Wafer level packaging device

Abstract

The utility model discloses a wafer level packaging device, and belongs to the technical field of IC packaging. Comprising a carrier plate supply part, an edge searching part, a resin supply part, a pressing part, a heating part, a carrier plate storage part, a transplanting part, a fixed robot and an electric control part. According to the utility model, the fixed robot is used for sequentially discharging the wafer from the carrier plate supply part and positioning the wafer at the edge searching part, then the wafer is transported to the resin supply part for supplying liquid resin, and after the wafer is moved to the transplanting part, the wafer is transported to the inside of the pressing part through the transplanting part so as to press the liquid resin on the surface of the wafer. And finally, heating hardening and storage are carried out, so that the resin molding of the wafer can be quickly and efficiently completed.

Description

Technical Field

[0001] The utility model relates to a wafer-level packaging device, belonging to the technical field of IC packaging. Background Art

[0002] Wafer Level Packaging (WLP) is an advanced packaging technology that has developed rapidly in recent years due to its advantages such as small size, excellent electrical performance, good heat dissipation and low cost.

[0003] Different from traditional packaging processes, wafer-level packaging is to package the entire carrier as a whole and then cut it into single chips.

[0004] Compared with traditional packaging, wafer-level packaging has the following advantages: no lead frame or substrate is required, no wire bonding is required, no ball planting is required on the substrate, etc.; the packaged chip has a small package size, short communication distance, low process cost, and short production cycle; it can achieve high transmission speed, high-density connection, high electrical and thermal performance of the chip, etc. At present, wafer-level packaging technology has been widely used in flash memory, EEPROM, high-speed DRAM, SRAM, LCD driver, RF device, logic device, power / battery management device and analog device (regulator, temperature sensor, controller, operational amplifier, power amplifier) ​​and other fields.

[0005] However, in actual production processes, traditional wafer packaging devices are relatively inefficient and cannot meet the needs of the growing chip market.

[0006] Therefore, a new solution needs to be proposed to solve this problem. Utility Model Content

[0007] The technical problem to be solved by the utility model is to provide a wafer-level packaging device, which solves the problem that the efficiency of wafer packaging devices in the prior art is relatively low and cannot meet the needs of the growing chip market.

[0008] The technical problem to be solved by the utility model is achieved by adopting the following technical solution: A wafer-level packaging device, comprising:

[0009] The substrate supply unit is used to supply the substrate to be packaged.

[0010] The edge finding part is used to locate and align the carrier board.

[0011] The resin supply unit is used to supply resin on the surface of the carrier board.

[0012] A pressing part for pressing resin in the cavity to perform resin molding on the carrier board,

[0013] The heating part is used to heat and harden the molded carrier plate.

[0014] The carrier plate storage section is used to store the hardened carrier plates.

[0015] The transfer part is arranged at one side of the pressing part, and is used to transport the carrier to the pressing part for resin molding and to remove the molded carrier from the pressing part.

[0016] The fixed robot is fixedly arranged and used to complete the transport of the carrier between the carrier supply part and the edge finding part, the edge finding part and the resin supply part, the resin supply part and the transplanting part, and the transplanting part and the heating part.

[0017] The electronic control unit is used to control the actions of various parts within the device.

[0018] By adopting the above technical solution, a fixed robot sequentially discharges the wafers from the carrier supply part, positions them in the edge finding part, and then transports them to the resin supply part for supplying liquid resin. After being moved to the transfer part, the wafer is transported to the pressing part by the transfer part to press the liquid resin onto the surface of the wafer, and finally heated, hardened and stored, thereby completing the resin molding of the wafer quickly and efficiently.

[0019] Preferably, the fixed robot is a multi-joint robot connected by a plurality of connecting arms and a tray is provided at the end, the plurality of connecting arms are rotatably connected to each other to rotate at any angle along the horizontal direction, and the fixed robot is driven to move up and down by a driving source.

