Turnover type cleaning device for semiconductor wafer

Abstract

The utility model discloses a semiconductor wafer turnover type cleaning device, which relates to the technical field of semiconductor wafer turnover type cleaning, and comprises a cleaning device main body, a feed tray, a nozzle and a jacking piece, a protective cover is arranged on the cleaning device main body, the feed tray is sleeved in the protective cover, the feed tray is spiral, a discharge port and a feed port are arranged on the feed tray, and the nozzle is arranged on the feed port. The top of the feeding port abuts against the feeding rails, connecting pieces are arranged at the ends of the feeding rails and used for connecting the multiple feeding rails to prolong the feeding distance, nozzles are arranged on the inner wall of the feeding disc and connected to the base through liquid conveying pipes and fixing frames, and the inner wall of the inner ring of the feeding disc makes contact with the side face of the jacking piece. According to the utility model, the jacking pieces are arranged at the bottom of the spiral feeding disc, so that the wafers are turned over by the jacking pieces which are continuously jacked in the spiral conveying process, more surfaces to be cleaned are provided, the cleaning is more thorough, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer flipping type cleaning, in particular to a semiconductor wafer flipping type cleaning device. Background Art

[0002] The semiconductor wafer flip cleaning device is a necessary operation for the wafer before leaving the factory. It cleans the dust on the surface of the wafer to ensure that the surface of the wafer is bright and clean, which is convenient for later lamination or installation. Traditional cleaning devices can only clean one side of the wafer. If two or more sides need to be cleaned, manual intervention or semi-automatic flipping is required, which has low cleaning efficiency and prolonged working time.

[0003] The existing semiconductor wafer flip-type cleaning device has low cleaning efficiency and can often only clean one side. For example, the semiconductor wafer cleaning device disclosed in publication number CN203862609U includes an overflow cleaning tank, the overflow cleaning tank has a water inlet and a water outlet, and also includes a hollow panel located in the overflow cleaning tank, the hollow panel has a first air inlet and a plurality of evenly distributed air outlets, and a gas pipeline connected to the first air inlet and passing gas into the first air inlet. The gas introduced into the hollow panel is discharged into the pure water in the overflow cleaning tank through multiple evenly distributed air outlets of the hollow panel, so that the wafer is fully stirred during overflow cleaning, and the impurities on the wafer can be dissolved in the pure water as quickly as possible and flow away with the pure water, thereby shortening the cleaning time and saving the amount of pure water. At the same time, nitrogen is introduced into the pure water, so that a nitrogen protective film is formed on the surface of the pure water, which plays a role of nitrogen sealing, quickly improves the water resistance of the pure water, further shortens the cleaning time, and saves the amount of pure water. However, the wafer can only be cleaned on one side and cannot be turned over multiple times. The all-round cleaning of multiple sides has a poor cleaning effect.

[0004] Therefore, it is necessary to invent a semiconductor wafer flip cleaning device to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a semiconductor wafer flip cleaning device to solve the problems of low cleaning efficiency, single and incomplete cleaning surface of the semiconductor wafer flip cleaning device in the art.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer flip-type cleaning device, comprising a cleaning device body, a feeding tray, a nozzle and a lifting member, a protective cover is installed on the cleaning device body, a feeding tray is arranged inside the protective cover, the feeding tray is spiral-shaped, a discharge port and a feeding port are installed on the feeding tray, the top of the feeding port is in conflict with the feeding track, a connecting piece is arranged at the end of the feeding track, the connecting piece is used to connect multiple feeding tracks to extend the feeding distance, a nozzle is arranged on the inner wall of the feeding tray, the nozzle is connected to the base through an infusion tube and a fixing frame, and the inner wall of the inner ring of the feeding tray is in contact with the side of the lifting member.

[0007] Preferably, the lifting member is disc-shaped and has openings evenly spaced apart with equal distances between the openings, and the top of the lifting member can contact the protruding portion of the wafer body transported in the feeding tray.

[0008] Preferably, a cylinder and a liquid sealing chamber are arranged in the base, the cylinder supplies energy to the lifting member, and the liquid sealing chamber is filled with two-thirds of the volume of the cleaning liquid.

