Jig for reducing warping of substrate

Abstract

The utility model relates to a jig for reducing warping of a substrate. The jig for reducing the warping of the substrate comprises a material carrying disc, the material carrying disc comprises a disc body, the disc body comprises a front face and a back face which are oppositely distributed, the front face of the disc body is used for carrying the substrate, and the front face of the disc body is provided with a plurality of carrying areas; a plurality of adsorption units which are in one-to-one correspondence with the bearing areas are arranged on the back surface of the tray body, and each adsorption unit comprises a plurality of adsorption beads which are distributed around orthographic projections of the bearing areas on the back surface of the tray body; and the cover plate is used for covering the front face of the material carrying disc, and the adsorption beads can adsorb the cover plate. According to the utility model, the warping condition of each unit area on the substrate is improved, and the problems of stretching, extruding or bridging in the unit areas in the chip mounting process are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a jig for reducing substrate warping. Background Art

[0002] During the packaging and manufacturing process of FC (Flip Chip) products, the chip is mounted on the upper surface of the substrate through the chip mounting process, and then the interconnection between the chip and the substrate is achieved by heating the molten tin / eutectic. During the heating process, due to the different thermal expansion coefficients of different materials in the substrate, the substrate will cause a certain degree of warpage. Therefore, the substrate needs to be fixed by a carrier plate and a cover plate during the instant heating process to reduce the problems of chip surface conductive bump cracking or conductive bump cold soldering caused by substrate warping.

[0003] For conductive bumps of smaller size and formed of copper-tin alloy, a flat substrate is sufficient to prevent the substrate from warping. However, for conductive bumps of larger size and formed of solder, a flat substrate cannot prevent the substrate from warping during heating, causing some conductive bumps to be stretched and some conductive bumps to be squeezed, leading to chip cracking, bridging between conductive bumps, and other electrical failures.

[0004] Therefore, how to reduce the problem of substrate warping during the heating process, thereby avoiding excessive stretching or excessive compression of the conductive bumps when the chip is mounted on the substrate, reducing chip damage, and increasing the success rate of chip mounting, thereby improving the performance of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention

[0005] The utility model provides a jig for reducing substrate warping, so as to reduce the problem of substrate warping during heating, thereby preventing the conductive bumps from being over-stretched or over-compressed when the chip is mounted on the substrate, reducing chip breakage, and increasing the success rate of chip mounting, thereby improving the performance of the packaging structure.

[0006] According to some embodiments, the utility model provides a jig for reducing substrate warping, comprising:

[0007] A material loading tray, comprising a tray body, the tray body comprising a front side and a back side that are relatively distributed, the front side of the tray body being used to load a substrate, the front side of the tray body being provided with a plurality of load-bearing areas, the back side of the tray body being provided with a plurality of adsorption units corresponding to the plurality of load-bearing areas one by one, the adsorption units comprising a plurality of adsorption beads distributed around the orthographic projection of the load-bearing areas on the back side of the tray body;

[0008] The cover plate is used to cover the front side of the material loading tray, and the adsorption beads can adsorb the cover plate.

[0009] In some embodiments, the adsorption beads are magnetic adsorption beads, and the cover plate is a ferromagnetic cover plate.

[0010] In some embodiments, the cover plate includes a cover plate body and a plurality of openings located on the cover plate body, and the plurality of openings correspond one-to-one to the plurality of carrying areas on the loading tray.

[0011] In some embodiments, the adsorption beads are entirely or partially located on the orthographic projection of the cover body on the back surface of the disk body.

[0012] In some embodiments, the front side of the disk body is provided with a plurality of the bearing areas arranged in an array and gap areas between adjacent bearing areas, and the adsorption beads are at least partially distributed in the orthographic projection of the gap areas on the back side;

[0013] Adjacent adsorption units share a portion of the adsorption beads.

[0014] In some embodiments, the substrate includes a plurality of chip mounting areas corresponding to the plurality of the carrying areas one by one for mounting chips; the carrying area includes:

[0015] A boss is protrudingly arranged on the front side of the disk body, and the boss is used to lift up the chip mounting area on the substrate corresponding to the bearing area.

[0016] In some embodiments, the plurality of adsorption beads in the adsorption unit are symmetrically distributed around the center of the orthographic projection of the boss on the back side of the disk body.

[0017] In some embodiments, the heights of the bosses in all the bearing areas of the disk body protruding from the front side of the disk body are the same.

