Wafer stripping and cleaning equipment

Abstract

The utility model discloses wafer stripping and cleaning equipment, which is characterized in that a pre-cleaning mechanism cleans a silicon rod assembly moved by a feeding mechanism, a first transfer mechanism transfers the silicon rod assembly on the feeding mechanism to a stripping mechanism, and the output end of a linear module in the stripping mechanism is provided with a hanger for bearing the silicon rod assembly; the material moving unit fixes the wafer at the end of the silicon rod beside the tail end of the linear module, the hot air gun heats the joint of the wafer at the end of the silicon rod and the resin plate, and the second transfer mechanism is in butt joint with the material moving unit and then feeds the wafer to the rear cleaning mechanism to be cleaned. And the discharging mechanism is connected with the rear cleaning mechanism and is used for discharging the cleaned wafer. According to the utility model, the hot air gun is used for heating the joints of the wafers on the silicon rod assembly and the resin plate and then stripping the wafers, so that the wafers are positioned and stripped one by one, the phenomena of side inclination, collision and the like between the wafers are avoided, the automation degree of wafer stripping is improved through series connection of multiple processes, and the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing devices, in particular to a wafer stripping and cleaning device, and a wafer boxing device after cleaning. Background Art

[0002] During the wafer production process, the silicon rod needs to be connected (bonded) to the resin plate. After a series of processing, the sliced ​​wafer and the resin plate are peeled off. During the wafer peeling process, the silicon rod assembly (the silicon rod connected to the resin plate after slicing) is generally placed in a warm water pool. At 65-75℃, the adhesive material loses its viscosity, so that the wafer can be smoothly peeled off the resin plate to complete the peeling action. Most of the existing technologies are improvements or perfections of this peeling method, such as a wafer peeling device with application number 202321111085.1, which discloses the use of a mover and a suction device to move the wafers and resin plates made in the previous process into a warm water pool. The wafers are sucked up by pulling up the carrier plate and individually controlling the suction cup in the middle, and are smoothly sent to the next process by the mover. There is no need for direct contact with water by human hands to avoid burns and damage to the wafers. However, the silicon rods are still heated in a water bath. During this process, tilting, bumping, and other phenomena that may occur after multiple wafers are separated from the silicon rods during immersion may still occur, which may easily cause damage to the wafers after peeling. Utility Model Content

[0003] The utility model aims to provide a wafer stripping and cleaning device, which heats the connection between the wafer and the resin plate on the silicon rod assembly with a hot air gun and then strips the wafer, thereby realizing wafer-by-wafer positioning and stripping, with good stripping effect, avoiding tilting and collision between the wafers, and having good stripping quality. In addition, multiple processes such as feeding, cleaning, stripping and unloading are connected in series, thereby improving the automation degree of wafer stripping and improving work efficiency.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a wafer stripping and cleaning device, including a frame, and:

[0005] The feeding mechanism includes a translation module and a material transfer assembly. The translation module is arranged on a frame, and a material transfer assembly capable of clamping a silicon rod assembly is arranged at the output end.

[0006] The pre-cleaning mechanism includes at least one cleaning unit for cleaning the silicon rod assembly clamped by the material transfer assembly.

[0007] The first transfer mechanism is arranged on the frame and transfers the silicon rod assembly on the material transfer assembly to the stripping mechanism.

[0008] The stripping mechanism includes a mounting frame, a linear module, a material transfer unit and a hot air gun. The output end of the linear module is provided with a rack capable of carrying a silicon rod assembly. The material transfer unit is arranged beside the end of the linear module to fix the wafer at the end of the silicon rod. The hot air gun is used to heat the connection between the wafer at the end of the silicon rod and the resin plate.

[0009] The second transfer mechanism is arranged on the frame and connected with the material transfer unit to deliver the wafers to the back-end cleaning mechanism for cleaning.

[0010] The unloading mechanism is connected with the back-end cleaning mechanism and is used for unloading the cleaned wafers.

[0011] As a further optimization, the material transfer unit includes a horizontal module, a rotating disk and a suction disk. The horizontal module is arranged on a mounting frame, and a vertical rotating disk is provided at the output end. The suction disk is arranged on the rotating disk for sucking wafers.

