Polishing disc cleaning mechanism and wafer polishing machine

Abstract

The utility model discloses a polishing disk cleaning mechanism and a wafer polisher, the polishing disk cleaning mechanism comprises a base, a first driving piece, a lifting driving piece, a second driving piece, a swing shaft, a swing arm and a cleaning part, the lifting driving piece is integrated on the swing shaft, and the lifting driving piece is configured to drive the swing shaft to lift; the first end of the swing arm is installed at the first end of the swing shaft, the cleaning part is rotatably installed at the second end of the swing arm, the driving end of the first driving piece is connected with the second end of the swing shaft, and the first driving piece is configured to drive the swing shaft to rotate so as to drive the cleaning part to alternately move between a waiting station and a cleaning station. The driving end of the second driving part is in transmission connection with the cleaning part, and the second driving part is configured to drive the cleaning part to rotate so as to clean the to-be-cleaned polishing disc; according to the polishing disk cleaning mechanism, the lifting driving part is integrated on the swing shaft, so that the space occupied by the polishing disk cleaning mechanism is reduced, and the overall structure of the cleaning mechanism is more compact.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment manufacturing, and in particular relates to a polishing disc cleaning mechanism and a wafer polishing machine. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] Current wafer polishing equipment usually polishes the wafer between the polishing head and the polishing disk by rotating the polishing head and the polishing disk. In the actual production process, it is necessary to regularly clean the polishing surface of the polishing disk through a polishing disk cleaning mechanism to maintain the polishing accuracy or remove the deposited substances on the polishing surface of the polishing disk. The existing polishing disk cleaning mechanism is usually provided with a lifting drive member. When cleaning the polishing disk, the lifting drive member drives the cleaning head to descend to a preset height, so that the cleaning head always maintains a certain downward pressure on the polishing disk to ensure the cleaning effect; however, the lifting drive member of the existing polishing disk cleaning mechanism is usually installed on the outside of the frame of the cleaning mechanism, which occupies a large space. Utility Model Content

[0004] The purpose of the present application is to provide a polishing disc cleaning mechanism to solve the problem that the existing polishing disc cleaning mechanism occupies a large space; in addition, another purpose of the present application is to provide a wafer polishing machine including the polishing disc cleaning mechanism.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a polishing disc cleaning mechanism, which includes a base, a first driving member, a lifting driving member, a second driving member, a swing shaft, a swing arm and a cleaning portion, wherein:

[0007] The lifting drive member includes a fixed part and a movable part, the fixed part is fixed on the base, the movable part is connected to the fixed part by transmission and is configured to be able to rise and fall relative to the fixed part, the movable part is sleeved on the periphery of the swing shaft, the swing shaft is connected to the movable part by transmission and can rotate relative to the movable part, and the lifting drive member is configured to drive the swing shaft to rise and fall through the movable part;

[0008] The first end of the swing arm is mounted on the first end of the swing shaft, the cleaning part is rotatably mounted on the second end of the swing arm, the driving end of the first driving member is connected to the second end of the swing shaft, and the first driving member is configured to drive the swing shaft to rotate, so as to drive the swing arm to swing a preset angle, so that the cleaning part alternately moves between a waiting position and a cleaning position, the waiting position is located outside the polishing disc to be cleaned, and the cleaning position is located directly above the polishing disc to be cleaned;

[0009] The driving end of the second driving member is drivingly connected to the cleaning part, and the second driving member is configured to drive the cleaning part to rotate so as to clean the polishing disc to be cleaned.

[0010] The polishing disc cleaning mechanism proposed in the present application reduces the space occupied by the polishing disc cleaning structure by integrating the lifting drive member on the swing shaft, making the overall structure of the cleaning mechanism more compact; at the same time, the movable part of the lifting drive member is sleeved on the periphery of the swing shaft, so that the movable part and the swing shaft can be concentrically arranged, and when cleaning the polishing disc, the consistency of the downward pressure of the cleaning part on the polishing disc is ensured, thereby improving the cleaning efficiency and cleaning effect of the polishing disc.

