Crystal grain wobble plate equipment for processing diode crystal

Abstract

The utility model relates to the technical field of semiconductor components, and discloses a crystal grain wobble plate device for processing diode crystals, which comprises a base, a support plate is fixedly connected onto the base, a vibration motor is fixedly mounted on the support plate, an output end of the vibration motor is fixedly connected with an arc-shaped cam, and the arc-shaped cam is fixedly connected with the base. An arc-shaped connecting head is connected to the arc-shaped cam in an attached mode, a connecting plate is fixedly connected to the arc-shaped connecting head, a guide rod is fixedly connected to the connecting plate, and a base plate is fixedly connected to one end of the guide rod. According to the utility model, the arc-shaped cam driven by the vibration motor is combined with the spring system, so that the uniform and controllable back-and-forth shaking of the substrate is realized, the redistribution of crystal grains on the core disc is facilitated by the shaking, the crystal grains can be ensured to fall into the crystal grain holes in the optimal posture, and as the shaking is uniform and predictable, the accuracy of the crystal grains is improved. Therefore, the precision and the consistency of crystal grain positioning can be remarkably improved, and the packaging quality of the glass-sealed diode is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor components, in particular to a crystal grain rocking plate device for processing diode crystals. Background Art

[0002] Among semiconductor components, glass-encapsulated diodes, also known as glass-sealed diodes, are a widely used switching diode device. During the assembly process of glass-encapsulated diodes, due to the small size of the grains, a shaking plate is required to vibrate the grains into each grain hole to facilitate the staff to load them into each glass shell.

[0003] However, firstly, during the vibration screening process, the chip is easy to slip off the edge of the core disk, thus causing waste. Secondly, it is impossible to adjust and clamp the core disks of different sizes. Therefore, a crystal shaking disk device for processing diode crystals is proposed. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a crystal grain shaking device for processing diode crystals.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a crystal rocking device for processing diode crystals, comprising a base, a support plate fixedly connected to the base, a vibration motor fixedly installed on the support plate, an arc cam fixedly connected to the output end of the vibration motor, an arc connector fittedly connected to the arc cam, a connecting plate fixedly connected to the arc connector, a guide rod fixedly connected to the connecting plate, one end of the guide rod fixedly connected to a substrate, the guide rod slides on the base, a spring is sleeved on the guide rod, and the two ends of the spring are respectively fixedly connected to the substrate and the base.

[0006] As a further description of the above technical solution:

[0007] The base is fixedly connected with a connecting seat, a rotating motor is fixedly installed on the connecting seat, a transmission shaft is fixedly connected with the output end of the rotating motor, a driving worm is fixedly connected with the transmission shaft, a driven worm wheel is meshedly connected with the driving worm, a threaded rod is fixedly connected with the driven worm wheel, a threaded sleeve is threadedly connected with the threaded rod, and a clamp is fixedly connected with the threaded sleeve.

[0008] As a further description of the above technical solution:

[0009] The substrate is provided with a core disk, and the core disk is provided with crystal grain holes. The crystal grain holes are provided in multiple groups and are evenly distributed on the core disk.

[0010] As a further description of the above technical solution:

[0011] The springs are provided in multiple groups and are evenly distributed between the base and the substrate, and the connecting plates and the guide rods are provided in multiple groups and are symmetrically distributed on both sides of the base.

[0012] As a further description of the above technical solution:

[0013] The connecting seat is located at the bottom of the base, and the transmission shaft and the threaded rod are both rotated in the connecting seat.

[0014] As a further description of the above technical solution:

[0015] The threads at the two ends of the threaded rod are opposite to each other. The threaded sleeves are provided in two groups and are symmetrically distributed at the two ends of the threaded rod. The threaded sleeves slide at the bottom of the base.

[0016] As a further description of the above technical solution:

[0017] The diameter of the grain hole is larger than the chip diameter and smaller than twice the chip diameter.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the arc cam driven by the vibration motor is combined with the spring system to achieve uniform and controllable back and forth shaking of the substrate. This shaking not only helps to redistribute the grains on the core disk, but also ensures that the grains fall into the grain holes in the best posture. Since the shaking is uniform and predictable, the accuracy and consistency of grain positioning can be significantly improved, thereby improving the packaging quality of the glass-sealed diode.