[0012] As a further optimization, the cleaning unit is a high-pressure spray tank and / or an ultrasonic cleaning tank, and is liftably arranged on the frame through a vertical module and connected to the silicon rod assembly on the material transfer assembly, so as to fully clean the gaps between the wafers.

[0013] As a further optimization, the first transfer mechanism includes a lifting assembly and a translation assembly, the lifting assembly is provided with a hanging groove for carrying the silicon rod assembly fed by the material transfer assembly, and the translation assembly is provided with a clamping part, which clamps the silicon rod assembly in the hanging groove and moves the material to the hanging rack.

[0014] As a further optimization, the lifting assembly includes a forward and backward moving module, a first lifting module and a support plate, the forward and backward moving module is arranged on the frame, the first lifting module is arranged at the output end of the forward and backward moving module, and a support plate is provided at its output end, and the hanging groove is formed on the upper end surface of the support plate; the translation assembly includes a horizontal moving module and a second lifting module, the horizontal moving module is arranged on the frame, the second lifting module is arranged at the output end of the horizontal moving module, and a clamping portion is provided at its output end.

[0015] As a further optimization, the back-end cleaning mechanism includes a cleaning tank, a feeding line, a cleaning component and a feeding component. The cleaning tank is arranged on a frame. The feeding line carries the wafers fed by the second transfer mechanism. The cleaning component cleans the residual glue on the wafers on the feeding line. The feeding component includes a lifting part and a translation cylinder. A pair of the translation cylinders are symmetrically arranged at the output end of the lifting part, and the output end is provided with a support plate for lifting the wafer at the end of the feeding line.

[0016] As a further optimization, the feeding line includes a plurality of synchronously rotating feeding rollers, and the feeding rollers include rollers and a plurality of support rings sleeved on the rollers. The wafers can be effectively protected by supporting and feeding the wafers through the support rings.

[0017] As a further optimization, the back-end cleaning mechanism also includes an air-drying component, which is arranged between the cleaning component and the feeding component, and can increase the drying rate of the rinsed wafers.

[0018] As a further optimization, the unloading mechanism includes a linear motion module, a multi-axis manipulator and a discharge table. The multi-axis manipulator is arranged on the linear motion module to place the cleaned wafers in a wafer box on the discharge table.

[0019] As a further optimization, the wafer stripping and cleaning equipment also includes a discharging mechanism, which is arranged beside the first transfer mechanism and is used to discharge the resin plate after the wafer is stripped from the bracket.

[0020] Compared with the prior art, the utility model has the following beneficial effects:

[0021] 1. The wafer is peeled off after heating the connection between the wafer and the resin plate on the silicon rod assembly with a hot air gun, replacing the conventional method of placing the entire silicon rod assembly in the working liquid for immersion and peeling. The wafer can be positioned and peeled off piece by piece, and the peeling effect is good. It can also avoid the tilting and bumping that may occur after the wafer and the silicon rod are separated in the immersion peeling method, thus ensuring the peeling quality;

[0022] 2. Connecting multiple processes such as feeding, cleaning, stripping and unloading in series improves the automation of wafer stripping and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural diagram of the utility model.

[0024] Figure 2 This is a positional relationship diagram of the feeding mechanism, pre-cleaning mechanism, first transfer mechanism and peeling mechanism in the utility model.

[0025] Figure 3 It is a structural diagram of the peeling mechanism of the utility model.

[0026] Figure 4 This is a structural diagram of the peeling mechanism of the utility model from the bottom perspective on the other side.

[0027] Figure 5 It is a structural diagram of the first transfer mechanism of the utility model.

[0028] Figure 6This is a positional relationship diagram of the peeling mechanism, the second transfer mechanism and the post-cleaning mechanism in the utility model.

[0029] Figure 7 It is a structural diagram of the back-end cleaning mechanism of the utility model.

