Heat dissipation uniform distribution mechanism and heat dissipation module for composite light source

Abstract

The utility model provides a heat dissipation uniform distribution mechanism and a heat dissipation module for a composite light source, the heat dissipation uniform distribution mechanism comprises a radiator, the back surface of the radiator is provided with a strip-shaped high heat conduction member groove and a uniform temperature block groove, the high heat conduction member groove is internally provided with a strip-shaped high heat conduction heat dissipation member, and the uniform temperature block groove is internally provided with a strip-shaped uniform temperature block. The high-heat-conduction heat dissipation piece extends in the long edge direction of the heat dissipation device and is located in the middle of the back face of the heat dissipation device. A copper block is arranged in the temperature equalizing block groove and located on the surface of the high-heat-conduction heat dissipation piece. The length of the copper block is smaller than that of the high-heat-conduction heat dissipation piece, the height of the copper block is larger than that of the high-heat-conduction heat dissipation piece, and the copper block, the radiator and the high-heat-conduction heat dissipation piece are connected into a whole; the heat conductivity coefficient of the high-heat-conductivity heat dissipation piece is not lower than that of copper; and the size of the copper block is larger than that of a heat source contacted with the copper block. By adopting the technical scheme, the temperature of the radiator is more uniform, and the utilization efficiency of the radiator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of light source heat dissipation, in particular to a heat dissipation uniform distribution mechanism and a heat dissipation module for a composite light source. Background Art

[0002] When a product combines LED and narrow-band laser, two heat sources with high heat generation will appear together, which undoubtedly poses a considerable challenge to the cooling system of the entire product.

[0003] In previous solutions, the product's cooling system is generally a combination of a radiator and a fan, such as Figure 1 As shown, the heat dissipation system consists of three fans 2 and a radiator 1. Two light sources 3 are used as two heat sources and are tightly attached to the radiator through a thermal interface material. The heat is then dissipated through the radiator to ensure that the heat source is maintained at a relatively stable temperature, thereby ensuring the stability of the product operation.

[0004] In the previous product solutions, the material of the radiator in the product's cooling system is generally 6061 aluminum alloy. The heat source is first transferred to the radiator, and then the high thermal conductivity of 6061 aluminum alloy is used to quickly conduct the heat, and then the fan is used to quickly remove the heat from the surface of the radiator. However, this cooling system has two defects. One defect is that when the heat source is concentrated on one side of the radiator, due to the problem of the radiator material, the heat cannot quickly reach the other side, which will cause a waste of heat dissipation area and there is no way to achieve perfect heat dissipation efficiency; another defect is that when the heat is concentrated on one side, due to the high concentration of heat, the heat of the heat source cannot be quickly released, resulting in heat accumulation on one side, which causes the product's working environment temperature to be in a very low range. Utility Model Content

[0005] In view of the above technical problems, the utility model discloses a heat dissipation uniform distribution mechanism and a heat dissipation module for a composite light source, which solves the problem of waste of heat dissipation area and uneven heat dissipation caused by the inability to quickly conduct heat.

[0006] To this end, the technical solution of the utility model is:

[0007] A heat dissipation uniformity mechanism for a composite light source, comprising a heat sink, wherein the back of the heat sink is provided with a strip-shaped high thermal conductivity component groove and a temperature equalizing block groove, wherein a strip-shaped high thermal conductivity heat sink is provided in the high thermal conductivity component groove, wherein the high thermal conductivity heat sink extends along the long side direction of the heat sink and is located in the middle of the back of the heat sink; wherein a copper block is provided in the temperature equalizing block groove, wherein the copper block is located on the surface of the high thermal conductivity heat sink; wherein the length of the copper block is less than the length of the high thermal conductivity heat sink, wherein the height of the copper block is greater than the height of the high thermal conductivity heat sink, wherein the copper block, the heat sink, and the high thermal conductivity heat sink are connected as a whole; wherein the thermal conductivity coefficient of the high thermal conductivity heat sink is not less than the thermal conductivity coefficient of copper; wherein the size of the copper block is greater than the size of the heat source in contact with. Here, it means that the length and width of the copper block are greater than the length and width of the heat source in contact with. wherein the high thermal conductivity heat sink is made of a high thermal conductivity material. wherein the side of the heat sink with fins is the front side, the side with fins is the front side of the heat sink, and the back side refers to the back side of the heat dissipation surface.