[0020] Preferably, a retaining structure is further provided on the pallet, and the retaining structure is used to retain the carrier plate on the pallet.

[0021] Preferably, a vacuum part is further included, and the vacuum part is connected to the pressing part through a plurality of pipes to adsorb the carrier plate in the pressing part.

[0022] Preferably, the carrier supply part, the edge finding part, the resin supply part, the transplanting part, the heating part and the carrier storage part are arranged along the circumferential direction of the fixed robot.

[0023] Preferably, the transplanting part comprises a feeding track and a bracket sliding on the feeding track, and the bracket is provided with two supporting seats.

[0024] Preferably, the resin supply unit comprises a machine platform, an injection head for injecting resin material is arranged on the machine platform, the injection head can rotate in a horizontal direction, and two storage racks are arranged below the injection head.

[0025] Preferably, an in-and-out press part is also provided between the pressing part and the transplanting part, and the in-and-out press part is used to load the unpackaged carrier into the pressing part and to load the molded carrier out of the pressing part. The pressing part includes a fixed bracket, and a material picking platform is provided on the top of the bracket to slide in the direction toward the pressing part. A plurality of clamps with L-shaped cross-sections are provided at the bottom of the material picking platform, and a plurality of material return grooves are provided on the surface along the central circumference array of the material picking platform, and the top ends of the plurality of clamps slide in the material return grooves. A plurality of sliding cylinders connected to the clamps are also provided on the surface of the material picking platform.

[0026] Preferably, the transplanting part and the in-and-out press part are respectively provided with a first pressing mechanism and a second pressing mechanism for pressing the carrier plate.

[0027] Preferably, the clamping mechanism 1 comprises a slide slidably connected to the feeding track, a pressing plate 1 is slidably connected to the bottom of the slide in a vertical direction, and a lifting driving source for driving the pressing plate 1 to slide is provided on the top of the slide;

[0028] The second clamping mechanism includes a downward pressure cylinder arranged on the feeding platform, and a plurality of guide pillars penetrating the bottom of the feeding platform are fixed to the surface of the feeding platform through a fixed seat, and a second pressure plate is slidably connected to the guide pillars. One end of the downward pressure cylinder penetrates the feeding platform and is connected to the second pressure plate.

[0029] The beneficial effects of the utility model are:

[0030] 1. The fixed robot discharges the carrier from the carrier supply part in sequence, positions it in the edge finding part, and then transports it to the resin supply part for supplying liquid resin. After moving it to the transfer part, the carrier is transported to the pressing part through the transfer part to press the liquid resin on the surface of the carrier, and finally heats, hardens and stores it, so that the resin molding of the carrier can be completed quickly and efficiently.

[0031] 2. The material support seat is used to place the carrier plate, and there are two of them. During the specific work, the fixed robot first sends a carrier plate to a material support seat, and then the bracket slides on the feeding track to the pressing part. After the carrier plate is sent to the pressing part, while waiting for the pressing to be completed, the bracket can return to the starting point to receive the next carrier plate from the fixed robot. After the pressing of the carrier plate in the pressing part is completed, the bracket returns again and receives the pressed carrier plate, and sends the next carrier plate to be pressed to the inside of the pressing part, and then returns to the starting point again and sends the pressed carrier plate into the heating part through the fixed robot, and receives a new carrier plate from the resin supply part, and repeats this process. Compared with the prior art that the transfer part can only transport the carrier plate once, the waiting time of the transfer part during the pressing process of the carrier plate and the resin is reasonably utilized, so that the pressing part can perform the next pressing work in a short time after the pressing is completed, saving the time of the transfer part to transport the carrier plate, thereby further improving the production efficiency of the carrier plate, and greatly improving the output of the carrier plate;

