Rotary driving mechanism and wafer polishing machine

Abstract

The utility model discloses a rotation driving mechanism and a wafer polisher, the rotation driving mechanism comprises a base, a rotating disc, a first driving part and a positioning assembly, the base is installed on a rack of polishing equipment, the rotating disc is rotatably installed on the base, and at least one polishing head is installed on the rotating disc; the first driving part is configured to drive the rotating disc to rotate by a preset angle relative to the base so as to drive the at least one polishing head to rotate to the corresponding polishing station or the feeding and discharging station, each polishing station is provided with at least one polishing disc, and the feeding and discharging station is provided with at least one wafer bearing mechanism; the positioning assembly is configured to fix the rotating disc relative to the base after the first driving piece drives the rotating disc to rotate by a preset angle relative to the base. According to the rotation driving mechanism, the positioning assembly is arranged, so that the turntable is relatively fixed on the base when a wafer is polished; therefore, the polishing head does not deviate in the polishing process, the polishing consistency of the wafer is guaranteed, and the polishing quality of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment, and in particular, relates to a rotary drive mechanism and a wafer polishing machine. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] Current wafer polishing equipment usually includes multiple polishing stations, and the polishing head is driven to move to the corresponding polishing station by a turntable to polish the wafer in coordination with the polishing disk on the polishing station. However, during the polishing process of the wafer, the rotation of the polishing disk and the polishing head may cause the turntable itself to shift in angle, that is, the polishing head may rotate with the turntable during the polishing process, thereby affecting the polishing quality of the wafer. Utility Model Content

[0004] The purpose of the present application is to provide a rotation drive mechanism to solve the problem that the turntable of the existing wafer polishing equipment may rotate during polishing; in addition, another purpose of the present application is to provide a wafer polishing machine including the rotation drive mechanism.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a rotary drive mechanism, which includes a base, a turntable, a first drive member and at least one set of positioning components, wherein:

[0007] The base is detachably mounted on a frame of the polishing device, the turntable is rotatably mounted on the base, and at least one polishing head is mounted on the turntable;

[0008] The fixed end of the first driving member is mounted on the base, and the driving end of the first driving member is in transmission connection with the turntable. The first driving member is configured to drive the turntable to rotate at a preset angle relative to the base, so as to drive at least one polishing head to rotate to a corresponding polishing station or loading and unloading station, each polishing station is provided with at least one polishing disk, and the loading and unloading station is provided with at least one wafer carrying mechanism;

[0009] At least one set of positioning components is arranged on the base along the circumferential direction and is configured to fix the turntable relative to the base after the first driving member drives the turntable to rotate relative to the base by a preset angle.

[0010] The rotary drive mechanism proposed in the present application realizes the fixation of the turntable on the base relatively when the polishing head cooperates with the polishing disk to polish the wafer by setting a positioning component, thereby avoiding the angular deviation of the turntable during the polishing process; the polishing head will not rotate with the turntable during the polishing process, thereby ensuring the consistency of wafer polishing and improving the polishing quality of the wafer.

[0011] Optionally, the positioning assembly includes a second driving member, a positioning hole and a positioning pin, the driving end of the second driving member is connected to the positioning pin, the second driving member is configured to drive the positioning pin to switch between the first position and the second position, and the positioning hole is provided on the turntable or the base and is arranged corresponding to the positioning pin;

[0012] The second driving member drives the positioning pin to move to the first position, and the positioning pin is inserted into the positioning hole to fix the turntable relative to the base;

[0013] The second driving member drives the positioning pin to move to the second position, and the positioning pin leaves the positioning hole, so that the first driving member can drive the turntable to rotate relative to the base.

[0014] Through the cooperation of the second driving member, the positioning pin and the positioning hole, the turntable can be fixed relative to the base after it rotates a preset angle relative to the base, so as to avoid the polishing head from shifting during the polishing process, providing a positioning component with simple structure, low cost and stable and reliable positioning.

