Diamond wire guide roller device for silicon wafer cutting device

Abstract

The diamond wire guide roller device for the silicon wafer cutting device comprises a first sliding seat and a second sliding seat, a first locking bolt is arranged at the first sliding seat, one side of the second sliding seat is connected with an extension plate, the other side of the second sliding seat is connected with a mounting plate, the extension plate is connected with a side plate, and a screw rod is mounted at the side plate; the first sliding seat is provided with a threaded hole matched with a screw, the screw penetrates through the side plate, the end of the screw is provided with a first knob, the second sliding seat is provided with a second locking bolt, the mounting plate is connected with an L-shaped plate, a rotating guide wheel is mounted on the L-shaped plate, and an adjusting unit used for adjusting the angle of the rotating guide wheel is mounted on the mounting plate. According to the diamond wire guide roller device, coarse adjustment and fine adjustment can be achieved, and therefore installation is more flexible. And the angle of the rotating guide wheel can be adjusted, so that the adaptability of the device to the diamond wire is improved, the angle of the rotating guide wheel can be accurately adjusted according to requirements in the silicon wafer cutting process, and it is ensured that the diamond wire is stably guided to the rotating roller.

Description

Technical Field

[0001] The utility model relates to the field of diamond wire guide roller devices, and more specifically to a diamond wire guide roller device for a silicon wafer cutting device. Background Art

[0002] When cutting silicon wafers, the guide roller device is used to guide the path of the diamond wire to ensure that the diamond wire can enter the cutting area and avoid friction or collision with other parts of the device. The diamond wire is guided and wound around the rotating roller, and the cutting of the silicon material is achieved through the rotation and cooperation of the rotating roller.

[0003] The existing diamond wire guide roller device is not easy to adjust after installation, which greatly reduces the adaptability of the device and cannot meet the diverse production needs. In addition, the angle of the rotating guide wheel is not easy to adjust according to the needs, and the diamond wire may not be stably and accurately guided to the cutting area, causing the cutting process to become unstable, which will reduce the cutting efficiency. And due to the inappropriate angle, the diamond wire may be subjected to uneven force or friction during the cutting process, resulting in increased wear. Utility Model Content

[0004] The utility model aims to overcome the defects of the prior art and provides a diamond wire guide roller device for a silicon slice cutting device.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a diamond wire guide roller device for a silicon wafer cutting device, comprising a first slide seat and a second slide seat, the first slide seat having a first locking bolt capable of fixing the position of the first slide seat, one side of the second slide seat is fixedly connected to an extension plate, and the other side is fixedly connected to a mounting plate, the extension plate is connected to a side plate, a screw is installed on the side plate, the first slide seat has a threaded hole matching the screw, the screw passes through the side plate and has a first knob at the end, the second slide seat has a second locking bolt capable of fixing the relative position of the second slide seat and the first slide seat, the mounting plate is connected to a side plate, and a screw is installed on the side plate, the first slide seat has a threaded hole matching the screw, the screw passes through the side plate and has a first knob at the end, the second slide seat has a second locking bolt capable of fixing the relative position of the second slide seat and the first slide seat The plate is connected to an L-shaped plate, the L-shaped plate includes a first plate body and a second plate body connected to the first plate body, the second plate body is installed with a rotating guide wheel, the mounting plate is installed with an adjustment unit for adjusting the angle of the rotating guide wheel, the adjustment unit includes a driving gear, a transmission gear meshing with the driving gear, a passive gear driven by the transmission gear and a rotating shaft connected to the passive gear, the driving gear has a second knob, the passive gear has a third locking bolt capable of fixing the relative position of the passive gear and the mounting plate, the rotating shaft passes through the mounting plate and is fixedly connected to the first plate body, and the mounting plate has a rotating shaft through hole that cooperates with the rotating shaft.

[0006] Furthermore, a plurality of protrusions are fixedly connected to the first slide seat, and the first locking bolts are installed on the protrusions.

[0007] This makes it easy to install the first locking bolt, thereby fixing the position of the first sliding seat.

