Vacuum chuck for wafer gluing equipment

Abstract

The utility model relates to the technical field of vacuum chucks, and discloses a vacuum chuck for wafer gluing equipment, which comprises a chuck body and a support sleeve, the chuck body is mounted on the support sleeve, the chuck body is a round chuck body, a vacuum suction hole is arranged at the center of the chuck body, and the vacuum suction hole is communicated with the support sleeve. A plurality of circles of concentric supporting assemblies are arranged on the upper surface of the suction cup body from the center to the outside, an arc-shaped suction groove is formed between every two adjacent supporting assemblies in the radial direction, each circle of supporting assembly comprises a plurality of arc-shaped supporting protrusions which are evenly arranged at intervals in the circumferential direction, and a communicating groove is formed between every two adjacent arc-shaped supporting protrusions on the same circumference. The arc-shaped supporting protrusions adjacent in the radial direction are arranged in a staggered mode, and the vacuum suction holes, the communicating grooves and the arc-shaped adsorption grooves communicate with one another. The plurality of arc-shaped adsorption grooves and the communication grooves form a labyrinth sealing groove, so that the adsorption pressure on the wafer can be balanced, the stress of the adsorbed wafer is more uniform, the deformation of the wafer caused by non-uniform stress is reduced, and the phenomenon of wafer flying is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum suckers, in particular to a vacuum sucker used for wafer glue coating equipment. Background Art

[0002] In the coating and developing equipment, the vacuum suction cup is installed on the motor output shaft, and the wafer is adsorbed by the vacuum suction cup. When the motor is working, it drives the vacuum suction cup and the wafer to rotate, so that the photoresist on the surface of the wafer is distributed more evenly in the coating equipment, and the residual liquid on the surface of the wafer is separated from the wafer more quickly in the developing equipment.

[0003] During the manufacturing process, it is necessary to ensure that the vacuum suction cup has a certain adsorption force on the wafer to avoid flying chips during the production process, and at the same time ensure that the wafer is evenly stressed to avoid unnecessary deformation. The existing vacuum suction cup is provided with multiple sector-shaped areas along the circumference of the disk surface, and each sector-shaped area is concentrically provided with multiple arc-shaped protrusions arranged at intervals, and grooves are formed between adjacent arc-shaped protrusions. This structure will cause greater pressure at the center of the wafer and uneven force, resulting in concave deformation of the wafer, and uneven coating of the photoresist during the coating process. In addition, in the early stage of coating, the centrifugal force and the impact of the photoresist can easily cause flying chips. Utility Model Content

[0004] The utility model aims at solving the existing technical problems and provides a vacuum suction cup for wafer glue coating equipment.

[0005] The utility model provides a technical solution to the above-mentioned technical problems as follows: a vacuum suction cup for wafer coating equipment, comprising a suction cup body and a support sleeve, the suction cup body being installed on the support sleeve, the suction cup body being a circular cup body, a vacuum suction hole being arranged at the center of the suction cup body, a plurality of circles of concentric support components being arranged on the upper surface of the suction cup body from the center to the outside, arc-shaped adsorption grooves being formed between radially adjacent support components, each circle of the support components comprising a plurality of arc-shaped support protrusions uniformly arranged along the circumferential direction, connecting grooves being formed between adjacent arc-shaped support protrusions on the same circumference, radially adjacent arc-shaped support protrusions being arranged in an alternating manner, the vacuum suction hole, the connecting groove and the arc-shaped adsorption groove being connected.

[0006] The beneficial effects of the utility model are as follows: a plurality of arc-shaped adsorption grooves and connecting grooves form a labyrinth sealing groove, which can balance the adsorption pressure on the wafer, make the adsorbed wafer more evenly stressed, and reduce the deformation of the wafer caused by uneven stress; in the gluing equipment, under the same vacuum degree, the wafer adsorbed by the labyrinth sealing groove can withstand greater centrifugal force, thus avoiding the wafer flying phenomenon.

[0007] On the basis of the above technical solution, the present invention can also make the following improvements to the above technical solution:

[0008] Furthermore, a vacuum chamber is provided in the support sleeve, the vacuum suction hole is connected to the vacuum chamber, and the vacuum chamber is connected to a vacuum pipe.