[0020] 2. In the utility model, through the worm gear transmission mechanism and the threaded rod with double-end reverse thread design, the equipment can accurately and stably clamp the core disk, ensuring the stability of the core disk in subsequent operations. This stable clamping foundation provides an important guarantee for the precise positioning of the grains, reducing the problem of grain misalignment caused by shaking or offset of the core disk. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional structural schematic diagram of a crystal rocking device for processing diode crystals proposed by the utility model;

[0022] Figure 2 A partial cross-sectional view of a crystal rocking device for processing diode crystals proposed by the utility model Figure 1 ;

[0023] Figure 3 A partial cross-sectional view of a crystal rocking device for processing diode crystals proposed by the utility model Figure 2 ;

[0024] Figure 4The utility model provides a top view of a crystal rocking device for processing diode crystals.

[0025] Legend:

[0026] 1. Base; 2. Support plate; 3. Vibration motor; 4. Arc cam; 5. Arc connector; 6. Connecting plate; 7. Guide rod; 8. Base plate; 9. Spring; 10. Connecting seat; 11. Rotating motor; 12. Transmission shaft; 13. Active worm; 14. Driven worm gear; 15. Threaded rod; 16. Threaded sleeve; 17. Clamp plate; 18. Core disk; 19. Grain hole. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-Figure 4 The utility model provides an embodiment: a crystal grain shaking plate device for processing diode crystals, comprising a base 1, a support plate 2 is fixedly connected to the base 1, a vibration motor 3 is fixedly installed on the support plate 2, an arc cam 4 is fixedly connected to the output end of the vibration motor 3, an arc connector 5 is fitted on the arc cam 4, a connecting plate 6 is fixedly connected to the arc connector 5, a guide rod 7 is fixedly connected to the connecting plate 6, one end of the guide rod 7 is fixedly connected to a substrate 8, the guide rod 7 slides on the base 1, a spring 9 is sleeved on the guide rod 7, and the two ends of the spring 9 are respectively fixedly connected to the substrate 8 and the base 1, the arc cam 4 driven by the vibration motor 3 is combined with the spring 9 system to realize the uniform and controllable back and forth shaking of the substrate 8, such shaking not only helps to redistribute the crystal grains on the core disk 18, but also ensures that the crystal grains fall into the crystal grain holes 19 in the best posture, and because the shaking is uniform and predictable, the accuracy and consistency of crystal grain positioning can be significantly improved, thereby improving the packaging quality of the glass-sealed diode.

[0029] The base 1 is fixedly connected with a connecting seat 10, a rotating motor 11 is fixedly installed on the connecting seat 10, a transmission shaft 12 is fixedly connected to the output end of the rotating motor 11, a driving worm 13 is fixedly connected to the transmission shaft 12, a driven worm gear 14 is meshedly connected to the driving worm 13, a threaded rod 15 is fixedly connected to the driven worm gear 14, a threaded sleeve 16 is threadedly connected to the threaded rod 15, a clamping plate 17 is fixedly connected to the threaded sleeve 16, a core disk 18 is provided on the base plate 8, a grain hole 19 is opened on the core disk 18, the grain hole 19 is provided with multiple groups and is evenly distributed on the core disk 18, a spring 9 is provided with multiple groups and is evenly distributed between the base 1 and the base plate 8, and a connecting plate 6 and a guide rod 7 are provided with multiple groups and are symmetrically divided The base 1 is arranged on both sides, and the connecting seat 10 is located at the bottom of the base 1. The transmission shaft 12 and the threaded rod 15 are both rotated in the connecting seat 10. The threads at both ends of the threaded rod 15 are opposite. The threaded sleeve 16 is provided with two groups and is symmetrically distributed at both ends of the threaded rod 15. The threaded sleeve 16 slides at the bottom of the base 1. The diameter of the grain hole 19 is larger than the chip diameter and smaller than twice the chip diameter. Through the worm and worm gear transmission mechanism and the threaded rod 15 with double-end reverse thread design, the equipment can accurately and stably clamp the core disk 18 to ensure the stability of the core disk 18 in subsequent operations. This stable clamping foundation provides an important guarantee for the precise positioning of the grains and reduces the problem of grain misalignment caused by shaking or offset of the core disk 18.