[0032] 3. Two racks are provided to match the number of supporting seats on the transfer part, so that when the injection head injects liquid resin into a carrier placed on the rack, the fixed robot can take the next carrier and place it on another rack. After the injection of resin to one carrier is completed, the next resin can be injected by rotation. After the fixed robot lifts a carrier to the transfer part, it can immediately lift a new carrier to the rack. Compared with the prior art, which needs to wait for the fixed robot to transport the injected carrier to the transfer part, and then lift the new carrier from the edge-finding part to the rack before the injection head can carry out the next injection work, the time for the injection head to inject onto the carrier is reasonably utilized, so that the injection head can immediately carry out the next step of injecting resin after injecting one carrier, thereby further improving the production efficiency of the carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a top view of the utility model;

[0034] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0035] Figure 3 This is a schematic diagram of the structure of a fixed robot in the utility model;

[0036] Figure 4 It is a structural schematic diagram of the transplanting part in the utility model;

[0037] Figure 5 It is a structural schematic diagram of the resin supply part in the utility model;

[0038] Figure 6It is a structural schematic diagram of the pressing part, the inlet and outlet press part and the transplanting part in the utility model;

[0039] Figure 7 This is a schematic diagram of the structure of the compression molding machine in the utility model;

[0040] Figure 8 It is a structural schematic diagram of the inlet and outlet press part of the utility model;

[0041] Fig. 9 It is a side view of the material taking platform in the utility model;

[0042] Fig.10 A top view of a retaining structure in another embodiment of the utility model;

[0043] Fig.11 It is a side view of a retaining structure in another embodiment of the utility model.

[0044] In the figure: 1, carrier supply unit; 101, carrier rack; 2, edge finder; 21, wafer edge finder; 3, resin supply unit; 31, machine table; 32, injection head; 33, rack; 4, pressing unit; 41, molding machine; 42, cavity; 43, suction port; 5, heating unit; 51, PMC oven; 6, carrier storage unit; 61, storage rack; 7, transplanting unit; 71, feeding track; 72, bracket; 73, bracket seat; 8, fixed robot; 81, connecting arm; 82, tray; 83, driving source; 84, base; 85, air port; 86, clamping cylinder; 87. Connecting plate; 88. Clamping block; 881. Slide groove; 89. Bump; 9. Electronic control unit; 10. Vacuum unit; 11. In and out of press unit; 111. Bracket; 112. Material taking platform; 113. Clamping claw; 114. Material return trough; 115. Sliding cylinder; 116. Slide rod; 117. Slide plate; 118. Driving cylinder; 12. Clamping mechanism 1; 121. Slide; 122. Pressing plate 1; 123. Lifting driving source; 13. Clamping mechanism 2; 131. Pressing cylinder; 132. Fixed seat; 133. Guide column; 134. Pressing plate 2; 135. Elastic member. DETAILED DESCRIPTION

[0045] In order to make the technical means, creative features, objectives and effects of the present invention easier to understand, the present invention is further described below in conjunction with specific illustrations.

[0046] like Figure 1 and Figure 2 As shown,

[0047] A wafer-level packaging device, comprising:

[0048] The substrate supply unit 1 is used to supply substrates to be packaged, specifically a substrate rack 101,

[0049] The edge finder 2 is used to position and align the carrier, specifically a wafer edge finder 21.

[0050] The resin supply unit 3 is used to supply resin on the surface of the carrier.

[0051] The pressing part 4 is used to press the resin in the cavity to perform resin molding on the carrier board,

[0052] The heating unit 5 is used to heat and harden the molded carrier plate, specifically a plurality of PMC ovens 51.

[0053] The carrier plate storage part 6 is used to store the hardened carrier plates, specifically a storage rack 61.

[0054] The transfer part 7 is arranged on one side of the pressing part 4 and is used to transport the carrier.

[0055] The fixed robot 8 is fixedly arranged and used to respectively complete the transporting actions of the wafers between the carrier supply part 1 and the edge finding part 2, the edge finding part 2 and the resin supply part 3, the resin supply part 3 and the transplanting part 7, and the transplanting part 7 and the heating part 5.