[0011] Optionally, the polishing disc cleaning mechanism also includes a mounting plate, which is located below the base. The first driving member includes a first motor and a first transmission assembly. The fixed end of the first motor is mounted on the mounting plate, the driving end of the first motor is connected to the first transmission assembly, and the first motor drives the swing shaft to rotate through the first transmission assembly.

[0012] By arranging a mounting plate below the base, the fixed end of the first motor is mounted on the mounting plate and the swing shaft is driven to rotate through the first transmission assembly, providing a first driving member with a reasonable layout and compact structure.

[0013] Optionally, the first transmission assembly includes a driving gear and a transmission ring gear, the driving gear is anti-rotationally mounted on the rotating shaft of the first motor, the transmission ring gear is fixed on the second end of the swing shaft, and the driving gear is meshed with the transmission ring gear.

[0014] Through the cooperation of the driving gear and the transmission gear ring, the transmission connection between the rotating shaft of the first motor and the swing shaft is realized, providing a first transmission component with high transmission accuracy, high transmission efficiency and compact structure.

[0015] Optionally, an angle control assembly is installed on the mounting plate, and the angle control assembly includes a sensor, a sensing member, a rotating shaft and a driven gear. The sensing member is rotatably mounted on the mounting plate through a sleeve, the driven gear is mounted on the first end of the rotating shaft and meshes with the driving gear, the sensing member is mounted on the second end of the rotating shaft and rotates with the rotating shaft, the fixed end of the sensor is fixedly connected to the mounting plate, the sensing end of the sensor is set corresponding to the sensing member, and the sensor is configured to sense the rotation angle of the swing shaft driven by the first motor by sensing the rotation angle of the sensing member.

[0016] Through the cooperation of the sensor, the sensing element, the rotating shaft, the driven gear and the driving gear, the automatic control of the rotation angle of the swing shaft is realized, thereby ensuring the swing accuracy of the swing arm; the overall structure is simple, the design is ingenious, and the control accuracy is high.

[0017] Optionally, the second driving member includes a second motor, a driving shaft and a second transmission assembly, the fixed end of the second motor is mounted on the mounting plate, the swing shaft is a hollow shaft, the driving shaft is rotatably mounted in the swing shaft, the driving end of the second motor is connected to the driving shaft, the second transmission assembly is arranged on the swing arm, the first end of the second transmission assembly is connected to the driving shaft, the second end of the second transmission assembly is connected to the cleaning part, and the second motor is configured to drive the driving shaft to rotate so as to drive the cleaning part to rotate through the second transmission assembly.

[0018] By setting the swing shaft as a hollow shaft, the drive shaft is rotatably installed in the swing shaft, and the second motor drives the cleaning part to rotate through the second transmission assembly, a second drive member with a compact structure, small space occupation and reasonable layout is provided.

[0019] Optionally, the second transmission assembly includes a first pulley, a second pulley and a transmission belt, the first pulley is rotatably mounted on the first end of the swing arm and is coaxially connected to the drive shaft, the second pulley is rotatably mounted on the second end of the swing arm, the transmission belt is sleeved on the first pulley and the second pulley, and the cleaning part includes a rotating member and a cleaning brush, the rotating member is rotatably mounted on the second end of the swing arm and is coaxially connected to the second pulley, and the cleaning brush is detachably mounted on the rotating member.

[0020] Through the cooperation of the first pulley, the second pulley and the transmission belt, the transmission connection between the drive shaft and the cleaning part is realized, providing a second transmission component with high transmission accuracy, high transmission efficiency and low noise.

[0021] Optionally, a tension control assembly is installed on the swing arm, and the tension control assembly includes a tensioning wheel and a tensioning bolt. The tensioning wheel is movably mounted on the swing arm and abuts against the transmission belt. The tensioning bolt is transmission-connected to the tensioning wheel and is configured to adjust the position of the tensioning wheel on the swing arm to adjust the tension of the transmission belt.

[0022] By setting up a tension control component, the tension of the transmission belt can be adjusted to ensure that the transmission belt always maintains appropriate tension. At the same time, through the cooperation of the tensioning wheel and the tensioning bolt, the position of the tensioning wheel on the swing arm can be easily adjusted, providing a tension control component with simple structure, low cost and easy adjustment.

