Polishing head mechanism and wafer polishing machine

Abstract

The utility model discloses a polishing head mechanism and a wafer polisher, the polishing head mechanism comprises a substrate, a first driving part and n sets of polishing head assemblies, each set of polishing head assembly comprises an assembly part, a polishing head and a second driving part, and the polishing head is mounted on the assembly part; the polishing head is configured to pick up a wafer to be polished and cooperate with the polishing disc to polish the picked wafer, the assembly parts can rotate and ascend and descend relative to the base plate, the fixed ends of the first driving part and the second driving part are both installed on the base plate, and the second driving part is configured to drive the corresponding assembly parts to ascend and descend relative to the base plate. The corresponding polishing heads are driven to ascend and descend; the first driving part is configured to drive the assembling parts of the n sets of polishing head assemblies to rotate synchronously through the transmission assembly so as to drive the polishing heads of the n sets of polishing head assemblies to rotate synchronously, the polishing head mechanism drives the polishing heads of the n sets of polishing head assemblies to rotate synchronously through the rotary driving device, the overall structure of the polishing head mechanism is simplified, cost is reduced, and the polishing efficiency is improved. And the polishing efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment, and in particular relates to a polishing head mechanism and a wafer polishing machine. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] In order to improve the polishing efficiency of wafers, current wafer polishing equipment usually carries at least two wafers to be polished on a polishing plate. A polishing head mechanism is arranged above the polishing plate. The polishing head mechanism includes multiple polishing heads corresponding to the wafers to be polished one by one. Through the rotational cooperation of the polishing head and the polishing plate, the multiple wafers carried on the polishing plate can be polished.

[0004] However, in the existing polishing head mechanism, each polishing head is provided with an independent rotation drive mechanism, and the corresponding polishing head is driven to rotate by the rotation drive mechanism. Obviously, this structure has the problems of complex structure, high cost, and poor consistency in polishing multiple wafers carried on the polishing disk. Utility Model Content

[0005] The purpose of the present application is to provide a polishing head mechanism to solve the problems of complex structure and high cost of the existing polishing head mechanism; in addition, another purpose of the present application is to provide a wafer polishing machine including the polishing head mechanism.

[0006] To achieve this goal, this application adopts the following technical solutions:

[0007] In a first aspect, the present application provides a polishing head mechanism, which includes a substrate, a first driving member, and n sets of polishing head assemblies, where n is a positive integer not less than 2, wherein:

[0008] Each set of polishing head assembly includes an assembly, a polishing head and a second driving member. The polishing head is mounted on the first end of the assembly. The polishing head cooperates with the polishing plate to polish the wafer to be polished carried on the polishing plate. A through hole for the assembly to pass through is opened on the substrate. The assembly passes through the through hole and can rotate and rise and fall relative to the substrate. The fixed end of the second driving member is mounted above the substrate through a mounting frame. The driving end of the second driving member is connected to the second end of the assembly. The second driving member is configured to drive the corresponding assembly to rise and fall relative to the substrate, so as to drive the corresponding polishing head to rise and fall.

[0009] The fixed end of the first driving member is mounted on the base plate, and the first driving member is configured to simultaneously drive the assembly parts of n sets of polishing head assemblies to rotate synchronously through the transmission assembly, so as to drive the polishing heads of the n sets of polishing head assemblies to rotate synchronously.

[0010] The polishing head mechanism proposed in the present application realizes the simultaneous polishing of at least two wafers by setting up n sets of polishing head assemblies, and the polishing efficiency is high; at the same time, the polishing heads of the n sets of polishing head assemblies are driven to rotate synchronously by the first driving member, and the polishing heads of the n sets of polishing head assemblies are driven to rotate synchronously by a rotating driving device, which simplifies the overall structure of the polishing head mechanism, reduces costs, improves polishing efficiency, and improves the consistency of polishing of multiple wafers carried on the polishing plate.