[0056] The electronic control unit 9 is used to control the actions of various parts in the device.

[0057] The vacuum part 10 is connected to the pressing part 4 through a plurality of pipes to absorb the carrier plate in the pressing part 4 .

[0058] The fixed robot 8 sequentially discharges the carrier from the carrier supply section 1, positions it at the edge finding section 2, and then transports it to the resin supply section 3 for supplying liquid resin. After moving it to the transfer section 7, the carrier is transported to the pressing section 4 by the transfer section 7 to press the liquid resin onto the surface of the carrier, and finally heats, hardens and stores it, thereby completing the resin molding of the wafer quickly and efficiently.

[0059] Among them, Figure 8 As shown, an in-and-out press section 11 is also provided between the pressing section 4 and the transplanting section 7, for loading unpackaged carriers into the pressing section 4 and for loading molded carriers out of the pressing section 4. Specifically, the pressing section 4 includes a fixed bracket 111, a material taking platform 112 is slidably provided on the top of the bracket 111 in a direction toward the pressing section 4, a plurality of clamping jaws 113 with L-shaped cross sections are provided at the bottom of the material taking platform 112, and a plurality of material withdrawal grooves 114 are provided on the surface along the central circumference array of the material taking platform 112, the top ends of the plurality of clamping jaws 113 all slide in the material withdrawal grooves 114, and a plurality of sliding cylinders 115 for connecting with the clamping jaws 113 are also provided on the surface of the material taking platform 112.

[0060] In addition, a slide bar 116 is provided on the bracket 111 , and a slide plate 117 connected to the material taking platform 112 slides on the slide bar 116 , and the slide plate 117 is driven to slide by a driving cylinder 118 .

[0061] When in use, the sliding cylinder 115 is first used to drive the plurality of clamps 113 to move away from each other. Then, when the transplanting portion 7 transports the carrier to the space below the material removal platform 112, that is, between the plurality of clamps 113, the sliding cylinder 115 is used to drive the plurality of clamps 113 to move closer to each other, so that the clamps 113 can clamp the carrier. Then, the driving cylinder 118 is used to drive the slide plate 117 to slide on the slide rod 116, thereby driving the material removal platform 112 to enter the pressing portion 4. Then, the clamps 113 are released to complete the carrier transportation operation.

[0062] like Figure 3 As shown, the fixed robot 8 is a multi-joint robot connected by a plurality of connecting arms 81 and a tray 82 is arranged at the end. The plurality of connecting arms 81 are rotatably connected to each other in the horizontal direction to realize rotation at any angle along the horizontal direction, and the fixed robot 8 is driven to move up and down by a driving source 83. A holding structure is also arranged on the tray, and the holding structure is used to keep the carrier on the tray, wherein the carrier supply part 1, the edge finding part 2, the resin supply part 3, the transplanting part 7, the heating part 5 and the carrier storage part 6 are arranged along the circumferential direction of the fixed robot 8, so as to facilitate the fixed robot 8 to reach the carrier.

[0063] Specifically, the fixed robot 8 includes a base 84, a holding structure that is an air port 85 arranged on the surface of the tray 82 and a vacuum pump (not marked in the figure) arranged in the base and connected to the air port 85, the driving source 83 is a cylinder and is arranged on the base 84, a plurality of connecting arms 81 are rotatably connected at their respective ends in turn, and the connecting arm 81 at the bottom is rotatably connected to the driving source 83, and the driving source is used to drive the connecting arm 81 at the bottom to move up and down, and the tray 82 is arranged on the connecting arm 81 at the top, and after the carrier is placed on the tray 82, the carrier is adsorbed by the vacuum pump (not marked in the figure) and the air port 85.

