Novel semiconductor heating plate structure

Abstract

The utility model discloses a novel semiconductor heating disc structure, which relates to the technical field of semiconductor heating discs and comprises a heating disc main body, arc-shaped vertical plates are mounted on the surface of the upper end of the heating disc main body, a semiconductor placing frame is mounted between the two arc-shaped vertical plates, a rectangular groove is formed in the center of the heating disc main body, and the rectangular groove is formed in the upper end of the heating disc main body. A heating lamp tube is connected between the two end walls of the rectangular groove, the semiconductor placing frame can be effectively limited after being overturned to a certain degree by introducing the limiting mechanism, and instability caused by excessive overturning or accidental movement in the using process of the semiconductor placing frame is avoided; the limiting insertion holes are accurately matched with the limiting insertion rods, so that the semiconductor placement frame can be quickly locked when being overturned to a specific position, and shaking or toppling caused by improper operation or external force is prevented; by means of the design, the use stability of the device is improved, potential safety hazards caused by unstable factors are reduced, and the safety of operators is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heating discs, in particular to a novel semiconductor heating disc structure. Background Art

[0002] In existing semiconductor heating equipment, the stability of the semiconductor placement rack is a key issue. Traditional heating equipment often lacks an effective limiting mechanism, which causes the semiconductor placement rack to shake or fall over easily due to improper operation or external force during use. This not only affects the uniformity and efficiency of heating, but may also cause damage to the equipment and even pose a safety hazard to the operator.

[0003] In existing semiconductor heating technology, a significant problem is that after the heating process is completed, the user needs to manually remove the semiconductor element for reverse processing in order to carry out the next round of heating. This operation method is not only cumbersome and increases the labor intensity of the operator, but may also cause heat loss and time waste during the heating process, thereby reducing the overall heating efficiency. In addition, manual operation may also introduce human errors, affecting the uniformity and accuracy of heating;

[0004] Although some semiconductor heating devices on the market are equipped with a flipping mechanism that allows the semiconductor element to automatically flip during the heating process, these flipping mechanisms often have the problem of insufficient stability. During the flipping process, the semiconductor element may shake or shift due to uneven force or mechanism design defects, resulting in uneven heating or equipment damage. This stability problem not only affects the heating effect, but may also shorten the service life of the equipment. For this reason, we provide a new semiconductor heating plate structure. Utility Model Content

[0005] In view of the deficiencies of the prior art, the utility model provides a novel semiconductor heating plate structure, which solves the problems raised by the above-mentioned background technology.

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a novel semiconductor heating plate structure, comprising: a heating plate body, an arc-shaped vertical plate is installed on the upper end surface of the heating plate body, a semiconductor placement rack is installed between two of the arc-shaped vertical plates, a rectangular groove is opened at the center of the heating plate body, a heating lamp is connected between the two end walls of the rectangular groove, and a rotatable and detachable structure is connected between the arc-shaped vertical plate and the semiconductor placement rack;

[0007] The rotatable and detachable structure comprises end fixing plates fixedly mounted on both ends of the semiconductor placement rack, the side of the end fixing plates is provided with a plug-in hole, the opposite surfaces of the two arc-shaped vertical plates are rotatably connected with an axially rotating plug-in rod through a bearing, and one end of the axially rotating plug-in rod is inserted into the inner wall of the plug-in hole;

[0008] A limiting component is connected between the arc-shaped vertical plate and the end fixing plate, and a position adjustment mechanism is connected between the heating plate body and the arc-shaped vertical plate.

[0009] As a further technical solution of the utility model, the limiting component includes a limiting plug hole opened on the side of the end fixing plate, the arc surface of the arc-shaped vertical plate is fixedly installed with an n-type frame, strip through grooves are opened on both sides of the n-type frame, and the inner wall of the strip through groove is slidably connected with a movable sleeve block, and a lap plate is fixedly connected between the two movable sleeve blocks, and a limiting plug rod is fixedly connected to the surface of the lap plate at the arc surface of the arc-shaped vertical plate, and a reset component is connected between the strip through groove and the movable sleeve block.

[0010] As a further technical solution of the utility model, the position adjustment mechanism includes a T-shaped groove opened on the upper end surface of the heating plate body, a T-shaped slider is slidably connected to the inner wall of the T-shaped groove, a T-shaped block is fixedly connected to the upper end surface of the T-shaped slider, and a tightening screw is threadedly connected to the upper end of the T-shaped block.

[0011] As a further technical solution of the utility model, the reset assembly includes a fixed rod fixedly connected between the two end walls of the strip-shaped through slot, a spring is sleeved on the periphery of the fixed rod, and the movable sleeve block is slidably sleeved on the periphery of the fixed rod.

[0012] As a further technical solution of the utility model, one end of the limit rod passes through the arc-shaped vertical plate and is inserted into the inner wall of the limit hole, and the inner diameter of the limit hole is matched with the designed outer diameter of the limit rod.

[0013] As a further technical solution of the utility model, the threaded section of the tightening screw passes through the T-block and is in contact with the upper end surface of the heating plate body to limit the continued sliding of the T-block.

