Power semiconductor module

Abstract

The utility model belongs to the technical field of power electronics, and discloses a power semiconductor module. The power semiconductor module includes a housing and a heat dissipation base plate. A mounting space with adjustable length or width is arranged in the shell, a plurality of mounting positions are arranged on the side wall of the shell, a connecting guide sheet is arranged in each mounting position, one end of each connecting guide sheet is used as a connecting end, and the other end of each connecting guide sheet is used as a bonding end; the heat dissipation bottom plate is arranged on the bottom wall of the installation space and seals the shell, a plurality of ceramic substrates are arranged on the heat dissipation bottom plate, and the ceramic substrates are located in the installation space and provided with circuits bonded with the bonding ends. Therefore, in the testing process of the power semiconductor module, the size of the installation space in the shell can be flexibly adjusted according to the testing result, the universality of the shell is improved, meanwhile, development of a plurality of molds can be avoided, the manufacturing cost in the testing stage is effectively reduced, and time is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to a power semiconductor module. Background Art

[0002] During the design and manufacturing process of power semiconductor modules, ceramic substrates will be installed inside the module housing. The number and layout of ceramic substrates in the module housing will directly affect the power density, heat dissipation and overall performance of the power semiconductor module. Therefore, efficiently and accurately forming the module housing is a key link to ensure that the power semiconductor module maintains a high quality.

[0003] In the prior art, when testing a power semiconductor module, a mold is developed according to the number and layout of ceramic substrates required in the power semiconductor module, and the corresponding module housing is generated by mold injection molding to achieve efficient and accurate formation of the module housing.

[0004] However, after the module housing is injection molded, the connecting guide plate needs to be fixedly set according to the layout of the ceramic substrate. Since the size of the module housing cannot be adjusted, the connecting guide plate is also difficult to disassemble and adjust. Therefore, when the number and layout of the ceramic substrates need to be changed after testing the power semiconductor module, it is necessary to develop a new mold for forming the module housing, and the mold housing cannot be reused, resulting in poor versatility of the module housing and the mold. At the same time, multiple molds need to be developed when manufacturing the power semiconductor module, which increases the manufacturing cost and consumes more time. Utility Model Content

[0005] The purpose of the utility model is to provide a power semiconductor module, which solves the problems in the prior art that the module housing and mold of the power semiconductor module have poor universality and need to develop multiple molds, resulting in increased manufacturing costs and more time-consuming testing.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a power semiconductor module, which includes:

[0008] A housing, wherein the housing has an installation space with adjustable length or width, wherein a plurality of installation positions are provided on a side wall of the housing, wherein a connecting guide is provided in each installation position, wherein one end of the connecting guide extends out of the housing as a connecting end, and the other end extends into the installation space as a bonding end;

[0009] A heat dissipation base plate is arranged on the bottom wall of the installation space and closes the shell. A plurality of ceramic substrates are arranged on the heat dissipation base plate. The ceramic substrates are located in the installation space and have circuits bonded to the bonding ends. Each of the ceramic substrates has a plurality of connection terminals distributed at intervals. The connection terminals extend out of the installation space away from a side of the heat dissipation base plate.

[0010] Optionally, the shell includes two oppositely arranged fixed plates and two oppositely arranged telescopic parts, the two telescopic parts are located between the two fixed plates, the two telescopic parts are connected end to end with the two fixed plates in sequence to enclose the installation space, and the telescopic parts can be extended and retracted to adjust the distance between the two fixed plates to change the length or width of the installation space.

[0011] Optionally, each of the telescopic members is provided with a plurality of mounting positions for mounting the connecting guides, and the connecting terminals are arranged close to the fixing plate.

[0012] Optionally, each of the fixing plates is provided with a plurality of mounting positions for mounting the connecting guides, and the connecting terminals are arranged close to the telescopic members.

[0013] Optionally, the telescopic member comprises:

[0014] A plurality of telescopic plates are movably connected in sequence, and at least part of the plurality of telescopic plates can be unfolded in sequence to adjust the distance between two relatively fixed plates.

[0015] Optionally, a plurality of the telescopic plates are slidably connected in sequence.

[0016] Optionally, a sliding cavity is provided in the telescopic plate, and adjacent telescopic plates are slidably connected in the sliding cavity.