[0030] Figure 8 It is a structural diagram of the feeding mechanism of the utility model. DETAILED DESCRIPTION

[0031] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0032] like Figures 1 to 4 As shown, a wafer stripping and cleaning device includes a frame 10, a feeding mechanism 20, a pre-cleaning mechanism 30, a first transfer mechanism 40, a stripping mechanism 50, a second transfer mechanism 60, a post-cleaning mechanism 70 and a feeding mechanism 80. The feeding mechanism 20 includes a translation module 21 and a material transfer assembly 22. The translation module 21 is arranged at the top of the frame 10, and the output end is provided with a material transfer assembly 22 for clamping a silicon rod assembly. The silicon rod assembly refers to a connector between a silicon rod and a resin plate, specifically refers to a silicon rod bonded to the resin plate and cut into wafers (i.e., a state in which multiple wafers are adjacently bonded to the resin plate). The pre-cleaning mechanism 30 includes at least one cleaning unit for cleaning the silicon rod assembly clamped by the material transfer assembly 22. The first transfer mechanism 40 is arranged on the frame 10 and transfers the cleaned and dried silicon rod assembly on the material transfer assembly 22. The silicon rod assembly is transported to the stripping mechanism 50, which includes a mounting frame 501, a linear module 51, a hot air gun 53 and a material transfer unit 54. The mounting frame 501 is arranged on the frame 10, the linear module 51 is arranged on the mounting frame 501, and its output end is provided with a hanger 52 that can carry the silicon rod assembly (the resin plate therein), the material transfer unit 54 is arranged on the side of the end of the linear module 51 to fix the wafer at the end of the silicon rod, the hot air gun 53 is arranged on the inner bracket 502, and it is used to heat the connection between the wafer at the end of the silicon rod and the resin plate, the second transfer machine 60 is arranged on the frame 10 and is connected with the material transfer unit 54 to feed the stripped wafer to the back-end cleaning mechanism 70 for cleaning, and the unloading mechanism 80 is connected to the back-end cleaning mechanism 70 for unloading the wafer after cleaning and drying.

[0033] In the present invention, firstly, the silicon rod assembly is fed to a side close to the feeding mechanism 20 manually or mechanically, and the resin plate on the silicon rod assembly is clamped by the material moving assembly 22. A pair of cylinders can be used to clamp the resin plate at the output end of the material moving assembly 22. Then, the translation module 21 can drive the material moving assembly 22 and the silicon rod assembly to move horizontally. The silicon rod assembly is cleaned by the cleaning unit in the pre-cleaning mechanism 30. After the cleaning is completed, the translation module 21 drives the silicon rod assembly to move horizontally and dock with the first transfer mechanism 40. Then, the feeding mechanism 20 can be reset and re-clamp the newly loaded silicon rod assembly. The first transfer mechanism 40 places the silicon rod assembly on the hanger 52 in the stripping mechanism 50. The linear module 51 drives the silicon rod assembly to move toward the hot air gun 53. When it reaches the specified position, it stops moving. The material moving unit 54 is driven by the moving After the operation, the wafer close to the hot air gun 53 is adsorbed and fixed, and the hot air gun 53 heats and softens the bonding point between the wafer and the resin plate. After reaching the set heating temperature and time, the hot air gun 53 stops heating. During the resetting process of the material moving unit 54, the wafer can be separated from the resin plate by pulling, and the wafer is transferred to the second transfer mechanism 60. During this process, the linear module 51 drives the hanger 52 to drive the silicon rod assembly to advance a certain distance, so that the bonding point between the wafer at the end and the silicon rod is located within the action range of the hot air gun 53. The material moving unit 54 re-adsorbs and fixes the wafer at the end, and the hot air gun 53 continues to heat. The second transfer mechanism 60 feeds the wafer transferred to it to the back-end cleaning mechanism 70 to clean, de-glue and dry the peeled wafer, and the unloading mechanism 80 feeds the wafer to the designated position.

[0034] The utility model peels off the wafer after heating the connection between the wafer and the resin plate on the silicon rod assembly by a hot air gun, replacing the conventional method of placing the entire silicon rod assembly in a working liquid for immersion and peeling, and can realize wafer positioning and peeling one by one. The peeling effect is good, and the phenomenon of tilting and bumping that may occur after the wafer and the silicon rod are separated in the immersion peeling method can be avoided, thereby ensuring the peeling quality; moreover, multiple processes such as feeding, cleaning, peeling and unloading are connected in series, thereby improving the automation degree of wafer peeling and improving work efficiency.