[0014] As a further technical solution of the utility model, one end of the spring is fixedly connected to the end wall of the strip-shaped through groove, and the other end of the spring is fixedly connected to one end surface of the moving sleeve block.

[0015] The utility model provides a novel semiconductor heating plate structure, which has the following beneficial effects compared with the prior art:

[0016] 1. A new type of semiconductor heating plate structure is designed in this invention. By introducing a limit mechanism, the semiconductor placement rack can be effectively restricted after being flipped to a certain degree, thus avoiding the instability caused by excessive flipping or accidental movement during use; the precise coordination between the limit socket and the limit rod ensures that the semiconductor placement rack can be quickly locked when flipped to a specific position, thus preventing shaking or tipping caused by improper operation or external force; this design not only improves the stability of the equipment, but also reduces the potential safety hazards caused by unstable factors, thus ensuring the safety of the operator.

[0017] A new semiconductor heating plate structure is designed in the present invention. By adopting a design that can be easily disassembled, users can easily replace or upgrade it quickly. This modular design not only simplifies the maintenance process, but also provides users with greater flexibility. More importantly, since the semiconductor placement rack can be easily removed and replaced, this embodiment can be used to install semiconductor placement racks of different lengths to meet different heating needs and application scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional schematic diagram of a novel semiconductor heating plate structure;

[0019] Figure 2 It is a schematic diagram of the connection structure of a semiconductor placement frame and an end fixing plate of a new semiconductor heating plate structure;

[0020] Figure 3 It is a schematic diagram of the connection structure of a new type of semiconductor heating plate structure arc-shaped vertical plate and n-shaped frame;

[0021] Figure 4 A new type of semiconductor heating plate structure Figure 1 A magnified view of the structure at center.

[0022] In the figure: 1. Heating plate body; 2. Arc-shaped vertical plate; 3. Semiconductor placement rack; 4. End fixing plate; 5. Plug-in hole; 6. Axial rotation rod; 7. Limiting plug-in hole; 8. N-shaped frame; 9. Strip through groove; 10. Fixed rod; 11. Spring; 12. Moving sleeve block; 13. Overlap plate; 14. Limiting rod; 15. T-shaped slide groove; 16. T-shaped slider; 17. T-shaped block; 18. Tightening screw; 19. Rectangular groove; 20. Heating lamp tube. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-4 , the utility model provides a new semiconductor heating plate structure technical solution:

[0025] like Figure 1-4 As shown, the heating plate body 1 is the cornerstone of the entire structure and is made of high-strength, high-thermal conductivity materials to ensure good thermal conductivity and structural stability. Its upper surface is designed with a precision machined surface for mounting the arc-shaped vertical plate 2 and other auxiliary components. In addition, the rectangular groove 19 opened at the center of the heating plate body 1 provides an installation space for the heating lamp 20 to ensure that the heat can be evenly distributed and efficiently transferred to the semiconductor element; the arc-shaped vertical plate 2 serves as a supporting structure for the semiconductor placement frame 3, and adopts an arc design to better meet the heating requirements of the semiconductor element; the two arc-shaped vertical plates 2 are installed on the heating plate body 1 by a suitable fixing method to form a stable support frame. The semiconductor placement frame 3 is installed between the two arc-shaped vertical plates 2 for placing and fixing semiconductor elements. The plug-in holes 5 opened on the end fixing plates 4 at both ends cooperate with the shaft-turning plug rod 6 to realize the function of rotation and detachability.

[0026] like Figure 1-4 As shown, the rotatable and detachable structure is one of the innovative features of this design; through the cooperation of the axial rotation rod 6 and the plug-in hole 5, the semiconductor placement rack 3 can rotate freely within a certain range, which is convenient for users to adjust the heating angle of the semiconductor components according to actual needs; at the same time, this structure also realizes the function of rapid disassembly and assembly, which greatly simplifies the replacement and maintenance process of semiconductor components; in order to ensure the stability of the semiconductor placement rack 3 during the rotation process, this design also introduces a limiting component. The limiting socket 7 is opened on the side of the end fixing plate 4 and cooperates with the limiting plug 14 slidably connected to the n-type frame 8. By adjusting the position of the limiting plug 14 and inserting it into the limiting socket 7, the rotation range of the semiconductor placement rack 3 can be effectively limited to prevent it from being damaged or affecting the heating effect due to excessive rotation. In addition, the spring 11 and the fixing rod 10 in the reset assembly also ensure that the limiting plug 14 can automatically reset to the initial position when not subject to external force.

[0027] like Figure 1-4As shown, in order to meet the heating requirements of semiconductor components of different sizes and shapes, the present design is also equipped with a position adjustment mechanism. By opening a T-shaped slide groove 15 on the upper surface of the heating plate body 1 and installing a T-shaped slider 16, the user can easily adjust the height and position of the semiconductor placement rack 3. The tightening screw 18 on the T-shaped block 17 is used to fix the position of the T-shaped slider 16 to prevent it from moving or shaking during the heating process.

