Silicon wafer bagging device

Abstract

The utility model discloses a silicon wafer bagging device, which belongs to the technical field of silicon wafer bagging, and comprises a bag opening part, the bag opening part comprises a bag opening platform deck, a first suction cup and a second suction cup, the first suction cup is arranged on the bag opening platform deck and adsorbs one side of a bag, the second suction cup is positioned above the first suction cup, and the first suction cup is used for sucking the other side of the bag. The other side of the bag is adsorbed, and the bag is opened; and the feeding part comprises a feeding module and a material carrying block, the material carrying block moves in the length direction of the feeding module, the silicon wafers are located on the material carrying block, and the feeding module feeds the silicon wafers located on the material carrying block into bags. According to the silicon wafer bagging device, rapid bagging treatment of the silicon wafers is achieved, manual operation is not needed in the process, manpower consumption is reduced, meanwhile, the bagging efficiency of the silicon wafers is greatly improved, the bagging consistency of the silicon wafers is guaranteed, and meanwhile the situation that the silicon wafers are damaged in the manual operation process can be avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon chip bagging, and in particular relates to a silicon chip bagging device. Background Art

[0002] Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present. Its cells use silicon as the main material and are made of single crystal silicon or polycrystalline silicon. Silicon crystal photovoltaics have the advantages of high efficiency, stability and reliability, but their production cost is high. The materials used in thin-film solar cells mainly include amorphous silicon, copper indium gallium selenide, organic materials, etc., which have the characteristics of light weight, low production cost and strong flexibility, but their efficiency is lower than that of silicon crystal photovoltaics. Polycrystalline silicon photovoltaics use microcrystalline crystals of high-purity silicon, which can be comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than silicon crystal photovoltaic technology, and silicon crystal rods are a commonly used silicon crystal.

[0003] Silicon wafers are formed after slicing the silicon crystal rods, and the silicon wafers are stacked to form a multi-layer structure. In actual use, the silicon wafers often need to be bagged for storage or transportation. At present, the bagging operation of silicon wafers is usually performed manually, that is, the operator opens the bag and then puts the silicon wafer into the bag to complete the bagging of the silicon wafers. This method requires a lot of manpower and greatly increases the labor intensity of the workers. In addition, this bagging method is inefficient, the bagging consistency is difficult to ensure, and the silicon wafers are easily damaged during the bagging process. Utility Model Content

[0004] The utility model overcomes the shortcomings of the prior art and provides a silicon wafer bagging device to solve the problems existing in the prior art.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a silicon wafer bagging device, comprising

[0006] A bag opening unit, the bag opening unit comprising a bag opening platform, a first suction cup and a second suction cup, wherein the first suction cup is disposed on the bag opening platform and sucks one side of the bag, and the second suction cup is located above the first suction cup and sucks the other side of the bag to open the bag;

[0007] The feeding part includes a feeding module and a loading block. The loading block moves along the length direction of the feeding module, and the silicon wafer is located on the loading block. The feeding module feeds the silicon wafer on the loading block into the bag.

[0008] In a preferred embodiment of the utility model, it further comprises a frame, and the bag opening part and the feeding part are both installed on the frame.

[0009] In a preferred embodiment of the utility model, a driving part is provided on the frame to drive the second suction cup, and the driving part includes a first driving cylinder and a second driving cylinder, the first driving cylinder drives the second driving cylinder, and the second suction cup is installed on the driving end of the second driving cylinder through a connecting block.

[0010] In a preferred embodiment of the utility model, a tensioning part is provided on the frame, and the tensioning part includes a first tensioning cylinder, a second tensioning cylinder and a tensioning plate. The first tensioning cylinder sends the tensioning plate into the opened bag, and the second tensioning cylinder drives the tensioning plate to tension the opened bag.

[0011] In a preferred embodiment of the utility model, the first tensioning cylinder drives the second tensioning cylinder, the tensioning plate is connected to the second tensioning cylinder via a fixed block, and there are two tensioning plates which move towards or in opposite directions.

[0012] In a preferred embodiment of the utility model, a material pressing part is provided on the feeding module, and the material pressing part includes a material pressing cylinder and a material pressing sheet. The material pressing cylinder drives the material pressing sheet to press down the silicon wafer located on the carrier block.