[0017] Optionally, each of the telescopic plates is provided with a locking hole, and the adjacent telescopic plates have an insertion hole corresponding to and connected to the locking hole, and a locking piece is inserted in the locking hole, and the locking piece can be inserted in the insertion hole to lock the two adjacent telescopic plates.

[0018] Optionally, the shell includes four telescopic parts, and the four telescopic parts are connected end to end in sequence to enclose and form the installation space.

[0019] Optionally, the connecting terminal is made of copper sheet; and / or,

[0020] The circuit is bonded to the connecting lead through an aluminum wire.

[0021] Beneficial effects of the utility model:

[0022] By setting an installation space with adjustable length or width in the shell, the size of the installation space can be flexibly adjusted according to the number and layout of the ceramic substrates to ensure that the shell can efficiently and accurately form the corresponding installation space. When the installation space is changed, the heat dissipation base plate can maintain the closure of the shell to ensure stable and reliable support and heat dissipation effect for the ceramic substrate. After the ceramic substrate is installed, the circuit it has can be bonded and connected with the bonding end of the connecting guide, the connecting guide can be connected to the external circuit, and the connecting terminal set on the ceramic substrate can also connect the circuit on the ceramic substrate to the external circuit. At this time, the power semiconductor module can be tested. After the test is completed, the number and layout of the ceramic substrates can be adjusted according to the test results. At the same time, the size of the installation space can be adjusted accordingly to reinstall the ceramic substrate for testing again until the test results meet the requirements. In this way, during the test process, the power semiconductor module can flexibly adjust the size of the installation space inside the shell according to the test results. While improving the versatility of the shell, it can also avoid the development of multiple molds, thereby effectively reducing the manufacturing cost of the test stage and saving time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic structural diagram of a telescopic member of a power semiconductor module of an embodiment of the utility model when it is extended;

[0024] Figure 2 It is a schematic structural diagram of a telescopic member of a power semiconductor module in an embodiment of the utility model when it is contracted.

[0025] In the figure:

[0026] 1. Shell; 11. Installation space; 12. Fixing plate; 13. Telescopic member; 2. Heat dissipation base plate; 3. Connecting guide; 4. Ceramic substrate; 5. Connecting terminal. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0028] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0031] An embodiment of the utility model provides a power semiconductor module.

[0032] Embodiment 1

[0033] Reference Figure 1 and Figure 2 The power semiconductor module includes a housing 1 and a heat dissipation base plate 2. The housing 1 has an installation space 11 with adjustable length or width. The side wall of the housing 1 has multiple installation positions, each of which is provided with a connecting guide 3, one end of which extends out of the housing 1 as a connecting end, and the other end extends into the installation space 11 as a bonding end; the heat dissipation base plate 2 is arranged on the bottom wall of the installation space 11 and closes the housing 1, and multiple ceramic substrates 4 are arranged on the heat dissipation base plate 2, the ceramic substrates 4 are located in the installation space 11 and have circuits bonded to the bonding end, and each ceramic substrate 4 is spaced apart with multiple connection terminals 5, and the connection terminal 5 extends out of the installation space 11 away from the side of the heat dissipation base plate 2.

[0034] Specifically, the shell 1 can be spliced ​​and its shape can be rectangular, circular, elliptical, etc. Its two opposite side walls can be close to or far away from each other, so that the length or width of the installation space 11 can be adjusted, or the length and width of the installation space 11 can be adjusted at the same time to achieve adjustment of the installation space 11 within a larger range.

[0035] Mounting positions are set on two opposite side walls of the shell 1, and multiple mounting positions are spaced apart on each side wall. A connecting guide 3 is installed corresponding to each mounting position. The connecting guide 3 is made of metal material, such as copper sheet, etc. The connecting guide 3 can be pre-buried in the side wall of the shell 1, and the side wall can be formed by injection molding, so that the connecting guide 3 does not need to be fixed and installed later, which simplifies the installation process of the connecting guide 3.

[0036] A hole may be provided on the side wall of the housing 1 as a mounting position, and the connecting guide 3 may be inserted into the mounting position, and the connecting guide 3 may be fixed to the housing 1. The upper end of the connecting guide 3 extends out of the side wall of the housing 1 as a connecting end, and the connecting end may be electrically connected to an external circuit. The lower end of the connecting guide 3 is bent so that the connecting guide 3 is L-shaped, and the lower end thereof is bent and extends into the mounting space 11 as a bonding end.

