Heat insulation device applied to electronic field
By installing a vacuum layer and inert gas-filled thermal insulation cotton in the main body of the laptop, the heat transferred to the C shell and D shell is blocked, and the problem of the comfort of electronic equipment due to heat generation is solved, and effective thermal insulation effect is achieved.
Patent Information
- Application Number
- CN202421955058.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-13
AI Technical Summary
During use, existing electronic devices such as laptops are likely to seriously affect their use comfort due to the heat generated during the system operation.
A heat insulation device applied in the electronics field is designed to block heat transferred to the C shell and D shell by installing a first and second insulation assembly in the main body of the laptop computer using a vacuum layer and an inert gas-filled thermal insulation cotton.
The heat transferred to the C and D shells is effectively isolated, allowing consumers to use their laptops comfortably, and the effective insulation energy reaches above 30°C at an ambient temperature of 25°C.
Smart Images
Figure CN222952658U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic equipment, in particular to a heat insulation device applied to the electronic field. Background Art
[0002] Electronic equipment refers to equipment that is composed of electronic components such as integrated circuits, transistors, and electron tubes, and uses electronic technology (including) software to function. It includes electronic computers and robots controlled by electronic computers, numerical control or program control systems, etc. For common electronic devices such as laptops, the most important thing is the comfort of use.
[0003] As the technological level of laptop computers continues to improve, their performance is also getting higher and higher. High performance has greatly improved the user experience, but high performance has also brought certain disadvantages. The power consumption of laptop computers will continue to increase when running at high performance, resulting in increased heat generation of the computer, making the temperature of the laptop's C shell (the shell with the keyboard side) and D shell (the bottom cover of the laptop) reach above 50°C when the computer is running, far exceeding the comfortable temperature. Without using external devices, the experience of directly using the laptop will be greatly affected, which is not conducive to consumers' comfortable use. How to block the heat to a certain extent so that it will not affect consumers' comfort too much is a problem that needs to be solved in the prior art. In this regard, the present application provides a heat insulation device applied to the electronics field to solve the above problems. Utility Model Content
[0004] 1. Technical issues to be solved
[0005] In view of the deficiencies in the prior art, the utility model provides a heat insulation device applied to the electronic field, which has the advantages of being able to effectively isolate the heat transferred to the C shell and the D shell, allowing consumers to use them comfortably, and solves the problem that the comfort of use of existing electronic devices such as laptops is seriously affected by the heat generated during system operation during use.
[0006] (II) Technical solution
[0007] In order to achieve the above-mentioned purpose of effectively isolating the heat transferred to the C shell and the D shell so that consumers can use the laptop comfortably, the utility model provides the following technical solutions: a heat insulation device applied to the electronic field, applied to a laptop computer main body, the laptop computer main body comprises a laptop main frame, the bottom of the laptop main frame is detachably connected to a laptop bottom shell, the top of the laptop main frame is detachably connected to a laptop iron piece, the bottom of the laptop bottom shell is provided with two groups of ventilation mesh holes, the top of the laptop bottom shell is installed with a first heat insulation component, and the side of the laptop iron piece close to the laptop main frame is installed with a second heat insulation component;
[0008] The first heat insulation component includes a position slot provided on a side of the bottom shell of the notebook close to the main frame of the notebook, and a first heat insulation member detachably connected to the inner side of the position slot;
[0009] The first thermal insulation component includes a first lower cover, a first thermal insulation cotton and a first upper cover; the top of the first lower cover is fixedly connected to the bottom of the first upper cover, and the first thermal insulation cotton is located between the first lower cover and the first upper cover on opposite sides.
[0010] Furthermore, a keyboard module is detachably connected to the top of the notebook iron part, and a keyboard shell located outside the top of the keyboard module is detachably connected to the top of the notebook main frame.
[0011] Furthermore, the second thermal insulation component includes a mounting slot provided on a side of the notebook iron member close to the notebook main frame, and a second thermal insulation member detachably connected to the inner side of the mounting slot and having the same composition structure as the first thermal insulation member.