[0009] Preferably, the liquid sealing chamber is semicircular, and the liquid sealing chamber is connected to the infusion tube.

[0010] Preferably, the fixing frame is hollow inside, and the cleaning liquid is transported inside the fixing frame, and the fixing frame can transport in multiple directions.

[0011] Preferably, a plurality of nozzles are provided, and the plurality of nozzles are respectively installed on the edge of the top of the feeding tray, and the nozzles are inclined at 45 degrees to spray the cleaning liquid downward.

[0012] Preferably, the lifting member can rise to a maximum height that is flush with the innermost circle height of the feeding tray, and the diameter of the lifting member is consistent with the innermost circle diameter of the feeding tray.

[0013] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0014] 1. The utility model arranges a lifting member at the bottom of the spiral feeding tray, so that the wafer is turned over by the lifting member during the spiral conveying process, so that more surfaces are cleaned, the cleaning is more thorough, and the cleaning efficiency is improved;

[0015] 2. The utility model installs a fixing frame and multiple nozzles on the spiral feeding tray, so that the multiple nozzles can evenly spray the cleaning liquid downward, and the wafers in the spiral feeding tray are evenly sprayed with the cleaning liquid for cleaning, and the spiral conveying can effectively increase the exposed area of ​​the wafers and increase the cleaning area. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the protective cover of the utility model;

[0018] Figure 3 It is a three-dimensional structural schematic diagram of the nozzle of the utility model;

[0019] Figure 4 It is a three-dimensional structural schematic diagram of the jacking member of the utility model;

[0020] Figure 5 It is a schematic diagram of the internal structure of the base of the utility model.

[0021] Description of reference numerals:

[0022] 1. Cleaning device body; 2. Protective cover; 3. Feed tray; 4. Discharge port; 5. Feed track; 6. Feed port; 7. Connector; 8. Base; 801. Cylinder; 802. Liquid sealing chamber; 9. Infusion tube; 10. Fixed bracket; 11. Nozzle; 12. Lifting piece. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] The utility model provides Figure 1-3 A semiconductor wafer flip cleaning device shown in the figure comprises a cleaning device body 1, a feeding tray 3, a nozzle 11 and a lifting member 12. A protective cover 2 is installed on the cleaning device body 1, and a feeding tray 3 is sleeved in the protective cover 2. The feeding tray 3 is spiral-shaped, and an outlet 4 and a feeding port 6 are installed on the feeding tray 3. The top of the feeding port 6 is in conflict with the feeding track 5. A connecting member 7 is provided at the end of the feeding track 5. The connecting member 7 is used to connect multiple feeding tracks 5 to extend the feeding distance. A nozzle 11 is provided on the inner wall of the feeding tray 3. The nozzle 11 is connected to the base 8 through an infusion tube 9 and a fixing frame 10. The inner wall of the inner ring of the feeding tray 3 contacts the side of the lifting member 12. The lifting member 12 is disc-shaped and has openings evenly arranged. The distances between the openings are equal, and the top of the lifting member 12 can contact the protruding part of the wafer body transported in the feeding tray 3.

[0025] Batches of wafers are conveyed to the inner diameter of the feeding tray 3, flipped during the continuous lifting process of the lifting member 12, and cleaned by the cleaning liquid sprayed by multiple nozzles 11. The whole process is intelligent, no human intervention is required, and the cleaning area is large, the cleaning efficiency is high, and the effect is good.

[0026] A cylinder 801 and a liquid sealed chamber 802 are arranged in the base 8. The cylinder 801 supplies energy to the lifting member 12. The liquid sealed chamber 802 is filled with two-thirds of the volume of the cleaning liquid. The liquid sealed chamber 802 is semicircular and is connected to the infusion tube 9. The fixed frame 10 is hollow and the cleaning liquid is transported in the fixed frame 10. The fixed frame 10 can transport in multiple directions.

[0027] The cleaning liquid stored in the base 8 can provide a continuous cleaning power for multiple infusion tubes 9, continuously spraying the cleaning liquid on the batches of wafers in 3, and cooperating with the continuous lifting of the lifting member 12 to flip the wafers, thereby increasing the cleaning area and efficiency.

