Stacked heat dissipation module

Abstract

A stacked heat dissipation module comprises a stacked heat pipe, at least one heat dissipation fin is arranged on the stacked heat pipe, the stacked heat pipe is composed of at least two layers of heat pipes, a heat conduction bottom plate is arranged at the bottom of the stacked heat pipe, the heat conduction bottom plate is composed of at least three layers of bottom plates, and the heat conduction bottom plate fixes the multiple layers of heat pipes to form the stacked heat pipe. According to the technical scheme, the heat pipes are arranged in a stacked mode, when the number of the heat pipes is increased, the heat dissipation efficiency is improved, the area of the bottom face is not too large, installation is prevented from being affected, the efficiency of conducting heat of a heat source to more heat pipes is improved, more heat pipes are placed under the condition that the size specification of the radiator is not changed, and the heat dissipation efficiency is improved. The heat of the electronic equipment can be well reduced, the output power of the electronic equipment is maintained, all performances of the electronic equipment are released, and the product capacity and competitiveness are improved.

Description

Technical Field

[0001] The utility model relates to the field of radiators, in particular to a stacked heat dissipation module. Background Art

[0002] As computers and other electronic devices become more high-performance, highly integrated, and highly dense, their power consumption is also showing an increasing trend. The heat generated by the equipment during operation is also increasing, and the demand for heat dissipation is also increasing.

[0003] In the prior art, the efficiency of the radiator is improved by increasing the number of heat pipes. When there are too many heat pipes arranged in a layer, the bottom area is too large and exceeds the heat source area, which not only affects the installation, but also the heat dissipation efficiency is not significantly improved. Therefore, a radiator with higher heat dissipation efficiency and which does not cause the bottom area to be too large when the number of heat pipes is increased is needed. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a stacked heat dissipation module.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A stacked heat dissipation module includes a stacked heat pipe, which is composed of multiple layers of heat pipes, each layer of heat pipes is composed of multiple heat pipes, the heat pipe is sealed inside and can quickly conduct heat, at least one heat dissipation fin is arranged on the stacked heat pipe, the heat dissipation fin is a copper sheet or an aluminum sheet, and the heat dissipation fin is provided with a hole for the heat pipe to pass through, the heat pipe is embedded or welded / adhesively fixed to the heat dissipation fin, the connection is firm and can quickly conduct heat, the stacked heat pipe is composed of at least two layers of heat pipes, the number of heat pipes is increased by stacking on top to improve the heat dissipation efficiency while avoiding the base being too large, and the stacking method can be used More heat pipes are set to achieve better heat dissipation effect. A thermally conductive base plate is provided at the bottom of the stacked heat pipe. The thermally conductive base plate fixes the stacked heat pipe and conducts heat from the heat source to the heat pipe. The thermally conductive base plate is composed of at least three layers of base plates. At least three layers of base plates are buckled up and down to fix the multi-layer heat pipe. Not only is the connection stable but also the heat conduction can be fully covered and the heat conduction efficiency is high. The thermally conductive base plate fixes the multi-layer heat pipe to form a stacked heat pipe. The upper base plate and the lower base plate are buckled. The upper base plate is used to press down the upper heat pipe and the lower base plate supports the lower heat pipe. Multiple middle base plates separate the multi-layer heat pipes to realize the production of stacked heat pipes.

[0007] In one embodiment, the stacked heat pipe includes a first layer of heat pipes and a second layer of heat pipes. The first layer of heat pipes is provided with a plurality of heat pipes arranged symmetrically side by side, and the second layer of heat pipes is provided with two symmetrical heat pipes. The heat conductive bottom plate includes an upper bottom plate, a middle bottom plate, and a lower bottom plate. The upper bottom plate is in an arch bridge shape and wraps, extrude, and fixes the middle bottom plate and the lower bottom plate.