[0023] Optionally, the polishing disc cleaning mechanism also includes a guide assembly, which includes a guide cylinder and a guide shaft. The guide cylinder is hollow in design, and the first end of the guide cylinder is fixedly mounted on the base, the first end of the guide shaft is fixedly connected to the mounting plate, and the second end of the guide shaft extends into the second end of the guide cylinder and is configured to slide in the guide cylinder under the drive of the lifting drive member.

[0024] The guidance of the lifting and lowering of the swing shaft is achieved through the cooperation of the guide shaft and the guide cylinder, and the guiding precision is high.

[0025] Optionally, the polishing disc cleaning mechanism further includes a cleaning device, which is located at the waiting station and is configured to clean the cleaning part located at the waiting station.

[0026] By arranging a cleaning device at the waiting station, automatic cleaning of the cleaning part is achieved to ensure the cleaning effect of the cleaning part.

[0027] In a second aspect, the present application further proposes a wafer polishing machine, which includes a polishing platform, a turntable, a polishing head mechanism, a polishing disc mechanism and the above-mentioned polishing disc cleaning mechanism, wherein:

[0028] The polishing platform is provided with a loading and unloading station and at least one polishing station, each polishing station is provided with a set of polishing disc mechanisms, and a polishing disc cleaning mechanism is provided on the side of each polishing station, and the polishing disc cleaning mechanism is configured to clean the polishing disc of the polishing disc mechanism on the corresponding polishing station;

[0029] The turntable is rotatably arranged above the polishing platform, at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable;

[0030] The turntable drives at least two groups of polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms and the polishing plate mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

[0031] The wafer polishing machine proposed in the present application realizes automatic polishing of the wafer and automatic cleaning of the polishing disk through the cooperation of the polishing platform, turntable, polishing head mechanism, polishing disk mechanism and polishing disk cleaning mechanism; at the same time, the overall structure of the polishing disk cleaning mechanism is compact and occupies little space, which can ensure the consistency of the downward pressure on the polishing disk during cleaning, thereby improving the cleaning efficiency and cleaning effect of the polishing disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a three-dimensional structural schematic diagram of the polishing disc cleaning mechanism provided in an embodiment of the present application;

[0033] Figure 2 It is another three-dimensional structural schematic diagram of the polishing disc cleaning mechanism provided in an embodiment of the present application;

[0034] Figure 3 It is a structural schematic diagram of a first transmission assembly and a second transmission assembly of a polishing disc cleaning mechanism provided in an embodiment of the present application;

[0035] Figure 4 is a cross-sectional schematic diagram of a polishing disc cleaning mechanism provided in an embodiment of the present application;

[0036] Figure 5 It is a structural schematic diagram of the wafer polishing machine provided in an embodiment of the present application.

[0037] Figures 1 to 5 The following reference numerals are included:

[0038] Base 10;

[0039] The first driving member 20 includes a first motor 21, a driving gear 22, and a transmission ring gear 23;

[0040] Lifting drive member 30: fixed portion 31, movable portion 32;

[0041] The second driving member 40 includes a second motor 41, a driving shaft 42, a first pulley 43, a second pulley 44, and a transmission belt 45;

[0042] Swing shaft 50: swing arm 51, tension control assembly 52, tension wheel 520, tension bolt 521, cleaning device 53;

[0043] Cleaning part 60: rotating member 61, cleaning brush 62;

[0044] Mounting plate 70;

[0045] Angle control assembly 80: sensor 81, sensor 82, rotating shaft 83, driven gear 84;

[0046] Guide assembly 90: guide cylinder 91, guide shaft 92;

[0047] Polishing platform 100 , turntable 101 , polishing head mechanism 102 , polishing disc mechanism 103 and the above-mentioned polishing disc cleaning mechanism 104 . DETAILED DESCRIPTION