[0012] Furthermore, a heat dissipation module is integrated and installed inside the main frame of the notebook; the heat dissipation module includes a heat pipe and two heat dissipation fans.
[0013] Furthermore, the two heat dissipation fans correspond to the positions of the two groups of ventilation mesh holes respectively, and the first heat insulation component and the second heat insulation component can be respectively attached to the two sides of the heat dissipation module.
[0014] Furthermore, the first heat insulating member is located between opposite sides of the two groups of ventilation mesh holes, and a vacuum layer is provided between opposite sides of the first lower cover and the first upper cover.
[0015] Furthermore, the first heat insulating cotton is filled inside the vacuum layer, and the interior of the vacuum layer is also filled with an inert gas.
[0016] (III) Beneficial effects
[0017] Compared with the prior art, the utility model provides a heat insulation device applied to the electronic field, which has the following beneficial effects:
[0018] The heat insulation device applied to the electronic field can effectively isolate the heat transferred to the C shell and the D shell through the cooperation between the first heat insulation member and the second heat insulation member, so that consumers can use it comfortably, and the heat transferred from the inside of the notebook computer body can be well blocked. At an ambient temperature of 25°C, the effective heat insulation can reach above 30°C. At the same time, the second heat insulation member can also block the heat transferred to the keyboard module and one side of the keyboard shell, thereby effectively isolating the heat transferred to the C shell and the D shell, so that consumers can use it comfortably. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the structure of the utility model;
[0020] Figure 2 The utility model structure Figure 1 A schematic top view of the connection structure of the bottom shell of a mid-size notebook;
[0021] Figure 3 The utility model structure Figure 2 A bottom view of the connection structure of the iron parts of the middle notebook;
[0022] Figure 4 The utility model structure Figure 2 Schematic diagram of the connection structure of the first thermal insulation component.
[0023] In the figure: 1 notebook main frame, 201 notebook bottom shell, 202 notebook iron parts, 203 keyboard module, 204 keyboard shell, 205 ventilation mesh, 300 first thermal insulation component, 301 position slot, 302 first thermal insulation part, 3021 first lower cover, 3022 first thermal insulation cotton, 3023 first upper cover, 401 installation slot, 402 second thermal insulation part, 5 notebook computer body. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] See also Figures 1 to 4The utility model provides a technical solution: a heat insulation device applied to the electronic field, applied to a notebook computer main body 5, the notebook computer main body 5 includes a notebook main frame 1, the bottom of the notebook main frame 1 is detachably connected with a notebook bottom shell 201, the top of the notebook main frame 1 is detachably connected with a notebook iron piece 202, the bottom of the notebook bottom shell 201 is provided with two groups of ventilation mesh holes 205, the top of the notebook bottom shell 201 is installed with a first heat insulation component 300, and the side of the notebook iron piece 202 close to the notebook main frame 1 is installed with a second heat insulation component; through the coordinated use between the first heat insulation component 302 and the second heat insulation component 402, the heat transferred to the C shell and the D shell can be effectively isolated, so that consumers can use it comfortably, so that the heat transferred inside the notebook computer main body 5 can be well blocked, at an ambient temperature of 25°C, the effective heat insulation can reach above 30°C, and at the same time, the heat transferred to the keyboard module 203 and the keyboard shell 204 can be blocked, so that the heat transferred to the C shell and the D shell can be effectively isolated, so that consumers can use it comfortably.
[0026] It should be noted that the top of the notebook metal part 202 is detachably connected to the keyboard module 203, and the top of the notebook main frame 1 is detachably connected to the keyboard shell 204 located on the top outer side of the keyboard module 203, thereby forming a complete notebook computer.
[0027] In this embodiment, the first heat insulation component 300 is a structure used to block the heat transferred from the inside of the notebook computer to the outside.
