Piezoelectric micropump device

Abstract

The utility model relates to a piezoelectric micropump device, which belongs to the technical field of piezoelectric pumps, solves the problems of larger volume, complicated manufacturing process and insufficient pumping capacity in the prior art, and comprises a heat dissipation plate, a flow guide plate, a resonant plate, an outer wall part with an embedded vibrator and an electrode frame which are assembled from top to bottom, wherein fluid passages through which fluid enters and exits are formed in the guide plate and the resonant plate, and wherein the vibrator includes a reinforcing plate and a piezoelectric element fixed below the reinforcing plate, and the vibrator is fitted to the outer wall portion through the reinforcing plate.

Description

Technical Field

[0001] The utility model relates to the technical field of piezoelectric pumps, in particular to a piezoelectric micro pump device. Background Art

[0002] As a micro-device with strong coupling across multiple disciplines such as materials, structures, fluids, electronics, and processes, the piezoelectric pump has the advantages of small size, low power consumption, high specific back pressure, large specific flow rate, high-speed response, and high flow accuracy. It has a wide range of applications in the fields of medical devices and semiconductor thermal management, and is particularly suitable for wearable and portable medical devices and ultra-thin micro-space heat dissipation management applications.

[0003] However, the integrated design of the actuator, elastic support, and sidewall structure in the prior art piezoelectric pump increases the process steps and difficulty of subsequent packaging, increasing the complexity of the packaging process. In addition, the prior art piezoelectric micropump is designed and prepared based on traditional precision machining and gluing processes, in which the pump body is a single layer of glue, and during the preparation process, the micropump needs to be tested and calibrated many times, and cannot be prepared by splicing, resulting in low production efficiency and high production costs. This also leads to low mass production capacity, which is not conducive to increasing production capacity at low cost.

[0004] Therefore, in the technical field of piezoelectric micropumps, there is a demand for piezoelectric micropumps that are thinner in appearance, simpler in manufacturing process, have excellent pumping capacity, and can operate stably for a long time. Utility Model Content

[0005] In order to solve the above problems of the existing piezoelectric micropump, the utility model provides a piezoelectric micropump device, which not only simplifies the processing technology and improves the processing efficiency, but also further reduces the overall volume of the piezoelectric micropump body while meeting the performance of the vibration element, thereby improving the device integration.

[0006] According to one embodiment of the present invention, a piezoelectric micropump device is provided, comprising:

[0007] The heat sink, guide plate, resonant plate, outer wall of the embedded vibrator and electrode frame are assembled from top to bottom.

[0008] The guide plate and the resonant plate form a fluid passage for fluid to enter and exit, and

[0009] The vibrator comprises a reinforcing plate and a piezoelectric element fixed below the reinforcing plate, and the vibrator is mounted on the outer wall portion by being embedded in the reinforcing plate.

[0010] Optionally, the heat sink, guide plate, resonance plate, outer wall portion and electrode frame have consistent outer peripheral size and shape.

[0011] Optionally, the guide plate includes a central guide hole and a guide groove extending from the guide hole to the outside laterally; the resonance plate has a central hole, which is connected to the guide hole of the guide plate, so that the guide groove, the guide hole and the central hole of the resonance plate together form the fluid passage.

[0012] Optionally, the guide hole of the guide plate is coaxial with the center hole of the resonance plate, and the aperture of the guide hole is larger than the aperture of the center hole; wherein the aperture of the guide hole is in the range of 4.5mm to 6.0mm, and the aperture of the center hole is in the range of 0.5mm to 1.2mm.

[0013] Optionally, the outer wall portion has a middle square opening, and a mounting recess is formed on the inner side facing the square opening; the reinforcement plate includes a circular reinforcement portion located in the center, and an octagonal beam structure surrounding the reinforcement portion; wherein the beam structure includes four lateral vibration beams alternately connected to each other to form an octagon, four oblique support beams, and a connection portion connecting the vibration beam and the step reinforcement portion; wherein the oblique support beam has a mounting protrusion extending outward from the connection with the vibration beam, and the mounting protrusion matches the mounting recess of the outer wall portion.