[0008] In one embodiment, a layer of heat pipes is provided above the lower bottom plate, a middle bottom plate is provided above the layer of heat pipes, a second layer of heat pipes is provided above the middle bottom plate, an upper bottom plate is provided above the second layer of heat pipes, and the lower bottom plate, a layer of heat pipes, the middle bottom plate, the second layer of heat pipes, and the upper bottom plate are arranged from bottom to top to form a stacked heat pipe and a heat-conducting bottom plate for fixing the stacked heat pipes.

[0009] In one of the embodiments, a heat pipe groove one is provided above the lower base plate, the heat pipe groove one matches the shape of a layer of heat pipes, the number of the heat pipe grooves one is greater than or equal to the number of heat pipes in a layer of heat pipes, and the heat pipe groove one ensures that the heat pipes in a layer of heat pipes have fixed positions and the number can be adjusted according to demand.

[0010] In one of the embodiments, a heat pipe groove 2 is provided below the middle bottom plate, the heat pipe groove 2 matches the shape of a layer of heat pipes, the number of the heat pipe grooves 2 is greater than or equal to the number of heat pipes in a layer of heat pipes, and the heat pipe groove 2 ensures that the heat pipes in a layer of heat pipes all have fixed positions and the number can be adjusted according to demand, and a heat pipe groove 3 is provided above the middle bottom plate, the heat pipe groove 3 matches the shape of a second layer of heat pipes, the number of the heat pipe grooves 3 is greater than or equal to the number of heat pipes in a second layer of heat pipes, and the heat pipe groove 3 ensures that the heat pipes in the second layer of heat pipes all have fixed positions and the number can be adjusted according to demand.

[0011] In one of the embodiments, a heat pipe groove four is provided under the upper base plate, and the heat pipe groove four matches the shape of the second layer of heat pipes. The number of the heat pipe groove four is greater than or equal to the number of heat pipes in the second layer of heat pipes. The heat pipe groove four ensures that the heat pipes of the second layer of heat pipes have fixed positions and the number can be adjusted according to demand.

[0012] In one of the embodiments, the upper surface of the middle bottom plate matches the lower surface of the upper bottom plate, and the lower surface of the middle bottom plate matches the upper surface of the lower bottom plate. The upper bottom plate, the middle bottom plate, and the lower bottom plate are fixedly connected by welding, tight fitting, and bonding. The middle bottom plate is a trapezoidal column. After the lower surface of the middle bottom plate is connected to the upper surface of the lower bottom plate, a plurality of holes for the heat pipes to pass through are formed. The upper half of the middle bottom plate is narrowed, and the number of second-layer heat pipes accommodated is less than that of one-layer heat pipes, so that the stacking of the heat pipes is more stable. The lower part of the upper bottom plate just fits over the upper part of the middle bottom plate and forms a plurality of holes for accommodating the heat pipes to pass through, thereby achieving stable fixation.

[0013] In one of the embodiments, the stacked heat pipe is U-shaped and is fixed in the holes of the heat sink fins. The U-shaped heat pipe has high heat transfer efficiency and a simple structure, which saves manufacturing costs. The heat pipe is fixed to the heat sink fins by embedding or welding / bonding to make the connection more stable. The thermal conductive base plate is made of high thermal conductivity material, which includes materials with high thermal conductivity such as copper, silver, and graphene, and has a good heat dissipation effect. A fan is provided on the side of the heat sink fins, and the fan increases the air flow speed to improve the heat dissipation efficiency.

[0014] In one embodiment, the width of the first layer of heat pipes is greater than the width of the second layer of heat pipes, and the heat pipes at the bottom of the multi-layer heat pipes are wider than the heat pipes at the top, thereby achieving a stable stacking arrangement.

[0015] In one embodiment, the number of heat pipes in the first layer of heat pipes is greater than that in the second layer of heat pipes, and the number of heat pipes at the bottom of the multi-layer heat pipes is greater than that at the top, so that the center of gravity is lowered to achieve a stable stacking arrangement.