[0008] With this technical solution, the copper block contacts the heat source, and the heat is transferred to the radiator through the uniform temperature of the copper block. At the same time, the heat is transferred to the radiator through the high thermal conductivity heat sink, and can be further quickly dissipated by fans or other cold sources. This technical solution solves the problem of heat conduction and uniform distribution of the radiator when the heat source is concentrated on one side; secondly, it solves the problem of the product's working environment temperature rising when the heat is highly concentrated and the product cannot be significantly modified.

[0009] As a further improvement of the present invention, the copper block protrudes from the back side of the radiator.

[0010] As a further improvement of the utility model, there are two temperature equalizing block grooves, which are spaced apart and distributed on the back side of the radiator.

[0011] As a further improvement of the present invention, the temperature-equalizing block groove is a square groove, and the copper block is square.

[0012] As a further improvement of the present invention, the high thermal conductivity heat sink is a heat pipe or a solid copper bar.

[0013] As a further improvement of the present invention, the number of the high thermal conductivity heat sinks is two.

[0014] As a further improvement of the present invention, the copper block, the heat sink, and the high thermal conductivity heat sink are connected as a whole by welding.

[0015] The utility model discloses a heat dissipation module, comprising a fan and the heat dissipation uniform distribution mechanism for a composite light source as described above, wherein the fan is located at the front side of the heat sink.

[0016] As a further improvement of the utility model, there are multiple fans, and the multiple fans are arranged closely.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] By adopting the technical solution of the utility model and improving the radiator structure, the heat conduction speed is faster, the radiator temperature is more uniform, the utilization efficiency of the radiator is improved, the working environment temperature of the product is increased, and the stability of the product is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of the prior art heat dissipation system of the utility model.

[0020] Figure 2 It is a schematic diagram of the exploded structure of the heat dissipation uniform distribution mechanism for the composite light source according to an embodiment of the utility model.

[0021] Figure 3 It is a structural schematic diagram of a heat dissipation uniform distribution mechanism for a composite light source according to an embodiment of the utility model.

[0022] Figure 4 It is a structural schematic diagram of a heat dissipation module according to an embodiment of the utility model.

[0023] 1- radiator, 2- fan, 3- light source;

[0024] 11-high thermal conductivity component slot, 12-temperature equalizing block slot, 13-high thermal conductivity heat sink, 14-copper block. DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0026] Example 1

[0027] like Figure 2 and Figure 3 As shown, a heat dissipation uniformity mechanism for a composite light source comprises a heat sink 1, wherein a strip-shaped high thermal conductivity component groove 11 and a temperature equalizing block groove 12 are provided on the back of the heat sink 1, wherein the depth of the high thermal conductivity component groove 11 is greater than the depth of the temperature equalizing block groove 12; the temperature equalizing block groove 12 is embedded in the high thermal conductivity component groove 11, the length of the temperature equalizing block groove 12 is less than the length of the high thermal conductivity component groove 11, the height of the temperature equalizing block groove 12 is greater than the height of the high thermal conductivity component groove 11, and the depth of the high thermal conductivity component groove 11 is greater than the depth of the temperature equalizing block groove 12.

[0028] A strip-shaped high thermal conductivity heat sink 13 is provided in the high thermal conductivity component groove 11, and the high thermal conductivity heat sink 13 extends along the long side direction of the radiator 1 and is located in the middle of the back side of the radiator 1; a copper block 14 is provided in the temperature equalizing block groove 12, and the copper block 14 is located on the surface of the high thermal conductivity heat sink 13; the length of the copper block 14 is less than the length of the high thermal conductivity heat sink 13, and the height of the copper block 14 is greater than the height of the high thermal conductivity heat sink 13; the thermal conductivity of the high thermal conductivity heat sink 13 is not lower than the thermal conductivity of copper; the size of the copper block 14 is greater than the size of the heat source in contact. Here, it means that the length and width of the copper block 14 are greater than the length and width of the heat source in contact. The copper block 14, the radiator 1, and the high thermal conductivity heat sink 13 are connected as a whole by welding.