[0014] Optionally, the electrode frame includes two insulating strips, an electrode frame part one and an electrode frame part two separated by the insulating strips, and a cantilever extending inwardly from the electrode frame part two, wherein the cantilever is electrically connected to the lower surface of the piezoelectric element.

[0015] Optionally, the guide plate, the resonance plate, the reinforcement plate and the outer wall are made of carbon fiber composite materials.

[0016] Optionally, the heat sink, guide plate, resonance plate, outer wall portion and electrode frame have a rectangular or circular outer peripheral shape.

[0017] Optionally, the vibrator, the outer wall portion and the resonant plate are assembled by one-time bonding. The piezoelectric micropump device according to the utility model has at least the following advantages over the prior art:

[0018] 1. The vibrator, the outer wall and the resonance plate are stacked structures and can be bonded at one time, which not only simplifies the processing technology and improves the processing efficiency, but also further reduces the overall volume of the piezoelectric micropump and improves the device integration while meeting the performance of the vibration element.

[0019] 2. In addition to being used to fix and support the piezoelectric element, the reinforcement plate of the vibrator can also reinforce the piezoelectric element and provide prestress to increase the piezoelectric coefficient. The circular boss structure on the upper surface of the reinforcement part can cooperate with the resonance when the vibrator vibrates, increase the resonance frequency, and achieve better vibration effects.

[0020] 3. The beam structure of the reinforcement plate provides better vibration performance by including a connection portion connecting the vibration beam to the reinforcement portion.

[0021] 4. The heat sink, guide plate, resonant plate and vibrator are stacked, with high integration and extremely thin appearance. The structure of the fluid passage formed in the guide plate and the resonant plate makes the fluid reflux very small, forming a one-way fluid transport in the piezoelectric micropump. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. The features and advantages of the utility model can be more clearly understood by referring to the drawings. The drawings are schematic and should not be understood as any limitation to the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is an isometric view of a piezoelectric micropump device provided according to the first embodiment of the utility model.

[0024] Figure 2 It is a bottom view of the piezoelectric micropump device provided according to the first embodiment of the utility model.

[0025] Figure 3 It is an exploded view of a piezoelectric micropump device provided according to the first embodiment of the utility model.

[0026] Figure 4 It is a top view of the guide plate of the piezoelectric micropump device provided according to the first embodiment of the utility model.

[0027] Figure 5 1 is a top view of a resonant plate of a piezoelectric micropump device provided according to a first embodiment of the present utility model.

[0028] Figure 6 It is a top view of a combination of a vibrator and an outer wall portion of a piezoelectric micropump device provided according to a first embodiment of the present invention.

[0029] Figure 7 It is a top view of the outer wall portion of the piezoelectric micropump device provided according to the first embodiment of the utility model.

[0030] Figure 8 It is a top view of a reinforcing plate of a piezoelectric micropump device provided according to the first embodiment of the utility model.

[0031] Fig. 9 1 is a top view of an electrode frame of a piezoelectric micropump device provided according to a first embodiment of the present utility model.

[0032] Fig.10 It is an exploded view of a piezoelectric micropump device provided according to the second embodiment of the utility model.