[0016] Beneficial effects of the utility model: Since the utility model adopts the above-mentioned technical scheme and arranges the heat pipes in a stacked manner, when the number of heat pipes is increased to improve the heat dissipation efficiency, the bottom surface area will not be too large, thereby avoiding affecting the installation. The efficiency of transferring heat from the heat source to more heat pipes is also improved, and more heat pipes can be placed to improve the heat dissipation efficiency while the size of the radiator remains unchanged. This can effectively reduce the heat of electronic equipment, maintain the output power of electronic equipment, release its full performance, and enhance product strength and competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is an exploded view of the utility model.

[0019] Figure 2 It is the front view of the utility model.

[0020] Figure 3 for Figure 2 Cross-sectional view at AA.

[0021] Figure 4 This is the front view of the utility model with a fan.

[0022] Figure 5 It is a top view of the utility model.

[0023] Figure 6 It is a bottom view of the utility model.

[0024] Figure 7 It is a side view of the utility model.

[0025] Figure 8 It is a three-dimensional diagram of the utility model.

[0026] Fig. 9 This is a three-dimensional diagram of the upper base plate.

[0027] Fig.10 This is a three-dimensional diagram of the midsole plate.

[0028] Fig.11 This is a three-dimensional diagram of the lower base plate.

[0029] The numbers in the figure represent: heat sink fin 1, stacked heat pipe 2, thermal conductive base plate 3, first layer of heat pipe 4, second layer of heat pipe 5, upper base plate 6, middle base plate 7, lower base plate 8, heat pipe slot one 9, heat pipe slot two 10, heat pipe slot three 11, heat pipe slot four 12, fan 13. DETAILED DESCRIPTION

[0030] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific implementations and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0033] For the embodiment of the utility model, please refer to Figures 1 to 11 :

[0034] A stacked heat dissipation module includes a stacked heat pipe 2. At least one heat dissipation fin 1 is arranged on the stacked heat pipe 2. The stacked heat pipe 2 is composed of at least two layers of heat pipes. A heat-conducting base plate 3 is provided at the bottom of the stacked heat pipe 2. The heat-conducting base plate 3 is composed of at least three layers of base plates. The heat-conducting base plate 3 fixes multiple layers of heat pipes to form the stacked heat pipe 2.

[0035] By adopting the above technical scheme, a stacked heat dissipation module includes a stacked heat pipe 2, which is composed of multiple layers of heat pipes, each layer of heat pipes is composed of multiple heat pipes, the internal sealing of the heat pipe can quickly conduct heat, and at least one heat dissipation fin 1 is arranged on the stacked heat pipe 2, the heat dissipation fin 1 is a copper sheet or an aluminum sheet, and the heat dissipation fin 1 is provided with a hole for the heat pipe to pass through, and the heat pipe is embedded or welded / bonded to the heat dissipation fin 1, the connection is firm and can quickly conduct heat, the stacked heat pipe 2 is composed of at least two layers of heat pipes, and the number of heat pipes is increased by stacking on top to improve the heat dissipation efficiency while avoiding the base being too large, and the stacking method is used. More heat pipes can be set to achieve better heat dissipation effect. A heat-conducting base plate 3 is provided at the bottom of the stacked heat pipe 2. The heat-conducting base plate 3 fixes the stacked heat pipe 2 and conducts heat from the heat source to the heat pipe. The heat-conducting base plate 3 is composed of at least three layers of base plates. At least three layers of base plates are buckled up and down to fix the multi-layer heat pipe. Not only is the connection stable but also the heat conduction can be fully covered and the heat conduction efficiency is high. The heat-conducting base plate 3 fixes the multi-layer heat pipe to form the stacked heat pipe 2. The upper base plate 6 and the lower base plate 8 are buckled. The upper base plate 6 is used to press down the upper heat pipe, and the lower base plate 8 supports the lower heat pipe. Multiple middle base plates 7 separate the multi-layer heat pipes to realize the production of the stacked heat pipe 2.