[0064] like Fig.10 and Fig.11 As shown, in another embodiment, the holding structure includes a clamping cylinder 86 arranged on the bottom surface of the topmost connecting arm 81, and an L-shaped connecting plate 87 is fixed to the output end of the clamping cylinder 86. A clamping block 88 is arranged on the top of the connecting plate 87. A sliding groove 881 is provided on the surface of the tray 82 for the clamping block 88 to pass through and move laterally, and a protrusion 89 is provided at the end of the tray away from the clamping block 88. The opposing surfaces of the clamping block 88 and the protrusion 89 are both concave arcs. In this embodiment, when the carrier is placed on the tray 82, the connecting plate 87 is pushed to move laterally by the clamping cylinder 86, thereby driving the clamping block 88 to move and press against the carrier together with the protrusion 89, so that the carrier cannot be detached from the tray 82.

[0065] The fixed robot 8 arranged above is fixed on the device, and the telescopic length and direction of the tray 82 are adjusted by rotating a number of connecting arms 81 to lift and absorb the carrier. There is no need to rely on the sliding of the slide rail to move to each processing part and then take out the carrier, which greatly improves the transportation efficiency of the carrier, thereby saving the time of carrier packaging and improving the production efficiency of the carrier.

[0066] like Figure 4 As shown, the transplanting part 7 includes a feeding track 71 and a bracket 72 sliding on the feeding track 71 , and two supporting seats 73 are arranged on the bracket 72 .

[0067] Among them, the support seat 73 is used to place the carrier and there are two of them. During the specific operation, the fixed robot 8 first sends a carrier to a support seat 73, and then the bracket 72 slides on the feeding track 71 to the pressing part 4. After the carrier is sent into the pressing part 4, while waiting for the pressing to be completed, the bracket 72 can return to the starting point to receive the next carrier from the fixed robot 8. After the carrier located in the pressing part 4 is pressed, the bracket 72 returns again and receives the pressed carrier, and sends the next carrier to be pressed to the pressing part 4, and then returns to the starting point again and sends the laminated carrier into the heating part 5 through the fixed robot 8, and receives a new carrier from the resin supply part 3, and repeats this process. Compared with the prior art in which the transfer part 7 can only transport the carrier once, the waiting time of the transfer part 7 during the lamination process is reasonably utilized, so that the lamination part 4 can carry out the next lamination work in a short time after the lamination is completed, which saves the time of the transfer part 7 transporting the carrier, thereby further improving the production efficiency of the carrier and greatly improving the output of the carrier.

[0068] In addition, if Figure 4 and Fig. 9 As shown, the transplanting part 7 and the in-and-out press part 11 are respectively provided with a clamping mechanism 12 and a clamping mechanism 2 13, so that the carrier can be pressed against the bonding surface during the process of loading and unloading the carrier, thereby avoiding large warping of the unpackaged carrier and the packaged carrier, reducing the production of defective products and improving product quality.

[0069] Specifically, the clamping mechanism 12 includes a slide 121 that slides independently on the feeding track 71, a pressing plate 122 slides vertically at the bottom of the slide 121, and a lifting drive source 123 for driving the pressing plate 122 to slide is provided on the top of the slide 121. In this embodiment, the lifting drive source 123 is a cylinder. In specific use, when the feeding track 71 is feeding materials in and out of the press part 11, the lifting drive source 123 drives the pressing plate 122 to slide downward, so that the pressing plate 122 can be closely attached to the carrier, thereby preventing the carrier from warping during the feeding process.

[0070] The clamping mechanism 13 includes a downward pressure cylinder 131 disposed on the material-retrieving platform 112. A plurality of guide posts 133 penetrating the bottom of the material-retrieving platform 112 are fixed to the surface of the material-retrieving platform 112 through a fixing seat 132. A second pressing plate 134 slides on the guide post 133. One end of the downward pressure cylinder 131 penetrates the material-retrieving platform 112 and is connected to the second pressing plate 134. The second pressing plate 134 is driven to slide downward by the downward pressure cylinder 131, so that after the clamping claw 113 clamps the carrier plate, the second pressing plate 134 can be attached to the surface of the carrier plate, thereby preventing the carrier plate from warping during the process of entering the pressing part 4.