[0048] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0049] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0050] Current wafer polishing equipment usually polishes the wafer between the polishing head and the polishing disk by rotating the polishing head and the polishing disk. In the actual production process, it is necessary to regularly clean the polishing surface of the polishing disk through a polishing disk cleaning mechanism to maintain the polishing accuracy or remove the deposited substances on the polishing surface of the polishing disk. The existing polishing disk cleaning mechanism is usually provided with a lifting drive member. When cleaning the polishing disk, the lifting drive member drives the cleaning head to descend to a preset height, so that the cleaning head always maintains a certain downward pressure on the polishing disk to ensure the cleaning effect; however, the lifting drive member of the existing polishing disk cleaning mechanism is usually installed on the outside of the frame of the cleaning mechanism, which occupies a large space.

[0051] Therefore, this application proposes a polishing disc cleaning mechanism, see Figure 1 and Figure 4 As shown, a polishing disc cleaning mechanism provided by an embodiment of the present application includes a base 10, a first driving member 20, a lifting driving member 30, a second driving member 40, a swing shaft 50, a swing arm 51 and a cleaning portion 60, wherein the lifting driving member 30 includes a fixed portion 31 and a movable portion 32, wherein the fixed portion 31 is fixed on the base 10, the movable portion 32 is transmission-connected with the fixed portion 31 and is configured to be able to rise and fall relative to the fixed portion 31, the movable portion 32 is sleeved on the periphery of the swing shaft 50, the swing shaft 50 is transmission-connected with the movable portion 32 and can rotate relative to the movable portion 32, and the lifting driving member 30 is configured to drive the swing shaft 50 to rise and fall through the movable portion 32; the swing arm 51 includes a first driving member 20, a second driving member 40, a swing shaft 50, a swing arm 51 and a cleaning portion 60, wherein the lifting driving member 30 includes a fixed portion 31 and a movable portion 32, wherein the fixed portion 31 is fixed on the base 10, the movable portion 32 is transmission-connected with the fixed portion 31 and is configured to be able to rise and fall relative to the fixed portion 31, the movable portion 32 is sleeved on the periphery of the swing shaft 50, the swing shaft 50 is transmission-connected with the movable portion 32 and can rotate relative to the movable portion 32, and the lifting driving member 30 is configured to drive the swing shaft 50 to rise and fall through the movable portion 32; The first end of the first driving member 1 is mounted on the first end of the swing shaft 50, the cleaning portion 60 is rotatably mounted on the second end of the swing arm 51, the driving end of the first driving member 20 is connected to the second end of the swing shaft 50, the first driving member 20 is configured to drive the swing shaft 50 to rotate, so as to drive the swing arm 51 to swing a preset angle, so that the cleaning portion 60 alternately moves between the waiting position and the cleaning position, the waiting position is located outside the polishing disc to be cleaned, and the cleaning position is located directly above the polishing disc to be cleaned; the driving end of the second driving member 40 is transmission-connected to the cleaning portion 60, and the second driving member 40 is configured to drive the cleaning portion 60 to rotate, so as to clean the polishing disc to be cleaned.

[0052] It can be seen that the polishing disc cleaning mechanism proposed in the present application reduces the space occupied by the polishing disc cleaning structure by integrating the lifting drive member 30 on the swing shaft 50, making the overall structure of the cleaning mechanism more compact; at the same time, the movable part 32 of the lifting drive member 30 is mounted on the periphery of the swing shaft 50, so that the movable part 32 and the swing shaft 50 can be concentrically arranged. When cleaning the polishing disc, the consistency of the downward pressure of the cleaning part 60 on the polishing disc is ensured, thereby improving the cleaning efficiency and cleaning effect of the polishing disc.

[0053] See also Figure 1 , Figure 3 and Figure 4As shown, as an embodiment, the polishing disc cleaning mechanism also includes a mounting plate 70, the mounting plate 70 is located below the base 10, the first driving member 20 includes a first motor 21 and a first transmission assembly, the fixed end of the first motor 21 is mounted on the mounting plate 70, the driving end of the first motor 21 is connected to the first transmission assembly, and the first motor 21 drives the swing shaft 50 to rotate through the first transmission assembly.

