaft of the motor 12 to the positioning shaft rod 07 through the docking sleeve 11, connect the lower part of the motor 12 to the motor mounting plate 13, connect the lower part of the glue filling processing cylinder 01 to the vertical support foot 02, and rotate the clamping plate 19 to connect the glue filling processing cylinder 01 through the connecting shaft 20.

[0026] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention.

Claims

1. A high thermal conductivity underfill processing device, characterized in that The invention comprises a glue filling processing cylinder (01), a vertical support leg (02), a heating ring rod (03), a circular side cover (04), a circular side baffle (06), a positioning shaft rod (07), a stirring bar rod (08), a motor (12), a vertical push-pull rod (15), a positioning ring (17), and a rotating clamping plate (19). The lower part of the glue filling processing cylinder (01) is connected to the vertical support leg (02), and a plurality of vertical support legs (02) are distributed at the bottom of the glue filling processing cylinder (01). The upper part of the glue filling processing cylinder (01) is provided with a feeding hopper (09), and the upper part of the feeding hopper (09) is connected to the feeding hopper cover (10). A plurality of heating ring rods (03) are inserted into and connected to the glue filling processing cylinder (01). Inside the working cylinder (01), a circular side cover (04) is connected to the glue filling processing cylinder (01), the circular side cover (04) is symmetrically arranged at both ends of the glue filling processing cylinder (01), the circular side cover (04) and the glue filling processing cylinder (01) have the same outer diameter, the side of the circular side cover (04) is provided with a side cover boss (05), the circular side baffle (06) is adapted to the glue filling processing cylinder (01), the circular side baffle (06) is inserted into the glue filling processing cylinder (01), the circular side baffle (06) rotates in the glue filling processing cylinder (01), and the stirring bar rod (08) is connected to the circular side baffle (06), and the circular side baffle (06) is symmetrically arranged on both sides of the stirring bar rod (08).

2. A high thermal conductivity underfill processing device according to claim 1, characterized in that The side surface of the circular side baffle (06) is fitted with the circular side cover (04), the side surface of the circular side baffle (06) is connected to the positioning shaft (07), the positioning shaft (07) is adapted to the side cover boss (05), the positioning shaft (07) is inserted into the side cover boss (05), the positioning shaft (07) rotates in the side cover boss (05), the motor mounting plate (13) is connected to the circular side cover (04), the lower part of the motor (12) is connected to the motor mounting plate (13), and the rotating shaft of the motor (12) is connected to the positioning shaft (07) through the docking sleeve (11).

3. A high thermal conductivity underfill processing device according to claim 2, characterized in that The bottom of the glue filling processing cylinder (01) is provided with a discharge pipe (14), a positioning ring (17) is adapted to the discharge pipe (14), the positioning ring (17) is inserted into the discharge pipe (14), the positioning ring (17) is connected to the discharge pipe (14), a vertical push-pull rod (15) is adapted to the positioning ring (17), the vertical push-pull rod (15) is inserted into the positioning ring (17), the vertical push-pull rod (15) slides in the positioning ring (17), the vertical push-pull rod (15) is inserted into the discharge pipe (14), and the upper part of the vertical push-pull rod (15) is connected to an arc-shaped baffle plate (16).

4. A high thermal conductivity underfill processing device according to claim 3, characterized in that The arc-shaped baffle plate (16) is placed in the glue filling processing cylinder (01), and the lower surface of the arc-shaped baffle plate (16) is in contact with the glue filling processing cylinder (01). The side of the vertical push-pull rod (15) is provided with a push-pull rod side plate (18). The upper surface of the rotating clamping plate (19) is in contact with the glue filling processing cylinder (01). The connecting shaft (20) passes through the rotating clamping plate (19) and is connected to the glue filling processing cylinder (01). The connecting shaft (20) rotates in the rotating clamping plate (19); the lower part of the rotating clamping plate (19) is provided with a rotating clamping plate lower plate (21), and the lower surface of the rotating clamping plate lower plate (21) is in contact with the push-pull rod side plate (18).