[0011] Optionally, the first driving member is a motor, the transmission assembly includes a driving wheel, n driven wheels and a transmission belt, the fixed end of the motor is mounted on the base plate, the driving wheel is mounted on the rotating shaft of the motor, each driven wheel is anti-rotationally mounted on an assembly part of a polishing head assembly, and the transmission belt is sleeved on the driving wheel and the n driven wheels;

[0012] The motor is configured to drive the driving wheel to rotate, so as to simultaneously drive n driven wheels to rotate through a transmission belt, thereby driving the assembly parts of n sets of polishing head assemblies to rotate synchronously.

[0013] Through the cooperation of the driving wheel, the transmission belt and n driven wheels, the transmission connection between the first driving member and the assembly parts of n sets of polishing head assemblies is realized, providing a transmission assembly with high transmission accuracy, high transmission efficiency and low noise.

[0014] Optionally, the transmission assembly further comprises at least one set of tensioning wheel assembly, and the at least one set of tensioning wheel assembly is configured to tension the transmission belt mounted on the driving wheel and the n driven wheels;

[0015] Each set of tensioning wheel assembly includes a mounting part and a tensioning wheel. The mounting part is mounted on a base plate. The tensioning wheel is rotatably mounted on the mounting part. The tensioning wheel is pressed against the side of the transmission belt to control the tension of the transmission belt mounted on the driving wheel and n driven wheels.

[0016] Through the cooperation of the mounting part and the tensioning wheel, the transmission belt mounted on the driving wheel and the n driven wheels is tensioned, thereby ensuring the transmission efficiency of the transmission assembly.

[0017] Optionally, the tensioning wheel assembly also includes an adjustment component, and the mounting member is adjustably mounted on the base plate through the adjustment component. The adjustment component is configured to adjust the mounting position of the mounting member on the base plate to adjust the position of the tensioning wheel, thereby adjusting the tension of the transmission belt.

[0018] By setting the adjustment component, the tension of the transmission belt is adjusted, so that the transmission belt always maintains appropriate tension; at the same time, the tension of the transmission belt is adjusted by adjusting the installation position of the mounting part on the base plate, which is convenient to adjust and has high adjustment efficiency.

[0019] Optionally, the adjustment component includes a hinge shaft and a locking piece, the mounting piece is rotatably mounted on the base plate via the hinge shaft, an arc-shaped adjustment hole is provided on the mounting piece, a locking hole is provided on the base plate, the locking piece passes through the adjustment hole and is locked in the locking hole to fix the mounting piece on the base plate.

[0020] The mounting piece is rotatably mounted on the base plate via a hinge shaft, which facilitates quick adjustment of the mounting position of the mounting piece on the base plate, thereby further improving the adjustment efficiency. At the same time, the cooperation of the locking piece, the adjustment hole and the locking hole enables the mounting piece to be fixed or loosened relative to the base plate, and the overall structure of the adjustment assembly is simple and low in cost.

[0021] Optionally, the adjustment assembly also includes an adjusting bolt, which is installed on the base plate through a mounting block, and the first end of the adjusting bolt abuts against the mounting member. The mounting member is controlled to rotate around the hinge axis by adjusting the second end of the adjusting bolt to achieve position adjustment of the mounting member.

[0022] The mounting part is pushed to rotate around the hinge shaft by adjusting the bolt, thereby adjusting the position of the mounting part, further improving the adjustment efficiency and ensuring the adjustment accuracy.

[0023] Optionally, the polishing head assembly further includes a stroke adjustment assembly, the stroke adjustment assembly is configured to adjust the lifting stroke of the assembly, and the stroke adjustment assembly includes a third driving member, a moving member and a limiting member, wherein:

[0024] The fixed end of the third driving member is mounted on the base plate, the driving end of the third driving member is connected to the moving member, and the third driving member is configured to drive the moving member to move laterally;

[0025] The limiting member is installed on the assembly member and is located above the moving member. The moving member is provided with at least two limiting surfaces, and the heights of the limiting surfaces are different.

