Wafer laser cutting machine with protection mechanism
By designing a protective mechanism and an automatic feeding system in the wafer laser cutting machine, the problem of laser cutting light affecting vision and artificial movement is solved, and the functions of facilitating feeding, material collection and protection are achieved, and cutting accuracy and operational safety are improved.
Patent Information
- Application Number
- CN202421830534.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-07-31
AI Technical Summary
When using the wafer laser cutting machine, laser cutting light affects vision health, the artificial moving position is not accurate enough, resulting in cutting errors, and it is not convenient to quickly remove materials.
A wafer laser cutting machine with a protective mechanism is designed, including a laser cutting cabinet, a protective door, a protective cover, a screw rail, a feeding table and a limit clamping block, through these components, the functions of facilitating feeding, picking and protection are achieved.
It realizes the function of easy feeding and picking up materials, improves cutting accuracy, reduces the risk of manual operation, and facilitates protection and heat dissipation maintenance.
Smart Images
Figure CN222944730U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser cutting, in particular to a wafer laser cutting machine with a protection mechanism. Background Art
[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. Silicon wafers and silicon solar cells are typical representatives of semiconductor materials and semiconductor devices, respectively. Laser cutting equipment is needed to cut wafers during processing. Laser cutting uses a high-power density laser beam to irradiate the material to be cut, so that the material is quickly heated to the vaporization temperature, evaporated to form holes, and as the light beam moves across the material, the holes continuously form a very narrow slit to complete the cutting of the material.
[0003] After searching, it was found that during the process of cutting wafers, the wafer laser cutting machine often produces strong laser cutting light, which affects the workers' vision and health. In addition, when using the wafer laser cutting machine, the workers need to manually push the wafer to the cutting position. The manually moved position is not accurate enough and cutting errors are prone to occur. It is also inconvenient to quickly remove the material from the wafer laser cutting machine.
[0004] There is an urgent need for a wafer laser cutting machine with a protective mechanism to solve the technical defects raised in the above-mentioned technology. Utility Model Content
[0005] The utility model aims to provide a wafer laser cutting machine with a protection mechanism to solve the problem of inconvenience in feeding and taking out materials in the above-mentioned background technology.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer laser cutting machine with a protective mechanism, comprising a laser cutting cabinet, protective doors are movably hinged on both sides of the front end of the laser cutting cabinet, a protective cover is installed on the top of the laser cutting cabinet, a lead screw slide is installed at the middle position of the top of the laser cutting cabinet, a driving motor is installed at one end of the lead screw slide, a lead screw driving sleeve is arranged at the top of the lead screw slide, a feeding table is fixedly connected to the top of the feed table, a placing table is fixedly connected to the top of the feed table, a limited clamping block is arranged on the outside of the placing table, a laser cutting assembly is installed at the top of the protective cover, a laser cutting head is installed at the bottom end of the laser cutting assembly, a protective cover is arranged at the front end of the protective cover, and a handle is fixedly connected to the bottom end of the protective cover.
[0007] Preferably, the output end of the driving motor is fixedly connected to one end of the lead screw inside the lead screw slide rail.
[0008] Preferably, the screw drive sleeve is threadedly connected to the outside of the screw inside the screw slide rail.
[0009] Preferably, four groups of the limiting clamping blocks are provided, and the limiting clamping blocks are distributed in a ring shape outside the placement table.
[0010] Preferably, a visual window is provided at the front end of the protective cover, and a sealing gasket is fixedly connected to the outside of the protective cover.
[0011] Preferably, a damping sleeve is fixedly connected to the top end of the protective cover, and the damping sleeve is movably connected to one end of the protective cover.
[0012] Preferably, a heat dissipation port is provided at the front end of the protective door, a dustproof mesh plate is installed inside the heat dissipation port, and a fixing bolt is provided at the front end of the dustproof mesh plate.
[0013] Preferably, the dustproof screen is installed at one end of the heat dissipation port, and one end of the fixing bolt is embedded in the interior of the protective door.