[0054] It can be seen that by arranging the mounting plate 70 below the base 10, the first motor 21 is installed on the mounting plate 70 and drives the swing shaft 50 to rotate through the first transmission assembly, providing a first driving member 20 with a reasonable layout and compact structure.

[0055] As an embodiment, the first transmission assembly includes a driving gear 22 and a transmission ring gear 23, the driving gear 22 is anti-rotationally mounted on the rotating shaft of the first motor 21, the transmission ring gear 23 is fixed on the second end of the swing shaft 50, and the driving gear 22 is meshed with the transmission ring gear 23.

[0056] It can be seen that the driving gear 22 and the transmission gear ring 23 cooperate to realize the transmission connection between the rotating shaft of the first motor 21 and the swing shaft 50, providing a first transmission assembly with high transmission accuracy, high transmission efficiency and compact structure.

[0057] As an embodiment, an angle control assembly 80 is mounted on the mounting plate 70, and the angle control assembly 80 includes a sensor 81, a sensing member 82, a rotating shaft 83, and a driven gear 84. The sensing member 82 is rotatably mounted on the mounting plate 70 through a shaft sleeve, the driven gear 84 is mounted on the first end of the rotating shaft 83 and meshes with the driving gear 22, the sensing member 82 is mounted on the second end of the rotating shaft 83 and rotates with the rotating shaft 83, the fixed end of the sensor 81 is fixedly connected to the mounting plate 70, and the sensing end of the sensor 81 is set corresponding to the sensing member 82. The sensor 81 is configured to sense the rotation angle of the swing shaft 50 driven by the first motor 21 by sensing the rotation angle of the sensing member 82. Optionally, the sensor 81 can determine the original position and limit position of the first motor 21 through the characteristic position of the sensing member 82, so as to facilitate the first motor 21 to return to the original position and avoid over-limit rotation.

[0058] It can be seen that through the cooperation of the sensor 81, the sensing element 82, the rotating shaft 83, the driven gear 84 and the driving gear 22, the automatic control of the rotation angle of the swing shaft 50 is realized, thereby ensuring the swing accuracy of the swing arm 51; the overall structure is simple, the design is ingenious, and the control accuracy is high.

[0059] See also Figure 1 and Figure 4As shown, as an embodiment, the second driving member 40 includes a second motor 41, a driving shaft 42 and a second transmission assembly, the fixed end of the second motor 41 is mounted on the mounting plate 70, the swing shaft 50 is a hollow shaft, the driving shaft 22 is rotatably mounted in the swing shaft 50, the driving end of the second motor 41 is connected to the driving shaft 42, the second transmission assembly is arranged on the swing arm 51, the first end of the second transmission assembly is connected to the driving shaft 42, the second end of the second transmission assembly is connected to the cleaning part 60, and the second motor 41 is configured to drive the driving shaft 42 to rotate, so as to drive the cleaning part 60 to rotate through the second transmission assembly.

[0060] It can be seen that by setting the swing shaft 50 as a hollow shaft, the drive shaft 42 is rotatably installed in the swing shaft 50, and the second motor 41 drives the cleaning part 60 to rotate through the second transmission assembly, providing a second driving member 40 with a compact structure, small space occupation and reasonable layout.

[0061] See also Figures 1 to 3 As shown, as an embodiment, the second transmission assembly includes a first pulley 43, a second pulley 44 and a transmission belt 45, the first pulley 43 is rotatably mounted on the first end of the swing arm 51 and is coaxially connected to the drive shaft 42, the second pulley 44 is rotatably mounted on the second end of the swing arm 51, the transmission belt 45 is sleeved on the first pulley 43 and the second pulley 44, the cleaning part 60 includes a rotating member 61 and a cleaning brush 62, the rotating member 61 is rotatably mounted on the second end of the swing arm 51 and is coaxially connected to the second pulley 44, and the cleaning brush 62 is detachably mounted on the rotating member 61.

[0062] Specifically, the first pulley 43 and the second pulley 44 are both synchronous pulleys, and the transmission belt 45 is a synchronous belt.