[0026] The third driving member drives the moving member to move horizontally to move the limiting surface of the corresponding height to the lifting path of the limiting member, and the second driving member drives the assembly member to descend to drive the limiting member to descend and abut against a corresponding limiting surface.

[0027] Through the cooperation of the third driving member, the moving member and the limiting member, the lifting stroke of the assembly is adjusted to meet different polishing requirements with good compatibility; at the same time, the stroke adjustment component has a simple overall structure, ingenious design, and stable and reliable operation.

[0028] Optionally, the polishing head comprises a base body and a limiting ring, wherein:

[0029] An adsorption cavity is arranged in the substrate, an adsorption hole connected to the adsorption cavity is opened on the adsorption surface of the substrate, a polishing film is arranged on the adsorption surface, and the polishing head adsorbs and fixes the wafer through the adsorption surface;

[0030] The limiting ring is arranged on the base and is located at the periphery of the adsorption surface. The limiting ring is configured to limit the wafer on the polishing head when the polishing head rotates.

[0031] By setting an adsorption cavity on the substrate and opening adsorption holes on the adsorption surface of the substrate, the wafer can be adsorbed and fixed on the substrate, which is convenient for the polishing head to pick up or release the wafer; by setting a limit ring, the wafer on the polishing head can be limited in the circumferential direction to prevent the wafer from being accidentally thrown out of the adsorption surface of the substrate when the polishing head rotates at high speed.

[0032] Optionally, the assembly includes a connecting seat, a slip ring and a connecting member, the driving end of the second driving member is connected to the first end of the connecting seat, the first end of the connecting member is rotatably mounted on the second end of the connecting seat through the slip ring, the second end of the connecting member is transmission-connected to the polishing head, the slip ring includes a rotor and a stator, the stator is fixed on the connecting seat, and the connecting member is connected to the rotor.

[0033] The connector is rotatably mounted on the second end of the connector base via a slip ring, which can prevent the wires and air pipes required for the connector from being entangled when the connector rotates, thereby facilitating the arrangement of the wires and air pipes of the connector.

[0034] In a second aspect, the present application proposes a wafer polishing machine, which includes a polishing platform, a turntable, and multiple sets of polishing head mechanisms and multiple sets of polishing discs. The polishing head mechanism adopts the polishing head mechanism as described above, wherein:

[0035] The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a set of polishing discs;

[0036] The turntable is rotatably arranged above the polishing platform, and a plurality of groups of polishing head mechanisms are evenly arranged on the turntable along the circumferential direction;

[0037] The turntable drives multiple groups of polishing head mechanisms to rotate synchronously at a preset angle, so that one group of polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms and the polishing disk cooperate with each other to polish the wafers to be polished picked up by other polishing head mechanisms.

[0038] The wafer polishing machine proposed in the present application realizes automatic polishing of wafers through the cooperation of a polishing platform, a turntable, and multiple sets of polishing head mechanisms and polishing discs, and the polishing efficiency is high; at the same time, the first driving member of the polishing head mechanism drives the assembly parts of n sets of polishing head assemblies to rotate synchronously through the transmission assembly, so as to drive the polishing heads of n sets of polishing head assemblies to rotate synchronously, thereby simplifying the overall structure of the polishing head mechanism, reducing costs, and improving polishing efficiency and consistency of wafer polishing. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1is a schematic diagram of the three-dimensional structure of the polishing head mechanism provided in an embodiment of the present application;

[0040] Figure 2 is a front view schematic diagram of a polishing head mechanism provided in an embodiment of the present application;

[0041] Figure 3 It is a schematic diagram of the three-dimensional structure of the adjustment component of the polishing head mechanism provided in an embodiment of the present application;

[0042] Figure 4 This is a schematic diagram of the three-dimensional structure of the stroke adjustment component of the polishing head mechanism provided in the embodiment of the present application:

[0043] Figure 5 is a cross-sectional schematic diagram of a polishing head of a polishing head mechanism provided in an embodiment of the present application;

[0044] Figure 6 It is a structural schematic diagram of the wafer polishing machine provided in an embodiment of the present application.