[0030] Working principle: When using the grain shaking device of the diode crystal, first place the core disk 18 on the substrate 8, then start the rotating motor 11, the rotating motor 11 transmits power to the active worm 13 through the transmission shaft 12, the transmission mechanism of the worm and worm gear ensures the smooth transmission of power and the deceleration effect, the driven worm gear 14 further drives the threaded rod 15 to rotate, because the threaded rod 15 adopts a double-end reverse thread design, so when the threaded rod 15 rotates, the two sets of threaded sleeves 16 will approach each other, this design cleverly realizes the simultaneous and relative movement of the two sets of clamping plates 17, the sliding of the threaded sleeve 16 on the base 1 ensures the stability of the movement process, and avoids unstable clamping caused by shaking or vibration, as the threaded sleeve 16 approaches, the clamping plate 17 gradually and evenly clamps the core disk 18, providing a solid foundation for the subsequent grain positioning, then start the vibration motor 3, the vibration motor 3 drives the arc cam 4 to rotate, the arc cam 4 The raised part of the arc connector 5 periodically hits the arc connector 5, and this impact is converted into a pulling force on the substrate 8. The connecting plate 6 and the guide rod 7 transfer the pulling force of the arc connector 5 to the substrate 8, and at the same time push the spring 9 to compress. The spring 9, as a buffer element, not only absorbs part of the impact force, but also realizes the back and forth swing of the substrate 8 through its reaction force. This swing is uniform and controllable, because the sliding of the guide rod 7 on the base 1 ensures that the spring 9 is uniformly compressed along the predetermined direction. Then the grain is placed on the core disk 18. Under the back and forth swing of the substrate 8, the grain is affected by gravity and inertia and gradually falls into the grain hole 19. At the same time, the diameter of the grain hole 19 is larger than the chip diameter and less than twice the chip diameter, so that only one grain can fall into the grain hole 19, which limits the possibility of multiple grains entering the grain hole 19 in a superimposed and parallel state, thereby avoiding the encapsulation of multiple grains in a glass-sealed diode, thereby ensuring the quality of the glass-sealed diode.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A crystal rocking device for processing diode crystals, comprising a base (1), characterized in that: The base (1) is fixedly connected to a support plate (2), a vibration motor (3) is fixedly mounted on the support plate (2), an arc cam (4) is fixedly connected to the output end of the vibration motor (3), an arc connector (5) is fittedly connected to the arc cam (4), a connecting plate (6) is fixedly connected to the arc connector (5), a guide rod (7) is fixedly connected to the connecting plate (6), one end of the guide rod (7) is fixedly connected to a base plate (8), the guide rod (7) slides on the base (1), a spring (9) is sleeved on the guide rod (7), and two ends of the spring (9) are respectively fixedly connected to the base plate (8) and the base (1).

2. A wafer shaking device for processing diode crystals according to claim 1, characterized in that: The base (1) is fixedly connected to a connecting seat (10), a rotating motor (11) is fixedly mounted on the connecting seat (10), an output end of the rotating motor (11) is fixedly connected to a transmission shaft (12), an active worm (13) is fixedly connected to the transmission shaft (12), a driven worm gear (14) is meshedly connected to the active worm (13), a threaded rod (15) is fixedly connected to the driven worm gear (14), a threaded sleeve (16) is threadedly connected to the threaded rod (15), and a clamping plate (17) is fixedly connected to the threaded sleeve (16).

3. A wafer shaking device for processing diode crystals according to claim 2, characterized in that: A core disk (18) is provided on the substrate (8), and crystal grain holes (19) are opened on the core disk (18). The crystal grain holes (19) are provided in multiple groups and are evenly distributed on the core disk (18).

4. A wafer shaking device for processing diode crystals according to claim 3, characterized in that: The springs (9) are provided in multiple groups and are evenly distributed between the base (1) and the base plate (8); the connecting plates (6) and the guide rods (7) are provided in multiple groups and are symmetrically distributed on both sides of the base (1).

5. A wafer shaking device for processing diode crystals according to claim 4, characterized in that: The connecting seat (10) is located at the bottom of the base (1), and the transmission shaft (12) and the threaded rod (15) are both rotated in the connecting seat (10).

6. A wafer rocking device for processing diode crystals according to claim 5, characterized in that: The threads at the two ends of the threaded rod (15) are opposite to each other. The threaded sleeves (16) are provided in two groups and are symmetrically distributed at the two ends of the threaded rod (15). The threaded sleeves (16) slide on the bottom of the base (1).

7. A wafer rocking device for processing diode crystals according to claim 6, characterized in that: The diameter of the grain hole (19) is larger than the chip diameter and smaller than twice the chip diameter.

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