Polishing disc mechanism and wafer polishing machine

Abstract

The utility model discloses a polishing disk mechanism and a wafer polisher, the polishing disk mechanism comprises a base, a movable part, a first driving part, a second driving part and a polishing disk assembly, and the first driving part is configured to drive the movable part to reciprocate in the horizontal direction; the polishing disc assembly is used for bearing a to-be-polished wafer and matched with the polishing head to polish the to-be-polished wafer, and the second driving part is configured to drive the polishing disc assembly to rotate so as to be matched with the rotating polishing head to polish the wafer located between the polishing head and the polishing disc assembly; before the wafer to be polished is polished or when the wafer to be polished is polished, the first driving piece drives the movable piece to drive the polishing disc assembly to move in the horizontal direction relative to the polishing head, and then the relative position of the wafer and the polishing face of the polishing disc assembly in the horizontal direction is adjusted. According to the polishing disc mechanism, the situation that an annular pit is formed in the polishing face of the polishing disc assembly after long-time use can be avoided, the service life of the polishing disc assembly is prolonged, and the wafer polishing cost is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment manufacturing, and in particular relates to a polishing disc mechanism and a wafer polishing machine. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] Current wafer polishing equipment usually polishes the wafer between the polishing head and the polishing disk by rotating the polishing head and the polishing disk. However, the existing polishing disk can only rotate during polishing, and the positions of the polishing head and the wafer on the polishing surface of the polishing disk are relatively fixed during each polishing. After long-term use, the polishing surface of the polishing disk is easily formed with annular pits because the wafer and the polishing surface of the polishing disk are always rubbed in the same area. In order to ensure the polishing accuracy, the polishing disk needs to be replaced frequently, which increases the cost of wafer polishing. Utility Model Content

[0004] The purpose of the present application is to provide a polishing disc mechanism to solve the problem that existing polishing discs easily form pits on the polishing surface of the polishing disc; in addition, another purpose of the present application is to provide a wafer polishing machine including the polishing disc mechanism.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a polishing disc mechanism, which includes a base, a movable member, a first driving member, a second driving member and a polishing disc assembly, wherein:

[0007] The movable member is arranged above the base and is installed on the base in a transversely movable manner. The driving end of the first driving member is connected to the movable member. The first driving member is configured to drive the movable member to reciprocate in a horizontal direction.

[0008] The polishing disc assembly is rotatably mounted on the movable member, the polishing disc assembly is configured to carry the wafer to be polished and cooperate with the polishing head to polish the wafer to be polished, the driving end of the second driving member is connected to the polishing disc assembly, and the second driving member is configured to drive the polishing disc assembly to rotate;

[0009] When the wafer to be polished is being polished, the second driving member drives the polishing plate assembly to rotate, so as to cooperate with the rotating polishing head to polish the wafer located between the polishing head and the polishing plate;

[0010] Before or during polishing of the wafer to be polished, the first driving member drives the movable member to move in the horizontal direction to drive the polishing disk assembly to move in the horizontal direction relative to the polishing head, thereby adjusting the relative position of the wafer in the horizontal direction and the polishing surface of the polishing disk assembly.

[0011] The polishing disc mechanism proposed in the present application integrates the polishing disc assembly on the movable part, and the first driving part drives the movable part to move in the horizontal direction, thereby driving the polishing disc assembly to move in the horizontal direction relative to the polishing head, so as to achieve adjustable position of the wafer on the polishing surface of the polishing disc assembly during polishing. It can avoid the formation of annular pits on the polishing surface of the polishing disc assembly after long-term use, extend the service life of the polishing disc assembly, and reduce the cost of wafer polishing.

[0012] Optionally, the first driving member includes a first motor and a first transmission assembly, the fixed end of the first motor is mounted on the base, the driving end of the first motor is transmission-connected to the movable member via the first transmission assembly, and the first motor drives the movable member to reciprocate in the horizontal direction via the first transmission assembly;

[0013] The first transmission assembly includes a transmission screw and a screw nut. The screw nut is movably mounted on the transmission screw. The screw nut is fixedly connected to the movable part. The transmission screw extends in a horizontal direction and is rotatably mounted on the base. The rotating shaft of the first motor is coaxially connected to one end of the transmission screw. The first motor is configured to drive the movable part to move horizontally through the cooperation of the transmission screw and the screw nut.

