Etching device for semiconductor chip processing

Abstract

The utility model discloses an etching device for processing a semiconductor chip, belongs to the technical field of chip processing, and solves the problem that the existing etching device for processing the semiconductor chip is easy to damage the semiconductor chip due to the arrangement of a stirring assembly. The device comprises an etching box used for containing etching liquid, a conduction plate, a protection frame and an ultrasonic generator are sequentially arranged on the outer side wall of the etching box, and the ultrasonic generator is electrically connected with a transducer. According to the utility model, through the arrangement of the ultrasonic generator, the energy converter and the conduction plate, when a semiconductor chip in the etching box needs to be etched, the ultrasonic generator and the energy converter are started to generate vibration energy of ultrasonic waves, and the vibration energy is uniformly transmitted to etching liquid in the etching box under the action of the conduction plate; according to the scheme, the etching process of the semiconductor chip and the etching liquid is accelerated, and compared with an existing mode of performing etching effect and cleaning in a stirring mode, the scheme not only avoids the situation of damaging the semiconductor chip, but also improves the etching effect.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to an etching device for semiconductor chip processing. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. Semiconductor chips are not just silicon chips, common ones also include semiconductor materials such as gallium arsenide and germanium.

[0003] The existing Chinese patent with announcement number CN219106087U discloses an etching device for semiconductor chip processing, which includes a processing table, a support frame is fixedly connected to the top of the processing table, an etching box and a cleaning box are arranged on the surface of the processing table, a screw is rotatably connected to the support frame, and a first motor is fixedly installed on the support frame.

[0004] Although the utility model provides a stirring component and a driving mechanism, the driving mechanism drives the stirring component to rotate, and the stirring component stirs the etching liquid and the cleaning liquid, so that the etching liquid and the cleaning liquid continuously flush the chip surface, improving the etching effect and cleaning effect of the etching liquid, however, the stirring method of the utility model may cause the chip and the device to collide, thereby easily damaging the semiconductor chip. Utility Model Content

[0005] In view of the above problems in the prior art, the utility model provides an etching device for processing semiconductor chips, which solves the problem that the prior etching device for processing semiconductor chips is easily damaged due to the stirring component being provided.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0007] Provided is an etching device for semiconductor chip processing, comprising an etching box for containing etching liquid, wherein a conductive plate, a protective frame and an ultrasonic generator are sequentially arranged on the outer side wall of the etching box, the ultrasonic generator is electrically connected to a transducer, the transducer is fixed on the protective frame, and the transmitting end of the transducer passes through the protective frame and contacts with the conductive plate.

[0008] In this solution, through the setting of ultrasonic generator, transducer and conduction plate, when it is necessary to etch the semiconductor chip in the etching box, the ultrasonic generator and transducer are started to generate ultrasonic vibration energy, and the vibration energy is evenly transmitted to the etching liquid in the etching box under the action of the conduction plate, thereby accelerating the etching process of the internal semiconductor chip and etching liquid. Compared with the existing etching and cleaning method by stirring, this solution not only avoids damage to the semiconductor chip, but also improves the etching effect.

[0009] Furthermore, a top cover is hingedly provided on one side of the top of the etching box, and two vents are provided on the top cover, a fan plate is fixed on the inner side wall of the top cover, two fans are provided on the fan plate, respectively located at the two vents, and a drying and heating component is fixed on the inner side wall of the fan plate. After etching is completed, external air is sucked in through the fan, and the external air can be heated by the drying and heating component to dry the semiconductor chip.

[0010] Furthermore, the drying and heating assembly includes a fixing frame fixed on the fan plate, and an electric heating net is arranged in the fixing frame. The electric heating net can provide uniform heat to help quickly evaporate the residual liquid on the surface of the semiconductor chip and reduce the drying time.

[0011] Furthermore, dustproof nets are arranged at the two vents on the outer side wall of the top cover, which reduce the entry of external dust and keep the interior clean.

[0012] Furthermore, a placement frame is provided inside the etching box, and a hollow placement plate is fixed on the placement frame. The placement frame and the hollow placement plate can conveniently load and remove chips, while ensuring that the etching liquid can fully contact all parts of the chip to ensure etching uniformity.

[0013] Furthermore, a waste liquid collection box for collecting waste liquid is arranged on the bottom of the etching box.

[0014] Furthermore, the bottom plate of the etching box is sealingly and slidably arranged on the opening surface of the waste liquid collection box. The etching liquid in the etching box can be quickly put into the waste liquid collection box by pulling out the bottom plate.