[0037] The heat dissipation base plate 2 is fixed to the bottom wall of the shell 1, and the cross-sectional area of ​​the heat dissipation base plate 2 is larger than the cross-sectional area of ​​the shell 1 to close the shell 1. The heat dissipation base plate 2 can be bonded and fixed to the shell 1, or a detachable connection can be formed through a snap-on structure, so as to adjust the size of the heat dissipation base plate 2 as the size of the installation space 11 changes. The heat dissipation base plate 2 is made of a material with a high thermal conductivity, such as a metal material. A ceramic substrate 4 is set on the top wall of the heat dissipation base plate 2. A plurality of ceramic substrates 4 can be set, and the number and layout can be designed according to actual needs. The size of the installation space 11 can be adjusted according to the number and layout of the ceramic substrates 4, ensuring that the ceramic substrates 4 are bonded to the corresponding connecting guides 3. In this embodiment, the circuit on the ceramic substrate 4 is bonded to the bonding end of the connecting guide 3 through an aluminum wire.

[0038] A plurality of connection terminals 5 are arranged on each ceramic substrate 4. The plurality of connection terminals 5 can be grouped into two. The two connection terminals 5 in a group are arranged opposite to each other and are respectively located at the edge positions of the ceramic substrate 4. The two opposite connection terminals 5 are both close to the side wall of the shell 1 where the connection guide 3 is not arranged. In the present embodiment, the connection terminals 5 are made of copper sheets, and a group of connection terminals 5 is arranged on each ceramic substrate 4.

[0039] By providing an installation space 11 with adjustable length or width in the housing 1 , the size of the installation space 11 can be flexibly adjusted according to the number and layout of the ceramic substrates 4 to ensure that the housing 1 can efficiently and accurately form the corresponding installation space 11 .

[0040] When the installation space 11 is changed, the heat dissipation base plate 2 can maintain the closure of the housing 1, ensuring stable and reliable support and heat dissipation effect for the ceramic substrate 4. After the ceramic substrate 4 is installed, the circuit it has can be bonded and connected with the bonding end of the connecting guide 3, and the connecting guide 3 can be connected to the external circuit, and the connecting terminal 5 set on the ceramic substrate 4 can also connect the circuit on the ceramic substrate 4 with the external circuit. At this time, the power semiconductor module can be tested. After the test is completed, the number and layout of the ceramic substrates 4 can be adjusted according to the test results. At the same time, the size of the installation space 11 can be adjusted accordingly to reinstall the ceramic substrate 4 for testing again until the test results meet the requirements. In this way, during the test process, the power semiconductor module can flexibly adjust the size of the installation space 11 inside the housing 1 according to the test results. While improving the versatility of the housing 1, it can also avoid the development of multiple molds, thereby effectively reducing the manufacturing cost of the test stage and saving time.

[0041] Optionally, the shell 1 includes two oppositely arranged fixed plates 12 and two oppositely arranged telescopic parts 13, the two telescopic parts 13 are located between the two fixed plates 12, the two telescopic parts 13 are connected end to end with the two fixed plates 12 in sequence to enclose an installation space 11, and the telescopic parts 13 can be extended and retracted to adjust the distance between the two fixed plates 12 to change the length or width of the installation space 11.

[0042] Specifically, taking the telescopic member 13 extending and retracting along the length direction of the installation space 11 as an example, that is, the fixed plate 12 serves as the wide side of the installation space 11, the telescopic member 13 can change the length of the installation space 11 by extending and retracting. Two fixed plates 12 are arranged opposite to each other, one of which is fixedly connected to one end of the telescopic member 13, and the other fixed plate 12 is fixedly connected to the other end of the telescopic member 13, and the fixing method can be one-piece molding, or can be bonding or welding. The telescopic member 13 itself can be expanded or contracted by folding, or expanded or contracted by sliding, and it only needs to be able to adjust the length of both ends.

[0043] By providing the telescopic member 13 , when the installation space 11 needs to be adjusted, the length of the telescopic member 13 can be adjusted, thereby correspondingly changing the distance between the two fixing plates 12 , and thus adjusting the length or width of the installation space 11 accordingly.

[0044] Optionally, in one embodiment, each fixing plate 12 is provided with a plurality of mounting positions for mounting the connecting guides 3 , and the connecting terminals 5 are arranged close to the telescopic members 13 .

