Anti-skid spring ejector pin assembly for die bonding
By introducing anti-slip texture and tungsten carbide anti-slip layer into the thimble assembly and stabilizing the movement of the movable plate with the guide assembly, the problem of poor anti-slip effect of the thimble assembly in the prior art is solved, and the accuracy and quality of crystal solidification operation are significantly improved.
Patent Information
- Application Number
- CN202421900555.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-07
AI Technical Summary
The prior art thimble assembly is in contact with the wafer and lifting the wafer, and the anti-slip effect is poor, resulting in the wafer easily sliding or offset during the lifting process, affecting the accuracy and quality of the solid crystal operation.
An anti-slip spring thimble assembly for solid crystals is designed, which uses the anti-slip texture of the thimble body and the anti-slip layer made of tungsten carbide to increase friction, and ensures the stable movement of the movable plate through the guide assembly.
It effectively improves the friction between the thimble and the wafer, prevents the wafer from sliding or offsetting, and improves the accuracy and quality of solid crystal operation.
Smart Images
Figure CN222953070U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of spring ejector pins, in particular to a spring ejector pin assembly for anti-slip crystal bonding. Background Art
[0002] In semiconductor packaging, die bonding is a critical process. In this process, specific components are needed to accurately lift the wafer to achieve accurate wafer fixation and packaging. With the continuous development of semiconductor technology, the requirements for the accuracy, stability and efficiency of die bonding are becoming higher and higher.
[0003] At present, the ejector pin assembly used in the die bonding operation generally includes basic components such as an ejector pin barrel, a spring, a movable plate and an ejector pin body, etc. These ejector pin assemblies can accomplish the task of lifting the wafer to a certain extent.
[0004] In the process of the ejector pin contacting and lifting the wafer, the ejector pin assembly in the prior art is prone to poor anti-slip effect. This will cause the wafer to slide or deflect during the lifting process, thereby affecting the accuracy and quality of the die bonding operation, reducing production efficiency and product qualification rate. Therefore, an anti-slip spring ejector pin assembly for die bonding is proposed to solve the above problem. Utility Model Content
[0005] In order to make up for the above shortcomings, the utility model provides a spring ejector assembly for anti-slip crystal bonding, which aims to improve the problem that the ejector assembly in the prior art is prone to poor anti-slip effect during the process of the ejector contacting and lifting the wafer, which may cause the wafer to slide or deflect during the lifting process.
[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a spring ejector assembly for anti-skid crystal bonding, comprising an ejector cylinder, the inner wall of the ejector cylinder is slidably connected to a movable plate, one end of the movable plate is fixedly connected to a spring body, the other end of the movable plate is fixedly connected to a connecting rod, one end of the connecting rod is fixedly connected to an ejector body, the top of the ejector body is provided with an anti-skid texture, the outer side of the ejector body is provided with an anti-skid layer, the outer side of the movable plate is provided with a guide assembly, and the guide assembly is used to provide guidance when the movable plate moves.
[0007] As a further description of the above technical solution:
[0008] The guide assembly comprises two guide plates, the outer sides of the two guide plates are fixedly connected to the outer side of the movable plate, and the inner wall of the ejector cylinder is provided with two guide grooves.
[0009] As a further description of the above technical solution:
[0010] The guide plates match the shapes of the guide grooves, and the outer sides of the two guide plates are respectively slidably connected to the inner walls of the corresponding guide grooves.
[0011] As a further description of the above technical solution:
[0012] The outer side of the connecting rod is slidably connected to the through hole of the ejector cylinder.
[0013] As a further description of the above technical solution:
[0014] One end of the spring body is fixedly connected to the inner wall of the ejector cylinder, and the outer side of the spring body is slidably connected to the inner wall of the ejector cylinder.
[0015] As a further description of the above technical solution:
[0016] The anti-slip layer is made of tungsten carbide.
[0017] As a further description of the above technical solution:
[0018] The outer side of the ejector cylinder is fixedly connected with a fixing piece.