[0033] Description of reference numerals:

[0034] 1, 2 Piezoelectric micro pump device;

[0035] 10. 210 heat sink;

[0036] 20, 220 guide plate;

[0037] 22 diversion holes;

[0038] 24, 224 diversion trough;

[0039] 26 diversion short slot;

[0040] 30, 230 resonance plate;

[0041] 32 center hole;

[0042] 34 Avoid openings;

[0043] 40 vibrator;

[0044] 50 reinforcement plate;

[0045] 51 round boss;

[0046] 52 reinforcement;

[0047] 53 beam structure;

[0048] 54 Vibrating beam;

[0049] 56 support beams;

[0050] 57 mounting convex part;

[0051] 58 connection part;

[0052] 60 hollow part;

[0053] 62 first gap portion;

[0054] 64 second gap portion;

[0055] 70 Piezoelectric element;

[0056] 80, 280 outer wall portion;

[0057] 82 square opening;

[0058] 84 mounting recess;

[0059] 90, 290 electrode frame;

[0060] 92 Insulation tape;

[0061] 94: an electrode frame;

[0062] 96 electrode frame part 2;

[0063] 98 Cantilever. DETAILED DESCRIPTION

[0064] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

[0065] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0066] A piezoelectric micro pump device provided according to an embodiment of the present utility model is described in detail below with reference to the accompanying drawings.

[0067] Example 1

[0068] like Figure 1 , Figure 2 and Figure 3 As shown, according to the first embodiment of the utility model, a piezoelectric micropump device 1 is provided, which includes: a heat sink 10, a guide plate 20, a resonance plate 30, an outer wall portion 80 with an embedded vibrator 40, and an electrode frame 90, which are assembled from top to bottom, wherein the guide plate 20 and the resonance plate 30 form a flow channel for fluid to enter and exit, and wherein the vibrator 40 includes a reinforcement plate 50 and a piezoelectric element 70 fixed below the reinforcement plate 50, and the vibrator 40 is mounted to the outer wall portion 80 through the reinforcement plate 50. The above-mentioned multilayer elements included in the piezoelectric micropump device 1, the heat sink 10, the guide plate 20, the resonance plate 30, the outer wall portion 80 and the electrode frame 90, have consistent outer peripheral dimensions and shapes, for example, in this embodiment, they are square in shape, and after assembly, a consistent shape of the piezoelectric micropump device 1 is formed. It should be understood that the piezoelectric micropump device of the utility model is not limited to the above-mentioned square shape, and can also be rectangular, circular, elliptical, etc. shapes as needed to meet different application requirements. As shown in FIG. Figure 2 and Figure 3 As shown, the assembled piezoelectric micropump device 1 is an integrated thin stacked structure, which is suitable for application fields such as small and micro wearable electronic devices, medical devices, precision instruments, etc.

[0069] like Figure 1 and Figure 3As shown, the heat sink 10 of the piezoelectric micropump device 1 of the first embodiment is arranged at the top and can be made of metal, alloy, ceramic, carbon fiber composite material and other materials.

[0070] See also Figure 4 The guide plate 20 installed below the heat sink 10 is formed with a guide hole 22 penetrating the center portion, and a guide groove 24 extending from the guide hole 22 to the outside laterally, so as to communicate with the outside through the guide groove 24. As shown in the figure, in the second embodiment, the guide grooves 24 are evenly spaced around the circular guide hole 22 and extend to the four corners of the guide plate 20. Optionally, each guide groove 24 may be provided with a short guide groove 26 bidirectionally communicating with the outside at the four corner ends of the guide plate 20, which crosses the four corner ends, so that the ends of each guide groove 24 are connected to the outside at the two side edges of the guide plate 20 through the short guide groove 26, and the shapes of the four corners of the guide plate 20 are kept intact. The width of the guide groove 24 can be set to a range of 0.6mm to 1.0mm as needed. The bidirectionally connected short flow guide groove 26 can provide a larger fluid inflow when the piezoelectric micro pump device 1 is working, and the buffering effect at the connection between the flow guide groove 24 and the outside can achieve smoother fluid inflow and outflow, avoid excessive rapid fluid flow, and retain the corners around the flow guide plate to facilitate alignment and assembly with other upper and lower components during installation. The flow guide plate 20 can be made of stainless steel, carbon fiber composite materials, etc.