[0015] Optionally, the fixed end of the second driving member is fixedly connected to the base and is located above the turntable, the driving end of the second driving member is arranged downward and connected to the positioning pin, the positioning hole is opened on the turntable, the positioning pin corresponds to the positioning hole, and the second driving member is configured to drive the positioning pin to rise and fall;

[0016] The second driving member drives the positioning pin to descend, so that the positioning pin is inserted into the corresponding positioning hole to connect the turntable and the base to prevent rotation;

[0017] The second driving member drives the positioning pin to rise, so that the positioning pin leaves the corresponding positioning hole to release the anti-rotation connection between the turntable and the base.

[0018] By installing the second driving member on the base, opening the positioning hole on the turntable, and the driving end of the second driving member facing downward and connected to the positioning pin, a second driving member upper positioning assembly is provided, which is convenient for installation and maintenance of the second driving member.

[0019] Optionally, the fixed end of the second driving member is mounted on the turntable, the driving end of the second driving member is arranged upward and connected to the positioning pin, the positioning hole is opened on the base and is located above the turntable, the positioning pin corresponds to the positioning hole, and the second driving member is configured to drive the positioning pin to rise and fall;

[0020] The second driving member drives the positioning pin to rise, so that the positioning pin is inserted into the corresponding positioning hole to connect the turntable and the base to prevent rotation;

[0021] The second driving member drives the positioning pin to descend, so that the positioning pin leaves the corresponding positioning hole to release the anti-rotation connection between the turntable and the base.

[0022] By installing the second driving member on the turntable, opening a positioning hole on the base, and the driving end of the second driving member facing upward and connected to the positioning pin, a bottom-mounted positioning assembly for the second driving member is provided, which does not occupy the space above the base and has a more compact overall structure.

[0023] Optionally, the base includes a support member and a connecting seat, the support member is vertically arranged, the connecting seat is fixedly installed on the top of the support member, the connecting seat is detachably installed on the frame of the polishing equipment, the turntable is rotatably mounted on the periphery of the support member, and the fixed ends of the first driving member and the second driving member are both installed on the connecting seat.

[0024] By providing a support member, the turntable can be rotatably mounted on the periphery of the support member, thereby achieving support for the rotary drive mechanism; by providing a connecting seat, the rotary drive mechanism can be installed on the frame of the polishing equipment; by installing the first drive member and the second drive member on the connecting seat, the installation and maintenance of the first drive member and the second drive member are facilitated, and the layout is reasonable.

[0025] Optionally, the first driving member includes a motor, a driving gear and a transmission ring gear, the fixed end of the motor is mounted on the connecting seat, the driving gear is mounted on the rotating shaft of the motor, the transmission ring gear is fixed on the top surface of the turntable and is located below the connecting seat, and the driving gear and the transmission ring gear are meshed.

[0026] Through the cooperation of the motor, the driving gear and the transmission gear ring, a first driving member using gear transmission is provided, which has a compact structure, high transmission efficiency, constant transmission ratio, and stable and reliable transmission.

[0027] Optionally, the connecting seat includes a connecting part and a supporting frame, and the connecting seat is installed on the frame of the polishing equipment through the connecting part. The supporting frame is arranged on the periphery of the connecting part, and a plurality of connecting ribs are arranged between the supporting frame and the connecting part. Four sets of positioning assemblies are provided, and the fixed ends of the second driving members of the four sets of positioning assemblies are evenly installed on the supporting frames.

[0028] By arranging a support frame on the periphery of the connecting part, the overall weight of the connecting seat is reduced while ensuring the stability and reliability of the connection of the connecting seat; by arranging four sets of positioning components, the fixed ends of the second driving parts of the four sets of positioning components are installed on the support frame, which further improves the stability and reliability of the turntable positioning during polishing.

[0029] Optionally, the support member is a hollow structure.

[0030] By setting the support member as a hollow structure, the weight of the support member is reduced while ensuring the strength of the support member.