[0045] Figures 1 to 6 The following reference numerals are included:

[0046] substrate 10;

[0047] A first driving member 20;

[0048] Polishing head assembly 30: assembly part 31, connecting seat 310, slip ring 311, connecting part 312, polishing head 32, base 320, limiting ring 321, adsorption cavity 322, polishing film 323, adsorption hole 324, second driving part 33, stroke adjustment assembly 34, third driving part 340, moving part 341, limiting part 342, limiting surface 343;

[0049] Transmission assembly 40: driving wheel 41, driven wheel 42, transmission belt 43, tensioning wheel assembly 44, mounting member 440, tensioning wheel 441, adjustment hole 442, adjustment assembly 45, hinge shaft 450, locking member 451, adjustment bolt 452, mounting block 453;

[0050] Polishing platform 50: loading and unloading station 51, polishing station 52;

[0051] Turntable 60;

[0052] Polishing head mechanism 70;

[0053] Polishing disc 80. DETAILED DESCRIPTION

[0054] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0055] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0056] In order to improve the polishing efficiency of wafers, current wafer polishing equipment usually carries at least two wafers to be polished on a polishing plate. A polishing head mechanism is arranged above the polishing plate. The polishing head mechanism includes multiple polishing heads corresponding to the wafers to be polished one by one. Through the rotational cooperation of the polishing head and the polishing plate, the multiple wafers carried on the polishing plate can be polished.

[0057] However, in the existing polishing head mechanism, each polishing head is provided with an independent rotation drive mechanism, and the corresponding polishing head is driven to rotate by the rotation drive mechanism. Obviously, this structure has the problems of complex structure, high cost, and poor consistency in polishing multiple wafers carried on the polishing disk.

[0058] To this end, in the first aspect, this embodiment proposes a polishing head mechanism, see Figure 1 and Figure 2 As shown, this embodiment provides a polishing head mechanism, which includes a substrate 10, a first driving member 20 and n sets of polishing head assemblies 30, where n is a positive integer not less than 2, wherein:

[0059] Each set of polishing head assembly 30 includes an assembly part 31, a polishing head 32 and a second driving member 33. The polishing head 32 is mounted on the first end of the assembly part 31. The polishing head 32 cooperates with the polishing plate to polish the wafer to be polished carried on the polishing plate. A through hole for the assembly part 31 to pass through is opened on the substrate 10. The assembly part 31 passes through the through hole and can rotate and rise and fall relative to the substrate 10. The fixed end of the second driving member 20 is mounted above the substrate 10 through a mounting frame. The driving end of the second driving member 20 is connected to the second end of the assembly part. The second driving member 20 is configured to drive the corresponding assembly part 31 to rise and fall relative to the substrate 10, so as to drive the corresponding polishing head 32 to rise and fall.

[0060] The fixed end of the first driving member 20 is mounted on the substrate 10 , and the first driving member 20 is configured to simultaneously drive the assembly parts 31 of the n sets of polishing head assemblies 30 to rotate synchronously through the transmission assembly 40 , so as to drive the polishing heads 32 of the n sets of polishing head assemblies 30 to rotate synchronously.

[0061] Specifically, the second driving member 33 is a cylinder.

[0062] The polishing head mechanism proposed in the present application realizes the simultaneous polishing of at least two wafers by setting up n sets of polishing head assemblies 30, and the polishing efficiency is high; at the same time, the polishing heads 32 of the n sets of polishing head assemblies 30 are driven to rotate synchronously by the first driving member 20, and the polishing heads 32 of the n sets of polishing head assemblies 30 are driven to rotate synchronously by a rotating driving device, which simplifies the overall structure of the polishing head mechanism, reduces costs, improves polishing efficiency, and improves the consistency of polishing of multiple wafers carried on the polishing plate.