[0014] Through the cooperation of the first motor and the first transmission assembly, the movable part is driven to move back and forth in the horizontal direction; through the cooperation of the screw nut and the transmission screw, the rotational motion of the first motor is converted into horizontal movement of the movable part, providing a first transmission assembly with high transmission accuracy and high reliability.

[0015] Optionally, at least one guide assembly is provided between the movable member and the base, the guide assembly comprising a linear guide rail and a slider, wherein: the linear guide rail is fixedly mounted on the base and extends in a horizontal direction, and the slider is fixed on the movable member and slidably mounted on the linear guide rail;

[0016] Alternatively, the linear guide rail is fixedly mounted on the movable member and extends in the horizontal direction, and the slider is fixed on the base and slidably mounted on the linear guide rail.

[0017] By arranging a guide assembly between the movable part and the base, the stability and reliability of the horizontal movement of the movable part are improved; through the cooperation of the linear guide rail and the slider, the support and guidance of the movable part are achieved.

[0018] Optionally, the second driving member includes a second motor and a second transmission assembly, the fixed end of the second motor is installed on the movable member, the driving end of the second motor is connected to the second transmission assembly, and the second motor drives the polishing disc assembly to rotate through the second transmission assembly.

[0019] The polishing disc assembly is driven to rotate by the cooperation of the second motor and the second transmission assembly.

[0020] Optionally, the movable member is arranged above the base, the second motor is vertically installed on the bottom surface of the movable member, and an avoidance hole for avoiding the second motor is opened on the base.

[0021] By vertically installing the second motor on the bottom surface of the movable part and providing an avoidance hole on the base for avoiding the second motor, the overall structure is compact, the layout is reasonable, and the space occupied is small.

[0022] Optionally, the polishing disk assembly includes a rotating shaft, a connecting disk and a polishing disk for carrying the wafer. The rotating shaft is rotatably mounted on the movable part, the connecting disk is arranged at one end of the rotating shaft, and the polishing disk is detachably mounted on the connecting disk. The second motor drives the rotating shaft to rotate through the second transmission assembly to drive the polishing disk to rotate.

[0023] The second motor drives the polishing disk to rotate by cooperating with the second motor, the second transmission assembly, the rotating shaft, the connecting plate and the polishing disk; at the same time, the rotating shaft is connected to the polishing disk through the connecting plate, thereby ensuring the reliability of the connection of the polishing disk.

[0024] Optionally, the second transmission assembly includes a driving gear and a transmission ring gear, the driving gear is anti-rotationally mounted on the driving end of the second motor, the transmission ring gear is fixedly mounted on the rotating shaft, and the driving gear is meshed with the transmission ring gear.

[0025] Through the cooperation of the driving gear and the transmission gear ring, the second motor drives the rotating shaft to rotate, providing a second transmission component with a constant transmission ratio, small occupied space and high transmission efficiency.

[0026] Optionally, the racks of the driving gear and the transmission gear ring are both inclined and meshed with each other.

[0027] By setting the racks of the driving gear and the transmission gear ring as helical racks, the impact and noise when the driving gear and the transmission gear ring are engaged can be reduced, and it can also be suitable for high-speed and heavy-load application scenarios with smooth transmission.

[0028] Optionally, a retaining ring is provided on the movable part and is located at the periphery of the connecting disk, and a gap is provided between the polishing disk and the retaining ring so that the polishing disk can rotate freely.

[0029] By arranging a retaining ring on the movable part and located at the periphery of the connecting disk, the mechanism between the polishing disk and the movable part can be shielded, and the rotation of the polishing disk can also be limited.