[0031] In a second aspect, the present application provides a wafer polishing machine, which includes a polishing platform, the above-mentioned rotation drive mechanism and a polishing disc mechanism, wherein:

[0032] The polishing platform is provided with a loading and unloading station and at least one polishing station, each polishing station is provided with a set of polishing disc mechanisms, and each set of polishing disc mechanisms includes at least one polishing disc;

[0033] The rotary drive mechanism is arranged above the polishing platform, and at least two groups of polishing head mechanisms are evenly arranged and installed on the turntable along the circumference, each group of polishing head mechanisms includes at least one polishing head, and the polishing head can be raised and lowered relative to the turntable;

[0034] The first driving member drives the turntable to rotate a preset angle to drive at least two groups of polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, and at the same time, the other polishing head mechanisms and the polishing plate mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

[0035] Through the cooperation of the polishing platform, the rotary drive mechanism and the polishing disc mechanism, automatic polishing of the wafer to be polished is realized, and the polishing efficiency is high; at the same time, the rotary drive mechanism can fix the turntable relatively to the base during the polishing process of the polishing head, so that the polishing head will not rotate with the turntable during the polishing process, thereby ensuring the consistency of wafer polishing and improving the polishing quality of the wafer.

[0036] Optionally, each set of polishing disc mechanisms includes two polishing discs disposed at intervals, and each set of polishing head mechanisms includes two polishing heads disposed at intervals, and each polishing head corresponds to one polishing disc.

[0037] By configuring each group of polishing disc mechanisms to include two polishing discs and configuring each group of polishing head mechanisms to include two polishing heads, it is possible to load and unload and polish two wafers simultaneously, thereby improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic diagram of the three-dimensional structure of the rotation drive mechanism provided in an embodiment of the present application;

[0039] Figure 2 is a side view schematic diagram of a rotary drive mechanism provided in an embodiment of the present application;

[0040] Figure 3 is a structural schematic diagram of a first driving member of a rotary driving mechanism provided in an embodiment of the present application;

[0041] Figure 4 It is a schematic top view of the polishing device provided in an embodiment of the present application.

[0042] Figures 1 to 4 The following reference numerals are included:

[0043] Rotation drive mechanism 10: base 11, support member 110, connection seat 111, connection part 1110, support frame 1111, connection rib 1112, turntable 12, first drive member 13, motor 130, driving gear 131, transmission gear ring 132, positioning assembly 14, second drive member 140, positioning pin 141, positioning sleeve 142;

[0044] Polishing platform 20: loading and unloading station 21, polishing station 22;

[0045] Polishing disc mechanism 30;

[0046] Polishing head mechanism 40. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0048] Current wafer polishing equipment usually includes multiple polishing stations, and the polishing head is driven to move to the corresponding polishing station by a turntable to polish the wafer in coordination with the polishing disk on the polishing station. However, during the polishing process of the wafer, the rotation of the polishing disk and the polishing head may cause the turntable itself to shift in angle, that is, the polishing head may rotate with the turntable during the polishing process, thereby affecting the polishing quality of the wafer.

[0049] Therefore, the present application provides a rotation drive mechanism 10, see Figure 1 and Figure 4 As shown, the rotary drive mechanism 10 provided in the embodiment of the present application includes a base 11, a turntable 12, a first drive member 13 and at least one set of positioning components 14. The base 11 can be detachably fixed on the frame of the polishing equipment, the turntable 12 can be rotatably mounted on the base 11, and at least one polishing head is mounted on the turntable 12; the fixed end of the first drive member 13 is mounted on the base 11, and the driving end of the first drive member 13 is connected to the turntable 12. The first drive member 13 is configured to drive the turntable 12 to rotate a preset angle relative to the base 11, so as to drive at least one polishing head to rotate to the corresponding polishing station 22, and each polishing station 22 is provided with at least one polishing disk; at least one set of positioning components 14 is configured to fix the turntable 12 relative to the base 11 when the polishing head cooperates with the polishing disk to polish the wafer.