[0063] In one embodiment, the first driving member 20 is a motor, and the transmission assembly 40 includes a driving wheel 41, n driven wheels 42 and a transmission belt 43. The fixed end of the motor is mounted on the base plate 10, the driving wheel 41 is mounted on the rotating shaft of the motor, each driven wheel 42 is anti-rotationally mounted on a set of assembly parts 31 of the polishing head assembly 30, and the transmission belt sleeve 43 is mounted on the driving wheel 41 and the n driven wheels 42;

[0064] The motor is configured to simultaneously drive n driven wheels 42 to rotate through a transmission belt 43 , thereby driving the assembly parts 31 of n sets of polishing head assemblies 30 to rotate synchronously.

[0065] Specifically, the driving wheel 41 and the n driven wheels 42 are all synchronous pulleys, and the transmission belt 43 is a synchronous belt.

[0066] Through the cooperation of the driving wheel 41, the transmission belt 43 and the n driven wheels 42, the transmission connection between the first driving member 20 and the assembly parts 31 of the n sets of polishing head assemblies 30 is realized, providing a transmission assembly with high transmission accuracy, high transmission efficiency and low noise.

[0067] See also Figure 2 and Figure 3 As shown, in one embodiment, the transmission assembly 40 further includes at least one set of tensioning wheel assembly 44, and the at least one set of tensioning wheel assembly 44 is configured to control the tension of the transmission belt 43 mounted on the driving wheel 41 and the n driven wheels 42;

[0068] Each set of tensioning wheel assembly 44 includes a mounting member 440 and a tensioning wheel 441. The mounting member 440 is mounted on the base plate 10, and the tensioning wheel 441 is rotatably mounted on the mounting member 440. The tensioning wheel 441 is pressed against the side of the transmission belt 43, abutting against the transmission belt 43 mounted on the driving wheel 41 and n driven wheels 42 to implement tension adjustment.

[0069] Through the cooperation of the mounting member 440 and the tensioning wheel 441 , the transmission belt 43 mounted on the driving wheel 41 and the n driven wheels 42 is tensioned, thereby ensuring the transmission efficiency of the transmission assembly 40 .

[0070] In one embodiment, the tensioning wheel assembly 44 also includes an adjustment assembly 45, and the mounting member 440 is adjustably mounted on the substrate 10 through the adjustment assembly 45. The adjustment assembly 45 is configured to adjust the installation position of the mounting member 440 on the substrate 10 to adjust the position of the tensioning wheel 441, thereby adjusting the tension of the transmission belt 43.

[0071] By setting the adjustment component 45, the tension of the transmission belt 43 is adjusted, so that the transmission belt 43 always maintains appropriate tension; at the same time, the tension of the transmission belt 43 is adjusted by adjusting the installation position of the mounting member 440 on the substrate 10, which is convenient to adjust and has high adjustment efficiency.

[0072] See also Figures 1 to 3 As shown, in one embodiment, the adjustment component 45 includes a hinge shaft 450 and a locking member 451, the mounting member 440 is rotatably mounted on the substrate 10 via the hinge shaft 450, an arc-shaped adjustment hole 442 is provided on the mounting member 440, a locking hole is provided on the substrate 10, the locking member 451 passes through the adjustment hole 442 and is locked and fixed in the locking hole to fix the mounting member 440 on the substrate 10.

[0073] The mounting member 440 is rotatably mounted on the substrate 10 via the hinge shaft 450, so that the mounting position of the mounting member 440 on the substrate 10 can be adjusted quickly and conveniently, thereby further improving the adjustment efficiency. At the same time, the cooperation among the locking member 451, the adjustment hole 442 and the locking hole enables the mounting member 440 to be fixed or loosened relative to the substrate 10, and the overall structure of the adjustment component 45 is simple and the cost is low.

[0074] In one embodiment, the adjustment assembly 45 also includes an adjustment bolt 452, which is installed on the substrate 10 through a mounting block 453. The first end of the adjustment bolt 452 abuts against the mounting member 440. The second end of the adjustment bolt 452 is adjusted to control the mounting member 440 to rotate around the hinge shaft 450 to achieve position adjustment of the mounting member 440.