[0030] In a second aspect, the present application proposes a wafer polishing machine, which includes a polishing platform, a turntable, a polishing head mechanism and the polishing disc mechanism, wherein:

[0031] The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a set of polishing disc mechanisms;

[0032] A turntable is rotatably arranged above the polishing platform, and at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable; the turntable drives at least two groups of polishing head mechanisms to synchronously rotate at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, and at the same time, the other polishing head mechanisms and the polishing plate mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

[0033] The wafer polishing machine proposed in the present application realizes automatic polishing of wafers with high polishing efficiency through the cooperation of a polishing platform, a turntable, a polishing head mechanism and a polishing disc mechanism; at the same time, the polishing disc assembly of the polishing disc mechanism can move in a horizontal direction relative to the polishing head, thereby avoiding the formation of annular pits on the polishing surface of the polishing disc assembly after long-term use, thereby extending the service life of the polishing disc assembly and reducing the cost of wafer polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a three-dimensional structural schematic diagram of the polishing disc mechanism provided in an embodiment of the present application;

[0035] Figure 2 is a schematic diagram of a side view of a polishing disc mechanism provided in an embodiment of the present application;

[0036] Figure 3 It is a schematic diagram of the internal three-dimensional structure of the polishing disc mechanism provided in an embodiment of the present application;

[0037] Figure 4 is a schematic diagram of the three-dimensional structure of the second driving member of the polishing disk mechanism provided in an embodiment of the present application;

[0038] Figure 5 It is a top view of the wafer polishing machine provided in an embodiment of the present application.

[0039] Figures 1 to 5 The following reference numerals are included:

[0040] Base 10: guide assembly 11, linear guide rail 110, slider 111, avoidance hole 12;

[0041] Movable part 20: retaining ring 21;

[0042] The first driving member 30 includes a first motor 31, a first transmission assembly 32, a lead screw nut 320, and a transmission lead screw 321;

[0043] The second driving member 40 includes a second motor 41, a second transmission assembly 42, a driving gear 420, and a transmission ring gear 421;

[0044] Polishing disc assembly 50: rotating shaft 51, connecting disc 52, polishing disc 53;

[0045] Polishing platform 60: loading and unloading station 61, polishing station 62;

[0046] Turntable 70;

[0047] Polishing head mechanism 80;

[0048] Polishing disc mechanism 90. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0050] In the production process of wafers, it is usually necessary to polish the wafers through polishing equipment to remove the unevenness and contaminants on the wafer surface and achieve high-quality smoothness. Current wafer polishing equipment usually polishes the wafer between the polishing head and the polishing disk through the rotational cooperation of the polishing head and the polishing disk. However, the existing polishing disk can only rotate during polishing. The positions of the polishing head and the wafer on the polishing surface of the polishing disk are relatively fixed each time during polishing. After long-term use, the polishing surface of the wafer and the polishing disk are always rubbed in the same area, which easily forms annular pits on the polishing surface of the polishing disk. In order to ensure the polishing accuracy, the polishing disk needs to be replaced frequently, which increases the cost of wafer polishing.

[0051] To this end, the present application proposes a polishing disc mechanism, see Figure 1 and Figure 2 As shown, a polishing disc mechanism provided in this embodiment includes a base 10, a movable member 20, a first driving member 30, a second driving member 40 and a polishing disc assembly 50, wherein:

[0052] The movable member 20 is disposed above the base 10 and is laterally mounted on the base 10. The driving end of the first driving member 30 is connected to the movable member 20. The first driving member 30 is configured to drive the movable member 20 to reciprocate in the horizontal direction.

[0053] The polishing disc assembly 50 is rotatably mounted on the movable member 20. The polishing disc assembly 50 is configured to carry the wafer to be polished and cooperate with the polishing head to polish the wafer to be polished. The driving end of the second driving member 40 is connected to the polishing disc assembly 50. The second driving member 40 is configured to drive the polishing disc assembly 50 to rotate.

[0054] When the wafer to be polished is being polished, the second driving member 40 drives the polishing plate assembly 50 to rotate, so as to cooperate with the rotating polishing head to polish the wafer located between the polishing head and the polishing plate 53;

[0055] Before polishing the wafer to be polished or during polishing the wafer to be polished, the first driving member 30 drives the movable member 20 to move in the horizontal direction to drive the polishing disk assembly 50 to move in the horizontal direction relative to the polishing head, thereby adjusting the relative position of the wafer in the horizontal direction and the polishing surface of the polishing disk assembly 50.