[0071] like Figure 5As shown, the resonant plate 30 located below the guide plate 20 may have a central hole 32 extending therethrough, and the central hole 32 is connected to the guide hole 22 of the guide plate 20. Optionally, the central hole 32 of the resonant plate 30 is coaxial with the guide hole 22 of the guide plate 20, and the aperture of the central hole 32 of the resonant plate 30 is smaller than the aperture of the guide hole 22 of the guide plate 20, so as to ensure that the amount of fluid reflux from the pump body to the outside is small enough when the piezoelectric micropump device 1 is working, forming a one-way transport of the fluid into the pump body 100. The guide short groove 26, the guide groove 24 and the guide hole 22 of the guide plate 20 and the central hole 32 of the resonant plate 30 together form a flow path for the fluid to enter the pump chamber from the outside. For example, but not limited to this, the aperture of the guide hole 22 of the guide plate 20 can be set in the range of 4.5mm to 6.0mm, and the resonance frequency needs to be calculated and optimized according to different requirements. The aperture of the central hole 32 of the resonant plate 30 can be set in the range of 0.5 mm to 1.2 mm. The resonant plate 30 and the vibrator 40 vibrate in opposite directions, and the vibrator 40 forms different pressure distributions when moving upward and downward, thereby achieving the push on the fluid, thereby improving the vibration efficiency of the piezoelectric micropump 1. Optionally, the resonant plate 30 can also be hollowed out with an avoidance opening 34 around the central hole 32, and the position of the avoidance opening 34 corresponds to the vibration part of the reinforcement plate 50 of the vibrator 40, so as to avoid the vibration part of the reinforcement plate 50 that vibrates up and down when the vibrator 40 vibrates, reduce the impact and collision between components, avoid component failure caused by vibration, and improve the overall durability of the piezoelectric micropump device 1.

[0072] See also Figures 6 to 8 , below the resonance plate 30 is a combination of a vibrator 40 and an outer wall portion 80, and the vibrator 40 includes a reinforcing plate 50 and a piezoelectric element 70 fixed below the reinforcing plate 50. The vibrator 40 is a structure without side walls, and is mounted to the outer wall portion 80 through the reinforcing plate 50, and is fixed to the resonance plate 30 above and the electrode frame 90 below through the outer wall portion 80. The outer wall portion 80 is in the form of a frame with a middle square opening 82, and a mounting recess 84 with an oblique angle is formed on the inner side facing the square opening 82, for fitting and mounting the reinforcing plate 50. Figure 7 As shown, the outer wall portion 80 in this embodiment is square, and two mounting recesses 84 are formed on each side thereof. The reinforcing plate 50 can be integrally formed, for example, cut and formed on a carbon composite material sheet. The reinforcing plate 50 and the outer wall portion 80 are separately manufactured components, and therefore can be manufactured using different materials, so that materials with different characteristics respectively meet the stable support performance requirements of the outer wall portion 80 and the high elastic modulus requirements of the reinforcing plate 50. The outer wall portion 80 can be made of materials such as stainless steel, carbon fiber composite materials, etc. The piezoelectric element 70 is made of piezoelectric ceramics.

[0073] like Figure 6 and Figure 8As shown, the reinforcing plate 50 includes a circular reinforcing portion 52 in the center, and an octagonal beam structure 53 surrounding the reinforcing portion 52. The piezoelectric element 70 can be fixed to the lower surface of the reinforcing portion 52 by bonding or welding. In addition to being used to fix and support the piezoelectric element 70, the reinforcing plate 50 can also reinforce and provide prestress to the piezoelectric element 70 to increase the piezoelectric coefficient. The upper surface of the reinforcing portion 52 of the reinforcing plate 50 may have a circular boss 51 located at the center, whose diameter is smaller than the diameter of the reinforcing portion 52 and is coaxial with the reinforcing portion 52. The circular boss 51 on the upper surface of the reinforcing portion 52 can cooperate with resonance when the vibrator 40 vibrates, thereby increasing the resonant frequency and achieving a better vibration effect.