[0050] It can be seen that the rotary drive mechanism 10 proposed in the present application realizes that when the polishing head cooperates with the polishing disk to polish the wafer, the turntable 12 is relatively fixed to the base 11 by setting the positioning component 14, thereby avoiding the angular deviation of the turntable 12 during the polishing process; the polishing head will not rotate with the turntable 12 during the polishing process, thereby ensuring the consistency of wafer polishing and improving the polishing quality of the wafer.

[0051] See also Figure 1 and Figure 2 As shown, as an embodiment, the positioning assembly 14 includes a second driving member 140, a positioning pin 141 and a positioning hole. The driving end of the second driving member 140 is connected to the positioning pin 141. The second driving member 140 is configured to drive the positioning pin 141 to switch between the first position and the second position. The positioning hole is opened on the turntable 12 or the base 11 and is arranged corresponding to the positioning pin 141; the second driving member 140 drives the positioning pin 141 to move to the first position, and the positioning pin 141 is inserted into the positioning hole of the turntable 12 to fix the turntable 12 relative to the base 11; the second driving member 140 drives the positioning pin 141 to move to the second position, and the positioning pin 141 leaves the positioning hole of the turntable 12, so that the first driving member 13 can drive the turntable 12 to rotate relative to the base 11.

[0052] It can be seen that through the cooperation of the second driving member 140, the positioning pin 141 and the positioning hole, the turntable 12 can be fixed relative to the base 11 after the turntable 12 is rotated relative to the base 11 by a preset angle, so as to avoid the polishing head from shifting during the polishing process, providing a positioning component 14 with a simple structure, low cost, and stable and reliable positioning.

[0053] As an embodiment, the fixed end of the second driving member 140 is fixedly connected to the base 11 and is located above the turntable 12. The driving end of the second driving member 140 is set downward and connected to the positioning pin 141. The positioning hole is opened on the turntable 12. The positioning pin 141 corresponds to the positioning hole. The second driving member 140 is configured to drive the positioning pin 141 to rise and fall; the second driving member 140 drives the positioning pin 141 to descend, so that the positioning pin 141 is inserted into the corresponding positioning hole to connect the turntable 12 and the base 11 to prevent rotation; the second driving member 140 drives the positioning pin 141 to rise, so that the positioning pin 141 leaves the corresponding positioning hole to release the anti-rotation connection between the turntable 12 and the base 11.

[0054] Specifically, the second driving member 140 is a cylinder.

[0055] Specifically, at least one positioning sleeve 142 is installed on the turntable 12 , each positioning sleeve 142 corresponds to a positioning pin 141 , and the inner hole of the positioning sleeve 142 serves as a positioning hole to ensure the positioning accuracy between the positioning pin 141 and the positioning hole.

[0056] It can be seen that by installing the second driving member 140 on the base 11, the positioning hole is opened on the turntable 12, the driving end of the second driving member 140 faces downward and is connected to the positioning pin 141, and a second driving member 140 upper positioning assembly 14 is provided to facilitate the installation and maintenance of the second driving member 140.

[0057] As an embodiment, the fixed end of the second driving member 140 is mounted on the turntable 12, the driving end of the second driving member 140 is arranged upward and connected to the positioning pin 141, the positioning hole is opened on the base 11 and is located above the turntable 12, the positioning pin 141 corresponds to the positioning hole, and the second driving member 140 is configured to drive the positioning pin 141 to rise and fall;

[0058] The second driving member 140 drives the positioning pin 141 to rise, so that the positioning pin 141 is inserted into the corresponding positioning hole, so as to connect the rotating disk 12 and the base 11 to prevent rotation;

[0059] The second driving member 140 drives the positioning pin 141 to descend, so that the positioning pin 141 leaves the corresponding positioning hole, so as to release the anti-rotation connection between the turntable 12 and the base 11 .

[0060] Specifically, the second driving member 140 is a cylinder.

[0061] Specifically, at least one positioning sleeve 142 is installed on the base 11 , each positioning sleeve 142 corresponds to a positioning pin 141 , and the inner hole of the positioning sleeve 142 serves as a positioning hole to ensure the positioning accuracy between the positioning pin 141 and the positioning hole.

