Vacuum adsorption jig and chip processing machine

Abstract

The utility model discloses a vacuum adsorption jig and a chip processing machine. The vacuum adsorption jig is used for fixing the chip. The vacuum adsorption jig comprises a carrying table and vacuumizing equipment. The carrying platform is used for carrying the chip. And the vacuumizing equipment is connected with the carrying platform. Wherein the carrying table is provided with a first hole channel, one end of the first hole channel is communicated with the vacuumizing equipment, and the other end of the first hole channel is arranged on the surface, used for carrying the chip, of the carrying table. The chip is adsorbed on the carrying table through the vacuumizing equipment, so that the process of manually fixing the chip on the carrying table in other forms is omitted, the chip fixing efficiency is improved, and the chip production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of chip marking technology, and in particular to a vacuum adsorption fixture and a chip processing machine. Background Art

[0002] Chip processing machines can cut different types of semi-finished chips to achieve chip processing.

[0003] CN112951738A discloses a chip sealing and testing jig, including a substrate and an adhesive film arranged on the surface of the substrate. During the production process, the chip is placed on the jig substrate and fixed in position by the adhesive film. The position accuracy is guaranteed by the placement equipment. The chip sealing and testing jig is compatible with multiple products of different external dimensions. The chip sealing and testing jig of the present invention has a simple structure, is easy to assemble, and has a low processing cost. It replaces the covered turntable of the prior art. There is no need to open or close the cover during the production process, which is conducive to process automation, improves production efficiency, and reduces manufacturing costs.

[0004] However, the jig in the above solution requires manual fixation of the chip on the jig. For semi-automatic production lines, the manually fixed jig affects the efficiency of chip fixation, thereby affecting the chip processing efficiency. Therefore, how to achieve fast chip fixation and improve chip processing efficiency is one of the problems that need to be solved urgently. Utility Model Content

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application embodiment provides a vacuum adsorption fixture and a chip processing machine, which can quickly fix the chip and improve production efficiency.

[0006] A vacuum adsorption fixture according to an embodiment of the first aspect of the present application is used to fix a chip. The vacuum adsorption fixture includes a carrier and a vacuum pumping device. The carrier is used to carry the chip. The vacuum pumping device is connected to the carrier. The carrier is provided with a first channel, one end of which is connected to the vacuum pumping device, and the other end is arranged on the surface of the carrier for carrying the chip.

[0007] A vacuum adsorption fixture in an embodiment of the present application adsorbs the chip onto the carrier through a vacuum pump, omitting the process of manually fixing the chip onto the carrier through other forms, thereby improving the efficiency of chip fixing and thus improving the production efficiency of the chip.

[0008] In some embodiments, the vacuum adsorption fixture includes a dust collector, and the carrier is provided with a second channel, one end of the second channel is connected to the dust collector, and the other end is arranged on the surface of the carrier for carrying the chip.

[0009] In some embodiments, the carrier has a first surface and a second surface in its thickness direction, the first surface is used to contact the chip, the second surface includes a main body and a protrusion, the second channel is arranged in the protrusion, and the first channel is arranged in the main body.

[0010] In some embodiments, there are multiple protrusions, and the multiple protrusions are arranged at intervals along the first direction.

[0011] In some embodiments, the vacuum adsorption jig further includes a cover plate, which is disposed on the second surface and is spaced apart from the main body along the thickness direction of the carrier and is in contact with the protrusion.

[0012] In some embodiments, the vacuum adsorption fixture further includes a first pressing member, and the first pressing member is spaced apart from the carrier in the thickness direction of the carrier, and the first pressing member is used to contact the chip.

[0013] In some embodiments, the vacuum adsorption fixture further includes a second pressing member, which is disposed along the circumference of the carrier, and the second pressing member is used to contact the circumference of the chip.

[0014] In some embodiments, the vacuum adsorption fixture further includes a power member, and an output end of the power member is connected to the first pressing member and the second pressing member.

[0015] In some embodiments, the vacuum adsorption fixture further includes positioning pins, which are disposed on a surface of the carrier for supporting the chip, and the positioning pins are used to fix the chip.

[0016] A chip processing machine according to an embodiment of the second aspect of the present application is used for processing chips, and includes a vacuum adsorption jig as described in any one of the embodiments of the first aspect.

[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0019] Figure 1 This is a schematic diagram of the structure of a vacuum adsorption fixture according to an embodiment of the present application;

[0020] Figure 2 It is a schematic diagram of the second surface of the carrier according to an embodiment of the present application.