[0074] Specifically, the octagonal beam structure 53 of the reinforcement plate 50 includes four lateral vibration beams 54 and four oblique support beams 56 that are alternately connected to each other to form an octagon, and the four support beams 56 play the role of connecting and fixing the vibration beams 54. The four vibration beams 54 are narrower than the four support beams 56, so that the vibration beams 54 provide a larger elastic deformation range, and the support beams 56 provide better support reliability. Optionally, the beam structure 53 of the reinforcement plate 50 may also include a connecting portion 58 extending inward from the vibration beam 54 to the reinforcement portion 52, and connected to the reinforcement portion 52 through the connecting portion 58 to provide better vibration performance. Optionally, the structure of the reinforcement plate 50 can be that four radially outwardly extending connecting portions 58 are evenly spaced around the central circular reinforcement portion 52, and four vibration beams 54 of equal length are respectively arranged at the outer ends of the four connecting portions 58, and the four vibration beams 54 are arranged so that adjacent vibration beams 54 are perpendicular to each other. Adjacent vibration beams 54 are connected by oblique support beams 56, and the support beams 56 extend beyond the outer edge of the vibration beams 54 to form mounting protrusions 57, which match the mounting recesses 84 of the outer wall 80 so as to fit together during installation. This design allows the reinforcing plate 50 to only require a material of appropriate thickness (such as 0.25mm to 0.3mm) to be processed by etching or laser processing, and to be realized by different steps or hollowing processing in a layer of material. At the same time, the wider vibration beam 54 and support beam 56 structure of this embodiment can make the entire reinforcing plate 50 have good overall flatness, and it is not easy to produce local deformation, thereby causing the yield of the pump to decrease. Optionally, the support beam 56 extends from the connection with the vibration beam 54 to form an oblique mounting protrusion 57, which matches the mounting recess 84 of the outer wall 80 with the same oblique shape. This shape makes the vibrator 40 and the outer wall 80 fit more firmly and not easy to loosen. The installed lateral vibration beam 54 is substantially parallel to the inner edge of the square opening 82 of the outer wall portion 80. In addition, the positions of the four avoidance openings 34 of the resonance plate 30 correspond to the positions of the four vibration beams 54 to avoid collision with the vibration beams 54 when they vibrate up and down.

[0075] Continue to refer Figure 6 , four separated hollow portions 60 are formed between the beam structure 53 of the reinforcing plate 50 and the reinforcing portion 52. The beam structure 53 can be arranged so that the width of one vibration beam 54 from the outside to the outside of another vibration beam 54 parallel thereto is slightly narrower than the corresponding width of the square opening 82 of the outer wall portion 80, thereby forming four elongated first gap portions 62 between the lateral vibration beams 54 and the side edges of the outer wall portion 80. Figure 6 As shown, after the reinforcing plate 50 and the outer wall 80 are assembled, four second gaps 64 of a substantially triangular shape located at the four corners are formed between the oblique support beam 56 of the reinforcing plate 50 and the outer wall 80, and four first gaps 62 located between the vibration beam 54 and the outer wall 80. Thus, in the assembled combination of the vibrator 40 and the outer wall 80, there are a plurality of hollow portions 60, first gaps 62 and second gaps 64 spaced apart from each other, so that during operation, the fluid can quickly flow through the space to reduce the flow resistance. The second gaps 64 located at the four corners of the outer wall 80 are invalid areas, which are very small and concentrated in the corners, so that the vibrator 40 has a larger area of ​​the middle vibration area, which is conducive to further reducing the overall volume of the vibrator 40 while meeting the performance of the vibrator 40, and improving the device integration. The above structure of the vibration element can be realized when using composite materials, making full use of the high elastic modulus and low density characteristics of composite materials such as carbon fiber, achieving a higher resonance frequency on an extremely thin material, and further thinning the volume of the pump body.