[0062] It can be seen that by installing the second driving member 140 on the turntable 12, the positioning hole is opened on the base 11, the driving end of the second driving member 140 faces upward and is connected to the positioning pin 141, and a lower-mounted positioning assembly 14 of the second driving member 140 is provided, which will not occupy the space above the base 11, and the overall structure is more compact.

[0063] As an embodiment, the base 11 includes a support member 110 and a connecting seat 111. The support member 110 is vertically arranged, and the connecting seat 111 is fixedly installed on the top of the support member 110. The connecting seat 111 is detachably installed on the frame of the polishing equipment. The turntable 12 is rotatably mounted on the periphery of the support member 110, and the fixed ends of the first driving member 13 and the second driving member 140 are both installed on the connecting seat 111.

[0064] It can be seen that by providing the support member 110, the turntable 12 can be rotatably mounted on the periphery of the support member 110, thereby realizing support for the rotary drive mechanism 10; by providing the connecting seat 111, the rotary drive mechanism 10 can be installed on the frame of the polishing equipment; by installing the first drive member 13 and the second drive member 140 on the connecting seat 111, the installation and maintenance of the first drive member 13 and the second drive member 140 are facilitated, and the layout is reasonable.

[0065] See also Figures 1 to 3 As shown, as an embodiment, the first driving member 13 includes a motor 130, a driving gear 131 and a transmission ring gear 132, the fixed end of the motor 130 is mounted on the connecting seat 111, the driving gear 131 is mounted on the rotating shaft of the motor 130, the transmission ring gear 132 is fixed on the top surface of the turntable 12 and is located below the connecting seat 111, and the driving gear 131 and the transmission ring gear 132 are meshed.

[0066] It can be seen that, through the cooperation of the motor 130, the driving gear 131 and the transmission gear ring 132, a first driving member 13 using gear transmission is provided, which has a compact structure, high transmission efficiency, constant transmission ratio, and stable and reliable transmission.

[0067] As an embodiment, the connecting seat 111 includes a connecting part 1110 and a supporting frame 1111. The connecting seat 111 is installed on the frame of the polishing equipment through the connecting part 1110. The supporting frame 1111 is arranged on the periphery of the connecting part 1110. A plurality of connecting ribs 1112 are arranged between the supporting frame 1111 and the connecting part 1110. Four sets of positioning assemblies 14 are provided, and the fixed ends of the second driving members 140 of the four sets of positioning assemblies 14 are evenly installed on the supporting frame 1111.

[0068] Specifically, the supporting frame 1111 is horizontally arranged in a rectangular shape on the periphery of the connecting portion 1110 , and the four sets of positioning components 14 are respectively arranged at the four corners of the supporting frame 1111 .

[0069] It can be seen that by setting a support frame 1111 on the periphery of the connecting part 1110, the overall weight of the connecting seat 111 is reduced while ensuring the connection stability and reliability of the connecting seat 111; by setting four sets of positioning assemblies 14, the fixed ends of the second driving members 140 of the four sets of positioning assemblies 14 are installed on the support frame 1111, thereby further improving the stability and reliability of the positioning of the turntable 12 during polishing.

[0070] As an implementation manner, the support member 110 is a hollow structure.

[0071] It can be seen that by configuring the support member 110 as a hollow structure, the weight of the support member 110 is reduced while ensuring the strength of the support member 110 .

[0072] The rotary drive mechanism provided in the embodiment of the present application has the following advantages:

[0073] 1) By setting a positioning component, the turntable can be relatively fixed on the base when the wafer is polished, so that the polishing head will not rotate with the turntable during the polishing process, thereby ensuring the consistency of wafer polishing and improving the polishing quality of the wafer;

[0074] 2) The turntable is fixed on the base to prevent rotation through the cooperation of the second driving member, the positioning pin and the positioning hole. The overall structure of the positioning assembly is simple, the cost is low, and the positioning is stable and reliable;

[0075] 3) Four sets of positioning components are arranged on the connecting seat to ensure the stability and reliability of the positioning of the turntable.