[0075] The mounting member 440 is pushed to rotate around the hinge shaft 450 by adjusting the bolt 452, thereby adjusting the position of the mounting member 440, further improving the adjustment efficiency and ensuring the adjustment accuracy.

[0076] See also Figure 1 and Figure 4 As shown, in one embodiment, the polishing head assembly 30 further includes a stroke adjustment assembly 34, which is configured to adjust the lifting stroke of the assembly 31, and the stroke adjustment assembly 34 includes a third driving member 340, a moving member 341 and a limiting member 342, wherein:

[0077] The fixed end of the third driving member 340 is mounted on the substrate 10 , the driving end of the third driving member 340 is connected to the moving member 341 , and the third driving member 340 is configured to drive the moving member 341 to move laterally;

[0078] The limiting member 342 is installed on the assembly member 31 and is located above the moving member 341. The moving member 341 is provided with at least two limiting surfaces 343, and the heights of the limiting surfaces 343 are different.

[0079] The third driving member 340 drives the moving member 341 to move horizontally to move the limiting surface 343 of the corresponding height to the lifting path of the limiting member 342. The second driving member 33 drives the assembly member 31 to descend to drive the limiting member 342 to descend and abut against a corresponding limiting surface 343.

[0080] Specifically, the third driving member 340 is a cylinder.

[0081] Through the cooperation of the third driving member 340, the moving member 341 and the limiting member 342, the lifting stroke of the assembly member 31 is adjusted to meet different polishing requirements with good compatibility; at the same time, the stroke adjustment component 34 has a simple overall structure, ingenious design, and stable and reliable operation.

[0082] See also Figure 5 As shown, in one embodiment, the polishing head 32 includes a base 320 and a limiting ring 321, wherein:

[0083] An adsorption cavity 322 is provided in the base 320, an adsorption hole 324 communicating with the adsorption cavity 322 is provided on the adsorption surface of the base 320, a polishing film 323 is provided on the adsorption surface, and the polishing head 32 adsorbs and fixes the wafer through the adsorption surface;

[0084] The limiting ring 321 is disposed on the base 320 and is located at the periphery of the adsorption surface. The limiting ring 321 is configured to limit the wafer on the polishing head 32 when the polishing head 32 rotates.

[0085] By providing an adsorption cavity 322 on the substrate and opening an adsorption hole 324 on the adsorption surface of the substrate 320, the wafer can be adsorbed and fixed on the substrate 320, which is convenient for the polishing head 32 to pick up or release the wafer; by providing a limit ring 321, the wafer on the polishing head 32 is limited in the circumferential direction to prevent the wafer from being accidentally thrown out from the adsorption surface of the substrate 320 when the polishing head 32 rotates at high speed.

[0086] See also Figure 1As shown, in one embodiment, the assembly 31 includes a connecting seat 310, a slip ring 311 and a connecting member 312, the driving end of the second driving member 33 is connected to the first end of the connecting seat 310, the first end of the connecting member 312 is rotatably mounted on the second end of the connecting seat 310 through the slip ring 311, the second end of the connecting member 312 is transmission-connected to the polishing head 32, the slip ring 311 includes a rotor and a stator, the stator is fixed on the connecting seat, and the connecting member 312 is connected to the rotor.

[0087] The connector 312 is rotatably mounted on the second end of the connector base 310 via the slip ring 311, which can prevent the wires and air pipes required for the connector 312 from being entangled when the connector 312 rotates, thereby facilitating the arrangement of the wires and air pipes of the connector.

[0088] The polishing head mechanism provided in the embodiment of the present application has the following advantages:

[0089] 1) The polishing heads 32 of n sets of polishing head assemblies 30 are driven to rotate synchronously by a rotary drive device, thereby simplifying the overall structure of the polishing head mechanism, reducing costs, and improving polishing efficiency.

[0090] 2) The tensioning wheel assembly 44 can keep the transmission belt 43 in a tensioned state at all times to ensure the transmission efficiency of the transmission assembly 40 .