[0045] Specifically, the fixing plate 12 can be injection molded, and a plurality of connecting guides 3 are embedded in the fixing plate 12, so that after the fixing plate 12 is formed, the connecting guides 3 are directly fixed in the fixing plate 12 to reduce the installation operation of the connecting guides 3. The telescopic member 13 no longer needs to reserve an installation position, which can also simplify the production process of the telescopic member 13 and reduce the production difficulty of the telescopic member 13. The connecting terminal 5 is arranged close to the telescopic member 13, so that the connecting terminal 5 and the connecting guide 3 are staggered in layout to avoid interference between the two when connected to the external circuit.

[0046] Optionally, in another embodiment, each telescopic member 13 is provided with a plurality of mounting positions for mounting the connecting guides 3 , and the connecting terminals 5 are arranged close to the fixing plate 12 .

[0047] Specifically, a plurality of holes are provided at intervals on the telescopic member 13 as installation positions, and when the telescopic member 13 is unfolded, the corresponding installation positions can be exposed, so that the connecting guide piece 3 can be arranged in the corresponding installation positions, and when the telescopic member 13 is retracted, the plurality of installation positions can overlap, so that the retracted installation positions can also be equipped with the connecting guide piece 3. The connecting terminal 5 is arranged close to the fixed plate 12, so that the connecting terminal 5 and the connecting guide piece 3 are staggered in layout to avoid interference between the two when connected to the external circuit.

[0048] Optionally, the telescopic member 13 includes a plurality of telescopic plates movably connected in sequence, wherein at least a portion of the plurality of telescopic plates can be unfolded in sequence to adjust the distance between the two relatively fixed plates 12 .

[0049] Specifically, the telescopic plate can be in a cubic shape, such as a rectangular parallelepiped, and multiple telescopic plates can be slidably connected in sequence. When the telescopic member 13 is extended, the multiple telescopic plates slide out and expand, and when the telescopic member 13 is retracted, the multiple telescopic plates slide in and contract. Multiple telescopic plates can also be hinged end to end in sequence. When the telescopic member 13 is extended, the narrow surfaces of the multiple telescopic plates are sequentially fitted and expanded, and when the telescopic member 13 is retracted, the wide surfaces of the multiple telescopic plates are sequentially fitted and folded, so that the telescopic member 13 can be telescoped. A buckle or other structure can also be provided between two adjacent telescopic plates to lock the expansion or folding between the two telescopic plates.

[0050] Optionally, a plurality of telescopic plates are slidably connected in sequence.

[0051] Specifically, the multiple telescopic plates can be connected in sequence, so that the multiple telescopic plates form a layout from the outside to the inside, wherein the outermost and innermost two telescopic plates are respectively fixedly connected to the two fixed plates 12, and a cavity can be set in each telescopic plate for the adjacent telescopic plates to slide. The sides of the multiple telescopic plates can also be slidably connected in sequence, that is, the multiple telescopic plates are stacked in the thickness direction when they are in the contracted state, and when the telescopic member 13 is extended, the multiple telescopic plates can be staggered and pulled out in sequence.

[0052] Optionally, a sliding cavity is provided in the telescopic plate, and adjacent telescopic plates are slidably connected in the sliding cavity.

[0053] Specifically, in this embodiment, a plurality of telescopic plates are arranged in a sleeve-connected manner, a sliding cavity is provided in the telescopic plate, the sliding cavity extends along the sliding direction of the telescopic plate, adjacent telescopic plates are slidably connected in the sliding cavity, and the depth of the sliding cavity is greater than or equal to the length of the telescopic plate, so that when retracted, the adjacent telescopic plates can completely slide into the sliding cavity. The outer wall of the telescopic plate can slide and fit with the cavity of the sliding cavity, so that the telescopic plate and the sliding cavity form a surface fit to guide the sliding telescopic plate and reduce the possibility of its deviation. The innermost telescopic plate is solid and does not have a cavity, so that the strength of the entire telescopic member 13 can meet the requirements.

[0054] Optionally, each telescopic plate is provided with a locking hole (not shown in the figure), and the adjacent telescopic plates have a socket (not shown in the figure) corresponding to the locking hole, and a locking piece (not shown in the figure) is inserted in the locking hole, which can be inserted in the socket to lock the two adjacent telescopic plates.