[0035] Continue as Figure 3 and Figure 4As shown, the material transfer unit 54 includes a horizontal module 541, a rotating disk 542 and a suction disk 543. The horizontal module 541 is arranged on the mounting frame 501, and a vertical rotating disk 542 is provided at the output end. The suction disk 543 is arranged on the rotating disk 542 to adsorb the wafer after peeling. Specifically, the linear module 541 can drive the suction disk 543 to move close to the hot air gun 53. The suction disk 543 is driven by the rotating disk 542 to rotate in the vertical plane close to the silicon rod assembly, and then adjusted by the linear module 541 to fix the position with the wafer at the end of the silicon rod assembly. After the hot air gun 53 completes heating, the rotating disk 542 drives the suction disk 543 to rotate in the vertical plane to peel the wafer off the silicon rod assembly, and then driven by the linear module 541 to move and transfer the wafer to the second transfer mechanism 60. Figure 6 As shown, the second transfer mechanism 60 may have a structure that is the same or similar to the material transfer unit 54, with the difference being that: the second transfer mechanism 60, in addition to being able to drive the wafer to move horizontally and vertically, also needs to have a suction cup assembly for rotating the vertical wafer that has been docked with the adsorption plate 543 to a horizontal state, so that it can be placed horizontally in the post-process cleaning mechanism 70 for transportation and cleaning.

[0036] In addition, the inner bracket 502 for fixing the hot air gun 53 can have the function of adjusting the horizontal position, vertical position and elevation angle, so that the hot air action range of the hot air gun 53 can be adjusted so as to accurately act on the connection between the wafer and the resin plate. The above-mentioned adjustment action can be set before the peeling action to ensure the stability during the peeling action.

[0037] For example Figure 2 As shown, the cleaning unit has two, which are a high-pressure spray tank 31 and an ultrasonic cleaning tank 32 arranged side by side, and both are liftably arranged on the frame 10 through the vertical module 300 so as to be connected with the silicon rod assembly on the material moving assembly 22, specifically: when the translation module 21 drives the material moving assembly 22 and the silicon rod assembly to be located above the high-pressure cleaning tank 31, the vertical module 200 drives the high-pressure cleaning tank 31 to move upward so that the silicon rod assembly is located in the high-pressure cleaning tank 31 for cleaning, and after cleaning, the high-pressure cleaning tank 31 is reset, and the translation module 21 drives the material moving assembly 22 and the silicon rod assembly to be located above the ultrasonic cleaning tank 32. The cleaning steps are the same as those mentioned above, and the specific cleaning processes of the two are: high-pressure spray washing of mortar on the surface of the crystal rod; ultrasonic cleaning adopts QDR mode, 48KHZ frequency ultrasonic combination, to clean impurities inside the crystal rod, and then ultrasonic cleaning hot water washing is performed, and QDR mode, 48KHZ frequency ultrasonic combination is adopted to finally rinse the inside of the crystal rod.

[0038] like Figure 5As shown, the first transfer mechanism 40 includes a lifting assembly 41 and a translation assembly 42. The lifting assembly 41 is provided with a hanging groove 410 for carrying the silicon rod assembly (resin plate) fed by the material transfer assembly 22. The translation assembly 42 is provided with a clamping part 420. The clamping part 420 clamps the silicon rod assembly in the hanging groove 410 and transfers the material to the hanger 52 in the stripping mechanism 50. More specifically, the lifting assembly 41 includes a front-to-back moving module 411, a first lifting module 412 and a support plate 413. The movable module 411 is arranged on the frame 10, the first lifting module 412 is arranged at the output end of the front-rear moving module 411, and a support plate 413 is provided at its output end, the hanging groove 410 is formed on the upper end surface of the support plate 413, the translation assembly 42 includes a horizontal moving module 421 and a second lifting module 422, the horizontal moving module 421 is arranged on the frame 10, the second lifting module 422 is arranged at the output end of the horizontal moving module 421, and a clamping portion 420 is provided at its output end. The docking process of the first rotation mechanism 40 and the material moving assembly 22 is as follows: the material moving assembly 22 drives the silicon rod assembly to move to the end of the translation module 21, the front and rear moving module 411 drives the first lifting module 412 and the support plate 413 to move to the bottom of the material moving assembly 22, the first lifting module 412 drives the support plate 413 to move upward to approach the material moving assembly 22 and carry the resin plate on the silicon rod assembly through the hanging groove 410, the material moving assembly 22 releases the silicon rod assembly, the first lifting module 412 drives the support plate 413 to move downward, and the front and rear moving module 411 drives the first lifting module 412 to move downward. The support plate 413 is driven to move toward the translation assembly 42. After moving into position, the first lifting module 412 and / or the second lifting module 422 are actuated to clamp the resin plate in the hanging groove 410 through the clamping part 420. The second lifting module 422 moves upward, and the silicon rod assembly is driven to the top of the stripping mechanism 50 by the horizontal moving module 421. The second lifting module 422 moves downward, and the resin plate is placed on the hanging rack 52 by the clamping part 420. In this way, the cleaned silicon rod assembly is transferred from the material moving assembly 22 to the stripping mechanism 50 through the first transfer mechanism 40.