[0071] In addition, an elastic member 135 is sleeved on one end of the guide column 133 between the material taking platform 112 and the second pressing plate 134. The setting of the elastic member 135 can effectively control the pressure exerted on the carrier by the second pressing plate 134, thereby avoiding damage to the carrier.

[0072] It should be noted that when the carrier is placed on the support seat 73, that is, when the new carrier is transported by the feed track 71 to the bottom of the pick-up table 112, or when the molded carrier is transported from the bottom of the pick-up table 112 to one end of the feed track 71 for grasping by the fixed robot 8, or after the carrier is clamped by the clamp 113, that is, when the new carrier is transported by the feed table to the inside of the pressing part 4, or when the molded carrier is transported by the pick-up table 112 out of the pressing part 4, the pressure plate 1 122 and the pressure plate 2 134 will press down on the carrier to avoid warping of the carrier.

[0073] like Figure 5 As shown, the resin supply unit 3 includes a machine platform 31 , on which an injection head 32 for injecting resin material is disposed. The injection head 32 can rotate in a horizontal direction, and two storage racks 33 are disposed below the injection head 32 .

[0074] The number of racks 33 is two to match the number of support seats 73 on the transfer section 7, so that in the process of the injection head 32 injecting liquid resin into a carrier placed on the rack 33, the fixed robot 8 can take the next carrier and place it on another rack 33. After the injection of resin to one carrier is completed, the next resin can be injected by rotation. After the fixed robot 8 lifts a carrier to the transfer section 7, it can immediately lift a new carrier to the rack 33. Compared with the prior art, which needs to wait for the fixed robot 8 to transport the injected carrier to the transfer section 7, and then lift the new carrier from the edge-finding section 2 to the rack 33 before the injection head 32 can perform the next injection work, the time for the injection head 32 to inject onto the carrier is reasonably utilized, so that the injection head 32 can immediately perform the next step of injecting resin after injecting one carrier, thereby further improving the production efficiency of the carrier.

[0075] like Figure 6 and Figure 7 As shown, the pressing part 4 includes a die pressing machine 41 , a cavity is arranged inside the die pressing machine 41 , and a plurality of suction ports connected with the vacuum part 10 are arranged in the cavity.

[0076] Workflow:

[0077] Step 1: The processed carrier is transported to the carrier rack 101, and then transported to the carrier edge finder 21 by the fixed robot 8 for scanning and edge finding. The fixed robot 8 fixes the carrier by vacuum adsorption or clamping by the clamping cylinder 86, which will not be described in detail later.

[0078] Step 2: The fixed robot 8 takes the carrier from the carrier edge finder 21 and transfers it to the rack 33 of the resin supply unit 3. When the injection head 32 injects liquid resin into the carrier, the fixed robot 8 returns to the carrier edge finder 21 to take the next carrier and place it on another rack 33.

[0079] Step 31, the fixed robot 8 transfers the injected carrier to the support seat 73 of the transfer part 7, and the injection head 32 rotates to start injecting another carrier. When the bracket 72 slides on the feed track 71, the slide 121 slides together with it, and the lifting drive source 123 also presses down the pressure plate 122, so that the pressure plate 122 is pressed against the surface of the carrier and slides on the feed track 71 with the carrier;