[0055] Specifically, the locking hole can be provided on one side of the telescopic plate close to the opening of the sliding cavity, and two jacks can be arranged at intervals along the sliding direction of the telescopic plate, and the two jacks are respectively located at the edges of the telescopic plate, so that when the telescopic plate completely slides into the sliding cavity or completely slides out of the sliding cavity, the corresponding jacks can be connected to the locking hole, and at this time, the locking member is inserted into the locking hole and the jack to lock the two adjacent telescopic plates together. The jacks can also be distributed at intervals so that the adjacent telescopic plates can be locked with the telescopic plates after sliding out any length, so as to further improve the flexibility of the telescopic member 13. The locking member can be a latch, a screw, or other structures that can achieve locking, and the utility model does not limit this.

[0056] Embodiment 2

[0057] Based on the first embodiment, the difference between this embodiment and the first embodiment lies in the different structure of the housing 1.

[0058] Optionally, the housing 1 includes four telescopic members 13 , and the four telescopic members 13 are sequentially connected end to end to enclose and form an installation space 11 .

[0059] Specifically, the housing 1 is formed by enclosing four telescopic members 13, and two opposite telescopic members 13 can be synchronously telescoped, so that the length and width dimensions of the housing 1 can be adjusted, so that the installation space 11 can be adjusted within a larger range, which is conducive to further improving the versatility of the housing 1. The telescopic members 13 can refer to the telescopic members 13 in the first embodiment, and the utility model will not be repeated here.

[0060] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A power semiconductor module, characterized in that include: A shell (1), wherein the shell (1) has an installation space (11) with adjustable length or width, a plurality of installation positions are provided on a side wall of the shell (1), a connecting guide (3) is provided in each of the installation positions, one end of the connecting guide (3) extends out of the shell (1) as a connecting end, and the other end extends into the installation space (11) as a bonding end; A heat dissipation base plate (2) is arranged on the bottom wall of the installation space (11) and closes the housing (1); a plurality of ceramic substrates (4) are arranged on the heat dissipation base plate (2); the ceramic substrates (4) are located in the installation space (11) and have circuits bonded to the bonding ends; each of the ceramic substrates (4) has a plurality of connection terminals (5) distributed at intervals; the connection terminals (5) extend out of the installation space (11) on a side away from the heat dissipation base plate (2).

2. The power semiconductor module according to claim 1, characterized in that: The housing (1) comprises two oppositely arranged fixed plates (12) and two oppositely arranged telescopic members (13); the two telescopic members (13) are located between the two fixed plates (12); the two telescopic members (13) and the two fixed plates (12) are connected end to end in sequence to enclose the installation space (11); the telescopic members (13) can be telescoped to adjust the distance between the two fixed plates (12) to change the length or width of the installation space (11).

3. The power semiconductor module according to claim 2, characterized in that: Each of the telescopic members (13) is provided with a plurality of mounting positions for mounting the connecting guides (3), and the connecting terminals (5) are arranged close to the fixing plate (12).

4. The power semiconductor module according to claim 2, characterized in that: Each of the fixing plates (12) is provided with a plurality of mounting positions for mounting the connecting guides (3), and the connecting terminals (5) are arranged close to the telescopic members (13).

5. The power semiconductor module according to claim 2, characterized in that: The telescopic member (13) comprises: A plurality of telescopic plates are movably connected in sequence, and at least part of the plurality of telescopic plates can be unfolded in sequence to adjust the distance between two relatively fixed plates (12).

6. The power semiconductor module according to claim 5, characterized in that: The plurality of telescopic plates are slidably connected in sequence.

7. The power semiconductor module according to claim 6, characterized in that: The telescopic plate has a sliding cavity inside, and the adjacent telescopic plates are slidably connected in the sliding cavity.

8. The power semiconductor module according to claim 6, characterized in that: Each of the telescopic plates is provided with a locking hole, and adjacent telescopic plates have insertion holes corresponding to and connected to the locking holes. A locking piece is inserted into the locking hole, and the locking piece can be inserted into the insertion hole to lock the two adjacent telescopic plates.

9. The power semiconductor module according to claim 1, characterized in that: The housing (1) comprises four telescopic parts (13), and the four telescopic parts (13) are sequentially connected end to end to enclose and form the installation space (11).

10. The power semiconductor module according to any one of claims 1 to 9, characterized in that: The connecting terminal (5) is made of copper sheet; and / or, The circuit is bonded to the connecting conductor (3) via an aluminum wire.

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