[0019] As a further description of the above technical solution:
[0020] An installation groove is formed at one end of the ejector cylinder close to the fixing piece.
[0021] The utility model has the following beneficial effects:
[0022] 1. In the utility model, when it is necessary to lift the wafer, the ejector pin body contacts the wafer and is subjected to pressure. The anti-skid texture on the top of the ejector pin body and the anti-skid layer of tungsten carbide material on the outside can increase the friction between the contacted wafer and the ejector pin body, thereby achieving a good anti-skid effect.
[0023] 2. In the present invention, during the movement of the movable plate, the guide plate slides in the guide groove to provide guidance for the movement of the movable plate, thereby ensuring the stability and linearity of its movement and preventing the movable plate from deflecting or shaking. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 A three-dimensional diagram of a spring ejector assembly for anti-slip crystal bonding proposed by the utility model;
[0025] Figure 2 This is a schematic diagram of the installation groove structure of a spring ejector assembly for anti-slip crystal bonding proposed by the utility model;
[0026] Figure 3 This is a schematic diagram of the connecting rod structure of a spring ejector assembly for anti-slip crystal bonding proposed by the utility model;
[0027] Figure 4for Figure 3 A enlarged view in;
[0028] Figure 5 This is a schematic diagram of the anti-skid groove structure of a spring ejector assembly for anti-skid die bonding proposed by the utility model;
[0029] Figure 6 This is a schematic diagram of the structure of a movable plate of a spring ejector assembly for anti-slip crystal bonding proposed by the utility model;
[0030] Figure 7 for Figure 6 B is an enlarged view of .
[0031] Legend:
[0032] 1. Ejector cylinder; 2. Fixing piece; 3. Mounting groove; 4. Ejector body; 5. Connecting rod; 6. Spring body; 7. Movable plate; 8. Guide plate; 9. Guide groove; 10. Anti-slip texture; 11. Anti-slip layer. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] Reference Figure 3 , Figure 5 and Figure 6 The utility model provides an embodiment: a spring ejector assembly for anti-skid crystal bonding, including an ejector cylinder 1, the inner wall of the ejector cylinder 1 is slidably connected with a movable plate 7, one end of the movable plate 7 is fixedly connected with a spring body 6, one end of the spring body 6 is fixedly connected to the inner wall of the ejector cylinder 1, the outer side of the spring body 6 is slidably connected to the inner wall of the ejector cylinder 1, the other end of the movable plate 7 is fixedly connected with a connecting rod 5, one end of the connecting rod 5 is fixedly connected with an ejector body 4, the outer side of the connecting rod 5 is slidably connected to the through hole of the ejector cylinder 1, the top of the ejector body 4 is provided with an anti-skid texture 10, the outer side of the ejector body 4 is provided with an anti-skid layer 11, and the anti-skid layer 11 is made of tungsten carbide.
[0035] Specifically, when the wafer needs to be lifted, the ejector body 4 first contacts the wafer, wherein the anti-skid texture 10 can increase the contact area with the wafer surface and improve the friction. The tungsten carbide anti-skid layer 11 provides additional hardness and wear resistance to ensure that the wafer surface will not be scratched during the lifting process, while further enhancing the anti-skid effect. As the ejector body 4 is subjected to the reaction force of the wafer, it is quickly transmitted to the movable plate 7 through the connecting rod 5, and the movable plate 7 squeezes the spring body 6. As the movable plate 7 continues to move downward, the ejector body 4 gradually penetrates under the wafer until the wafer is lifted to a predetermined position.
[0036] Reference Figure 1 , Figure 2 and Figure 3 A guide assembly is provided on the outer side of the movable plate 7, and the guide assembly is used to provide guidance when the movable plate 7 moves. The guide assembly includes two guide plates 8, and the outer sides of the two guide plates 8 are fixedly connected to the outer side of the movable plate 7. The inner wall of the ejector cylinder 1 is provided with two guide grooves 9, and the shapes of the guide plates 8 and the guide grooves 9 are matched. The outer sides of the two guide plates 8 are respectively slidably connected to the inner walls of the corresponding guide grooves 9.