[0021] Reference numerals: vacuum adsorption fixture 1;

[0022] The carrier 10, the first hole 11, the second hole 12, the first surface 13, the second surface 14, the main body 141, the protrusion 142;

[0023] Vacuuming equipment 20;

[0024] Dust collector 30;

[0025] A first pressing member 40;

[0026] A second pressing member 50;

[0027] Power member 60;

[0028] Positioning pin 70. DETAILED DESCRIPTION

[0029] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0030] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0033] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0034] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the vacuum adsorption fixture of an embodiment of the present application. Figure 2 Schematic diagram of the second surface of the carrier according to an embodiment of the present application, wherein the main body and the protruding portion are indicated by dashed lines respectively.

[0035] The first embodiment of the present application provides a vacuum adsorption fixture 1 for fixing a chip. The vacuum adsorption fixture 1 includes a carrier 10 and a vacuum pumping device 20. The carrier 10 is used to carry the chip. The vacuum pumping device 20 is connected to the carrier 10. The carrier 10 is provided with a first channel 11, one end of the first channel 11 is connected to the vacuum pumping device 20, and the other end is arranged on the surface of the carrier 10 for carrying the chip.

[0036] In some embodiments, the carrier 10 may be a carrier platform having a carrier plane, and the chip is disposed on the plane. After the chip is fixed on the carrier 10, the chip is cut.

[0037] In some embodiments, the vacuum equipment 20 may be an air extractor or an air pump.

[0038] In some embodiments, the vacuuming device 20 changes the air pressure on the surface of the carrier 10 for carrying the chip by vacuuming the first channel 11 , so that the chip is adsorbed on the surface of the carrier 10 when it is placed on the carrier 10 .

[0039] A vacuum adsorption fixture 1 according to an embodiment of the present application adsorbs a chip onto a carrier 10 through a vacuum pump 20, omitting the process of manually fixing the chip onto the carrier 10 through other forms, thereby improving the efficiency of chip fixing and thus improving chip production efficiency.

[0040] In some embodiments, the vacuum adsorption fixture 1 includes a dust collector 30, and the carrier 10 is provided with a second channel 12, one end of the second channel 12 is connected to the dust collector 30, and the other end is arranged on the surface of the carrier 10 for carrying the chip.

[0041] In some embodiments, the dust collector 30 may have the function of absorbing impurities. For example, the dust collector 30 may be a vacuum cleaner.

[0042] In some embodiments, the dust collector 30 can be connected to the second channel 12. When the chip is cut on the carrier 10, impurities are usually generated. The impurities are sucked away by the dust collector 30, reducing the risk of impurities affecting chip quality and improving chip processing quality.

[0043] In some embodiments, the carrier 10 has a first surface 13 and a second surface 14 in its thickness direction, the first surface 13 is used to contact the chip, the second surface 14 includes a main body 141 and a protrusion 142, the second channel 12 is arranged on the protrusion 142, and the first channel 11 is arranged on the main body 141.

[0044] In some embodiments, the thickness direction of the carrier 10 may be parallel to the direction of gravity.

[0045] In some embodiments, when the chip is disposed on the carrier 10 , the first surface 13 is in contact with the chip.

[0046] In some embodiments, the first channel 11 and the second channel 12 both penetrate the first surface 13 and the second surface 14. The vacuum device 20 is connected to one end of the first channel 11 and the dust collector 30 is connected to one end of the second channel 12.

[0047] In some embodiments, the second surface 14 includes a body portion 141 and a protruding portion 142, wherein the protruding portion 142 protrudes in a direction away from the first surface 13 along the thickness direction of the carrier 10. The body portion 141 is a portion of the second surface 14 that is not protruding.

[0048] In some embodiments, the adsorption power of the dust collector 30 may be greater than the adsorption power of the vacuum device 20 to reduce the risk of impurities entering the first channel 11 and causing the vacuum channel to be blocked.

[0049] In some embodiments, the first channel 11 is located at one end of the second surface 14 and is arranged on the main body 141, and the second channel 12 is located at one end of the second surface 14 and is arranged on the protrusion 142, that is, the first channel 11 and the second channel 12 are arranged separately, thereby reducing the probability of impurities being sucked into the vacuum equipment 20 during dust removal, reducing the risk of the vacuum equipment 20 being blocked and affecting the vacuum adsorption of the chip, and improving the stability of chip fixing.