[0076] In this embodiment, the thickness of the outer wall portion 80 should be greater than or equal to the thickness of the vibrator 40 formed by the superposition of the reinforcing plate 50 and the piezoelectric element 70. Optionally, the thickness of the outer wall portion 80 can range from 0.35 mm to 0.5 mm, and the thickness of the vibrator 40 can range from 0.35 mm to 0.45 mm. This size setting can ensure that sufficient vibration space is provided while also ensuring that the overall size of the piezoelectric micropump device 1 meets a variety of ultra-thin application requirements. The reinforcing plate 50 of the above structure can provide excellent vibration performance for the piezoelectric micropump device 1, and the structure enables the reinforcing plate 50 to be integrally cut and processed on a single sheet of material, which is convenient for manufacturing, saves raw materials, and reduces manufacturing costs. The reinforcing plate 50 and the outer wall portion 80 are assembled in a manner that is conducive to improving the tolerance of the manufacturing error of the reinforcing plate 50, which is convenient for assembly and has excellent adaptability. The reinforcing plate 50 can be assembled on the outer wall portion 80 with different external shapes, so that it is suitable for different pump bodies and piezoelectric pump devices, and then suitable for a variety of different application products. The reinforcing plate 50 may be made of a fiber-reinforced composite material. The vibrator 40, by including the above-mentioned substantially straight beam structure 53, can make full use of the reinforcement modulus in the fiber direction of the fiber-reinforced composite material to provide better vibration performance and durability. The reinforcing plate 50 and the outer wall portion 80 can be made of different materials, embedded and bonded, or bonded, which is conducive to meeting the ultra-thin, low heat generation vibrator structure while also enabling the outer wall portion 80 to meet the dicing requirements of the dicing machine. For example, the reinforcing plate 50 can be made of stainless steel or a carbon fiber composite material, and the outer wall portion 80 can be made of glass fiber or a carbon fiber composite material, ceramics, stainless steel and other materials, and the glass fiber and ceramic materials used can be metallized.

[0077] like Fig. 9As shown, the electrode frame 90 located below the embedded vibrator 40 has a cantilever 98 extending inwardly, and the cantilever 98 is electrically connected to the lower surface of the piezoelectric element 70 away from the reinforcement portion 52. The piezoelectric element 70 is powered by an external power supply through the electrode frame 90. The electrode frame 90 may include two insulating strips 92, and two parts separated by the insulating strips 92, namely, the electrode frame part 1 94 and the electrode frame part 2 96, wherein the cantilever 98 extends inwardly from the electrode frame part 2 96. The electrode frame 90 is made of a conductive metal material, and the electrical connection between the electrode frame part 1 94 and the electrode frame part 2 96 is cut off by the insulating strip 92, so that they are insulated from each other to avoid internal short circuit. The cantilever 98 of the electrode frame 90 can be connected to the lower surface of the piezoelectric element 70 of the vibrator 40 by soldering spot welding or high-temperature curing of silver paste. When the pump body 100 is working, the cantilever 98 of the electrode frame 90 supplies power to the lower surface of the piezoelectric element 70 away from the reinforcement portion 52. The electrode frame portion 94 is connected to the reinforcing plate 50 through a conductive adhesive. Since the reinforcing plate 50 is a good conductor, the piezoelectric element 70 is powered on the upper surface of the reinforcing portion 52 through the electrode frame portion 94, the conductive adhesive, and the reinforcing plate 50. Thus, low impedance power is supplied to the two electrode surfaces of the piezoelectric element 70, reducing power loss.

[0078] The electrode frame 90 is fixed to the outer wall 80 of the vibrator 40 in such a manner that the electrode frame portion 94 of the electrode frame 90 is bonded or bonded to the outer wall 80 by conductive glue, and the electrode frame portion 96 is bonded or bonded to the outer wall 80 by insulating glue.