[0056] The polishing disc mechanism proposed in the present application integrates the polishing disc assembly 50 on the movable part 20, and the first driving part 30 drives the movable part 20 to move in the horizontal direction, thereby driving the polishing disc assembly 50 to move in the horizontal direction relative to the polishing head, so as to achieve the adjustable position of the wafer on the polishing surface of the polishing disc assembly 50 during polishing. It can avoid the formation of annular pits on the polishing surface of the polishing disc assembly 50 caused by polishing at the same position for a long time, prolong the service life of the polishing disc assembly 50, and reduce the cost of wafer polishing.

[0057] In one embodiment, the first driving member 30 includes a first motor 31 and a first transmission assembly 32. The fixed end of the first motor 31 is mounted on the base 10. The driving end of the first motor 31 is connected to the movable member 20 through the first transmission assembly 32. The first motor 31 drives the movable member 20 to reciprocate in the horizontal direction through the first transmission assembly 32.

[0058] The first transmission assembly 32 includes a transmission screw 321 and a screw nut 320. The screw nut 320 is movably mounted on the transmission screw 321. The screw nut 320 is fixedly connected to the movable part 20. The transmission screw 321 extends in the horizontal direction and is rotatably mounted on the base 10. The rotating shaft of the first motor 31 is coaxially connected to one end of the transmission screw 321. The first motor 31 is configured to drive the movable part 20 to move horizontally through the cooperation of the transmission screw 321 and the screw nut 320.

[0059] Through the cooperation of the first motor 31 and the first transmission assembly 32, the movable part 20 is driven to move back and forth in the horizontal direction; through the cooperation of the screw nut 320 and the transmission screw 321, the rotational motion of the first motor 31 is converted into the horizontal movement of the movable part 20, providing a first transmission assembly 32 with high transmission accuracy and high reliability.

[0060] In one embodiment, at least one guide assembly 11 is arranged between the movable part 20 and the base 10, and the guide assembly 11 includes a linear guide rail 110 and a slider 111, wherein: the linear guide rail 110 is fixedly mounted on the base 10 and extends in a horizontal direction, and the slider 111 is fixed on the movable part 20 and slidably mounted on the linear guide rail 110; or, the linear guide rail 110 is fixedly mounted on the movable part 20 and extends in a horizontal direction, and the slider 111 is fixed on the base 10 and slidably mounted on the linear guide rail 110.

[0061] Specifically, two sets of guide assemblies 11 are arranged in parallel and at intervals between the movable member 20 and the base 10 .

[0062] By arranging the guide assembly 11 between the movable part 20 and the base 10, the stability and reliability of the horizontal movement of the movable part 20 are improved; through the cooperation of the linear guide rail 110 and the slider 111, the support and guidance of the movable part 20 are achieved.

[0063] See also Figures 1 to 4 As shown, in one embodiment, the second driving member 40 includes a second motor 41 and a second transmission assembly 42, the fixed end of the second motor 41 is installed on the movable member 20, the driving end of the second motor 41 is connected to the second transmission assembly 42, and the second motor 41 drives the polishing disc assembly 50 to rotate through the second transmission assembly 42.

[0064] The polishing disc assembly 50 is driven to rotate by the cooperation between the second motor 41 and the second transmission assembly 42 .

[0065] In one embodiment, the movable member 20 is disposed above the base 10 , the second motor 41 is vertically mounted on the bottom surface of the movable member 20 , and an escape hole 12 for evading the second motor 41 is opened on the base 10 .

[0066] By vertically installing the second motor 41 on the bottom surface of the movable part 20 and providing an escape hole 12 on the base 10 for escaping the second motor 41 , the overall structure is compact, the layout is reasonable, and the space occupied is small.

[0067] In one embodiment, the polishing disk assembly 50 includes a rotating shaft 51, a connecting disk 52 and a polishing disk 53 for carrying a wafer. The rotating shaft 51 is rotatably mounted on the movable part 20, the connecting disk 52 is arranged at one end of the rotating shaft 51, and the polishing disk 53 is detachably mounted on the connecting disk 52. The second motor 41 drives the rotating shaft 51 to rotate through the second transmission assembly 42 to drive the polishing disk 53 to rotate.

[0068] The rotation of the polishing disk 53 is achieved through the cooperation of the second motor 41, the second transmission assembly 42, the rotating shaft 51, the connecting disk 52 and the polishing disk 53; at the same time, the rotating shaft 51 is connected to the polishing disk 53 through the connecting disk 52, ensuring the reliability and consistency of the connection of the polishing disk 53.