[0013] The utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0014] The silicon wafer bagging device of the utility model realizes the rapid bagging of silicon wafers. During this process, no manual operation is required, which reduces manpower consumption, greatly improves the bagging efficiency of silicon wafers, ensures the bagging consistency of silicon wafers, and also avoids damage to silicon wafers during manual operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the utility model;

[0017] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0018] Figure 3 This is another overall structural schematic diagram of a preferred embodiment of the utility model;

[0019] Figure 4 This is a schematic structural diagram of a tensioning portion of a preferred embodiment of the utility model;

[0020] In the figure: 10, bag opening part; 11, bag opening platform; 12, first suction cup; 13, second suction cup; 20, feeding part; 21, feeding module; 22, loading block; 30, frame; 40, driving part; 41, first driving cylinder; 42, second driving cylinder; 50, connecting block; 60, tensioning part; 61, first tensioning cylinder; 62, second tensioning cylinder; 63, tensioning sheet; 70, fixing block; 80, pressing part; 81, pressing cylinder; 82, pressing sheet. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0022] The present embodiment provides a silicon wafer bagging device, which realizes the rapid bagging of silicon wafers. During this process, no manual operation is required, which reduces manpower consumption and greatly improves the bagging efficiency of silicon wafers. The bagging consistency of silicon wafers is ensured, and at the same time, it can also avoid damage to silicon wafers during manual operation.

[0023] Combination Figures 1 to 4 As shown, the silicon wafer bagging device of this embodiment includes a bag opening part 10 and a feeding part 20. The bag opening part 10 can stably open the bag, and the feeding part 20 can feed the silicon wafers into the opened bag to complete the bagging operation of the silicon wafers.

[0024] In this embodiment, the silicon wafer bagging device further includes a frame 30 , and the bagging part 10 and the feeding part 20 are both mounted on the frame 30 , and the frame 30 is used to realize the overall support of the device.

[0025] Combination Figure 1 and Figure 2 As shown, the bag opening part 10 of the present embodiment includes a bag opening platform 11, a first suction cup 12 and a second suction cup 13. The first suction cup 12 is arranged on the bag opening platform 11 and sucks one side of the bag. The second suction cup 13 is located above the first suction cup 12 and sucks the other side of the bag to open the bag. In the process of opening the bag, the bag is located on the bag opening platform 11, and the first suction cup 12 sucks one side of the bag, and then the second suction cup 13 sucks the other side of the bag. The bag is opened under the pull of the second suction cup 13, and the bag opening operation is completed.

[0026] In this embodiment, a driving unit 40 is provided on the frame 30 to drive the second suction cup 13. The driving unit 40 includes a first driving cylinder 41 and a second driving cylinder 42. The first driving cylinder 41 drives the second driving cylinder 42. The second suction cup 13 is installed on the driving end of the second driving cylinder 42 through the connecting block 50. The first driving cylinder 41 and the second driving cylinder 42 are used to perform secondary driving on the second suction cup 13. After the silicon wafers are bagged, the second suction cup 13 can be pulled up to avoid interference with the feeding unit 20, which is beneficial for the feeding unit 20 to quickly deliver the bagged silicon wafers.

[0027] Combination Figure 1 and Figure 4 As shown, a tensioning part 60 is provided on the frame 30 of the present embodiment, and the tensioning part 60 includes a first tensioning cylinder 61, a second tensioning cylinder 62 and a tensioning sheet 63. The first tensioning cylinder 61 sends the tensioning sheet 63 into the opened bag, and the second tensioning cylinder 62 drives the tensioning sheet 63 to tension the opened bag. After the bag opening part 10 opens the bag, the first tensioning cylinder 61 sends the tensioning sheet 63 into the opened bag, and then the second tensioning cylinder 62 drives the tensioning sheet 63, so that the tensioning sheet 63 tensions the two ends of the bag.

[0028] In this embodiment, the first tensioning cylinder 61 drives the second tensioning cylinder 62, and the tensioning plate 63 is connected to the second tensioning cylinder 62 through the fixed block 70. There are two tensioning plates 63 and they move towards or in opposite directions. The second tensioning cylinder 62 of this embodiment is a bidirectional cylinder with two piston rods. The two piston rods move towards or in opposite directions, and the tensioning plates 63 are respectively located on the two piston rods and driven by the piston rods to realize the movement of the two tensioning plates 63 towards or in opposite directions. When the two tensioning plates 63 move in opposite directions into place, the bag is tensioned and stretched.