[0079] Optionally, in the assembled piezoelectric micropump device 1, the flow channel hole 22 of the guide plate 20, the central hole 32 of the resonant plate 30, the reinforcement portion 52 of the reinforcement plate 50, and the piezoelectric element 70 are coaxial, so as to cooperate to provide excellent fluid flow performance and oscillation effect. In this embodiment,

[0080] According to the piezoelectric micropump device provided by the first embodiment of the utility model, the vibration element, the outer wall portion and the resonance plate can be bonded at one time, which not only simplifies the processing technology and improves the processing efficiency, but also further reduces the overall volume of the vibration element while meeting the performance of the vibration element, thereby improving the device integration.

[0081] The working principle of the piezoelectric micropump device provided according to the first embodiment of the utility model is as follows.

[0082] When the piezoelectric micro pump device 1 is working, power is supplied from an external power source to the piezoelectric element 70 via the electrode frame 90, driving the piezoelectric element 70 to drive the vibrator 40 to vibrate up and down. When the piezoelectric element 70 drives the reinforcement portion 52 of the reinforcement plate 50 to deform downward, the beam structure 53 around the reinforcement portion 52 bends upward, and a portion of the beam structure 53 approaches the resonance plate 30 upward so that the space therebetween is compressed to form a high-pressure area, while the reinforcement portion 52 moves away from the resonance plate 30 downward so that the space therebetween is expanded to form a low-pressure area. Since the flow resistance in the high-pressure area is large and the flow resistance in the low-pressure area is small, the fluid flows into the low-pressure area from the outside at high speed through the fluid passage formed in the guide plate 20 and the resonance plate 30, thereby achieving fluid suction. When the piezoelectric element 70 drives the reinforcement portion 52 of the reinforcement plate 50 to deform upward, the beam structure 53 around the reinforcement portion 52 bends downward, and part of the beam structure 53 moves downward away from the resonance plate 30 so that the space therebetween expands to form a low-pressure area, while the reinforcement portion 52 moves upward close to the resonance plate 30 so that the space therebetween compresses to form a high-pressure area. Since the central area is a high-pressure area with a large flow resistance, and the surrounding area is a low-pressure area with a small flow resistance, a large amount of fluid flows from the central high-pressure area to the surrounding low-pressure areas. Also, since the aperture of the central hole 32 of the resonance plate 30 is much smaller than the aperture of the guide hole 22 of the guide plate 20, the flow of fluid from the pump cavity to the outside is blocked, and thus the amount of fluid flowing from the central high-pressure area to the outside of the piezoelectric micro-pump device 1 is very small, which is much less than the amount of fluid flowing into the pump cavity from the outside when the piezoelectric element 70 drives the reinforcement portion 52 to deform downward. As the pressure in the pump chamber of the piezoelectric micropump device 1 increases, when it reaches a certain pressure value, the amount of fluid flowing back from the bottom of the reinforcement part 52 to the top of the reinforcement part 52 when the piezoelectric element 70 drives the reinforcement part 52 to vibrate downward is equal to the amount of fluid flowing from the top of the reinforcement part 52 to the bottom of the reinforcement part 52 when the piezoelectric element 70 drives the reinforcement part 52 to vibrate upward, and a dynamic balance is achieved. At this time, the piezoelectric micropump device 1 reaches a zero flow back pressure state, and the fluid only oscillates, and no unidirectional flow is formed.

[0083] Example 2

[0084] The following references Fig.10 , a piezoelectric micropump device provided according to the second embodiment of the utility model is described.