[0069] In one embodiment, the second transmission assembly 42 includes a driving gear 420 and a transmission ring gear 421, the driving gear 420 is anti-rotationally mounted on the driving end of the second motor 41, the transmission ring gear 421 is fixedly mounted on the rotating shaft 51, and the driving gear 420 is meshed with the transmission ring gear 421.

[0070] By fixing the transmission ring gear 421 on the rotating shaft 51 and matching the driving gear 420 with the transmission ring gear 421, a second transmission assembly 42 with a constant transmission ratio, small occupied space and high transmission efficiency is provided.

[0071] In one embodiment, the racks of the driving gear 420 and the transmission gear ring 421 are both inclined and meshed with each other.

[0072] By setting the racks of the driving gear 420 and the transmission gear ring 421 as helical racks, the impact and noise when the driving gear 420 and the transmission gear ring 421 are engaged can be reduced, which can be suitable for high-speed and heavy-load application scenarios with smooth transmission.

[0073] In one embodiment, a retaining ring 21 is provided on the movable member 20 and is located at the periphery of the connecting disk 52 . There is a gap between the polishing disk 53 and the retaining ring 21 so that the polishing disk 53 can rotate freely.

[0074] By providing a retaining ring 21 on the movable part 20 and located at the periphery of the connecting disk 52 , the mechanism between the polishing disk 53 and the movable part 20 can be shielded, and the rotation of the polishing disk 53 can also be limited.

[0075] The polishing disc mechanism provided in the embodiment of the present application has the following advantages:

[0076] 1) The horizontal position of the wafer relative to the polishing surface of the polishing disc assembly 50 can be adjusted during polishing to avoid the formation of annular pits on the polishing surface of the polishing disc assembly 50 after long-term use, thereby extending the service life of the polishing disc assembly 50 and reducing the cost of wafer polishing.

[0077] 2) By providing the guide assembly 11, the stability and reliability of the horizontal movement of the movable part 20 are improved.

[0078] 3) The second transmission assembly 42 adopts gear transmission, which has a constant transmission ratio, small occupied space and high transmission efficiency; at the same time, the racks of the driving gear 420 and the transmission gear ring 421 are both helical racks, which can reduce the impact and noise when the driving gear 420 and the transmission gear ring 421 are engaged.

[0079] 4) The overall structure is compact, occupies little space and has a reasonable layout.

[0080] In the second aspect, the present application proposes a wafer polishing machine, see Figure 1 and Figure 5 As shown, the wafer polishing machine proposed in the embodiment of the present application includes a polishing platform 60, a turntable 70, a polishing head mechanism 80 and the above-mentioned polishing disc mechanism 90, wherein:

[0081] A loading and unloading station 61 and at least one polishing station 62 are arranged on the polishing platform 60, and a group of polishing disk mechanisms 90 are arranged on each polishing station 62; the turntable 70 is rotatably arranged above the polishing platform 60, and at least two groups of polishing head mechanisms 80 are evenly arranged along the circumference and installed on the turntable 70, and the polishing head mechanisms 80 can be raised and lowered relative to the turntable 70; the turntable 70 drives at least two groups of polishing head mechanisms 80 to rotate synchronously at a preset angle, so that one group of polishing head mechanisms 80 is opposite to the loading and unloading station 61 to pick up the wafers to be polished on the loading and unloading station 61 or place the polished wafers on the loading and unloading station 61, and at the same time, the other polishing head mechanisms 80 and the polishing disk mechanisms 90 cooperate with each other to polish the wafers to be polished picked up by other polishing head mechanisms 80.

[0082] The wafer polishing machine proposed in the present application realizes automatic polishing of the wafer with high polishing efficiency through the cooperation of the polishing platform 60, the turntable 70, the polishing head mechanism 80 and the polishing disk mechanism 90; at the same time, the polishing disk assembly 50 of the polishing disk mechanism 90 can move in the horizontal direction relative to the polishing head, avoiding the formation of annular pits on the polishing surface of the polishing disk assembly 50 after long-term use, thereby extending the service life of the polishing disk assembly 50 and reducing the cost of wafer polishing.