[0036] Preferably, the stacked heat pipe 2 includes a layer of heat pipes 4 and a second layer of heat pipes 5 , and the heat conductive base plate 3 includes an upper base plate 6 , a middle base plate 7 , and a lower base plate 8 .

[0037] By adopting the above technical solution, the stacked heat pipe 2 includes a layer of heat pipes 4 and a second layer of heat pipes 5. The first layer of heat pipes 4 is provided with multiple heat pipes arranged symmetrically side by side, and the second layer of heat pipes 5 is provided with two symmetrical heat pipes. The heat conductive bottom plate 3 includes an upper bottom plate 6, a middle bottom plate 7, and a lower bottom plate 8. The upper bottom plate 6 is in an arch bridge shape to wrap, extrude, and fix the middle bottom plate 7 and the lower bottom plate 8.

[0038] Preferably, a layer of heat pipes 4 is provided above the lower bottom plate 8 , a middle bottom plate 7 is provided above the layer of heat pipes 4 , a second layer of heat pipes 5 is provided above the middle bottom plate 7 , and an upper bottom plate 6 is provided above the second layer of heat pipes 5 .

[0039] By adopting the above technical solution, a layer of heat pipes 4 is provided above the lower bottom plate 8, a middle bottom plate 7 is provided above the layer of heat pipes 4, a second layer of heat pipes 5 is provided above the middle bottom plate 7, an upper bottom plate 6 is provided above the second layer of heat pipes 5, and the lower bottom plate 8, the layer of heat pipes 4, the middle bottom plate 7, the second layer of heat pipes 5, and the upper bottom plate 6 are arranged from bottom to top to form a stacked heat pipe 2 and a heat-conducting bottom plate 3 for fixing the stacked heat pipes 2.

[0040] Preferably, a heat pipe groove 9 is provided above the lower base plate 8 , the heat pipe groove 9 matches the shape of a layer of heat pipes 4 , and the number of the heat pipe grooves 9 is greater than or equal to the number of heat pipes in a layer of heat pipes 4 .

[0041] By adopting the above technical solution, a heat pipe groove 9 is provided above the lower base plate 8, and the heat pipe groove 9 matches the shape of a layer of heat pipes 4. The number of the heat pipe grooves 9 is greater than or equal to the number of heat pipes in a layer of heat pipes 4. The heat pipe grooves 9 ensure that the heat pipes in a layer of heat pipes 4 have fixed positions and the number can be adjusted according to demand.

[0042] Preferably, a heat pipe groove 2 10 is provided below the middle bottom plate 7, and the heat pipe groove 2 10 matches the shape of a layer of heat pipes 4, and the number of the heat pipe grooves 2 10 is greater than or equal to the number of heat pipes in a layer of heat pipes 4, and a heat pipe groove 3 11 is provided above the middle bottom plate 7, and the heat pipe groove 3 11 matches the shape of a second layer of heat pipes 5, and the number of the heat pipe grooves 3 11 is greater than or equal to the number of heat pipes in the second layer of heat pipes 5.

[0043] By adopting the above technical solution, a second heat pipe groove 10 is provided below the middle bottom plate 7, and the second heat pipe groove 10 matches the shape of the first layer of heat pipes 4. The number of the second heat pipe grooves 10 is greater than or equal to the number of heat pipes in the first layer of heat pipes 4. The second heat pipe groove 10 enables the heat pipes of the first layer of heat pipes 4 to have fixed positions and the number can be adjusted according to demand. A third heat pipe groove 11 is provided above the middle bottom plate 7, and the third heat pipe groove 11 matches the shape of the second layer of heat pipes 5. The number of the third heat pipe groove 11 is greater than or equal to the number of heat pipes in the second layer of heat pipes 5. The third heat pipe groove 11 enables the heat pipes of the second layer of heat pipes 5 to have fixed positions and the number can be adjusted according to demand.

