Spraying head structure capable of automatically leveling
By designing an automatically leveled spray head structure, and using the cooperation of pushing components and sliding components, the problem of inconvenient height adjustment in traditional spray head structures during processing of semiconductor sheets of different thicknesses is solved, achieving high-precision spraying treatment and cost reduction.
Patent Information
- Application Number
- CN202421781862.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-25
AI Technical Summary
When the traditional spray head structure processes semiconductor plate-like materials of different thicknesses, it is not convenient to adjust the height of the spray head, resulting in higher processing costs.
An automatic leveling spray head structure is designed. By pushing the cooperation between the assembly and the sliding assembly, the height of the spray assembly can be adjusted according to the thickness of the semiconductor plate-like material, ensuring that the spray assembly and the surface of the semiconductor sheet are kept in high-precision parallel.
It realizes flexible adjustment of the spray head height, improves the spraying accuracy of semiconductor sheets of different thicknesses, and reduces processing costs.
Smart Images
Figure CN222943734U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of spray heads, and in particular to a spray head structure capable of automatic leveling. Background Art
[0002] A spray head is a device used to spray paint on the surface of semiconductor plate-like materials. When the spray head processes semiconductor plate-like materials, the semiconductor plate-like materials are generally placed on a processing table first, and then the paint is sprayed on the semiconductor plate-like materials through the spray head fixed on the processing table, thereby achieving spray processing of the semiconductor plate-like materials.
[0003] The traditional spray head structure is generally fixed directly on the processing table and sprays at a fixed height. However, when processing semiconductor plate materials of different thicknesses, it is inconvenient to adjust the height of the spray head, so different types of spray head structures need to be used for processing, which leads to higher processing costs. Utility Model Content
[0004] The utility model aims to provide a spray head structure capable of automatic leveling, so as to solve the problem in the prior art that when the spray head processes semiconductor plate-like materials, it is inconvenient to adjust according to the height of the semiconductor plate-like materials.
[0005] The utility model provides the following technical solutions: a spray head structure capable of automatic leveling, comprising a fixed frame, a spray assembly fixedly connected to the outer side of the middle end of the fixed frame, and a connecting assembly fixedly connected to an end of the spray assembly away from the fixed frame, a first coating assembly fixedly connected to one end of the connecting assembly, and a second coating assembly is arranged at an end of the connecting assembly away from the first coating assembly, a pushing assembly fixedly connected to an end of the second coating assembly close to the connecting assembly, and a sliding assembly fixedly connected to an end of the pushing assembly close to the connecting assembly, an end of the sliding assembly close to the connecting assembly is fixedly connected to the connecting assembly, and a positioning assembly is fitted to the outer side of an end of the spray assembly away from the fixed frame.
[0006] Furthermore, the spraying assembly includes a sprayer fixedly connected to the outer side of the middle end of the fixing frame, a first connecting end fixedly connected to the outer side of the upper end of the sprayer, and a first rotating joint fixedly connected to the outer side of the middle end of the sprayer.
[0007] Furthermore, the connecting assembly includes a connecting plate arranged outside the middle end of the sprayer, and a slot is opened at the middle end of the connecting plate, the inner side of the slot is sleeved on the outside of the first rotating joint, and both ends of the connecting plate are fixedly connected to the fixing frame.
[0008] Furthermore, the first coating assembly includes a second rotating joint fixedly connected to the outer side of one end of the connecting plate away from the fixing frame, and the lower end of the second rotating joint is fixedly connected to the first controller.
[0009] Furthermore, the second coating assembly includes a third rotating joint arranged at one end of the connecting plate away from the second rotating joint, and the second controller is fixedly connected to the outer side of the lower end of the third rotating joint.
[0010] Furthermore, the pushing assembly includes an electric cylinder arranged near one end of the fixed frame of the third rotating joint, and a push plate is fixedly connected to the outer side of the upper end of the electric cylinder, and the outer side of the middle end of the electric cylinder is fixedly connected to the third rotating joint.
[0011] Furthermore, the sliding assembly includes a slide plate fixedly connected to one end of the electric cylinder away from the third rotating joint, and one end of the slide plate away from the electric cylinder is sleeved with a slide rail, and one end of the slide rail away from the slide plate is fixedly connected to the connecting plate.
[0012] Furthermore, the positioning assembly includes a mounting plate that is fitted onto one end of the first rotating joint away from the sprayer, and a first nozzle is provided on the inner side of the middle end of the mounting plate, the inner side of the first nozzle is sleeved on the outer side of the first rotating joint, and second nozzles are provided at both ends of the mounting plate, the inner side of the second nozzle is sleeved on the outer sides of the second rotating joint and the third rotating joint.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] This type of spray head structure that can automatically level is used to process semiconductor plate-like materials. When the semiconductor plate-like materials are first placed on the processing table, and then according to the thickness of the semiconductor plate-like materials, the pushing component can be started to drive the second coating component to move a small distance. At the same time, the position of the pushing component can be adjusted by the sliding component, so that the height of the spray component and the surface of the semiconductor plate material can be kept parallel with higher precision, which is convenient for subsequent spraying processing. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is an overall schematic diagram of a spray head structure capable of automatic leveling;
[0016] Figure 2 A schematic diagram of the expanded structure of a clamping component of a spray head structure capable of automatic leveling;
[0017] Figure 3 for Figure 2 A schematic diagram of the structure enlargement in the middle;
[0018] Figure 4 This is an enlarged schematic diagram of the structure of the clamping component of a spray head structure that can automatically level itself.