[0028] The working principle of the utility model is as follows: First, make sure that all parts are complete and intact. Check whether the heating plate body 1, the arc-shaped vertical plate 2, the semiconductor placement rack 3, the shaft-turning plug rod 6, the limit component and the position adjustment mechanism meet the design requirements. At the same time, prepare the required installation tools and auxiliary materials; place the two arc-shaped vertical plates 2 on the upper end surface of the heating plate body 1 according to the preset position. Use bolts or other fixing methods to firmly install the arc-shaped vertical plate 2 on the heating plate body 1. Pay attention to ensure that the spacing and angle between the two arc-shaped vertical plates 2 meet the design requirements; install the shaft-turning plug rod 6 through bearings on the opposite surfaces of the two arc-shaped vertical plates 2. Make sure that the shaft-turning plug rod 6 can rotate freely without obvious jamming. Then, align one end of the shaft-turning plug rod 6 with the plug-in hole 5 on the end fixing plates 4 at both ends of the semiconductor placement rack 3, and gently insert it into it to achieve preliminary connection; place the semiconductor placement rack 3 between the two arc-shaped vertical plates 2, and make the end fixing plates 4 at both ends of the semiconductor placement rack 3 completely aligned with the shaft-turning plug rod 6. Then, the semiconductor placement rack 3 is pushed toward the arc-shaped vertical plate 2 with force, so that the pivot rod 6 is completely inserted into the insertion hole 5.

[0029] The above is only a preferred embodiment of the present invention. It should be noted that, for ordinary technicians in the technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the field unless otherwise specified and limited.

Claims

1. A novel semiconductor heating plate structure, characterized in that: include: A heating plate body (1), wherein an arc-shaped vertical plate (2) is installed on the upper surface of the heating plate body (1), a semiconductor placement rack (3) is installed between two of the arc-shaped vertical plates (2), a rectangular groove (19) is opened at the center of the heating plate body (1), a heating lamp tube (20) is connected between the two end walls of the rectangular groove (19), and a rotatable and detachable structure is connected between the arc-shaped vertical plate (2) and the semiconductor placement rack (3); The rotatable and detachable structure comprises end fixing plates (4) fixedly mounted on both ends of the semiconductor placement frame (3), the side of the end fixing plates (4) being provided with plug holes (5), the opposite surfaces of the two arc-shaped vertical plates (2) being rotatably connected with shaft-rotating plug rods (6) via bearings, and one end of the shaft-rotating plug rod (6) being inserted into the inner wall of the plug hole (5); A limiting component is connected between the arc-shaped vertical plate (2) and the end fixing plate (4), and a position adjustment mechanism is connected between the heating plate body (1) and the arc-shaped vertical plate (2).

2. A novel semiconductor heating plate structure according to claim 1, characterized in that: The limiting component comprises a limiting plug hole (7) provided on the side of the end fixing plate (4); an n-shaped frame (8) is fixedly mounted on the arc surface of the arc-shaped vertical plate (2); strip-shaped through grooves (9) are provided on both sides of the n-shaped frame (8); a movable sleeve block (12) is slidably connected to the inner wall of the strip-shaped through groove (9); a lap plate (13) is fixedly connected between two movable sleeve blocks (12); a limiting plug rod (14) is fixedly connected to the surface of the lap plate (13) at the arc surface relative to the arc-shaped vertical plate (2); and a reset component is connected between the strip-shaped through groove (9) and the movable sleeve block (12).

3. A novel semiconductor heating plate structure according to claim 1, characterized in that: The position adjustment mechanism comprises a T-shaped slide groove (15) provided on the upper end surface of the heating plate body (1), a T-shaped slider (16) being slidably connected to the inner wall of the T-shaped slide groove (15), a T-shaped block (17) being fixedly connected to the upper end surface of the T-shaped slider (16), and a tightening screw (18) being threadedly connected to the upper end of the T-shaped block (17).

4. A novel semiconductor heating plate structure according to claim 2, characterized in that: The reset assembly comprises a fixed rod (10) fixedly connected between the two end walls of the strip-shaped through slot (9), a spring (11) is sleeved on the periphery of the fixed rod (10), and the movable sleeve block (12) is slidably sleeved on the periphery of the fixed rod (10).

5. A novel semiconductor heating plate structure according to claim 2, characterized in that: One end of the limiting plug rod (14) passes through the arc-shaped vertical plate (2) and is inserted into the inner wall of the limiting plug hole (7), and the inner diameter of the limiting plug hole (7) is adapted to the designed outer diameter of the limiting plug rod (14).

6. A novel semiconductor heating plate structure according to claim 3, characterized in that: The threaded section of the tightening screw (18) passes through the T-shaped block (17) and is in contact with the upper end surface of the heating plate body (1), so as to limit the further sliding of the T-shaped slider (16).

7. A novel semiconductor heating plate structure according to claim 4, characterized in that: One end of the spring (11) is fixedly connected to the end wall of the strip-shaped through groove (9), and the other end of the spring (11) is fixedly connected to one end surface of the moving sleeve block (12).

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