[0014] Compared with the prior art, the utility model has the beneficial effects that: the wafer laser cutting machine with a protection mechanism not only realizes the functions of convenient material feeding and material taking, realizes the function of convenient protection, but also realizes the function of convenient heat dissipation and maintenance;
[0015] (1) By providing a screw guide rail, a feeding table, a placement table, a driving motor, a screw drive sleeve and a limit clamping block, during laser cutting processing, the round wafer needs to be placed on the equipment first, the driving motor drives the screw inside the screw guide rail to rotate, the screw drive sleeve can drive the placement table to move to the front end of the protective cover, the staff places the round wafer on the placement table, the limit clamping block on the placement table can limit the round wafer, and then the driving motor drives the screw to reverse, the screw drive sleeve drives the placement table to move to the bottom of the laser cutting head for laser cutting, and this structure realizes the functions of easy placement, material collection and automatic feeding;
[0016] (2) By providing a protective cover, a protective cap, a damping sleeve, a sealing gasket, a viewing window and a handle, the protective cover and the protective cap can protect the laser during cutting. Before cutting, the protective cover is flipped upwards, and then the wafer is placed on the placement table. After the feeding table moves the wafer to the bottom of the laser cutting head, the staff covers the protective cover. The sealing gasket on the protective cover can improve the sealing effect of the closure. This structure realizes the function of convenient protection.
[0017] (3) By providing a protective door, a heat dissipation port, a dustproof screen and fixing bolts, the protective door can protect the laser cutting cabinet, the heat dissipation port on the protective door can dissipate heat for the equipment inside the laser cutting cabinet, the dustproof screen on the heat dissipation port can provide dust protection during the heat dissipation process, the dustproof screen can reduce the entry of dust and impurities into the interior of the laser cutting cabinet, and the dustproof screen can be removed and cleaned. When cleaning, first unscrew the fixing bolts and then remove the dustproof screen. This structure realizes the function of facilitating heat dissipation maintenance. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;
[0019] Figure 2 This is a front view structural schematic diagram of the utility model;
[0020] Figure 3 For the utility model Figure 1 The enlarged structural diagram at A in the middle;
[0021] Figure 4 It is a front view structural schematic diagram of the feeding platform of the utility model.
[0022] In the figure: 1. Laser cutting cabinet; 2. Protective door; 3. Heat dissipation port; 4. Protective cover; 5. Screw guide rail; 6. Feeding table; 7. Laser cutting assembly; 8. Laser cutting head; 9. Placement table; 10. Drive motor; 11. Dustproof mesh plate; 12. Protective cover; 13. Damping bushing; 14. Sealing gasket; 15. Visual window; 16. Handle; 17. Fixing bolt; 18. Screw drive sleeve; 19. Limit clamping block. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] Example 1: Please refer to Figure 1-4, a wafer laser cutting machine with a protection mechanism, comprising a laser cutting cabinet 1, protective doors 2 are movably hinged on both sides of the front end of the laser cutting cabinet 1, a protective cover 4 is installed on the top of the laser cutting cabinet 1, a lead screw slide 5 is installed at the middle position of the top of the laser cutting cabinet 1, a driving motor 10 is installed at one end of the lead screw slide 5, a lead screw driving sleeve 18 is arranged on the top of the lead screw slide 5, a feeding table 6 is fixedly connected to the top of the lead screw driving sleeve 18, a placing table 9 is fixedly connected to the top of the feeding table 6, a limited position clamping block 19 is arranged on the outside of the placing table 9, a laser cutting component 7 is installed on the top of the protective cover 4, a laser cutting head 8 is installed on the bottom end of the laser cutting component 7, a protective cover 12 is arranged on the front end of the protective cover 4, and a handle 16 is fixedly connected to the bottom end of the protective cover 12;
[0025] The output end of the driving motor 10 is fixedly connected to one end of the screw inside the screw guide rail 5, the screw drive sleeve 18 is threadedly connected to the outside of the screw inside the screw guide rail 5, and four groups of limit clamping blocks 19 are arranged, and the limit clamping blocks 19 are distributed in a ring shape outside the placement table 9;
[0026] Specifically, Figure 1 and Figure 4 As shown, the wafer is first placed on the equipment, and the driving motor 10 drives the screw inside the screw slide 5 to rotate. The screw driving sleeve 18 can drive the placement table 9 to move to the front end of the protective cover 4. The staff places the wafer on the placement table 9. The limit clamping block 19 on the placement table 9 can limit the wafer. Then the driving motor 10 drives the screw to reverse, and the screw driving sleeve 18 drives the placement table 9 to move to the bottom of the laser cutting head 8 for laser cutting.
[0027] Embodiment 2: A visual window 15 is provided at the front end of the protective cover 12, a sealing gasket 14 is fixedly connected to the outside of the protective cover 12, a damping sleeve 13 is fixedly connected to the top end of the protective cover 12, and the damping sleeve 13 is movably connected to one end of the protective cover 4;
[0028] Specifically, Figure 1 and Figure 2 As shown, the protective cover 4 and the protective cover 12 can protect it during the laser cutting process. Before cutting, the protective cover 12 is flipped up, and then the wafer is placed on the placement table 9. After that, the feeding table 6 moves the wafer to the bottom of the laser cutting head 8, and then the staff covers the protective cover 12. The sealing gasket 14 on the protective cover 12 can improve the sealing effect of the closure.