[0029] Furthermore, in this embodiment, there are two temperature-equalizing block grooves 12, which are spaced apart on the back of the radiator 1. The temperature-equalizing block groove 12 is a square groove, and the copper block 14 is a square. The high thermal conductivity heat sink 13 is a heat pipe or a solid copper bar. There are two high thermal conductivity heat sinks 13.

[0030] During assembly, first fix the heat sink 1, put two high thermal conductivity heat sinks 13 into the high thermal conductivity component groove 11, and use welding to connect the heat sink 1 and the two high thermal conductivity heat sinks 13 together at the molecular level. Next, put two copper blocks 14 into two temperature-averaging block grooves 12 respectively, and use welding to connect the two copper blocks 14, the heat sink 1, and the high thermal conductivity heat sink 13 together at the molecular level, so that the five parts of the two copper blocks 14, the two high thermal conductivity heat sinks 13, and the heat sink 1 are formed into one part. The copper block 14 is used to contact with the heat source such as the light source 3.

[0031] In this embodiment, the heat source first passes through the copper block 14 to even out the temperature, and then conducts the heat to the radiator 1 and the high thermal conductivity heat sink 13 by increasing the heat conduction area; at the same time, the heat is transferred to the radiator 1 through the high thermal conductivity heat sink 13, and then the heat is quickly transferred to the surrounding air by the fan 2 in contact with the radiator 1, so that the temperature of the heat source drops. In the whole process, the heat is released by the heat source, and after being evenly heated by the copper block 14, it reaches the high thermal conductivity heat sink 13, and then quickly transferred to the radiator 1 by the high thermal conductivity heat sink 13. In this process, the fan 2 continuously takes away the heat on the surface of the radiator 1, so that the temperature of the radiator 1 drops rapidly.

[0032] Example 2

[0033] like Figure 4 As shown, a heat dissipation module comprises a fan 2 and the heat dissipation uniform distribution mechanism for a composite light source as described in Example 1, wherein the fan 2 is located on the front of the heat sink 1. In this embodiment, there are three fans 2, and the three fans 2 are arranged adjacent to each other.

[0034] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] The specific implementation methods described above are preferred implementation methods of the present utility model, and are not intended to limit the specific implementation scope of the present utility model. The scope of the present utility model includes but is not limited to the specific implementation methods. All equivalent changes made in accordance with the shape and structure of the present utility model are within the protection scope of the present utility model.

Claims

1. A heat dissipation uniformity mechanism for a composite light source, characterized in that: It includes a radiator, the back of which is provided with a strip-shaped high thermal conductivity component groove and a temperature equalizing block groove, the high thermal conductivity heat sink is provided in the high thermal conductivity component groove, the high thermal conductivity heat sink extends along the long side direction of the radiator and is located in the middle of the back of the radiator; a copper block is provided in the temperature equalizing block groove, the copper block is located on the surface of the high thermal conductivity heat sink; the length of the copper block is less than the length of the high thermal conductivity heat sink, the height of the copper block is greater than the height of the high thermal conductivity heat sink, the copper block, the radiator and the high thermal conductivity heat sink are connected as a whole; the thermal conductivity of the high thermal conductivity heat sink is not lower than the thermal conductivity of copper; the size of the copper block is greater than the size of the heat source it contacts.

2. The heat dissipation uniform distribution mechanism for a composite light source according to claim 1, characterized in that: There are two temperature equalizing block grooves, which are spaced apart and distributed on the back of the radiator.

3. The heat dissipation uniform distribution mechanism for a composite light source according to claim 2, characterized in that: The temperature-averaging block groove is a square groove, and the copper block is a square.

4. The heat dissipation uniform distribution mechanism for a composite light source according to claim 2, characterized in that: The high thermal conductivity heat sink is a heat pipe or a solid copper bar.

5. The heat dissipation uniform distribution mechanism for a composite light source according to claim 4, characterized in that: The number of the high thermal conductivity heat sinks is two.

6. The heat dissipation uniform distribution mechanism for a composite light source according to claim 1, characterized in that: The copper block, the heat sink and the high thermal conductivity heat sink are connected as a whole by welding.

7. A heat dissipation module, characterized in that: The invention comprises a fan and a heat dissipation uniform distribution mechanism for a composite light source as claimed in any one of claims 1 to 6, wherein the fan is located at the front of the heat sink.

8. The heat dissipation module according to claim 7, characterized in that: There are multiple fans, and the multiple fans are arranged closely.

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