[0050] In some embodiments, there are multiple protrusions 142 , and the multiple protrusions 142 are spaced apart along the first direction.

[0051] In some embodiments, the second surface 14 only includes a body portion 141 and a protrusion 142. The protrusions 142 are spaced apart along the first direction, that is, the body portions 141 are also multiple, and the body portions 141 and the protrusions 142 are staggered.

[0052] In some embodiments, the first direction may be a horizontal direction, and may be a length direction of the stage 10 or a width direction of the stage 10 .

[0053] In some embodiments, by providing a plurality of protrusions 142, that is, correspondingly providing a plurality of main body portions 141, that is, correspondingly providing a plurality of first channels 11 and second channels 12, the first channels 11 and the second channels 12 are distributed on the second surface 14, thereby improving the dust removal ability and vacuum adsorption ability of the vacuum adsorption fixture 1, and improving the reliability of chip fixing and the quality of the chip.

[0054] In some embodiments, the vacuum adsorption jig 1 further includes a cover plate, which is disposed on the second surface 14 and is spaced apart from the main body 141 along the thickness direction of the carrier 10 and is in contact with the protrusion 142 .

[0055] In some embodiments, the cover plate is disposed on the second surface 14 and is in contact with the surface of the protrusion 142 of the second surface 14 .

[0056] In some embodiments, in the thickness direction of the carrier 10, the cover plate is attached to the surface of the protrusion 142, and a channel can be set at a position corresponding to the second channel 12, and the dust collector 30 is connected to the corresponding channel to achieve the connection between the dust collector 30 and the second channel 12.

[0057] In some embodiments, the cover plate is disposed on the second surface 14, so as to be spaced apart from the main body 141, so that the cover plate and the main body 141 form a cavity that is not connected to the second channel 12. There are multiple main bodies 141, and the multiple main bodies 141 and the cover plate form multiple cavities spaced apart along the first direction. The protrusion 142 may be provided with a channel disposed along the first direction, and the channel may not be connected to the second channel 12, and the channel connects multiple cavities spaced apart along the first direction. The vacuum device 20 may be connected to the channel of one of the multiple protrusions 142, so as to realize vacuuming of the multiple first channels 11, thereby improving the reliability of chip adsorption.

[0058] By providing a cover plate to isolate the first hole 11 and the second hole 12, the risk of the vacuum pumping device 20 being blocked and thus affecting the vacuum adsorption of the chip is further reduced, thereby improving the stability of chip fixation.

[0059] In some embodiments, the vacuum adsorption fixture 1 further includes a first pressing member 40 . The first pressing member 40 is spaced apart from the carrier 10 in the thickness direction of the carrier 10 . The first pressing member 40 is used to contact the chip.

[0060] In some embodiments, when the chip is disposed on the stage 10, one surface of the chip in the thickness direction is in contact with the stage 10, and the other surface is disposed away from the stage 10. The first pressing member 40 is spaced apart from the stage 10 in the thickness direction of the stage 10, and the first pressing member 40 can be disposed above the stage 10.

[0061] In some embodiments, the first pressing member 40 can move along the thickness direction of the carrier 10. Before the chip is placed in the carrier 10, the first pressing member 40 moves upward along the thickness direction of the carrier 10 so that the chip can be placed in the carrier 10. After the chip is placed in the carrier 10, the first pressing member 40 moves downward along the thickness direction of the carrier 10 so that the chip is pressed by the first pressing member 40. After the chip is cut, the first pressing member 40 moves upward along the thickness direction of the carrier 10 so that the chip can leave the carrier 10.

[0062] The first clamping member 40 can contact the surface of the chip facing away from the carrier 10 to fix the position of the chip in the thickness direction of the carrier 10 and reduce the risk of the chip moving along the thickness direction of the carrier 10 and affecting the chip processing quality.

[0063] In some embodiments, the vacuum adsorption fixture 1 further includes a second pressing member 50 , which is disposed along the circumference of the carrier 10 , and the second pressing member 50 is used to contact the circumference of the chip.

[0064] In some embodiments, the chip can be carried by a tray and then adsorbed onto the carrier 10 .

[0065] In some embodiments, the second pressing member 50 is arranged along the circumference of the carrier 10, and the second pressing member 50 can contact the four sides of the tray. For example, multiple pressing members contact the two end faces of the tray in the length direction of the tray, and multiple pressing members contact the two end faces of the tray in the width direction of the tray, so as to limit the chip in the horizontal direction and reduce the risk of the chip moving in the horizontal direction and affecting the chip processing quality.