[0091] 3) The tension of the transmission belt 43 can be adjusted through the adjustment component 45. The overall structure of the adjustment component 45 is simple, and the adjustment is convenient and quick.

[0092] 4) The stroke adjustment component 34 can be used to adjust the lifting stroke of the assembly 31 to meet different polishing requirements, and has good compatibility.

[0093] In the second aspect, the present application proposes a wafer polishing machine, see Figure 1 and Figure 6 As shown, the wafer polishing machine proposed in the embodiment of the present application includes a polishing platform 50, a turntable 60, multiple sets of polishing head mechanisms 70 and multiple sets of polishing discs 80, and the multiple sets of polishing head mechanisms 70 all adopt the polishing head mechanism as described above, wherein:

[0094] The polishing platform 50 is provided with a loading and unloading station 51 and at least one polishing station 52, and each polishing station 52 is provided with a set of polishing discs 80;

[0095] The turntable 60 is rotatably disposed above the polishing platform 50, and a plurality of groups of polishing head mechanisms 70 are evenly distributed and installed on the turntable 60 along the circumferential direction;

[0096] The turntable 60 drives multiple groups of polishing head mechanisms 70 to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms 70 is opposite to the loading and unloading station 51 to pick up the wafers to be polished on the loading and unloading station 51 or place the polished wafers on the loading and unloading station 51, and at the same time, the other polishing head mechanisms 70 and the polishing disk 80 cooperate with each other to move to polish the wafers to be polished picked up by the other polishing head mechanisms 70.

[0097] The wafer polishing machine proposed in the present application realizes automatic polishing of the wafer through the cooperation of the polishing platform 50, the turntable 60 and multiple sets of polishing head mechanisms 70 and the polishing disk 80, and the polishing efficiency is high; at the same time, the first driving member 20 of the polishing head mechanism 70 drives the assembly parts 31 of the n sets of polishing head assemblies 30 to rotate synchronously through the transmission assembly 40, so as to drive the polishing heads 32 of the n sets of polishing head assemblies 30 to rotate synchronously, thereby simplifying the overall structure of the polishing head mechanism 30, reducing the cost, and improving the polishing efficiency and the consistency of wafer polishing.

[0098] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A polishing head mechanism, characterized in that: The polishing head mechanism comprises a base plate, a first driving member and n sets of polishing head assemblies, where n is a positive integer not less than 2, wherein: Each set of the polishing head assembly comprises an assembly, a polishing head and a second driving member, wherein the polishing head is mounted on the first end of the assembly, and the polishing head cooperates with the polishing disc to polish the wafer to be polished carried on the polishing disc, the substrate is provided with a through hole for the assembly to pass through, the assembly passes through the through hole and can rotate and rise and fall relative to the substrate, the fixed end of the second driving member is fixedly mounted above the substrate through a mounting frame, the driving end of the second driving member is connected to the second end of the assembly, and the second driving member is configured to drive the corresponding assembly to rise and fall relative to the substrate, so as to drive the corresponding polishing head to rise and fall; The fixed end of the first driving member is mounted on the base plate, and the first driving member is configured to simultaneously drive n sets of assembly parts of the polishing head assembly to rotate synchronously through a transmission assembly, so as to drive the polishing heads of the n sets of the polishing head assembly to rotate synchronously.

2. The polishing head mechanism according to claim 1, characterized in that: The first driving member is a motor, and the transmission assembly includes a driving wheel, n driven wheels and a transmission belt. The fixed end of the motor is mounted on the base plate, the driving wheel is mounted on the rotating shaft of the motor, each driven wheel is anti-rotationally mounted on a set of assembly parts of the polishing head assembly, and the transmission belt is sleeved on the driving wheel and the n driven wheels; The motor is configured to drive the driving wheel to rotate, so as to simultaneously drive n driven wheels to rotate through the transmission belt, thereby driving n sets of assembly parts of the polishing head assembly to rotate synchronously.