[0037] Specifically, the spring body 6 is compressed when the movable plate 7 moves. During the movement of the movable plate 7, the guide plate 8 slides in the guide groove 9 to provide guidance for the movement of the movable plate 7, ensuring the stability and linearity of its movement and preventing the movable plate 7 from deflecting or shaking. At the same time, during the resetting process of the movable plate 7, the guide plate 8 continues to slide in the guide groove 9 to provide stable guidance for the resetting of the movable plate 7, so that the ejector body 4 can smoothly return to the initial position along the same trajectory as when it was ejected.
[0038] Reference Figure 1 and Figure 2 A fixing piece 2 is fixedly connected to the outer side of the ejector tube 1, and a mounting groove 3 is provided at one end of the ejector tube 1 close to the fixing piece 2.
[0039] Specifically, the fixing member 2 is used to fix the entire ejector assembly on a corresponding device or apparatus, and the mounting groove 3 is convenient for matching and installing with the mounting component.
[0040] Working principle: When it is necessary to lift the wafer, the ejector body 4 contacts the wafer and is subjected to pressure. The anti-skid texture 10 on the top of the ejector body 4 and the anti-skid layer 11 made of tungsten carbide on the outside can increase the friction between the contacted wafer and the ejector body 4, thereby achieving a good anti-skid effect. The ejector body 4 will be subjected to pressure and push the connecting rod 5, which in turn pushes the movable plate 7 to slide in the ejector tube 1. The spring body 6 is compressed when the movable plate 7 moves. During the movement of the movable plate 7, the guide plate 8 slides in the guide groove 9 to provide guidance for the movement of the movable plate 7, thereby ensuring the stability and linearity of its movement and preventing the movable plate 7 from deflecting or shaking.
[0041] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A spring ejector assembly for anti-slip die bonding, comprising an ejector cylinder (1), characterized in that: The inner wall of the ejector cylinder (1) is slidably connected to a movable plate (7), one end of the movable plate (7) is fixedly connected to a spring body (6), the other end of the movable plate (7) is fixedly connected to a connecting rod (5), one end of the connecting rod (5) is fixedly connected to an ejector body (4), the top of the ejector body (4) is provided with an anti-slip texture (10), the outer side of the ejector body (4) is provided with an anti-slip layer (11), and the outer side of the movable plate (7) is provided with a guide component, the guide component is used to provide guidance when the movable plate (7) moves.
2. The anti-slip spring pin assembly for die bonding according to claim 1, characterized in that: The guide assembly comprises two guide plates (8), the outer sides of the two guide plates (8) are fixedly connected to the outer side of the movable plate (7), and the inner wall of the ejector cylinder (1) is provided with two guide grooves (9).
3. The anti-slip spring ejector pin assembly for die bonding according to claim 2, characterized in that: The guide plates (8) match the shapes of the guide grooves (9), and the outer sides of the two guide plates (8) are respectively slidably connected to the inner walls of the corresponding guide grooves (9).
4. The anti-slip spring ejector pin assembly for die bonding according to claim 1, characterized in that: The outer side of the connecting rod (5) is slidably connected to the through hole of the ejector cylinder (1).
5. The anti-slip spring ejector pin assembly for die bonding according to claim 1, characterized in that: One end of the spring body (6) is fixedly connected to the inner wall of the ejector cylinder (1), and the outer side of the spring body (6) is slidably connected to the inner wall of the ejector cylinder (1).
6. The anti-slip spring ejector pin assembly for die bonding according to claim 1, characterized in that: The anti-slip layer (11) is made of tungsten carbide.
7. The anti-slip spring ejector pin assembly for die bonding according to claim 1, characterized in that: A fixing piece (2) is fixedly connected to the outer side of the ejector cylinder (1).
8. The anti-slip spring ejector pin assembly for die bonding according to claim 1, characterized in that: An installation groove (3) is formed at one end of the ejector cylinder (1) close to the fixing member (2).