[0066] Similar to the first pressing member 40 , the second pressing member 50 can move in the horizontal direction, so that the chip can be placed into the carrier 10 , fixed on the carrier 10 , and can leave the carrier 10 .

[0067] In some embodiments, the vacuum adsorption jig 1 further includes a power member 60 , and an output end of the power member 60 is connected to the first pressing member 40 and the second pressing member 50 .

[0068] In some embodiments, the power component 60 may be a cylinder or a motor.

[0069] In some embodiments, the power member 60 may be connected to the first pressing member 40 to drive the first pressing member 40 to move along the thickness direction of the carrier 10 .

[0070] In some embodiments, the power member 60 may be connected to the second pressing member 50 to drive the first pressing member 40 to move in the horizontal direction.

[0071] The first pressing member 40 and the second pressing member 50 are driven to move by the power member 60, thereby improving mechanization and saving manpower.

[0072] In some embodiments, the vacuum adsorption fixture 1 further includes positioning pins 70 , which are disposed on the surface of the carrier 10 for carrying the chip, and the positioning pins 70 are used to fix the chip.

[0073] In some embodiments, after the chip is placed on the carrier 10, the positioning pins 70 lock the chip on the carrier 10. It should be noted that the chip and the carrier 10 have holes that match the positioning pins 70.

[0074] In some embodiments, before the chip is placed on the carrier 10 , the positioning pins 70 are detached from the carrier 10 , so that the chip can be placed on the carrier 10 .

[0075] In some embodiments, after the chip is cut, the positioning pins 70 are detached from the carrier 10 , so that the chip can be separated from the carrier 10 .

[0076] In some embodiments, the locking and separation of the positioning pin 70 and the carrier 10 can be achieved by a robot.

[0077] The positioning pins 70 are provided to lock the chip, thereby completing the fixation of the chip and further improving the reliability of the chip fixation.

[0078] A second embodiment of the present application provides a chip processing machine for processing chips, including a vacuum adsorption jig 1 as in any one of the first embodiment.

[0079] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A vacuum adsorption fixture for fixing a chip, characterized in that: The vacuum adsorption fixture comprises: A carrier, used for carrying the chip; A vacuum pumping device connected to the carrier; The carrier is provided with a first channel, one end of which is connected to the vacuum pumping device, and the other end of which is arranged on the surface of the carrier for carrying the chip.

2. The vacuum adsorption fixture according to claim 1, characterized in that: The vacuum adsorption fixture includes a dust remover, and the carrier is provided with a second channel, one end of the second channel is connected to the dust remover, and the other end is arranged on the surface of the carrier for carrying the chip.

3. The vacuum adsorption fixture according to claim 2, characterized in that: The carrier has a first surface and a second surface in the thickness direction thereof, the first surface is used for contacting the chip, the second surface includes a main body and a protruding portion, the second channel is arranged in the protruding portion, and the first channel is arranged in the main body.

4. The vacuum adsorption fixture according to claim 3, characterized in that: There are multiple protrusions, and the multiple protrusions are arranged at intervals along the first direction.

5. The vacuum adsorption fixture according to claim 3, characterized in that: The vacuum adsorption fixture further includes a cover plate, which is disposed on the second surface and is spaced apart from the main body along the thickness direction of the carrier and is in contact with the protruding portion.

6. The vacuum adsorption fixture according to claim 1, characterized in that: The vacuum adsorption fixture further includes a first pressing member, which is spaced apart from the carrier in the thickness direction of the carrier, and is used to contact the chip.

7. The vacuum adsorption fixture according to claim 6, characterized in that: The vacuum adsorption fixture further includes a second pressing member, which is arranged along the circumference of the carrier and is used to contact the circumference of the chip.

8. The vacuum adsorption fixture according to claim 7, characterized in that: The vacuum adsorption fixture further includes a power member, and an output end of the power member is connected to the first pressing member and the second pressing member.

9. The vacuum adsorption fixture according to claim 1, characterized in that: The vacuum adsorption fixture further includes a positioning pin, which is disposed on a surface of the carrier for carrying the chip, and is used to fix the chip.

10. A chip processing machine for processing chips, characterized in that: It comprises the vacuum adsorption jig as claimed in any one of claims 1 to 9.

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