[0039] Combination Figure 6 and 7As shown, the wafers after being stripped by the stripping mechanism 50 are fed to the post-process cleaning mechanism 70 through the second transfer mechanism 60. The post-process cleaning mechanism 70 includes a cleaning tank 700, a feeding line 71, a cleaning component 72 and a feeding component. The cleaning tank 70 is arranged on the frame 10. The feeding line 71 carries the wafers fed by the second transfer mechanism 60. The cleaning component 72 cleans the residual glue on the wafers on the feeding line. The feeding component includes a lifting part 731 and a translation cylinder 732. The lifting part 731 can select a cylinder. A pair of translation cylinders 732 are symmetrically arranged at the output end of the lifting part 731, and a support plate 733 is provided at the output end for lifting the wafer at the end of the feeding line 71. During the feeding process of the wafer on the feeding line 71, the cleaning component 72 is used to rinse and remove the glue, and the cleaning liquid can fall into the cleaning tank 70. The specific rinsing process is: 18 megohm ultrapure water spray + auxiliary brush (PVA). The rinsed and dried wafer moves to the end of the feeding line 71. Since the initial position of a pair of support plates 733 is located below the feeding line 71, they can be driven by the translation cylinder 732 to move toward each other and driven by the lifting part 731 to lift the wafer upward and then detach from the feeding line 71, so that the unloading mechanism 80 can remove the wafer.

[0040] Furthermore, the feeding line 71 includes a plurality of synchronously rotating feeding rollers, and there is a gap between adjacent feeding rollers so that the support plate 733 can pass upward to lift the wafer. The feeding roller includes a roller 711 and a plurality of support rings 712 mounted on the roller 711. The support ring 712 is preferably made of a non-hard material and will not damage the wafer when in contact with the wafer. Feeding by contacting the wafer with a plurality of support rings 712 can also avoid damage to the wafer caused by the roller 711 contacting the wafer over a large area or a large line length.

[0041] In addition, the post-cleaning mechanism 70 also includes an air drying component 74, which is disposed between the cleaning component 72 and the feeding component to accelerate the drying of the wafer after cleaning. The specific drying process is to air dry the entire surface of the wafer with fluid.

[0042] like Figure 6 As shown, the unloading mechanism 80 includes a linear moving module 81, a multi-axis manipulator 82 and a discharge table 83. The multi-axis manipulator 82 is arranged on the linear moving module 81 to place the cleaned wafers in the wafer box on the discharge table 83 as required, thereby completing the wafer peeling and boxing process after cleaning.

[0043] For example Figure 1As shown, the wafer stripping and cleaning equipment also includes a discharging mechanism 90, which is arranged beside the first transfer mechanism 40 and is used to discharge the resin plate after the wafers are stripped from the bracket 52. After the stripping mechanism 50 completes the stripping of all wafers on a silicon rod assembly, the first transfer mechanism 40 clamps the resin plate on the hanger 52 to the discharging mechanism 90, and the discharging mechanism 90 completes the unloading of the resin plate. The discharging mechanism can be in the form of a roller line.