[0019] In the figure: 1, fixing frame; 2, sprayer; 21, first connection end; 22, first rotating joint; 3, connecting plate; 31, slot; 4, second rotating joint; 41, first controller; 5, third rotating joint; 51, second controller; 6, electric cylinder; 61, push plate; 7, slide plate; 71, slide rail; 8, mounting plate; 81, first nozzle; 82, second nozzle. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0021] like Figure 1-Figure 4 As shown, the utility model provides a technical solution: a spray head structure capable of automatic leveling, comprising a fixed frame 1, a spray assembly is fixedly connected to the outer side of the middle end of the fixed frame 1, and the end of the spray assembly away from the fixed frame 1 is fixedly connected to a connecting assembly, one end of the connecting assembly is fixedly connected to a first coating assembly, and the end of the connecting assembly away from the first coating assembly is provided with a second coating assembly, the end of the second coating assembly close to the connecting assembly is fixedly connected to a pushing assembly, and the end of the pushing assembly close to the connecting assembly is fixedly connected to a sliding assembly, the end of the sliding assembly close to the connecting assembly is fixedly connected to the connecting assembly, and a positioning assembly is attached to the outer side of the end of the spray assembly away from the fixed frame 1. When processing semiconductor plate-like materials, the semiconductor plate-like materials are first placed on the processing table, and then when adjusting according to the thickness of the semiconductor plate-like materials, the pushing assembly can be started to drive the second coating assembly to move a small distance, and the position of the pushing assembly can also be adjusted by the sliding assembly, so that the height of the spray assembly is kept parallel to the surface of the semiconductor sheet material with higher precision, thereby facilitating subsequent spraying processing.
[0022] like Figure 2 As shown, the spraying assembly includes a sprayer 2 fixedly connected to the outer side of the middle end of the fixed frame 1, and a first connecting end 21 is fixedly connected to the outer side of the upper end of the sprayer 2, and a first rotating joint 22 is fixedly connected to the outer side of the middle end of the sprayer 2. The sprayer 2 is controlled by the first connecting end 21, so that the paint can be sprayed out from the first rotating joint 22.
[0023] like Figure 2 As shown, the connecting assembly includes a connecting plate 3 arranged on the outer side of the middle end of the sprayer 2, and a card slot 31 is opened at the middle end of the connecting plate 3, the inner side of the card slot 31 is sleeved on the outer side of the first rotating joint 22, and the two ends of the connecting plate 3 are fixedly connected to the fixing frame 1, and the card slot 31 is used to fix the first rotating joint 22, and at the same time, it is convenient to install the second paint, etc. through the connecting plate 3.
[0024] like Figure 2As shown, the first coating component includes a second rotating joint 4 fixedly connected to the outer side of one end of the connecting plate 3 away from the fixing frame 1, and a first controller 41 is fixedly connected to the lower end of the second rotating joint 4, and the second rotating joint 4 is controlled by the first controller 41 to spray the coating.
[0025] like Figure 3 As shown, the second coating component includes a third rotating joint 5 arranged at one end of the connecting plate 3 away from the second rotating joint 4, and a second controller 51 is fixedly connected to the outer side of the lower end of the third rotating joint 5, and the third rotating joint 5 is controlled by the second controller 51 to spray the coating.
[0026] like Figure 3 As shown, the pushing component includes an electric cylinder 6 arranged at one end of the third rotating joint 5 near the fixed frame 1, and a push plate 61 is fixedly connected to the outer side of the upper end of the electric cylinder 6, and the outer side of the middle end of the electric cylinder 6 is fixedly connected to the third rotating joint 5. The electric cylinder 6 is started, and the third rotating joint 5 and the second controller 51 are pushed to move through 62. When the third rotating joint 5 moves to a suitable position, the electric cylinder 6 can be turned off, so as to facilitate the adjustment of the position of the third rotating joint 5.
[0027] like Figure 3 As shown, the sliding assembly includes a slide plate 7 fixedly connected to one end of the electric cylinder 6 away from the third rotating joint 5, and the end of the slide plate 7 away from the electric cylinder 6 is provided with a slide rail 71, and the end of the slide rail 71 away from the slide plate 7 is fixedly connected to the connecting plate 3, pushing the slide plate 7 so that the slide plate 7 slides on the outside of the slide rail 71, thereby adjusting the position of the electric cylinder 6.