[0044] Preferably, four heat pipe grooves 12 are provided under the upper base plate 6 , and the shape of the four heat pipe grooves 12 matches that of the second-layer heat pipes 5 , and the number of the four heat pipe grooves 12 is greater than or equal to the number of heat pipes in the second-layer heat pipes 5 .

[0045] By adopting the above technical solution, a heat pipe groove four 12 is provided under the upper base plate 6, and the heat pipe groove four 12 matches the shape of the second-layer heat pipe 5. The number of the heat pipe groove four 12 is greater than or equal to the number of heat pipes in the second-layer heat pipe 5. The heat pipe groove four 12 enables the heat pipes of the second-layer heat pipe 5 to have fixed positions and the number can be adjusted according to demand.

[0046] Preferably, the upper surface of the middle bottom plate 7 matches the lower surface of the upper bottom plate 6, and the lower surface of the middle bottom plate 7 matches the upper surface of the lower bottom plate 8. The upper bottom plate 6, the middle bottom plate 7, and the lower bottom plate 8 are fixedly connected by welding, tight fitting, or bonding.

[0047] By adopting the above technical solution, the upper surface of the middle bottom plate 7 matches the lower surface of the upper bottom plate 6, and the lower surface of the middle bottom plate 7 matches the upper surface of the lower bottom plate 8. The upper bottom plate 6, the middle bottom plate 7, and the lower bottom plate 8 are fixedly connected by welding, tight fitting, and bonding. The middle bottom plate 7 is a trapezoidal column. After the lower surface of the middle bottom plate 7 is connected to the upper surface of the lower bottom plate 8, a plurality of holes for the heat pipes to pass through are formed. The upper half of the middle bottom plate 7 becomes narrower, and the number of the second-layer heat pipes 5 accommodated is less than that of the first-layer heat pipes 4, so that the stacking of the heat pipes is more stable. The lower part of the upper bottom plate 6 just fits the upper part of the middle bottom plate 7 and forms a plurality of holes for accommodating the heat pipes to pass through, thereby achieving stable fixation.

[0048] Preferably, the stacked heat pipe 2 is U-shaped, the stacked heat pipe 2 is fixed in the hole of the heat dissipation fin 1 , the heat conduction base plate 3 is made of a high thermal conductivity material, and a fan 13 is provided on the side of the heat dissipation fin 1 .

[0049] By adopting the above technical solution, the stacked heat pipe 2 is U-shaped, and the stacked heat pipe 2 is fixed in the hole of the heat sink fin 1. The U-shaped heat pipe has high heat transfer efficiency and simple structure, which saves production cost. The heat pipe is fixed to the heat sink fin 1 by embedding or welding / bonding, which makes the connection more stable. The thermal conductive base plate 3 is made of high thermal conductivity material, and the high thermal conductivity material includes copper, silver, graphene and other materials with high thermal conductivity, which have good heat dissipation effect. A fan 13 is provided on the side of the heat sink fin 1, and the fan 13 increases the air flow speed to improve the heat dissipation efficiency.

[0050] Preferably, the width of the first layer of heat pipes 4 is greater than the width of the second layer of heat pipes 5 .

[0051] By adopting the above technical solution, the width of the first layer of heat pipes 4 is greater than that of the second layer of heat pipes 5 , and the heat pipes at the bottom of the multi-layer heat pipes are wider than the heat pipes at the top, thereby achieving a stable stacking arrangement.

[0052] Preferably, the number of heat pipes in the first layer of heat pipes 4 is greater than the number of heat pipes in the second layer of heat pipes 5 .

[0053] By adopting the above technical solution, the number of heat pipes in the first layer of heat pipes 4 is greater than that in the second layer of heat pipes 5 , and the number of heat pipes at the bottom of the multi-layer heat pipes is greater than that at the top, so that the center of gravity is lowered to achieve a stable stacking arrangement.