[0063] Specifically, the cleaning brush 62 may be made of any one of metal, natural wool or artificial fiber, wherein the artificial fiber may be any one of PA, PP, PET or PVC.

[0064] It can be seen that through the cooperation of the first pulley 43, the second pulley 44 and the transmission belt 45, the transmission connection between the drive shaft 42 and the cleaning part 62 is realized, providing a second transmission component with high transmission accuracy, high transmission efficiency and low noise.

[0065] As an embodiment, a tension control assembly 52 is installed on the swing arm 51, and the tension control assembly 52 includes a tensioning wheel 520 and a tensioning bolt 521. The tensioning wheel 520 is movably installed on the swing arm 51 and abuts against the transmission belt 45. The tensioning bolt 521 is transmission-connected to the tensioning wheel 520 and is configured to adjust the position of the tensioning wheel 520 on the swing arm 51 to adjust the tension of the transmission belt 45.

[0066] It can be seen that by setting up the tension control component 52, the tension of the transmission belt 45 is adjusted to ensure that the transmission belt 45 always maintains an appropriate tensioning force; at the same time, through the cooperation of the tensioning wheel 520 and the tensioning bolt 521, the position of the tensioning wheel 520 on the swing arm 51 is conveniently adjusted, providing a tension control component 52 with a simple structure, low cost and easy adjustment.

[0067] See also Figure 1 and Figure 4 As shown, as an embodiment, the polishing disc cleaning mechanism also includes a guide assembly 90, and the guide assembly 90 includes a guide cylinder 91 and a guide shaft 92. The guide cylinder 91 is hollow in design, and the first end of the guide cylinder 91 is fixedly mounted on the base 10, the first end of the guide shaft 92 is fixedly connected to the mounting plate 70, and the second end of the guide shaft 92 extends into the second end of the guide cylinder 91, and is configured to slide in the guide cylinder 91 under the drive of the lifting drive 30.

[0068] It can be seen that, through the cooperation between the guide shaft 92 and the guide cylinder 91, the guidance of the lifting and lowering of the swing shaft 50 is achieved, and the guiding accuracy is high.

[0069] See also Figure 1 As shown, as an embodiment, the polishing disc cleaning mechanism further includes a cleaning device 53, and the cleaning device 53 is located at the waiting position, and the cleaning device 53 is configured to clean the cleaning part 60 located at the waiting position.

[0070] Specifically, the cleaning device 53 includes a cleaning chamber, in which a cleaning nozzle is disposed. The cleaning portion 60 is moved to a preset position in the cleaning chamber, and the cleaning portion 60 is cleaned by the cleaning nozzle.

[0071] See also Figure 1 and Figure 2 As shown, the working principle of the polishing disc cleaning mechanism provided in the embodiment of the present application is:

[0072] In the initial state, the cleaning unit 60 is located at the waiting position. When the polishing disc needs to be cleaned:

[0073] The first driving member 20 drives the swing shaft 50 to rotate at a preset angle, driving the cleaning portion 60 to move from the waiting position to the cleaning position;

[0074] The lifting drive member 30 drives the swing shaft 50 to descend to a preset height, so that the cleaning portion 60 is attached to the polishing surface of the polishing disc to be cleaned;

[0075] The second driving member 40 drives the cleaning brush 62 of the cleaning portion 60 to rotate so as to clean the polishing disc to be cleaned;

[0076] After cleaning is completed, the second driving member 40 stops working, the lifting driving member 30 drives the swing shaft 50 to rise, driving the cleaning part 60 to move to the cleaning position, and the first driving member 20 works to drive the cleaning part 60 from the cleaning position to the waiting position.

[0077] The polishing disc cleaning mechanism provided in the embodiment of the present application has the following advantages:

[0078] 1) The lifting drive is integrated on the swing shaft, which reduces the space occupied by the polishing disc cleaning structure and makes the overall structure of the cleaning mechanism more compact.

[0079] 2) The movable part of the lifting drive member is sleeved on the periphery of the swing shaft, so that the movable part and the swing shaft can be arranged concentrically. When cleaning the polishing disc, the downward pressure of the cleaning part on the polishing disc is guaranteed to be consistent, thereby improving the cleaning efficiency and cleaning effect of the polishing disc.