[0028] There are multiple nozzles 11, which are respectively installed on the edge of the top of the feeding tray 3. The nozzles 11 are inclined at 45 degrees to spray the cleaning liquid downward. The lifting member 12 can rise to a maximum height that is flush with the innermost circle height of the feeding tray 3, and the diameter of the lifting member 12 is consistent with the innermost circle diameter of the feeding tray 3.

[0029] The wafer sprayed by the nozzle 11 cooperates with the continuously lifting lifting member 12, so that the wafers spirally conveyed in the feeding tray 3 are turned over and cleaned at the same time, and multiple surfaces are cleaned to increase the cleaning area.

[0030] Working principle of this utility model:

[0031] Refer to the instruction manual Figure 1-3 When using the utility model, the wafer to be cleaned is first transported toward the feeding port 6 through the feeding track 5, and then transported to the spiral feeding tray 3 by the feeding port 6, and then transported out from the discharge port 4, and the cleaning in the feeding tray 3 is completed;

[0032] Refer to the instruction manual Figure 3-5 When the utility model is used, the liquid in the liquid sealing chamber 802 is transported to the multiple nozzles 11, and is sprayed out from the multiple nozzles 11, and the wafers that are continuously transported to the discharge port 4 are cleaned in the feeding tray 3;

[0033] At the same time, the cylinder 801 drives the lifting member 12 to continuously lift up. During the lifting process, the side of the wafer being continuously transported is contacted and turned over during the transportation in the feeding tray 3, so that it is cleaned more thoroughly, and the entire cleaning device body 1 has strong functionality.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer flip cleaning device, characterized in that: The cleaning device comprises a cleaning device body (1), a feeding tray (3), a nozzle (11) and a lifting member (12). The cleaning device body (1) is provided with a protective cover (2), the feeding tray (3) is sleeved in the protective cover (2), the feeding tray (3) is spiral-shaped, a discharge port (4) and a feeding port (6) are provided on the feeding tray (3), the top of the feeding port (6) contacts with a feeding track (5), a connecting member (7) is provided at the end of the feeding track (5), the connecting member (7) is used to connect a plurality of feeding tracks (5) to extend the feeding distance, a nozzle (11) is provided on the inner wall of the feeding tray (3), the nozzle (11) is connected to a base (8) through an infusion tube (9) and a fixing frame (10), and the inner wall of the inner ring of the feeding tray (3) contacts with the side of the lifting member (12).

2. The semiconductor wafer flip cleaning device according to claim 1, characterized in that: The lifting member (12) is disc-shaped and has evenly spaced openings, with the distances between the openings being equal, and the top of the lifting member (12) can contact the protruding portion of the wafer body transported in the feeding tray (3).

3. The semiconductor wafer flip cleaning device according to claim 1, characterized in that: An air cylinder (801) and a liquid sealing chamber (802) are arranged in the base (8); the air cylinder (801) supplies energy to the lifting member (12); and the liquid sealing chamber (802) is filled with two-thirds of the volume of cleaning liquid.

4. The semiconductor wafer flip cleaning device according to claim 3, characterized in that: The liquid sealing chamber (802) is semicircular, and the liquid sealing chamber (802) is connected to the infusion tube (9).

5. The semiconductor wafer flip cleaning device according to claim 1, characterized in that: The interior of the fixed frame (10) is hollow, and the interior of the fixed frame (10) is used for conveying cleaning liquid, and the fixed frame (10) can convey cleaning liquid in multiple directions.

6. The semiconductor wafer flip cleaning device according to claim 1, characterized in that: A plurality of nozzles (11) are provided, and the plurality of nozzles (11) are respectively mounted on the edge of the top of the feeding tray (3), and the nozzles (11) are tilted at 45 degrees to spray the cleaning liquid downward.

7. The semiconductor wafer flip cleaning device according to claim 2, characterized in that: The lifting member (12) can rise to a maximum height that is flush with the innermost circle height of the feeding tray (3), and the diameter of the lifting member (12) matches the innermost circle diameter of the feeding tray (3).

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