[0028] like Figure 1 , Figure 2 and Figure 4 As shown, the first heat insulation component 300 includes a position slot 301 opened on a side of the notebook bottom shell 201 close to the notebook main frame 1, and a first heat insulation member 302 detachably connected to the inner side of the position slot 301;
[0029] The first thermal insulation component 302 includes a first lower cover 3021 , a first thermal insulation cotton 3022 and a first upper cover 3023 ; the top of the first lower cover 3021 is fixedly connected to the bottom of the first upper cover 3023 , and the first thermal insulation cotton 3022 is located between the first lower cover 3021 and the first upper cover 3023 on opposite sides.
[0030] It should be noted that the first thermal insulation member 302 is located between the opposite sides of the two groups of ventilation mesh holes 205, a vacuum layer is provided between the opposite sides of the first lower cover 3021 and the first upper cover 3023, the first thermal insulation cotton 3022 is filled in the interior of the vacuum layer, and the interior of the vacuum layer is also filled with inert gas, the first lower cover 3021 and the first upper cover 3023 are both stainless steel shells, and a certain deformation is produced by stamping, so that a cavity can be formed between the opposite sides after the two are connected together, specifically, the first thermal insulation cotton 3022 is filled between the opposite sides of the first lower cover 3021 and the first upper cover 3023, and the first lower cover 3021 and the first upper cover 3023 are fixed together by welding or the like, and then the space inside the opposite side is vacuumized, and finally inert gas is injected into it, and the thermal insulation properties of the first thermal insulation cotton 3022 and the inert gas are utilized to prevent heat from being effectively transferred vertically, and the thermal conductivity of stainless steel is utilized to allow heat to be dissipated to the surroundings, thereby not affecting the internal heat dissipation effect too much.
[0031] In this embodiment, the second heat insulation component is a structure for blocking the heat transferred to the side close to the keyboard module 203 and the keyboard housing 204 .
[0032] like Figure 3 As shown, the second thermal insulation component includes a mounting slot 401 opened on the side of the notebook iron member 202 close to the notebook main frame 1, and a second thermal insulation member 402 detachably connected to the inner side of the mounting slot 401 and having the same structure as the first thermal insulation member 302.
[0033] It should be noted that a heat dissipation module is integrated on the inner side of the notebook main frame 1; the heat dissipation module includes a heat pipe and two heat dissipation fans, and the two heat dissipation fans correspond to the positions of the two groups of ventilation mesh holes 205 respectively, so that the outside air can be filtered through the ventilation mesh holes 205 and then enter the interior of the notebook computer body 5, wherein an air outlet channel is integrated inside the heat dissipation module and runs through the outer side of the notebook main frame 1, so that the outside air enters the interior of the notebook computer body 5 through the ventilation mesh holes 205 and then is discharged through the air outlet channel, and this is the existing heat dissipation technology of notebook computers, so it will not be elaborated in detail.
[0034] In addition, the first thermal insulation member 302 and the second thermal insulation member 402 can be respectively attached to the two sides of the heat dissipation module, so that the first thermal insulation member 302 and the second thermal insulation member 402 can respectively play a role in heat blocking on both sides of the heat dissipation module. At the same time, the second thermal insulation member 402 corresponds to the position of the chip on the heat dissipation module, that is, the position of the core heating point, so that it can perform targeted heat insulation.
[0035] It should also be noted that the second thermal insulation member 402 has the same composition structure as the first thermal insulation member 302. The second thermal insulation member 402 includes a second lower cover, a second upper cover and a second thermal insulation cotton. The second lower cover and the second upper cover are stainless steel shells. Their connection method and vacuum extraction and inert gas injection processes are the same as the manufacturing method of the first thermal insulation member 302. Only the appearance is different. Therefore, by changing the shape, targeted insulation can be performed on local heat dissipation locations such as chips, so that the thermal insulation device can not only be used in laptops, but also can be applied to other electronic devices through changes in the structure, thus having a very wide range of applications.