[0080] 3) It is able to automatically control the rotation angle of the swing shaft to ensure the swing accuracy of the swing arm.

[0081] 4) The driving shaft is rotatably installed in the swing shaft, with reasonable layout and compact structure, further reducing the occupied space.

[0082] 5) The tension of the transmission belt can be adjusted to ensure that the transmission belt always maintains appropriate tension.

[0083] 6) It has the function of automatically cleaning the cleaning part, which improves the working efficiency of the cleaning mechanism.

[0084] In the second aspect, the present application also provides a wafer polishing machine, see Figure 5As shown, the wafer polishing machine provided in the embodiment of the present application includes a polishing platform 100, a turntable 101, a polishing head mechanism 102, a polishing disc mechanism 103 and the above-mentioned polishing disc cleaning mechanism 104. A loading and unloading station 105 and at least one polishing station 106 are arranged on the polishing platform 100. A group of polishing disc mechanisms 103 are arranged on each polishing station 106. A polishing disc cleaning mechanism 104 is arranged on the side of each polishing station 106. The polishing disc cleaning mechanism 104 is configured to clean the polishing disc of the polishing disc mechanism 103 on the corresponding polishing station 106; the turntable 101 is rotatably arranged on the polishing platform 100. Above the optical platform 100, at least two groups of polishing head mechanisms 102 are evenly arranged along the circumference and installed on the turntable 101, and the polishing head mechanisms 102 can be raised and lowered relative to the turntable 101; the turntable 101 drives at least two groups of polishing head mechanisms 102 to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms 102 is opposite to the loading and unloading station 105 to pick up the wafers to be polished on the loading and unloading station 105 or place the polished wafers on the loading and unloading station 105, and at the same time, the other polishing head mechanisms 102 and the polishing disk mechanisms 103 cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms 102.

[0085] It can be seen that the wafer polishing machine proposed in the present application realizes automatic polishing of the wafer and automatic cleaning of the polishing disk of the polishing disk mechanism 103 through the cooperation of the polishing platform 100, the turntable 101, the polishing head mechanism 102, the polishing disk mechanism 103 and the polishing disk cleaning mechanism 104; at the same time, the polishing disk cleaning mechanism 104 has a compact overall structure and occupies a small space, which can ensure the consistency of the downward pressure on the polishing disk during cleaning, thereby improving the cleaning efficiency and cleaning effect of the polishing disk.

[0086] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A polishing disc cleaning mechanism, characterized in that: The polishing disc cleaning mechanism comprises a base, a first driving member, a lifting driving member, a second driving member, a swing shaft, a swing arm and a cleaning part, wherein: The lifting drive member includes a fixed part and a movable part, the fixed part is fixed on the base, the movable part is connected to the fixed part by transmission and is configured to be able to rise and fall relative to the fixed part, the movable part is sleeved on the periphery of the swing shaft, the swing shaft is connected to the movable part by transmission and can rotate relative to the movable part, and the lifting drive member is configured to drive the swing shaft to rise and fall through the movable part; The first end of the swing arm is mounted on the first end of the swing shaft, the cleaning portion is rotatably mounted on the second end of the swing arm, the driving end of the first driving member is connected to the second end of the swing shaft, and the first driving member is configured to drive the swing shaft to rotate, so as to drive the swing arm to swing a preset angle, so that the cleaning portion alternately moves between a waiting position and a cleaning position, the waiting position is located outside the polishing disc to be cleaned, and the cleaning position is located directly above the polishing disc to be cleaned; The driving end of the second driving member is drivingly connected to the cleaning part, and the second driving member is configured to drive the cleaning part to rotate so as to clean the polishing disc to be cleaned.

2. The polishing disc cleaning mechanism according to claim 1, characterized in that: The polishing disc cleaning mechanism also includes a mounting plate, which is located below the base. The first driving member includes a first motor and a first transmission assembly. The fixed end of the first motor is mounted on the mounting plate, and the driving end of the first motor is connected to the first transmission assembly. The first motor drives the swing shaft to rotate through the first transmission assembly.