[0029] Embodiment 3: A heat dissipation port 3 is provided at the front end of the protective door 2, a dustproof screen 11 is installed inside the heat dissipation port 3, a fixing bolt 17 is provided at the front end of the dustproof screen 11, the dustproof screen 11 is installed at one end of the heat dissipation port 3, and one end of the fixing bolt 17 is embedded in the interior of the protective door 2;
[0030] Specifically, Figure 1 and Figure 3 As shown, the heat dissipation port 3 on the protective door 2 can dissipate heat for the equipment inside the laser cutting cabinet 1, and the dustproof mesh plate 11 on the heat dissipation port 3 can provide dust protection during the heat dissipation process. The dustproof mesh plate 11 can reduce the dust and impurities from entering the interior of the laser cutting cabinet 1. The dustproof mesh plate 11 can be disassembled and taken out for cleaning. When cleaning, just unscrew the fixing bolts 17 first.
[0031] Working principle: When the utility model is in use, the protective cover 4 and the protective cover 12 can protect the laser during cutting. Before cutting, the protective cover 12 is flipped up, and then the wafer is placed on the placement table 9. After the feeding table 6 moves the wafer to the bottom of the laser cutting head 8, the staff covers the protective cover 12. The sealing gasket 14 on the protective cover 12 can improve the sealing effect of the closure. The heat dissipation port 3 on the protective door 2 can dissipate heat for the equipment inside the laser cutting cabinet 1. The dustproof mesh plate 11 on the heat dissipation port 3 can provide dust protection during the heat dissipation process. The dustproof mesh plate 11 can To reduce the entry of dust and impurities into the interior of the laser cutting cabinet 1, first place the wafer on the equipment, drive the motor 10 to drive the screw inside the screw slide 5 to rotate, the screw drive sleeve 18 can drive the placement table 9 to move to the front end of the protective cover 4, the staff places the wafer on the placement table 9, the limit clamping block 19 on the placement table 9 can limit the wafer, then drive the motor 10 to drive the screw to reverse, the screw drive sleeve 18 drives the placement table 9 to move to the bottom of the laser cutting head 8 for laser cutting, and finally the cut wafer can be taken out. This structure realizes the function of facilitating quick material retrieval and feeding.
[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A wafer laser cutting machine with a protective mechanism, comprising a laser cutting cabinet (1), characterized in that: Protective doors (2) are movably hinged on both sides of the front end of the laser cutting cabinet (1); a protective cover (4) is installed at the top of the laser cutting cabinet (1); a lead screw guide rail (5) is installed at the middle position of the top of the laser cutting cabinet (1); a drive motor (10) is installed at one end of the lead screw guide rail (5); a lead screw drive sleeve (18) is arranged at the top of the lead screw guide rail (5); a feed table (6) is fixedly connected to the top of the lead screw drive sleeve (18); a placement table (9) is fixedly connected to the top of the feed table (6); a limited position clamping block (19) is arranged outside the placement table (9); a laser cutting assembly (7) is installed at the top of the protective cover (4); a laser cutting head (8) is installed at the bottom of the laser cutting assembly (7); a protective cover (12) is arranged at the front end of the protective cover (4); a handle (16) is fixedly connected to the bottom end of the protective cover (12).
2. A wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The output end of the driving motor (10) is fixedly connected to one end of the screw inside the screw guide rail (5).
3. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The screw drive sleeve (18) is sleeved on the outside of the screw inside the screw slide rail (5) and is threadedly connected.
4. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: Four groups of the position-limiting clamping blocks (19) are provided, and the position-limiting clamping blocks (19) are distributed in a ring shape outside the placement platform (9).
5. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: A visual window (15) is provided at the front end of the protective cover (12), and a sealing gasket (14) is fixedly connected to the outside of the protective cover (12).
6. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The top end of the protective cover (12) is fixedly connected to a damping sleeve (13), and the damping sleeve (13) is movably connected to one end of the protective cover (4).
7. The wafer laser cutting machine with a protection mechanism according to claim 1, characterized in that: The front end of the protective door (2) is provided with a heat dissipation port (3), a dustproof screen (11) is installed inside the heat dissipation port (3), and the front end of the dustproof screen (11) is provided with a fixing bolt (17).
8. The wafer laser cutting machine with a protection mechanism according to claim 7, characterized in that: The dustproof screen plate (11) is installed at one end of the heat dissipation port (3), and one end of the fixing bolt (17) is embedded in the interior of the protective door (2).