[0018] In some embodiments, the disk body includes a first area and a second area, each of the first area and the second area includes a plurality of the bearing areas, and a height of the boss in the bearing area in the first area protruding from the front side of the disk body is different from a height of the boss in the bearing area in the second area protruding from the front side of the disk body.

[0019] In some embodiments, the bosses in all the bearing areas of the disk body are located at the same position within the bearing area; or,

[0020] The bosses in at least two of the bearing areas have different positions within the bearing areas.

[0021] In some embodiments, the substrate includes a plurality of chip mounting areas corresponding to the plurality of the carrying areas one by one for mounting chips; the carrying area includes:

[0022] The groove is located on the front side of the disk body, and the groove is recessed from the front side of the disk body toward the back side of the disk body. The position of the groove corresponds to the position of the chip mounting area corresponding to the carrying area.

[0023] The utility model provides a jig for reducing substrate warping. A plurality of adsorption units corresponding to a plurality of bearing areas are arranged on the back side of a tray body of a carrier tray, and the adsorption units include a plurality of adsorption beads distributed around the orthographic projections of the bearing areas on the back side of the tray body. After the substrate is placed on the carrier tray and a cover plate is placed on the front side of the carrier tray, the adsorption force between the tray body of the carrier tray and the cover plate can be enhanced, thereby reducing or even avoiding deformation such as warping of the substrate during the chip mounting process, thereby improving chip mounting efficiency and the manufacturing yield of the packaging structure. At the same time, since the multiple adsorption units on the back side of the disk body correspond one-to-one to the multiple bearing areas on the front side of the disk body, and the multiple adsorption beads in each adsorption unit are distributed around the corresponding bearing area, it is possible to apply an adsorption force to adsorb the cover plate around a single unit area on the substrate, thereby improving the warping of each unit area on the substrate, avoiding the problem of stretching, extrusion or bridging in the unit area during chip mounting, further improving the chip mounting efficiency, and improving the manufacturing yield of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Attached Figure 1 It is a structural schematic diagram of the front side of the disk body in a specific implementation mode of the utility model;

[0025] Attached Figure 2 It is a structural schematic diagram of the back side of the disk body in a specific implementation mode of the utility model;

[0026] Attached Figure 3 It is a structural schematic diagram of a cover plate in a specific implementation mode of the utility model;

[0027] Attached Figure 4 It is a structural schematic diagram of a specific embodiment of the utility model after the cover plate covers the front side of the loading tray;

[0028] Attached Figure 5 It is a schematic diagram of the relative position relationship among the bearing area, the adsorption unit and the opening in the cover plate in a specific implementation manner of the utility model. DETAILED DESCRIPTION

[0029] The specific implementation of the jig for reducing substrate warping provided by the present invention is described in detail below in conjunction with the accompanying drawings.

[0030] This specific embodiment provides a jig for reducing substrate warpage, Figure 1 It is a structural schematic diagram of the front side of the disk body in a specific implementation mode of the utility model, and Figure 2 It is a schematic diagram of the structure of the back side of the disk body in the specific implementation mode of the utility model, and Figure 3 It is a structural schematic diagram of the cover plate in a specific embodiment of the utility model, and Figure 4 This is a schematic diagram of the structure after the cover plate covers the front of the loading tray in the specific implementation mode of the utility model, Figure 5 It is a schematic diagram of the relative position relationship among the bearing area, the adsorption unit and the opening in the cover plate in a specific implementation manner of the utility model.

[0031] like Figure 1-Figure 5 As shown, the jig for reducing substrate warping includes:

[0032] A material loading tray, comprising a tray body 10, wherein the tray body 10 comprises a front side 101 and a back side 102 which are relatively distributed, wherein the front side 101 of the tray body 10 is used to load a substrate, wherein the front side 101 of the tray body 10 is provided with a plurality of loading areas 11, wherein the back side 102 of the tray body 10 is provided with a plurality of adsorption units corresponding to the plurality of loading areas 11 one by one, wherein the adsorption units comprise a plurality of adsorption beads 20 which are distributed around the periphery of the orthographic projection of the loading areas 11 on the back side 102 of the tray body 10;

[0033] The cover plate 40 is used to cover the front side 101 of the material loading tray, and the adsorption beads 20 can adsorb the cover plate 40 .