[0015] Furthermore, a liquid outlet pipe is arranged on the side wall of the waste liquid collection box, and the arrangement of the liquid outlet pipe enables the waste liquid to be conveniently discharged from the waste liquid collection box.

[0016] The utility model discloses an etching device for semiconductor chip processing, which has the following beneficial effects:

[0017] 1. The utility model is provided with an ultrasonic generator, a transducer and a conduction plate. When it is necessary to etch the semiconductor chip in the etching box, the ultrasonic generator and the transducer are started to generate ultrasonic vibration energy. The vibration energy is evenly transmitted to the etching liquid in the etching box under the action of the conduction plate, thereby accelerating the etching process of the internal semiconductor chip and the etching liquid. Compared with the existing etching and cleaning method by stirring, this scheme not only avoids the damage to the semiconductor chip, but also improves the etching effect.

[0018] 2. The utility model is provided with a drying and heating component and a fan. When etching is completed, the internal etching liquid is discharged, the top cover is closed, the fan and the drying and heating component are started, and the wind generated by the fan is converted into wind with a certain temperature through the drying and heating component to dry the semiconductor chip containing the etching liquid inside. After drying, the semiconductor chip is taken out, which can prevent the etching liquid from dripping and causing damage to the desktop. At the same time, it can also protect the hands of the personnel and prevent the etching liquid from corroding the hands of the personnel to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of an etching device for semiconductor chip processing;

[0020] Figure 2 The exploded view of the etching tank and the waste liquid collection tank;

[0021] Figure 3 is a schematic diagram of the structure of the top cover;

[0022] Figure 4 It is a schematic diagram of the structure of ultrasonic wave and transducer;

[0023] Among them: 1. etching box; 2. conduction plate; 3. protection frame; 4. ultrasonic generator; 5. transducer; 6. drying and heating component; 601. fixing frame; 602. heating net; 7. fan plate; 8. fan; 9. top cover; 10. dust net; 11. placement plate; 12. waste liquid collection box; 13. bottom plate. DETAILED DESCRIPTION

[0024] The specific implementation methods of the utility model are described below to facilitate technical personnel in this technical field to understand the utility model, but it should be clear that the utility model is not limited to the scope of the specific implementation methods. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the utility model defined and determined by the attached claims, these changes are obvious, and all utility model creations using the concept of the utility model are protected.

[0025] In this embodiment, an etching device for semiconductor chip processing is provided, which uses the vibration energy of ultrasound to accelerate the etching process of the semiconductor chip and the etching solution. Compared with the existing etching and cleaning method by stirring, it not only avoids damage to the semiconductor chip, but also improves the etching effect.

[0026] refer to Figure 1 and 4An etching device for semiconductor chip processing includes an etching box 1, which is used to contain etching liquid. A conductive plate 2, a protective frame 3 and an ultrasonic generator 4 are sequentially arranged on the outer wall of the etching box 1. The ultrasonic generator 4 is electrically connected to a transducer 5, which is fixed on the protective frame 3, and an emitting end of the transducer 5 passes through an opening on the protective frame 3 and contacts the conductive plate 2. The arrangement of the conductive plate 2 helps to ensure that ultrasonic energy is evenly distributed on the entire plate surface to avoid energy concentration.

[0027] As a further solution of this embodiment, a top cover 9 is hingedly provided on one side of the top of the etching box 1, and two vents are provided on the top cover 9. Dust-proof nets 10 are provided at the two vents on the outer wall of the top cover 9. The provision of the dust-proof nets 10 reduces the entry of external dust and keeps the interior clean.

[0028] refer to Figure 3 A fan plate 7 is fixed on the inner side wall of the top cover 9, and two fans 8 are respectively arranged on the fan plate 7 at two vents, and a drying and heating component 6 is fixed on the inner side wall of the fan plate 7. After etching is completed, the external air is sucked in through the fan 8, and the external air is heated by the drying and heating component 6 to dry the semiconductor chip.

[0029] Specifically, as a specific structure of the drying and heating component 6, the drying and heating component 6 includes a fixed frame 601 fixed on the fan plate 7, and an electric heating net 602 is arranged in the fixed frame 601. The electric heating net 602 can provide uniform heat to help quickly evaporate the residual liquid on the surface of the semiconductor chip and reduce the drying time.