[0080] Step 32, first drive the plurality of clamps 113 away from each other through the sliding cylinder 115, then when the transplanting unit 7 transports the carrier to the space below the material-retrieving platform 112, that is, between the plurality of clamps 113, the lifting drive source 123 drives the pressing plate 122 to rise, and the independently sliding slide 121 randomly leaves the space below the material-retrieving platform 112, and then drives the plurality of clamps 113 to approach each other through the sliding cylinder 115, so that the clamps 113 can clamp the carrier, and then drives the pressing plate 2 134 to slide downward through the pressing cylinder 131, so that the clamps 113 clamp the carrier. After the plate is loaded, the second pressing plate 134 can be attached to the surface of the carrier plate, and then the driving cylinder 118 drives the slide plate 117 to slide on the slide rod 116, so as to drive the material taking platform 112 to enter the surface of the cavity 42 of the die pressing machine 41. At this time, the vacuum part 10 adsorbs the carrier plate through the adsorption port 43, and the in-and-out press part 11 drives the clamping claw 113 to slide in the material withdrawal groove 114 in the opposite direction through the sliding cylinder 115, thereby releasing the clamping claw 113, and the second pressing plate 134 rises accordingly and slides in the opposite direction under the drive of the driving cylinder 118, and the material taking platform 112 exits the die pressing machine 41 accordingly;

[0081] Step 33, during the process of the pressing machine 41 pressing the carrier plate and the resin, the bracket 72 returns to the origin, the fixed robot 8 first transfers the carrier plate from the carrier frame 101 to the carrier plate edge finder 21, and then transfers the new carrier plate that has completed edge finding from the carrier plate edge finder 21 to the storage rack 33, and holds up the new injected carrier plate, the injection head 32 starts to inject the new carrier plate, and then the fixed robot 8 places the injected carrier plate on the support seat 73;

[0082] Step 34, after the die-casting machine 41 completes the lamination, the bracket 72 with the newly injected carrier slides to the material-removing platform 112 until the empty carrier seat 73 is directly opposite to the bottom of the material-removing platform 112, and the pressure plate 122 will simultaneously press down the carrier during the movement of the carrier, and then the material-removing platform 112 is driven into the die-casting machine 41 by the driving cylinder 118, the clamping jaws 113 clamp the carrier and retreat through the material-removing platform 112 to remove the laminated carrier, and when the material-removing platform 112 retreats, the pressure plate 2 134 will continue to press down the carrier, and then the carrier is placed on the empty carrier seat 73, and then the bracket 72 retreats slightly, so that the carrier seat 73 with the carrier placed is directly opposite to the bottom of the material-removing platform 112, and then the new carrier is placed into the die-casting machine 41 through the clamping jaws 113 and the material-removing platform 112, and the die-casting machine 41 continues to lamination;

[0083] Step 35, the bracket 72 with the pressed carrier returns to its original position, the fixed robot 8 puts the pressed carrier into the heating part 5-PMC oven 51, then performs step 1 and transfers the new carrier from the carrier edge finder 21 to the rack 33, and lifts the new injected carrier, the injection head 32 starts to inject the new carrier, and the fixed robot 8 places the injected carrier on the support seat 73, after the molding machine completes the pressing, the bracket 72 with the new injected carrier slides to the bottom of the material taking platform, takes out the pressed carrier through the material taking platform 112 and places it on the empty support seat 73, and puts the new carrier into the molding machine 41, and the molding machine 41 continues to press;

[0084] Step 36, the bracket 72 returns to its original position, and the fixed robot 8 puts the laminated carrier into the heating section 5, and transfers the wafer baked in the heating section 5 to the storage rack 61;

[0085] Step 4. Repeat the above steps.

[0086] The wafer packaging production can be carried out quickly and efficiently, which improves production efficiency and greatly increases output.

[0087] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited to the above embodiments. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of protection claimed by the utility model. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer-level packaging device, characterized in that: include: The substrate supply unit (1) is used to supply the substrate to be packaged. The edge finding part (2) is used to position and align the carrier board. The resin supply unit (3) is used to supply resin on the surface of the carrier plate. A pressing part (4) is used to press resin in the cavity to perform resin molding on the carrier. The heating part (5) is used to heat and harden the molded carrier plate. The carrier plate storage part (6) is used to store the hardened carrier plate. The transfer part (7) is arranged at one side of the pressing part (4) and is used to transport the carrier to the pressing part (4) for resin molding and to remove the molded carrier from the pressing part (4). The fixed robot (8) is fixedly arranged and is used to respectively complete the transporting action of the carrier between the carrier supply part (1) and the edge finding part (2), the edge finding part (2) and the resin supply part (3), the resin supply part (3) and the transplanting part (7), and the transplanting part (7) and the heating part (5), The electric control unit (9) is used to control the actions of various parts in the device.