[0034] Specifically, the loading tray includes the tray body 10, and the front side 101 of the tray body 10 is provided with a plurality of the carrying areas 11 arranged in an array, and the back side 102 of the tray body 10 is provided with a plurality of adsorption units arranged in an array, and the plurality of the carrying areas 11 correspond one-to-one to the plurality of the adsorption units, and the plurality of adsorption beads 20 in the adsorption units are distributed around the positive projection of the corresponding carrying areas 11 on the back side 102 of the tray body 10. The cover plate 40 includes a cover plate body and a plurality of openings 41 located on the cover plate body, and the plurality of openings 41 correspond one-to-one to the plurality of the carrying areas 11 on the loading tray. For example, the loading tray includes a plurality of the carrying areas 11 arranged in an array, and the cover plate 40 also includes a plurality of the openings 41 arranged in an array. In one example, the loading tray and the cover plate 40 are both flat, and the shape and size of the openings 41 match the shape and size of the carrying areas 11. In this specific embodiment, Figure 1 In the figure, only the position of one of the carrying areas 11 is shown in a dotted frame, and in the actual material loading tray, no spacing structure is provided between adjacent carrying areas 11. In one example, the adsorption beads 20 are all or partially located on the orthographic projection of the cover body 40 on the back surface 102 of the tray body 10.

[0035] When performing the chip mounting process, a substrate is first provided, the substrate including a plurality of unit areas and a cutting path area between adjacent unit areas, and then the substrate is cut along the cutting path area to separate the adjacent unit areas to form an independent packaging structure. After providing the substrate, the substrate is placed on the front side 101 of the tray body 10 of the carrier tray, and the plurality of unit areas on the substrate are placed one by one on the plurality of supporting areas 11. Next, the cover plate 40 is placed on the front side 101 of the tray body 10 of the carrier tray, so that the substrate is sandwiched between the carrier tray and the cover plate 40, as shown in FIG. Figure 4As shown. The adsorption beads 20 on the back side 102 of the disk body 10 adsorb the cover plate 40, so that the cover plate 40 applies a pressure to the substrate to flatten the substrate, thereby reducing or even avoiding deformation such as warping of the substrate during the chip mounting process, improving chip mounting efficiency, and improving the manufacturing yield of the packaging structure. At the same time, since the multiple adsorption units on the back side 102 of the disk body 10 correspond one-to-one to the multiple bearing areas 11 on the front side 101 of the disk body 10, and the multiple adsorption beads 20 in each adsorption unit are distributed around the corresponding bearing area 11, the adsorption force of the adsorption unit on the cover plate 40 can be used to make the cover plate 40 apply a pressure to each unit area on the substrate, thereby improving the warping of each unit area on the substrate, avoiding the problem of stretching, extrusion or bridging in the unit area during the chip mounting process, further improving the chip mounting efficiency, and improving the manufacturing yield of the packaging structure.

[0036] In some embodiments, the adsorption beads 20 are magnetic adsorption beads, and the cover plate 40 is a ferromagnetic cover plate.

[0037] For example, the cover plate 40 may be a galvanized ferromagnetic cover plate. The adsorption beads 20 are magnetic adsorption beads, and the cover plate 40 is a ferromagnetic cover plate, so that the adsorption beads 20 can adsorb the cover plate 40 through magnetic force, which not only ensures the stable adsorption of the adsorption beads 20 on the cover plate 40, but also helps to simplify the structure of the jig for reducing substrate warping.

[0038] In some embodiments, the front side 101 of the disk body 10 is provided with a plurality of the bearing areas 11 arranged in an array and gap areas between adjacent bearing areas 11, and the adsorption beads 20 are at least partially distributed in the gap areas within the orthographic projection of the back side 102;

[0039] Adjacent adsorption units share a portion of the adsorption beads 20 .

[0040] For example, if Figure 1 , Figure 4 and Figure 5As shown, the adsorption beads 20 are arranged at the corners of the orthographic projection of each polygonal (e.g., rectangular) bearing area 11 on the back surface 102, and the multiple adsorption beads 20 in the same adsorption unit are evenly distributed on the periphery of the corresponding bearing area 11, so as to further reduce the warping of the unit area in the substrate. The adsorption beads 20 are at least partially distributed in the orthographic projection of the gap area on the back surface 102, and the adjacent adsorption units share a part of the adsorption beads 20, so as to reduce the warping of the unit area in the substrate while avoiding an excessive number of the adsorption beads 20, thereby reducing the manufacturing cost of the jig for reducing the warping of the substrate.