[0009] The beneficial effect of adopting the above further technical solution is that the vacuum generator generates a vacuum, thereby firmly adsorbing the wafer through the vacuum suction hole, the connecting groove and the arc-shaped adsorption groove, thereby ensuring the adsorption effect on the wafer.

[0010] Furthermore, the plurality of arc-shaped support protrusions are distributed at equal intervals along the radial direction.

[0011] The beneficial effect of adopting the above further technical solution is to ensure the uniformity of the force applied to the wafer, avoid deformation of the wafer due to uneven force, and facilitate processing.

[0012] Furthermore, the depth h of the arc-shaped adsorption groove is 0.5mm-1mm.

[0013] The beneficial effect of adopting the above further technical solution is that it can not only ensure the adsorption force on the wafer, but also avoid the problem of deformation of the wafer caused by the excessive height of the arc-shaped supporting protrusion.

[0014] Furthermore, the suction cup body and the support sleeve are an integrated structure.

[0015] The beneficial effect of adopting the above further technical solution is that the overall structural strength is ensured and the processing is convenient.

[0016] Furthermore, the suction cup body and the support sleeve are made of zirconia ceramics.

[0017] The beneficial effect of adopting the above further technical solution is that the performance is stable, it will not react with materials such as photoresist, and the service life of the suction cup body and the support sleeve is guaranteed.

[0018] Furthermore, each of the arc-shaped supporting protrusions has the same width.

[0019] The beneficial effect of adopting the above further technical solution is that the uniformity of the force applied to the wafer is further ensured and the processing is convenient.

[0020] Furthermore, the support sleeve is provided with a pin hole.

[0021] The beneficial effect of adopting the above further technical solution is that the support sleeve is connected to the output sleeve of the motor through the cooperation of the pin shaft and the pin hole, so that the vacuum suction cup and the motor output sleeve can rotate synchronously, thereby ensuring the uniformity of the wafer glue coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1It is a three-dimensional schematic diagram of the vacuum suction cup of the utility model;

[0023] Figure 2 It is a cross-sectional schematic diagram of the vacuum suction cup of the utility model.

[0024] Figure numerals: 1. suction cup body; 2. arc-shaped supporting protrusion; 3. vacuum suction hole; 4. vacuum chamber; 5. pin hole; 6. connecting groove; 7. supporting sleeve; 8. arc-shaped adsorption groove. DETAILED DESCRIPTION

[0025] In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0026] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0027] like Figure 1 and Figure 2 As shown, the utility model discloses a vacuum suction cup for wafer coating equipment, including a suction cup body 1 and a support sleeve 7, the suction cup body 1 is installed on the support sleeve 7, the suction cup body 1 is a circular disc body, and a circular vacuum suction hole 3 is arranged at the center of the suction cup body 1, which is easy to process. The upper surface of the suction cup body 1 is provided with multiple circles of concentric support components from the center to the outside, and an arc-shaped adsorption groove 8 is formed between radially adjacent support components. Each circle of support components includes a plurality of arc-shaped support protrusions 2 evenly arranged along the circumferential direction, and a connecting groove 6 is formed between adjacent arc-shaped support protrusions 2 on the same circumference. The radially adjacent arc-shaped support protrusions 2 are staggered, and the vacuum suction hole 3, the connecting groove 6 and the arc-shaped adsorption groove 8 are connected. The vacuum suction hole 3, the connecting groove 6 and the arc-shaped adsorption groove 8 form a labyrinth sealing groove to generate uniform suction force on the wafer, so that the wafer is tightly attached to the suction cup body 1, ensuring the uniformity of the force on the wafer, reducing the deformation of the wafer caused by uneven force, and ensuring the normal coating of the wafer and the service life of the wafer.