2. The wafer-level packaging device according to claim 1, characterized in that: The fixed robot (8) is a multi-joint robot connected by a plurality of connecting arms (81) and a tray (82) is arranged at the end thereof. The plurality of connecting arms (81) are rotatably connected to each other so as to rotate at any angle along the horizontal direction, and the fixed robot (8) is driven to move up and down by a driving source (83).

3. The wafer-level packaging device according to claim 2, characterized in that: The tray (82) is also provided with a retaining structure, and the retaining structure is used to retain the carrier plate on the tray (82).

4. The wafer-level packaging device according to claim 1, characterized in that: It also comprises a vacuum part (10), wherein the vacuum part (10) is connected to the pressing part (4) through a plurality of pipes so as to absorb the carrier plate located in the pressing part (4).

5. The wafer-level packaging device according to claim 1, characterized in that: The carrier plate supply part (1), the edge finding part (2), the resin supply part (3), the transplanting part (7), the heating part (5) and the carrier plate storage part (6) are arranged along the circumferential direction of the fixed robot (8).

6. The wafer-level packaging device according to claim 1, characterized in that: The transplanting part (7) comprises a feeding track (71) and a bracket (72) sliding on the feeding track (71), and two supporting seats (73) are arranged on the bracket (72).

7. The wafer-level packaging device according to claim 1, characterized in that: The resin supply unit (3) comprises a machine platform (31), on which an injection head (32) for injecting resin material is arranged, the injection head (32) being used to rotate in a horizontal direction, and two storage racks (33) being arranged below the injection head (32).

8. The wafer-level packaging device according to claim 1, characterized in that: An in-and-out press section (11) is also provided between the pressing section (4) and the transplanting section (7), and the in-and-out press section (11) is used to load an unpackaged carrier into the pressing section (4) and to load a molded carrier out of the pressing section (4). The pressing section (4) comprises a fixed bracket (111), and a material taking platform (112) is provided on the top of the bracket (111) to slide in a direction toward the pressing section (4). A plurality of clamping jaws (113) with an L-shaped cross section are provided at the bottom of the material taking platform (112), and a plurality of material return grooves (114) are provided on the surface along the central circumference of the material taking platform (112), and the top ends of the plurality of clamping jaws (113) all slide in the material return grooves (114). A plurality of sliding cylinders (115) connected to the clamping jaws (113) are also provided on the surface of the material taking platform (112).

9. The wafer-level packaging device according to claim 8, characterized in that: The transplanting part and the in-and-out press part (11) are respectively provided with a first pressing mechanism (12) and a second pressing mechanism (13) for pressing the carrier plate.

10. The wafer-level packaging device according to claim 9, characterized in that: The clamping mechanism (12) comprises a slide (121) slidably connected to the feed track (71), the bottom of the slide (121) is slidably connected to a pressing plate (122) in a vertical direction, and the top of the slide (121) is provided with a lifting drive source (123) for driving the pressing plate (122) to slide; The second clamping mechanism (13) comprises a downward pressing cylinder (131) arranged on the material taking platform (112); a plurality of guide pillars (133) penetrating the bottom of the material taking platform (112) are fixed on the surface of the material taking platform (112) through a fixing seat (132); a second pressing plate (134) is slidably connected to the guide pillars (133); one end of the downward pressing cylinder (131) penetrates the material taking platform (112) and is connected to the second pressing plate (134).

Images