[0029] Combination Figure 1 and Figure 3 As shown, the feeding part 20 of this embodiment includes a feeding module 21 and a loading block 22. The loading block 22 moves along the length direction of the feeding module 21, and the silicon wafers are located on the loading block 22. The feeding module 21 delivers the silicon wafers located on the loading block 22 into the bag. The silicon wafers to be bagged are located on the loading block 22. When the bag is opened, the feeding module 21 delivers the silicon wafers into the bag. After the bagging is completed, the bagging part 10, the driving part 40 and the tensioning part 60 are all reset, and the feeding module 21 can deliver the bagged silicon wafers.

[0030] In this embodiment, a pressing part 80 is provided on the feeding module 21, and the pressing part 80 includes a pressing cylinder 81 and a pressing sheet 82. The pressing cylinder 81 drives the pressing sheet 82 to press down the silicon wafer on the loading block 22. The pressing part 80 can press down the silicon wafer on the loading block 22 to avoid the position of the silicon wafer being shifted during the bagging process, so as to ensure the accuracy and stability of the silicon wafer bagging.

[0031] In actual use of the silicon wafer bagging device of this embodiment, the silicon wafers to be bagged are placed on the loading block 22 of the feeding part 20, and the bag is opened with the cooperation of the bag opening part 10 and the driving part 40. After opening, the bag is tightened by the tensioning part 60 so that the silicon wafers can enter the bag smoothly.

[0032] In summary, the silicon wafer bagging device of this embodiment realizes the rapid bagging of silicon wafers. No manual operation is required in this process, which reduces manpower consumption and greatly improves the bagging efficiency of silicon wafers, ensures the consistency of bagging of silicon wafers, and also avoids damage to silicon wafers during manual operation.

[0033] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A silicon wafer bagging device, characterized in that: include A bag opening unit (10), the bag opening unit (10) comprising a bag opening platform (11), a first suction cup (12) and a second suction cup (13), the first suction cup (12) being arranged on the bag opening platform (11) and sucking one side of the bag, the second suction cup (13) being located above the first suction cup (12) and sucking the other side of the bag and opening the bag; A feeding section (20), the feeding section (20) comprising a feeding module (21) and a loading block (22), the loading block (22) moving along the length direction of the feeding module (21), and the silicon wafer being located on the loading block (22), the feeding module (21) feeding the silicon wafer located on the loading block (22) into a bag.

2. A silicon wafer bagging device according to claim 1, characterized in that: It also comprises a frame (30), and the bag opening part (10) and the feeding part (20) are both installed on the frame (30).

3. A silicon wafer bagging device according to claim 2, characterized in that: The frame (30) is provided with a driving unit (40) for driving the second suction cup (13); the driving unit (40) comprises a first driving cylinder (41) and a second driving cylinder (42); the first driving cylinder (41) drives the second driving cylinder (42); the second suction cup (13) is mounted on the driving end of the second driving cylinder (42) via a connecting block (50).

4. The silicon wafer bagging device according to claim 2, characterized in that: The frame (30) is provided with a tensioning part (60), and the tensioning part (60) comprises a first tensioning cylinder (61), a second tensioning cylinder (62) and a tensioning plate (63). The first tensioning cylinder (61) sends the tensioning plate (63) into the opened bag, and the second tensioning cylinder (62) drives the tensioning plate (63) to tension the opened bag.

5. The silicon wafer bagging device according to claim 4, characterized in that: The first tensioning cylinder (61) drives the second tensioning cylinder (62), and the tensioning sheet (63) is connected to the second tensioning cylinder (62) via a fixing block (70). There are two tensioning sheets (63) and they move towards or in opposite directions.

6. The silicon wafer bagging device according to claim 1, characterized in that: The feeding module (21) is provided with a material pressing part (80), and the material pressing part (80) comprises a material pressing cylinder (81) and a material pressing sheet (82). The material pressing cylinder (81) drives the material pressing sheet (82) to press down the silicon wafer on the carrier block (22).

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