[0054] Working principle: Heat pipes are arranged in a stacked manner to achieve the goal of setting as many heat pipes as possible while fixing the size of the bottom surface. The number of heat pipes in the upper layer is less than that in the lower layer. This design not only considers the center of gravity to make the radiator stable, but also considers the effect of heat conduction distance on efficiency, thus balancing the relationship between efficiency and cost.

[0055] During installation, the fan 13 is fixed on the radiator, the heat-conducting base is attached to the heat source and fixed, and the fan 13 is turned on during use to complete the installation.

[0056] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A stacked heat dissipation module, comprising a stacked heat pipe (2), at least one heat dissipation fin (1) being arranged on the stacked heat pipe (2), characterized in that: The stacked heat pipe (2) is composed of at least two layers of heat pipes; a heat-conducting base plate (3) is provided at the bottom of the stacked heat pipe (2); the heat-conducting base plate (3) is composed of at least three layers of base plates; the heat-conducting base plate (3) fixes multiple layers of heat pipes to form the stacked heat pipe (2); the stacked heat pipe (2) comprises a layer of heat pipes (4) and two layers of heat pipes (5); and the heat-conducting base plate (3) comprises an upper base plate (6), a middle base plate (7), and a lower base plate (8).

2. A stacked heat dissipation module according to claim 1, characterized in that: A layer of heat pipes (4) is arranged above the lower bottom plate (8), a middle bottom plate (7) is arranged above the layer of heat pipes (4), a second layer of heat pipes (5) is arranged above the middle bottom plate (7), and an upper bottom plate (6) is arranged above the second layer of heat pipes (5).

3. A stacked heat dissipation module according to claim 1, characterized in that: A heat pipe groove (9) is provided above the lower base plate (8); the heat pipe groove (9) matches the shape of a layer of heat pipes (4); and the number of the heat pipe grooves (9) is greater than or equal to the number of heat pipes in a layer of heat pipes (4).

4. The stacked heat dissipation module according to claim 1, characterized in that: A second heat pipe groove (10) is provided below the middle bottom plate (7), the second heat pipe groove (10) matches the shape of a layer of heat pipes (4), and the number of the second heat pipe grooves (10) is greater than or equal to the number of heat pipes in the layer of heat pipes (4). A third heat pipe groove (11) is provided above the middle bottom plate (7), the third heat pipe groove (11) matches the shape of a second layer of heat pipes (5), and the number of the third heat pipe grooves (11) is greater than or equal to the number of heat pipes in the second layer of heat pipes (5).

5. The stacked heat dissipation module according to claim 1, characterized in that: Four heat pipe grooves (12) are provided below the upper base plate (6); the heat pipe grooves (12) match the shape of the second layer of heat pipes (5); and the number of the heat pipe grooves (12) is greater than or equal to the number of heat pipes in the second layer of heat pipes (5).

6. The stacked heat dissipation module according to claim 1, characterized in that: The upper surface of the middle bottom plate (7) matches the lower surface of the upper bottom plate (6), and the lower surface of the middle bottom plate (7) matches the upper surface of the lower bottom plate (8). The upper bottom plate (6), the middle bottom plate (7) and the lower bottom plate (8) are fixedly connected by welding, tight fitting or bonding.

7. The stacked heat dissipation module according to claim 1, characterized in that: The stacked heat pipe (2) is U-shaped and is fixed in the hole of the heat dissipation fin (1). The heat conduction base plate (3) is made of a high heat conduction material. A fan (13) is provided on the side of the heat dissipation fin (1).

8. The stacked heat dissipation module according to claim 1, characterized in that: The width of the first layer of heat pipes (4) is greater than the width of the second layer of heat pipes (5).

9. The stacked heat dissipation module according to claim 1, characterized in that: The number of heat pipes in the first layer of heat pipes (4) is greater than the number of heat pipes in the second layer of heat pipes (5).

Images