[0044] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

Claims

1. A wafer stripping and cleaning device, comprising a frame, characterized in that: Also includes: The feeding mechanism includes a translation module and a material transfer assembly. The translation module is arranged on a frame, and a material transfer assembly capable of clamping a silicon rod assembly is arranged at the output end. The pre-cleaning mechanism includes at least one cleaning unit for cleaning the silicon rod assembly clamped by the material transfer assembly. The first transfer mechanism is arranged on the frame and transfers the silicon rod assembly on the material transfer assembly to the stripping mechanism. The stripping mechanism includes a mounting frame, a linear module, a material transfer unit and a hot air gun. The output end of the linear module is provided with a rack capable of carrying a silicon rod assembly. The material transfer unit is arranged beside the end of the linear module to fix the wafer at the end of the silicon rod. The hot air gun is used to heat the connection between the wafer at the end of the silicon rod and the resin plate. The second transfer mechanism is arranged on the frame and connected with the material transfer unit to deliver the wafers to the back-end cleaning mechanism for cleaning. The unloading mechanism is connected with the back-end cleaning mechanism and is used for unloading the cleaned wafers.

2. The wafer stripping and cleaning equipment according to claim 1, characterized in that: The material transfer unit comprises a horizontal module, a rotating disk and a suction disk. The horizontal module is arranged on a mounting frame, and a vertical rotating disk is arranged at an output end. The suction disk is arranged on the rotating disk for suctioning wafers.

3. The wafer stripping and cleaning equipment according to claim 1, characterized in that: The cleaning unit is a high-pressure spray tank and / or an ultrasonic cleaning tank, and is escalably arranged on the frame through a vertical module and connected to the silicon rod assembly on the material transfer assembly.

4. The wafer stripping and cleaning equipment according to claim 1, characterized in that: The first transfer mechanism includes a lifting assembly and a translation assembly. The lifting assembly is provided with a hanging groove for carrying the silicon rod assembly fed by the material transfer assembly. The translation assembly is provided with a clamping part, which clamps the silicon rod assembly in the hanging groove and transfers the material to the hanging rack.

5. The wafer stripping and cleaning equipment according to claim 4, characterized in that: The lifting assembly includes a front-and-rear moving module, a first lifting module and a support plate, the front-and-rear moving module is arranged on a frame, the first lifting module is arranged at the output end of the front-and-rear moving module, and a support plate is provided at the output end thereof, and the hanging groove is formed on the upper end surface of the support plate; the translation assembly includes a horizontal moving module and a second lifting module, the horizontal moving module is arranged on a frame, the second lifting module is arranged at the output end of the horizontal moving module, and a clamping portion is provided at the output end thereof.

6. The wafer stripping and cleaning equipment according to claim 1, characterized in that: The back-end cleaning mechanism includes a cleaning tank, a feeding line, a cleaning component and a feeding component. The cleaning tank is arranged on a frame. The feeding line carries the wafers fed by the second transfer mechanism. The cleaning component cleans the residual glue on the wafers on the feeding line. The feeding component includes a lifting part and a translation cylinder. A pair of the translation cylinders are symmetrically arranged at the output end of the lifting part, and the output end is provided with a support plate for lifting the wafer at the end of the feeding line.

7. The wafer stripping and cleaning equipment according to claim 6, characterized in that: The feeding line comprises a plurality of synchronously rotating feeding rollers, and the feeding rollers comprise rollers and a plurality of supporting rings sleeved on the rollers.

8. The wafer stripping and cleaning equipment according to claim 6 or 7, characterized in that: The post-cleaning mechanism further comprises an air-drying component, and the air-drying component is arranged between the cleaning component and the feeding component.

9. The wafer stripping and cleaning equipment according to claim 1, characterized in that: The unloading mechanism comprises a linear motion module, a multi-axis manipulator and a discharge table. The multi-axis manipulator is arranged on the linear motion module and is used for placing the cleaned wafers in a wafer box on the discharge table.

10. The wafer stripping and cleaning equipment according to claim 1, characterized in that: It also includes a discharging mechanism, which is arranged beside the first transfer mechanism and is used to discharging the resin plate after the wafers are peeled off from the bracket.

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