[0076] In the second aspect, the present application also proposes a wafer polishing machine, see Figure 1 and Figure 4 As shown, the wafer polishing machine provided in the embodiment of the present application includes the above-mentioned rotation drive mechanism 10, polishing platform 20 and polishing disc mechanism 30, wherein:

[0077] The polishing platform 20 is provided with a loading and unloading station 21 and at least one polishing station 22, each polishing station 22 is provided with a set of polishing disc mechanisms 30, and each set of polishing disc mechanisms 30 includes at least one polishing disc;

[0078] The rotary drive mechanism 10 is arranged above the polishing platform 20. At least two groups of polishing head mechanisms 40 are evenly arranged and installed on the turntable 12 along the circumferential direction. Each group of polishing head mechanisms 40 includes at least one polishing head, and the polishing head can be raised and lowered relative to the turntable 12.

[0079] The first driving member 13 drives the turntable 12 to rotate a preset angle, so as to drive at least two groups of polishing head mechanisms 40 to rotate synchronously at the preset angle, so that one group of the polishing head mechanisms 40 is opposite to the loading and unloading station 21 to pick up the wafers to be polished on the loading and unloading station 21 or place the polished wafers on the loading and unloading station 21, and at the same time, the other polishing head mechanisms 40 and the polishing disk mechanism 30 cooperate with each other to move, so as to polish the wafers to be polished picked up by the other polishing head mechanisms 40.

[0080] Specifically, a loading and unloading station 21 and three polishing stations 22 are provided on the polishing platform 20 , and four groups of polishing head mechanisms 40 are evenly arranged and installed on the turntable 12 along the circumferential direction.

[0081] It can be seen that through the cooperation of the polishing platform, the rotating drive mechanism 10 and the polishing disk mechanism 30, automatic polishing of the wafer to be polished is achieved, and the polishing efficiency is high; at the same time, the rotating drive mechanism 10 can fix the turntable 12 relatively to the base 11 during the polishing process of the polishing head, so that the polishing head will not rotate with the turntable 12 during the polishing process, thereby ensuring the consistency of wafer polishing and improving the polishing quality of the wafer.

[0082] As an implementation manner, each set of polishing disc mechanisms 30 includes two polishing discs disposed at intervals, and each set of polishing head mechanisms 40 includes two polishing heads disposed at intervals, and each polishing head corresponds to one polishing disc.

[0083] Specifically, the polishing head is driven to rotate by a driving member to polish the wafer to be polished on the polishing plate.

[0084] It can be seen that by configuring each group of polishing disc mechanisms 30 to include two polishing discs and configuring each group of polishing head mechanisms 40 to include two polishing heads, it is possible to load and unload and polish two wafers simultaneously, thereby improving work efficiency.

[0085] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A rotary drive mechanism, characterized in that: The rotary drive mechanism comprises a base, a turntable, a first drive member and at least one set of positioning components, wherein: The base is detachably mounted on a frame of the polishing device, the turntable is rotatably mounted on the base, and at least one polishing head is mounted on the turntable; The fixed end of the first driving member is mounted on the base, and the driving end of the first driving member is in driving connection with the turntable. The first driving member is configured to drive the turntable to rotate relative to the base at a preset angle, so as to drive the at least one polishing head to rotate to a corresponding polishing station or loading and unloading station, each of the polishing stations is provided with at least one polishing disk, and the loading and unloading stations are provided with at least one wafer carrying mechanism; The at least one set of positioning components is arranged on the base along the circumferential direction, and is configured to fix the turntable relative to the base after the first driving member drives the turntable to rotate a preset angle relative to the base.

2. The rotary drive mechanism according to claim 1, characterized in that: The positioning assembly includes a second driving member, a positioning hole and a positioning pin, wherein a driving end of the second driving member is connected to the positioning pin, and the second driving member is configured to drive the positioning pin to switch between a first position and a second position, and the positioning hole is provided on the turntable or the base and is arranged corresponding to the positioning pin; The second driving member drives the positioning pin to move to a first position, and the positioning pin is inserted into the positioning hole, so that the turntable is fixed relative to the base; The second driving member drives the positioning pin to move to the second position, and the positioning pin leaves the positioning hole, so that the first driving member can drive the turntable to rotate relative to the base.