[0041] In some embodiments, the substrate includes a plurality of chip mounting areas corresponding to the plurality of the carrying areas 11 for mounting chips; the carrying area 11 includes:

[0042] The boss 12 is protrudingly disposed on the front surface 101 of the disk body 10 , and the boss 12 is used to lift up the chip mounting area on the substrate corresponding to the carrying area 11 .

[0043] Specifically, the boss 12 protrudes from the bearing area 11 in the front side 101 of the disk body 10 , so that there is a height difference between the upper surface of the boss 12 (i.e., the surface of the boss 12 facing away from the front side 101 of the disk body 11 ) and the front side 101 of the disk body 10 . After the substrate is placed on the front side 101 of the tray body 10 of the carrier tray, the boss 12 can lift up the chip mounting area on the substrate. On the one hand, it is easy to identify the position of the chip mounting area in the chip mounting process, reducing the difficulty of alignment during the chip mounting process; on the other hand, the plurality of adsorption beads 20 distributed around the supporting area 11 on the back side 102 of the tray body 10 cooperate with the boss 12, that is, the adsorption effect of the adsorption beads 20 flattens the edge of the unit area in the substrate, and the boss 12 lifts up the chip mounting area, effectively avoiding the problem of stretching of the conductive bumps in the middle and compression of the conductive bumps at the edge after chip mounting, further improving the chip mounting effect and improving the manufacturing yield of the packaging structure.

[0044] In some embodiments, the plurality of adsorption beads 20 in the adsorption unit are symmetrically distributed around the center of the positive projection of the boss 12 on the back side 102 of the disk body 10, so as to further protrude the chip mounting area in the unit area while flattening the edge of the unit area of ​​the substrate.

[0045] In some embodiments, the bosses 12 in all the bearing areas 11 of the disk body 10 protrude from the front side 101 of the disk body 10 at the same height, so as to further simplify the manufacturing process of the jig for reducing substrate warping.

[0046] In other embodiments, the disk body 10 includes a first area and a second area, each of the first area and the second area includes a plurality of the bearing areas 11, and a height of the boss 12 in the bearing area 11 in the first area protruding from the front side 101 of the disk body 10 is different from a height of the boss 12 in the bearing area 11 in the second area protruding from the front side 101 of the disk body 10.

[0047] For example, the protrusion height of the boss 12 in the first area is different from the protrusion height of the boss 12 in the second area to adapt to the manufacturing requirements of packaging structures of different sizes, so that the unit areas on the substrate with different requirements or structures can simultaneously perform chip mounting processes, thereby improving the manufacturing efficiency of the packaging structure.

[0048] In some embodiments, the bosses 12 in all the bearing areas 11 in the disk body 10 have the same position within the bearing area 11; or, the bosses 12 in at least two of the bearing areas 11 have different positions within the bearing area 11.

[0049] In one example, the bosses 12 in all the bearing areas of the disk body 10 are located at the center of the bearing area 11, thereby simplifying the manufacturing process of the jig for reducing substrate warpage. In another example, at least one of the bosses 12 in the bearing area 11 is located at the center of the bearing area 11, and at least one of the bosses 12 in the bearing area 11 deviates from the center of the bearing area 11, so that the unit areas with different structures or functions can be mounted with the same or different chips at the same time, thereby improving the manufacturing efficiency and manufacturing flexibility of the packaging structure.

[0050] In some other embodiments, the substrate includes a plurality of chip mounting areas corresponding one-to-one to the plurality of the carrying areas 11 for mounting chips; the carrying area also includes:

[0051] The groove is located on the front side 101 of the disk body 10 , and the groove is sunken from the front side 101 of the disk body 10 toward the back side 102 of the disk body 10 , and the position of the groove corresponds to the position of the chip mounting area.

[0052] Specifically, the groove does not penetrate the disk body 10. The groove is recessed from the front side 101 of the disk body 10 toward the back side 102 of the disk body 10, so that there is a height difference between the bottom surface of the groove and the front side 101 of the disk body 10. After the substrate is placed on the disk body 10 of the carrier disk, the groove can make the chip mounting area on the substrate recessed. On the one hand, it is easy to identify the position of the chip mounting area in the chip mounting process, reducing the difficulty of alignment during the chip mounting process; on the other hand, the plurality of adsorption beads 20 distributed around the periphery of the bearing area 11 on the back side 102 of the disk body 10 cooperate with the groove, that is, the adsorption effect of the adsorption beads 20 makes the edge of the unit area in the substrate flattened, and the groove makes the chip mounting area recessed inward, effectively avoiding the problem of stretching of the conductive bumps in the middle and compression of the conductive bumps at the edge after chip mounting, further improving the chip mounting effect and improving the manufacturing yield of the packaging structure.