3. The polishing disc cleaning mechanism according to claim 2, characterized in that: The first transmission assembly includes a driving gear and a transmission gear ring. The driving gear is anti-rotationally mounted on the rotating shaft of the first motor. The transmission gear ring is fixed on the second end of the swing shaft. The driving gear is meshed with the transmission gear ring.

4. The polishing disc cleaning mechanism according to claim 3, characterized in that: An angle control assembly is mounted on the mounting plate, and the angle control assembly includes a sensor, a sensing member, a rotating shaft and a driven gear. The sensing member is rotatably mounted on the mounting plate through a sleeve, the driven gear is mounted on the first end of the rotating shaft and meshes with the driving gear, the sensing member is mounted on the second end of the rotating shaft and rotates with the rotating shaft, the fixed end of the sensor is fixedly connected to the mounting plate, the sensing end of the sensor is arranged corresponding to the sensing member, and the sensor is configured to sense the rotation angle of the swing shaft driven by the first motor by sensing the rotation angle of the sensing member.

5. The polishing disc cleaning mechanism according to claim 2, characterized in that: The second driving member includes a second motor, a driving shaft and a second transmission assembly. The fixed end of the second motor is mounted on the mounting plate. The swing shaft is a hollow shaft. The driving shaft is rotatably mounted in the swing shaft. The driving end of the second motor is connected to the driving shaft. The second transmission assembly is arranged on the swing arm. The first end of the second transmission assembly is connected to the driving shaft. The second end of the second transmission assembly is connected to the cleaning part. The second motor is configured to drive the driving shaft to rotate so as to drive the cleaning part to rotate through the second transmission assembly.

6. The polishing disc cleaning mechanism according to claim 5, characterized in that: The second transmission assembly includes a first pulley, a second pulley and a transmission belt, the first pulley is rotatably mounted on the first end of the swing arm and is coaxially connected to the drive shaft, the second pulley is rotatably mounted on the second end of the swing arm, the transmission belt is sleeved on the first pulley and the second pulley, the cleaning part includes a rotating member and a cleaning brush, the rotating member is rotatably mounted on the second end of the swing arm and is coaxially connected to the second pulley, and the cleaning brush is detachably mounted on the rotating member.

7. The polishing disc cleaning mechanism according to claim 6, characterized in that: A tension control assembly is installed on the swing arm, and the tension control assembly includes a tension wheel and a tension bolt. The tension wheel is movably installed on the swing arm and abuts against the transmission belt. The tension bolt is transmission-connected to the tension wheel and is configured to adjust the position of the tension wheel on the swing arm to adjust the tension of the transmission belt.

8. The polishing disc cleaning mechanism according to claim 2, characterized in that: The polishing disc cleaning mechanism also includes a guide assembly, which includes a guide cylinder and a guide shaft. The guide cylinder is hollow in design, and the first end of the guide cylinder is fixedly mounted on the base, the first end of the guide shaft is fixedly connected to the mounting plate, and the second end of the guide shaft extends into the second end of the guide cylinder and is configured to slide in the guide cylinder under the drive of the lifting drive member.

9. The polishing disc cleaning mechanism according to claim 1, characterized in that: The polishing disc cleaning mechanism further comprises a cleaning device, which is located at the waiting station and is configured to clean the cleaning part located at the waiting station.

10. A wafer polishing machine, characterized in that: The wafer polishing machine comprises a polishing platform, a turntable, a polishing head mechanism, a polishing disc mechanism and a polishing disc cleaning mechanism as claimed in any one of claims 1 to 9, wherein: The polishing platform is provided with a loading and unloading station and at least one polishing station, each of the polishing stations is provided with a group of the polishing disc mechanisms, and a polishing disc cleaning mechanism is provided on the side of each of the polishing stations, and the polishing disc cleaning mechanism is configured to clean the polishing disc of the polishing disc mechanism on the corresponding polishing station; The turntable is rotatably arranged above the polishing platform, at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable; The turntable drives at least two groups of the polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms and the polishing disk mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

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