3. The rotary drive mechanism according to claim 2, characterized in that: The fixed end of the second driving member is fixedly connected to the base and is located above the turntable. The driving end of the second driving member is arranged downward and connected to the positioning pin. The positioning hole is opened on the turntable. The positioning pin corresponds to the positioning hole. The second driving member is configured to drive the positioning pin to rise and fall. The second driving member drives the positioning pin to descend, so that the positioning pin is inserted into the corresponding positioning hole to connect the turntable and the base to prevent rotation; The second driving member drives the positioning pin to rise, so that the positioning pin leaves the corresponding positioning hole, so as to release the anti-rotation connection between the turntable and the base.

4. The rotary drive mechanism according to claim 2, characterized in that: The fixed end of the second driving member is mounted on the turntable, the driving end of the second driving member is arranged upward and connected to the positioning pin, the positioning hole is opened on the base and is located above the turntable, the positioning pin corresponds to the positioning hole, and the second driving member is configured to drive the positioning pin to rise and fall; The second driving member drives the positioning pin to rise, so that the positioning pin is inserted into the corresponding positioning hole, so as to connect the turntable and the base to prevent rotation; The second driving member drives the positioning pin to descend, so that the positioning pin leaves the corresponding positioning hole, so as to release the anti-rotation connection between the turntable and the base.

5. The rotary drive mechanism according to claim 2, characterized in that: The base includes a support member and a connecting seat, the support member is vertically arranged, the connecting seat is fixedly installed on the top end of the support member, the connecting seat is detachably installed on the frame of the polishing equipment, the turntable is rotatably mounted on the periphery of the support member, and the fixed ends of the first driving member and the second driving member are both installed on the connecting seat.

6. The rotary drive mechanism according to claim 5, characterized in that: The first driving member includes a motor, a driving gear and a transmission gear ring. The fixed end of the motor is installed on the connecting seat, the driving gear is installed on the rotating shaft of the motor, and the transmission gear ring is fixed on the top surface of the turntable and located below the connecting seat. The driving gear and the transmission gear ring are meshed.

7. The rotary drive mechanism according to claim 5, characterized in that: The connecting seat includes a connecting part and a supporting frame, and the connecting seat is installed on the frame of the polishing equipment through the connecting part. The supporting frame is arranged on the periphery of the connecting part, and a plurality of connecting ribs are arranged between the supporting frame and the connecting part. The positioning assembly is provided with four sets, and the fixed ends of the second driving members of the four sets of the positioning assemblies are evenly installed on the supporting frame.

8. The rotary drive mechanism according to claim 5, characterized in that: The supporting member is a hollow structure.

9. A wafer polishing machine, characterized in that: The wafer polishing machine comprises a polishing platform, a rotation drive mechanism and a polishing disc mechanism as claimed in any one of claims 1 to 8, wherein: The polishing platform is provided with a loading and unloading station and at least one polishing station, each of the polishing stations is provided with a group of the polishing disc mechanisms, and each group of the polishing disc mechanisms includes at least one polishing disc; The rotary drive mechanism is arranged above the polishing platform, and at least two groups of polishing head mechanisms are evenly arranged and installed on the turntable along the circumference, each group of the polishing head mechanisms includes at least one polishing head, and the polishing head can be raised and lowered relative to the turntable; The first driving member drives the turntable to rotate a preset angle to drive at least two groups of the polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, and at the same time, the other polishing head mechanisms and the polishing disk mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

10. The wafer polishing machine according to claim 9, characterized in that: Each group of the polishing disc mechanism includes two polishing discs arranged at intervals, and each group of the polishing head mechanism includes two polishing heads arranged at intervals, and each of the polishing heads corresponds to one of the polishing discs.

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