[0028] In this embodiment, a vacuum chamber 4 is provided in the support sleeve 7, the vacuum suction hole 3 is connected to the vacuum chamber 4, and the vacuum chamber 4 is connected to the vacuum pipe. The vacuum generator sucks the air in the vacuum chamber 4 through the vacuum pipe to form a vacuum, so that the vacuum suction hole 3, the connecting groove 6 and the arc-shaped adsorption groove 8 produce an adsorption force on the wafer, thereby achieving the effect of firmly adsorbing the wafer. The support sleeve 7 is detachably connected to the vacuum motor. Specifically, the output end of the vacuum motor is connected to the output sleeve, and the output sleeve is provided with a positioning hole. The pin shaft is inserted into the positioning hole and the pin hole 5 on the support sleeve 7, thereby driving the vacuum suction cup and the wafer to rotate synchronously to ensure the uniformity of the wafer glue coating. The vacuum pipe passes through the output sleeve and is connected to the vacuum chamber 4 to avoid the vacuum pipe from being entangled.

[0029] In this embodiment, the plurality of arc-shaped support protrusions 2 are distributed at equal intervals in the radial direction, so that the widths of the arc-shaped adsorption grooves 8 are the same, further improving the uniformity of force on the wafer and avoiding concave distortion due to uneven force.

[0030] The depth h of the arc-shaped adsorption groove 8 is 0.5 mm-1 mm, preferably 0.8 mm, which can ensure the adsorption force on the wafer and avoid the problem of the wafer being deformed due to the arc-shaped support protrusion 2 being too high.

[0031] In this embodiment, the suction cup body 1 and the support sleeve 7 are an integrated structure, which ensures the overall structural strength and facilitates processing, thereby saving processing costs.

[0032] Furthermore, the material of the suction cup body 1 and the support sleeve 7 is zirconia ceramic.

[0033] Optionally, the suction cup body 1 and the support sleeve 7 are detachably connected, and a sealing ring is provided at the connection to facilitate replacement of suction cup bodies 1 of different sizes to meet the adsorption requirements of wafers of different sizes and improve the flexibility of use and scope of application.

[0034] Furthermore, the width of each arc-shaped supporting protrusion 2 is the same, which further improves the uniformity of the force applied to the wafer.

[0035] Furthermore, the number of arc-shaped supporting protrusions 2 of each circle of supporting components is the same. In the present embodiment, each circle of supporting components is provided with four arc-shaped supporting protrusions 2, so as to ensure the uniformity of the force applied to the wafer and facilitate processing.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A vacuum chuck for wafer coating equipment, characterized in that: The invention comprises a suction cup body (1) and a support sleeve (7), wherein the suction cup body (1) is mounted on the support sleeve (7), the suction cup body (1) is a circular cup body, a vacuum suction hole (3) is arranged at the center of the suction cup body (1), a plurality of circles of concentric support components are arranged on the upper surface of the suction cup body (1) from the center to the outside, arc-shaped adsorption grooves (8) are formed between radially adjacent support components, the depth h of the arc-shaped adsorption grooves (8) is 0.5 mm-1 mm, each circle of the support components comprises a plurality of arc-shaped support protrusions (2) uniformly arranged along the circumferential direction, a connecting groove (6) is formed between the adjacent arc-shaped support protrusions (2) on the same circumference, the radially adjacent arc-shaped support protrusions (2) are arranged in an alternating manner, the vacuum suction hole (3), the connecting groove (6) and the arc-shaped adsorption groove (8) are connected, and the plurality of arc-shaped adsorption grooves (8) and the connecting groove (6) form a labyrinth sealing groove.

2. The vacuum chuck for wafer glue coating equipment according to claim 1, characterized in that: A vacuum chamber (4) is provided in the support sleeve (7), the vacuum suction hole (3) is in communication with the vacuum chamber (4), and the vacuum chamber (4) is in communication with a vacuum pipe.

3. The vacuum chuck for wafer coating equipment according to claim 1 or 2, characterized in that: The plurality of arc-shaped supporting protrusions (2) are distributed at equal intervals along the radial direction.

4. The vacuum chuck for wafer glue coating equipment according to claim 1, characterized in that: The suction cup body (1) and the support sleeve (7) are an integrated structure.

5. The vacuum chuck for wafer glue coating equipment according to claim 1 or 4, characterized in that: The material of the suction cup body (1) and the support sleeve (7) is zirconium oxide ceramic.

6. The vacuum chuck for wafer glue coating equipment according to claim 1, characterized in that: The width of each arc-shaped supporting protrusion (2) is the same.

7. The vacuum chuck for wafer glue coating equipment according to claim 1, characterized in that: The support sleeve (7) is provided with a pin hole (5).

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