[0036] The working principle of the above embodiment is:
[0037] When in use, the first thermal insulation member 302 and the second thermal insulation member 402 are installed at corresponding positions inside the notebook computer body 5. With the cooperation of the first lower cover 3021, the first thermal insulation cotton 3022 and the first upper cover 3023, the heat transferred to the side of the notebook bottom shell 201 can be blocked. Similarly, the second thermal insulation member 402 blocks the heat transferred to the side of the keyboard module 203 and the keyboard shell 204, so that the outer temperature of the notebook computer body 5 will not be too high, so that consumers can use it comfortably.
[0038] Compared with the prior art, the heat insulation device applied to the electronic field can effectively isolate the heat transferred to the C shell and the D shell through the coordinated use of the first heat insulation member 302 and the second heat insulation member 402, so that consumers can use it comfortably, and the heat transferred inside the notebook computer body 5 can be well blocked. At an ambient temperature of 25°C, the effective heat insulation can reach above 30°C. At the same time, the heat transferred to the keyboard module 203 and the keyboard shell 204 can also be blocked by the second heat insulation member 402, thereby effectively isolating the heat transferred to the C shell and the D shell, so that consumers can use it comfortably, solving the problem that the existing electronic equipment such as notebook computers is easily affected by the heat generated during system operation, which seriously affects the comfort of use.
[0039] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0040] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention.
Claims
1. A heat insulation device used in the field of electronics, applied to a notebook computer body (5), characterized in that: The notebook computer body (5) comprises a notebook main frame (1), the bottom of the notebook main frame (1) is detachably connected to a notebook bottom shell (201), the top of the notebook main frame (1) is detachably connected to a notebook metal part (202), the bottom of the notebook bottom shell (201) is provided with two groups of ventilation mesh holes (205), the top of the notebook bottom shell (201) is provided with a first heat insulation component (300), and a second heat insulation component is provided on a side of the notebook metal part (202) close to the notebook main frame (1); The first heat insulation component (300) comprises a position slot (301) provided on a side of the notebook bottom shell (201) close to the notebook main frame (1), and a first heat insulation member (302) detachably connected to the inner side of the position slot (301); The first thermal insulation component (302) comprises a first lower cover (3021), a first thermal insulation cotton (3022) and a first upper cover (3023); the top of the first lower cover (3021) is fixedly connected to the bottom of the first upper cover (3023), and the first thermal insulation cotton (3022) is located between opposite sides of the first lower cover (3021) and the first upper cover (3023).
2. A heat insulation device used in the electronic field according to claim 1, characterized in that: The top of the notebook iron part (202) is detachably connected to a keyboard module (203), and the top of the notebook main frame (1) is detachably connected to a keyboard shell (204) located outside the top of the keyboard module (203).
3. The heat insulation device used in the electronic field according to claim 1, characterized in that: The second thermal insulation component comprises a mounting groove (401) provided on a side of the notebook iron member (202) close to the notebook main frame (1), and a second thermal insulation member (402) detachably connected to the inner side of the mounting groove (401) and having the same structural composition as the first thermal insulation member (302).
4. The heat insulation device used in the electronic field according to claim 3, characterized in that: A heat dissipation module is integrated and installed on the inner side of the notebook main frame (1); the heat dissipation module comprises a heat pipe and two heat dissipation fans.
5. The heat insulation device used in the electronic field according to claim 4, characterized in that: The two heat dissipation fans correspond to the positions of the two groups of ventilation mesh holes (205) respectively, and the first heat insulation component (302) and the second heat insulation component (402) can be respectively attached to the two sides of the heat dissipation module.
6. The heat insulation device used in the electronic field according to claim 1, characterized in that: The first heat insulating member (302) is located between opposite sides of the two groups of ventilation mesh holes (205), and a vacuum layer is provided between opposite sides of the first lower cover (3021) and the first upper cover (3023).
7. The heat insulation device used in the electronic field according to claim 6, characterized in that: The first heat insulating cotton (3022) is filled inside the vacuum layer, and the inside of the vacuum layer is also filled with inert gas.