[0085] like Fig.10As shown, a piezoelectric micropump device 2 provided according to the second embodiment of the utility model includes, from top to bottom, a heat sink 210, a guide plate 220, a resonant plate 230, an outer wall portion 280 of an embedded vibrator 40, and an electrode frame 290. The above-mentioned multilayer components included in the piezoelectric micropump device 2 have consistent outer peripheral dimensions and circular outer peripheral shapes, and form a piezoelectric micropump device 2 with a circular outer periphery after assembly. Among them, the guide groove 224 of the guide plate 220 directly extends to the outer periphery of the guide plate 220 to communicate with the outside. In this embodiment, a wider outlet can be formed at the end of the guide groove 224 located at the outer periphery of the guide plate 220 to facilitate the inflow of a large amount of fluid. In this embodiment, although the outer peripheral shape of the multilayer components of the piezoelectric micropump device 2 is circular, its internal structure is the same as the structure of the pump body 100 of the first embodiment above, and will not be repeated here. In addition, since the square opening structure in the middle of the outer wall portion 280 is the same as the square opening 82 in the middle of the outer wall portion 80 in the first embodiment, the vibrator 40 composed of the reinforcing plate 50 and the piezoelectric element 70 in the first embodiment can be matched and installed therein. The piezoelectric micropump device 2 is suitable for applications requiring a circular piezoelectric micropump.

[0086] All the above optional technical solutions can be arbitrarily combined to form optional embodiments of the present application, which will not be described one by one here.

[0087] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the utility model.

[0088] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by any technician familiar with the technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A piezoelectric micropump device, It is characterized in that include: The heat sink, guide plate, resonance plate, outer wall of the embedded vibrator and electrode frame are assembled from top to bottom. The guide plate and the resonant plate form a fluid passage for fluid to enter and exit, and The vibrator comprises a reinforcing plate and a piezoelectric element fixed below the reinforcing plate, and the vibrator is mounted on the outer wall portion by being embedded in the reinforcing plate.

2. The piezoelectric micropump device according to claim 1, It is characterized in that The heat dissipation plate, the guide plate, the resonance plate, the outer wall portion and the electrode frame have consistent outer peripheral size and shape.

3. The piezoelectric micropump device according to claim 1, Features: The guide plate includes a central guide hole and a guide groove extending from the guide hole to the outside in a lateral direction; The resonant plate has a central hole, which is communicated with the guide holes of the guide plate, so that the guide grooves of the guide plate, the guide holes and the central hole of the resonant plate together form the fluid passage.

4. The piezoelectric micropump device according to claim 3, Features: The guide hole of the guide plate is coaxial with the central hole of the resonant plate, and the aperture of the guide hole is larger than the aperture of the central hole; The diameter of the guide hole is in the range of 4.5 mm to 6.0 mm, and the diameter of the center hole is in the range of 0.5 mm to 1.2 mm.

5. The piezoelectric micropump device according to claim 1, Features: The outer wall portion has a middle square opening, and a mounting recess is formed on the inner side facing the square opening; The reinforcing plate includes a circular reinforcing portion located in the center and an octagonal beam structure surrounding the reinforcing portion; Wherein, the beam structure includes four lateral vibration beams alternately connected to each other to form an octagon, four oblique support beams, and a connecting portion connecting the vibration beam and the step reinforcement portion; The oblique support beam has a mounting protrusion extending outward from a connection with the vibration beam, and the mounting protrusion matches the mounting recess of the outer wall.

6. The piezoelectric micropump device according to claim 1, Features: The electrode frame includes two insulating strips, an electrode frame part 1 and an electrode frame part 2 separated by the insulating strips, and a cantilever extending inwardly from the electrode frame part 2. Wherein, the cantilever is electrically connected to the lower surface of the piezoelectric element.

7. The piezoelectric micropump device according to claim 1, Features: The guide plate, the resonance plate, the reinforcement plate and the outer wall are made of carbon fiber composite materials.

8. The piezoelectric micropump device according to claim 2, Features: The heat dissipation plate, the guide plate, the resonance plate, the outer wall portion and the electrode frame have a rectangular or circular outer peripheral shape.

9. The piezoelectric micropump device according to any one of claims 1 to 8, Features: The vibrator, the outer wall portion and the resonance plate are assembled by one-time bonding.

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