3. The polishing head mechanism according to claim 2, characterized in that: The transmission assembly further comprises at least one set of tensioning wheel assemblies, wherein the at least one set of tensioning wheel assemblies is configured to tension the transmission belts sleeved on the driving wheel and the n driven wheels; Each set of the tensioning wheel assembly includes a mounting member and a tensioning wheel, wherein the mounting member is mounted on the base plate, and the tensioning wheel is rotatably mounted on the mounting member, and the tensioning wheel is pressed against the side surface of the transmission belt to tension the transmission belt mounted on the driving wheel and the n driven wheels.

4. The polishing head mechanism according to claim 3, characterized in that: Each set of the tensioning wheel assembly also includes an adjustment assembly, through which the mounting member is adjustably mounted on the base plate, and the adjustment assembly is configured to adjust the mounting position of the mounting member on the base plate to adjust the position of the tensioning wheel, thereby adjusting the tension of the transmission belt.

5. The polishing head mechanism according to claim 4, characterized in that: The adjustment component includes a hinge shaft and a locking piece. The mounting piece is rotatably mounted on the base plate via the hinge shaft. An arc-shaped adjustment hole is provided on the mounting piece. A locking hole is provided on the base plate. The locking piece passes through the adjustment hole and is locked in the locking hole to fix the mounting piece on the base plate.

6. The polishing head mechanism according to claim 5, characterized in that: The adjustment assembly also includes an adjustment bolt, which is installed on the base plate through a mounting block. The first end of the adjustment bolt abuts against the mounting member. The mounting member is controlled to rotate around the hinge axis by adjusting the second end of the adjustment bolt to achieve position adjustment of the mounting member.

7. The polishing head mechanism according to claim 1, characterized in that: Each set of the polishing head assembly further includes a stroke adjustment assembly, which is configured to adjust the lifting stroke of the assembly, and the stroke adjustment assembly includes a third driving member, a moving member and a limiting member, wherein: The fixed end of the third driving member is mounted on the base plate, the driving end of the third driving member is connected to the moving member, and the third driving member is configured to drive the moving member to move laterally; The limiting member is installed on the assembly member and is located above the moving member. The moving member is provided with at least two limiting surfaces, and the heights of the limiting surfaces are different. The third driving member drives the movable member to move horizontally to move the limiting surface of the corresponding height to the lifting path of the limiting member, and the second driving member drives the assembly member to descend to drive the limiting member to descend and abut against a corresponding limiting surface.

8. The polishing head mechanism according to claim 1, characterized in that: The polishing head comprises a base body and a limiting ring, wherein: An adsorption cavity is arranged in the base, an adsorption hole communicating with the adsorption cavity is opened on the adsorption surface of the base, a polishing film is arranged on the adsorption surface, and the polishing head adsorbs and fixes the wafer through the adsorption surface; The limiting ring is arranged on the base and is located at the periphery of the adsorption surface. The limiting ring is configured to limit the position of the wafer adsorbed by the polishing head when the polishing head rotates.

9. The polishing head mechanism according to claim 8, characterized in that: The assembly includes a connecting seat, a slip ring and a connecting member, the driving end of the second driving member is connected to the first end of the connecting seat, the first end of the connecting member is rotatably mounted on the second end of the connecting seat through the slip ring, the second end of the connecting member is transmission-connected to the polishing head, the slip ring includes a rotor and a stator, the stator is fixed on the connecting seat, and the connecting member is connected to the rotor.

10. A wafer polishing machine, characterized in that: The wafer polishing machine comprises a polishing platform, a turntable, multiple sets of polishing head mechanisms and multiple sets of polishing discs, wherein the polishing head mechanism adopts the polishing head mechanism according to any one of claims 1 to 9, wherein: The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a group of polishing discs; The turntable is rotatably arranged above the polishing platform, and a plurality of groups of polishing head mechanisms are evenly installed on the turntable along the circumferential direction; The turntable drives multiple groups of the polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms cooperate with the polishing disc to move so as to polish the wafers to be polished picked up by the other polishing head mechanisms.

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