[0028] like Figure 3 and Figure 4 As shown, the positioning assembly includes a mounting plate 8 that is fitted to one end of the first rotating joint 22 away from the sprayer 2, and a first nozzle 81 is opened on the inner side of the middle end of the mounting plate 8, and the inner side of the first nozzle 81 is sleeved on the outer side of the first rotating joint 22, and second nozzles 82 are opened at both ends of the mounting plate 8, and the inner side of the second nozzle 82 is sleeved on the outer side of the second rotating joint 4 and the third rotating joint 5. During spraying, the paint can be sprayed through the second rotating joint 4, the first rotating joint 22 and the third rotating joint 5, and the sprayed paint can be sprayed on the surface of the semiconductor plate-like material through the first nozzle 81 and the second nozzle 82, so that the second rotating joint 4, the first rotating joint 22 and the third rotating joint 5 can be positioned conveniently by using the mounting plate 8, the first nozzle 81 and the second nozzle 82.
[0029] Working principle: When processing semiconductor plate-like materials, when adjusting the third rotating joint 5 according to the thickness of the semiconductor plate-like materials, first start the electric cylinder 6, and push the third rotating joint 5 and the second controller 51 to move through 62. When the third rotating joint 5 moves to a suitable position, turn off the electric cylinder 6 to push the slide 7, so that the slide 7 slides on the outside of the slide rail 71, thereby adjusting the position of the electric cylinder 6. During spraying, the paint can be sprayed through the second rotating joint 4, the first rotating joint 22 and the third rotating joint 5, and the sprayed paint passes through the first nozzle 81 and the second nozzle 82 and is sprayed on the surface of the semiconductor plate-like material.
[0030] The above embodiments are only used to illustrate the technical solution of the present invention, but not to limit it.
Claims
1. A spray head structure capable of automatic leveling, comprising a fixing frame, characterized in that: A spraying assembly is fixedly connected to the outer side of the middle end of the fixing frame, and a connecting assembly is fixedly connected to the end of the spraying assembly away from the fixing frame, a first coating assembly is fixedly connected to one end of the connecting assembly, and a second coating assembly is provided at an end of the connecting assembly away from the first coating assembly, a pushing assembly is fixedly connected to an end of the second coating assembly close to the connecting assembly, and a sliding assembly is fixedly connected to an end of the pushing assembly close to the connecting assembly, an end of the sliding assembly close to the connecting assembly is fixedly connected to the connecting assembly, and a positioning assembly is attached to the outer side of an end of the spraying assembly away from the fixing frame.
2. The spray head structure capable of automatic leveling according to claim 1, characterized in that: The spraying assembly comprises a sprayer fixedly connected to the outer side of the middle end of the fixing frame, and a first connecting end is fixedly connected to the outer side of the upper end of the sprayer, and a first rotating joint is fixedly connected to the outer side of the middle end of the sprayer.
3. The spray head structure capable of automatic leveling according to claim 2, characterized in that: The connection assembly includes a connection plate arranged outside the middle end of the sprayer, and a slot is opened at the middle end of the connection plate. The inner side of the slot is sleeved on the outside of the first rotating joint, and both ends of the connection plate are fixedly connected to the fixing frame.
4. The spray head structure capable of automatic leveling according to claim 3, characterized in that: The first coating component comprises a second rotating joint fixedly connected to the outer side of one end of the connecting plate away from the fixing frame, and the lower end of the second rotating joint is fixedly connected to the first controller.
5. The spray head structure capable of automatic leveling according to claim 4, characterized in that: The second coating component includes a third rotating joint arranged at one end of the connecting plate away from the second rotating joint, and the outer side of the lower end of the third rotating joint is fixedly connected to the second controller.
6. The spray head structure capable of automatic leveling according to claim 1, characterized in that: The pushing assembly includes an electric cylinder arranged at one end of the third rotating joint close to the fixing frame, and a push plate is fixedly connected to the outer side of the upper end of the electric cylinder, and the outer side of the middle end of the electric cylinder is fixedly connected to the third rotating joint.
7. The spray head structure capable of automatic leveling according to claim 1, characterized in that: The sliding assembly comprises a slide plate fixedly connected to one end of the electric cylinder away from the third rotating joint, and one end of the slide plate away from the electric cylinder is sleeved with a slide rail, and one end of the slide rail away from the slide plate is fixedly connected to the connecting plate.
8. The spray head structure capable of automatic leveling according to claim 2, characterized in that: The positioning assembly includes a mounting plate that is attached to one end of the first rotating joint away from the sprayer, and a first nozzle is opened on the inner side of the middle end of the mounting plate, the inner side of the first nozzle is sleeved on the outer side of the first rotating joint, and second nozzles are opened at both ends of the mounting plate, the inner side of the second nozzle is sleeved on the outer sides of the second rotating joint and the third rotating joint.