[0083] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A polishing disc mechanism, characterized in that: The polishing disc mechanism comprises a base, a movable member, a first driving member, a second driving member and a polishing disc assembly, wherein: The movable member is arranged above the base and is installed on the base in a transversely movable manner, the driving end of the first driving member is connected to the movable member, and the first driving member is configured to drive the movable member to reciprocate in a horizontal direction; The polishing disc assembly is rotatably mounted on the movable member, the polishing disc assembly is configured to carry the wafer to be polished and cooperate with the polishing head to polish the wafer to be polished, the driving end of the second driving member is connected to the polishing disc assembly, and the second driving member is configured to drive the polishing disc assembly to rotate, so as to cooperate with the rotating polishing head to polish the wafer located between the polishing head and the polishing disc assembly; Before polishing the wafer to be polished or during polishing the wafer to be polished, the first driving member drives the movable member to move in the horizontal direction to drive the polishing disk assembly to move in the horizontal direction relative to the polishing head, thereby adjusting the relative position of the wafer in the horizontal direction and the polishing surface of the polishing disk assembly.

2. The polishing disc mechanism according to claim 1, characterized in that: The first driving member includes a first motor and a first transmission assembly, the fixed end of the first motor is mounted on the base, the driving end of the first motor is connected to the movable member through the first transmission assembly, and the first motor drives the movable member to reciprocate in the horizontal direction through the first transmission assembly; The first transmission assembly includes a transmission screw and a screw nut, the screw nut is movably mounted on the transmission screw, the screw nut is fixedly connected to the movable part, the transmission screw extends along the horizontal direction and is rotatably mounted on the base, the rotating shaft of the first motor is coaxially connected to one end of the transmission screw, and the first motor is configured to drive the movable part to move horizontally through the cooperation of the transmission screw and the screw nut.

3. The polishing disc mechanism according to claim 1, characterized in that: At least one guide assembly is arranged between the movable member and the base, and the guide assembly includes a linear guide rail and a slider, wherein: the linear guide rail is fixedly mounted on the base and extends along the horizontal direction, and the slider is fixed on the movable member and slidably mounted on the linear guide rail; Alternatively, the linear guide rail is fixedly mounted on the movable member and extends along the horizontal direction, and the sliding block is fixed on the base and slidably mounted on the linear guide rail.

4. The polishing disc mechanism according to claim 1, characterized in that: The second driving member includes a second motor and a second transmission assembly, the fixed end of the second motor is installed on the movable member, the driving end of the second motor is connected to the second transmission assembly, and the second motor drives the polishing disc assembly to rotate through the second transmission assembly.

5. The polishing disc mechanism according to claim 4, characterized in that: The movable part is arranged above the base, the second motor is vertically installed on the bottom surface of the movable part, and an avoidance hole for avoiding the second motor is opened on the base.

6. The polishing disc mechanism according to claim 4, characterized in that: The polishing disk assembly includes a rotating shaft, a connecting disk and a polishing disk for carrying a wafer. The rotating shaft is rotatably mounted on the movable part. The connecting disk is arranged at one end of the rotating shaft. The polishing disk is detachably mounted on the connecting disk. The second motor drives the rotating shaft to rotate through the second transmission assembly to drive the polishing disk to rotate.

7. The polishing disc mechanism according to claim 6, characterized in that: The second transmission assembly includes a driving gear and a transmission gear ring. The driving gear is anti-rotationally mounted on the driving end of the second motor, and the transmission gear ring is fixedly mounted on the rotating shaft. The driving gear is meshed with the transmission gear ring.

8. The polishing disc mechanism according to claim 7, characterized in that: The driving gear and the racks of the transmission gear ring are both arranged obliquely and mesh with each other.

9. The polishing disc mechanism according to claim 6, characterized in that: The movable part is provided with a retaining ring located at the periphery of the connecting disk, and a gap is provided between the polishing disk and the retaining ring so that the polishing disk can rotate freely.

10. A wafer polishing machine, characterized in that: The wafer polishing machine comprises a polishing platform, a turntable, a polishing head mechanism and a polishing disc mechanism as claimed in any one of claims 1 to 9, wherein: The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a group of the polishing disc mechanisms; The turntable is rotatably arranged above the polishing platform, at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable; The turntable drives at least two groups of polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms and the polishing disk mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

Images