[0008] Furthermore, a bearing is installed between the screw and the side plate.

[0009] This makes it easy to rotate the screw rod and thus fine-tune the position of the second slide seat.

[0010] Furthermore, the first slide seat has a limiting slide rail, and the second slide seat has a limiting slide groove matched with the limiting slide rail.

[0011] Thereby, the second slide moves more stably and accurately.

[0012] Furthermore, the first slide seat has two horizontal slide grooves.

[0013] Therefore, the first slide seat moves more smoothly, making it more convenient to adjust the position of the guide roller device of the present application.

[0014] Furthermore, there are four of each of the first locking bolt, the second locking bolt and the third locking bolt.

[0015] Thereby, the connection between the components is more firm, ensuring the stable operation of the guide roller device.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The diamond wire guide roller device of the present application facilitates coarse adjustment and positioning of the position of the rotating guide wheel by adjusting the position of the first slide, and facilitates fine adjustment of the position of the rotating guide wheel by adjusting the relative position of the second slide and the first slide, thereby making the installation more flexible.

[0018] 2. The diamond wire guide roller device of the present application can adjust the angle of the rotating guide wheel through the second knob, thereby improving the adaptability of the device to the diamond wire, so that during the silicon wafer cutting process, the angle of the rotating guide wheel can be accurately adjusted according to needs to ensure that the diamond wire is stably guided to the rotating roller. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the installation of the guide roller device;

[0020] Figure 2 It is a schematic diagram of the separation of the guide roller device components;

[0021] Figure 3 It is a schematic diagram of the guide roller device;

[0022] Figure 4 This is a schematic diagram after the angle of the rotating guide wheel is adjusted.

[0023] Explanation of the reference numerals: 1 first slide; 1.1 first locking bolt; 1.2 protrusion; 1.3 limiting slide rail; 2 second slide; 2.1 second locking bolt; 3 extension plate; 3.1 side plate; 3.2 screw rod; 3.3 first knob; 4 mounting plate; 4.1 shaft through hole; 5.1 first plate body; 5.2 second plate body; 6 rotating guide wheel; 7.1 driving gear; 7.2 second knob; 7.3 transmission gear; 7.4 passive gear; 7.5 shaft; 7.6 third locking bolt; 8 diamond wire; 9 rotating roller. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model provides Figure 1-4 The diamond wire guide roller device for a silicon wafer cutting device shown in the figure comprises a first slide 1 and a second slide 2, wherein the first slide 1 has a first locking bolt 1.1 capable of fixing the position of the first slide 1, one side of the second slide 2 is fixedly connected to an extension plate 3, and the other side is fixedly connected to a mounting plate 4, the extension plate 3 is connected to a side plate 3.1, a screw 3.2 is installed at the side plate 3.1, the first slide 1 has a threaded hole matching the screw 3.2, the screw 3.2 passes through the side plate 3.1 and has a first knob 3.3 at the end, the second slide 2 has a second locking bolt 2.1 capable of fixing the relative position of the second slide 2 and the first slide 1, the mounting plate 4 is connected to an L-shaped plate, and the L-shaped plate comprises a first plate body 5.1 and a second plate body 5.2 connected to the first plate body, the second plate body 5.2 is installed with a rotating guide wheel 6, and an adjusting unit for adjusting the angle of the rotating guide wheel 6 is installed at the mounting plate 4, the adjusting unit includes a driving gear 7.1, a transmission gear 7.3 meshing with the driving gear 7.1, a passive gear 7.4 driven by the transmission gear 7.3 and a rotating shaft 7.5 connected to the passive gear 7.4, the driving gear 7.1 has a second knob 7.2, the passive gear 7.4 has a third locking bolt 7.6 capable of fixing the relative position of the passive gear 7.4 and the mounting plate 4, the rotating shaft passes through the mounting plate 4 and is fixedly connected to the first plate body 5.1, and the mounting plate 4 has a rotating shaft through hole 4.1 that cooperates with the rotating shaft.