[0053] The jig for reducing substrate warping provided in this specific embodiment is configured by arranging a plurality of adsorption units corresponding to a plurality of bearing areas on the back side of a tray body of a carrier tray, and the adsorption units include a plurality of adsorption beads distributed around the orthographic projections of the bearing areas on the back side of the tray body, so that after placing the substrate on the carrier tray and covering the front side of the carrier tray with a cover plate, the adsorption force between the tray body of the carrier tray and the cover plate can be enhanced, thereby reducing or even avoiding deformation such as warping of the substrate during the chip mounting process, thereby improving the chip mounting efficiency and the manufacturing yield of the packaging structure. At the same time, since the multiple adsorption units on the back side of the disk body correspond one-to-one to the multiple bearing areas on the front side of the disk body, and the multiple adsorption beads in each adsorption unit are distributed around the corresponding bearing area, it is possible to apply an adsorption force to adsorb the cover plate around a single unit area on the substrate, thereby improving the warping of each unit area on the substrate, avoiding the problem of stretching, extrusion or bridging in the unit area during chip mounting, further improving the chip mounting efficiency, and improving the manufacturing yield of the packaging structure.

[0054] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A jig for reducing substrate warping, characterized in that: include: A material loading tray, comprising a tray body, the tray body comprising a front side and a back side that are relatively distributed, the front side of the tray body being used to load a substrate, the front side of the tray body being provided with a plurality of load-bearing areas, the back side of the tray body being provided with a plurality of adsorption units corresponding to the plurality of load-bearing areas one by one, the adsorption units comprising a plurality of adsorption beads distributed around the orthographic projection of the load-bearing areas on the back side of the tray body; The cover plate is used to cover the front side of the material loading tray, and the adsorption beads can adsorb the cover plate.

2. The jig for reducing substrate warpage according to claim 1, characterized in that: The adsorption beads are magnetic adsorption beads, and the cover plate is a ferromagnetic cover plate.

3. The jig for reducing substrate warpage according to claim 1, characterized in that: The cover plate includes a cover plate body and a plurality of openings located on the cover plate body, and the plurality of openings correspond one-to-one to the plurality of carrying areas on the material loading tray.

4. The jig for reducing substrate warpage according to claim 3, characterized in that: The adsorption beads are entirely or partially located on the orthographic projection of the cover body on the back surface of the disk body.

5. The jig for reducing substrate warpage according to claim 1, characterized in that: The front side of the disk body is provided with a plurality of the bearing areas arranged in an array and gap areas between adjacent bearing areas, and the adsorption beads are at least partially distributed in the orthographic projection of the gap areas on the back side; Adjacent adsorption units share a portion of the adsorption beads.

6. The jig for reducing substrate warpage according to claim 1, characterized in that: The substrate comprises a plurality of chip mounting areas corresponding one-to-one to the plurality of the carrying areas for mounting chips; The bearing area includes: A boss is protrudingly arranged on the front side of the disk body, and the boss is used to lift up the chip mounting area on the substrate corresponding to the bearing area.

7. The jig for reducing substrate warpage according to claim 6, characterized in that: The plurality of adsorption beads in the adsorption unit are symmetrically distributed around the center of an orthographic projection of the boss on the back side of the disk body.

8. The jig for reducing substrate warpage according to claim 6, characterized in that: The heights of the bosses in all the bearing areas of the disk body protruding from the front side of the disk body are the same.

9. The jig for reducing substrate warpage according to claim 6, characterized in that: The disk body includes a first area and a second area, each of the first area and the second area includes a plurality of the bearing areas, and a height of the boss in the bearing area in the first area protruding from the front side of the disk body is different from a height of the boss in the bearing area in the second area protruding from the front side of the disk body.

10. The jig for reducing substrate warpage according to claim 6, characterized in that: The bosses in all the bearing areas of the disk body are located at the same position within the bearing area; or, The bosses in at least two of the bearing areas are located at different positions within the bearing areas.

11. The jig for reducing substrate warpage according to claim 1, characterized in that: The substrate comprises a plurality of chip mounting areas corresponding one-to-one to the plurality of the carrying areas for mounting chips; The bearing area includes: The groove is located on the front side of the disk body, and the groove is recessed from the front side of the disk body toward the back side of the disk body. The position of the groove corresponds to the position of the chip mounting area corresponding to the carrying area.

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