[0030] As a further solution of this embodiment, in order to facilitate the placement of semiconductor chips, refer to Figure 2 The etching box 1 is provided with a placement frame inside, and a hollow placement plate 11 is fixed on the placement frame. The placement frame and the hollow placement plate 11 can conveniently load and remove chips, while ensuring that the etching liquid can fully contact all parts of the chip to ensure etching uniformity.

[0031] In order to facilitate the collection of waste liquid, a waste liquid collection box 12 for collecting waste liquid is provided on the bottom of the etching box 1 of this embodiment. As a structure for collecting waste liquid by the waste liquid collection box 12, the waste liquid collection box 12 can be connected to the etching box 1 through an external collection pipe, and a valve switch is provided on the collection pipe. The waste liquid collection box 12 can also be provided with a switch on the bottom plate 13 of the etching box 1 to realize the closed function of the connection.

[0032] Preferably, reference Figure 2The bottom plate 13 of the etching box 1 of this embodiment is sealingly slidably arranged on the opening surface of the waste liquid collection box 12. The etching liquid in the etching box 1 can be quickly put into the waste liquid collection box 12 by pulling out the bottom plate 13. When the waste liquid does not need to be collected, the bottom plate 13 only needs to be slid to the opening surface of the waste liquid collection box 12 for sealing.

[0033] As a further solution of this embodiment, in order to facilitate the discharge of waste liquid, a liquid outlet pipe is provided on the side wall of the waste liquid collection box 12, and a valve is provided on the liquid outlet pipe.

[0034] In summary, the working principle of this solution is:

[0035] The first step is to place the semiconductor chip on the surface of the placement plate 11 and inject etching liquid into the etching box 1.

[0036] Step 2: When the semiconductor chip needs to be etched, start the ultrasonic generator 4 and the transducer 5 to generate ultrasonic vibration energy. The vibration energy is evenly transmitted to the etching liquid in the etching box 1 under the action of the conductive plate 2, thereby accelerating the etching process of the internal semiconductor chip and the etching liquid.

[0037] The third step: after the etching is completed, the bottom plate 13 of the etching box 1 is dragged outward, and the etching liquid falls into the waste liquid collection box 12. The top cover 9 is closed, and the fan 8 and the drying and heating component 6 are started. The wind generated by the fan 8 is converted into wind with a certain temperature through the drying and heating component 6 to dry the semiconductor chip containing the etching liquid inside. After the drying is completed, the semiconductor chip is taken out.

[0038] Although the specific implementation of the utility model is described in detail in conjunction with the drawings, it should not be understood as limiting the scope of protection of this patent. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still fall within the scope of protection of this patent.

Claims

1. An etching device for semiconductor chip processing, characterized in that: The invention comprises an etching box (1) for containing etching liquid, wherein a conducting plate (2), a protective frame (3) and an ultrasonic generator (4) are sequentially arranged on the outer side wall of the etching box (1), wherein the ultrasonic generator (4) is electrically connected to a transducer (5), wherein the transducer (5) is fixed on the protective frame (3), and an emitting end of the transducer (5) passes through the protective frame (3) and contacts the conducting plate (2).

2. The etching device for semiconductor chip processing according to claim 1, characterized in that: A top cover (9) is hingedly provided on one side of the top of the etching box (1), and two ventilation holes are provided on the top cover (9). A fan plate (7) is fixed on the inner side wall of the top cover (9), and two fans (8) are provided on the fan plate (7) and are respectively located at the two ventilation holes. A drying and heating component (6) is fixed on the inner side wall of the fan plate (7).

3. The etching device for semiconductor chip processing according to claim 2, characterized in that: The drying and heating component (6) comprises a fixing frame (601) fixed on the fan plate (7), and an electric heating net (602) is arranged inside the fixing frame (601).

4. The etching device for semiconductor chip processing according to claim 2, characterized in that: Dust-proof nets (10) are provided on the outer side wall of the top cover (9) at the two ventilation openings.

5. The etching device for semiconductor chip processing according to claim 2, characterized in that: A placement frame is provided inside the etching box (1), and a hollow placement plate (11) is fixed on the placement frame.

6. The etching device for semiconductor chip processing according to claim 5, characterized in that: A waste liquid collection box (12) for collecting waste liquid is arranged on the bottom of the etching box (1).

7. The etching device for semiconductor chip processing according to claim 6, characterized in that: The bottom plate (13) of the etching box (1) is sealingly and slidably arranged on the opening surface of the waste liquid collection box (12).

8. The etching device for semiconductor chip processing according to claim 6, characterized in that: A liquid outlet pipe is arranged on the side wall of the waste liquid collection box (12).

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