[0026] A plurality of protrusions 1.2 are fixedly connected to the first slide 1, and the first locking bolt 1.1 is installed on the protrusion 1.2; a bearing is installed between the screw rod 3.2 and the side plate 3.1; the first slide 1 has a limiting slide rail 1.3, and the second slide 2 has a limiting slide groove matching the limiting slide rail 1.3; the first slide 1 has two horizontal slide grooves 1.4; the first locking bolt 1.1, the second locking bolt 2.1, and the third locking bolt 7.6 each have four.

[0027] Working principle: The diamond wire guide roller device of the present application can realize coarse adjustment and fine adjustment, so that the installation is more flexible. The angle of the rotating guide wheel can be adjusted to improve the adaptability of the device to the diamond wire, so that during the silicon wafer cutting process, the angle of the rotating guide wheel can be accurately adjusted according to the needs to ensure that the diamond wire is stably guided to the rotating roller.

[0028] During the specific installation, first, according to the needs, by adjusting the position of the first slide, the initial position of the rotating guide wheel is preliminarily determined, and the position of the first slide is fixed by the first locking bolt. Therefore, the coarse adjustment method is fast and direct, and the position of the rotating guide wheel can be quickly located within a large range. When the coarse adjustment is completed, the position of the second slide relative to the first slide is fine-tuned by rotating the first knob to rotate the screw until it is adjusted to a suitable position, and the position of the second slide is fixed with the second locking bolt. Then, according to the needs, by rotating the second knob, the active gear is driven to rotate, thereby driving the passive gear through the transmission gear, thereby adjusting the angle of the rotating guide wheel. After adjusting to a suitable angle, the third locking bolt is used to fix the relative position of the passive gear and the mounting plate, thereby ensuring that the angle of the rotating guide wheel does not change during the cutting process.

[0029] Although the present invention has been illustrated and described with respect to preferred embodiments, it should be understood by those skilled in the art that various changes and modifications may be made to the present invention without departing from the scope of the present invention as defined by the claims.

Claims

1. A diamond wire guide roller device for a silicon wafer cutting device, characterized in that: The invention comprises a first slide seat and a second slide seat, wherein the first slide seat is provided with a first locking bolt capable of fixing the position of the first slide seat, one side of the second slide seat is fixedly connected to an extension plate, and the other side is fixedly connected to a mounting plate, the extension plate is connected to a side plate, a screw is installed on the side plate, the first slide seat has a threaded hole matched with the screw, the screw passes through the side plate and has a first knob at the end, the second slide seat is provided with a second locking bolt capable of fixing the relative position of the second slide seat and the first slide seat, the mounting plate is connected to an L-shaped plate, the L-shaped plate comprises a first plate body and a and a second plate body connected to the first plate body, the second plate body being equipped with a rotating guide wheel, an adjusting unit for adjusting the angle of the rotating guide wheel being installed at the mounting plate, the adjusting unit comprising a driving gear, a transmission gear meshing with the driving gear, a passive gear driven by the transmission gear and a rotating shaft connected to the passive gear, the driving gear having a second knob, the passive gear having a third locking bolt capable of fixing the relative position of the passive gear and the mounting plate, the rotating shaft passing through the mounting plate and being fixedly connected to the first plate body, and the mounting plate having a rotating shaft through hole matching the rotating shaft.

2. The diamond wire guide roller device for silicon wafer cutting device according to claim 1, characterized in that: A plurality of protrusions are fixedly connected to the first slide seat, and the first locking bolts are installed on the protrusions.

3. The diamond wire guide roller device for silicon wafer cutting device according to claim 1, characterized in that: A bearing is installed between the screw rod and the side plate.

4. The diamond wire guide roller device for silicon wafer cutting device according to claim 1, characterized in that: The first slide seat has a limiting slide rail, and the second slide seat has a limiting slide groove matched with the limiting slide rail.

5. The diamond wire guide roller device for silicon wafer cutting device according to claim 1, characterized in that: The first slide seat has two horizontal slide grooves.

6. The diamond wire guide roller device for silicon wafer cutting device according to claim 1, characterized in that: There are four of each of the first locking bolt, the second locking bolt and the third locking bolt.

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