VCSEL laser packaging structure

Abstract

The utility model discloses a VCSEL laser packaging structure, which comprises a substrate and a supporting seat, the supporting seat is connected to the top of the substrate, a VCSEL chip is integrated on the top of the substrate, the inner wall of the supporting seat is connected with a reflective wall, the interior of the supporting seat is connected with a diffuser, the diffuser is located at the top of the VCSEL chip, and the reflective wall is connected with the VCSEL chip. And the inner wall of the supporting base is provided with movable grooves which are evenly distributed, and the inner walls of the movable grooves are rotationally connected with limiting bases. According to the utility model, the diffuser is packaged and connected through the rotatable limiting seat, so that the connection of glue to the diffuser can be replaced, the stability and durability of the connection of the diffuser are improved, and meanwhile, heat dissipation in the VCSEL laser is realized through the heat dissipation holes, so that the service life of the VCSEL laser is prolonged. And the electromagnetic ring and the magnetic ring are matched for use, so that heat dissipation is not affected when the VCSEL laser operates, heat dissipation holes are shielded when the VCSEL laser is in a standing state, and dust or other factors can be prevented from affecting operation of the VCSEL laser in cooperation with a filter screen.

Description

Technical Field

[0001] The utility model relates to the technical field of laser packaging, and more specifically to a VCSEL laser packaging structure. Background Art

[0002] VCSEL, or vertical surface laser emitter, is a semiconductor whose laser is emitted perpendicular to the top surface. Unlike other light sources such as LED and LD, it has the advantages of small size, circular output spot, single longitudinal mode output, small threshold current, low price and easy integration of large-area arrays. It is widely used in optical communications, optical interconnection and optical storage.

[0003] In the existing VCSEL packaging structure, an engineering beam expander is generally used for beam expansion. The function of the engineering beam expander is to diffuse the light emitted by the VCSEL to prevent the light beam from being too concentrated. Generally, the engineering beam expander is a plate-like structure, and is usually connected to the supporting components in the packaging structure by bonding, and is set above the VCSEL chip.

[0004] However, with this connection method, when the connecting glue between the beam expander and the supporting structure fails, the engineering beam expander is easy to fall off. Once the beam expander falls off, the laser will be directly emitted without diffusion. The intensity of the undiffused laser is very high and it is easy to cause damage to the human eye.

[0005] After searching, it was found that the patent application number CN202221798209.3 discloses a packaging structure of a VCSEL laser, including: a substrate; a support member, the support member is mounted on the substrate, the support member is provided with a positioning groove, the positioning groove includes a guide groove and a locking groove, the guide groove and the locking groove are connected; a VCSEL chip, the VCSEL chip is mounted on the substrate; a diffuser, the diffuser is provided with a connecting bump, and the connecting bump is connected to the locking groove. The utility model reduces the probability of the diffuser falling off from the support member, thereby solving the problem that the diffuser is easy to fall off and cause laser eye injury.

[0006] This structure achieves the limitation of the diffuser by connecting a protrusion to the diffuser to engage in the locking groove instead of the sealant. However, the diffuser needs to be processed separately in this structure to destroy the integrity of the diffuser. At the same time, the multiple groups of extended protrusions have poor strength and are easily damaged when connected to the support base. At the same time, the heat dissipation holes in this structure are continuously open, and the inside of the laser is easily affected by dust or temperature and humidity. Therefore, the professionals provide a VCSEL laser packaging structure to solve the above-mentioned problems. Utility Model Content

[0007] In view of the problems existing in the prior art, the purpose of the utility model is to provide a VCSEL laser packaging structure, which uses a rotatable limit seat to package and connect the diffuser, replacing the connection of the diffuser with glue, thereby improving the stability and durability of the diffuser connection.

[0008] To achieve the above purpose, the utility model adopts the following technical solution.

[0009] The VCSEL laser packaging structure comprises a substrate and a support seat, wherein the support seat is connected to the top of the substrate, a VCSEL chip is integrated on the top of the substrate, a reflective wall is connected to the inner wall of the support seat, a diffuser is connected inside the support seat, the diffuser is located on the top of the VCSEL chip, evenly distributed movable grooves are opened on the inner wall of the support seat, a limiting seat is rotatably connected to the inner wall of the movable groove, the limiting seat is located on the top of the diffuser, the interior of the movable groove is filled with sealant, and a heat dissipation component is arranged at the bottom of the substrate.

[0010] As a further description of the above technical solution: the heat dissipation assembly includes a mounting groove, which is opened on the top of the substrate, and the inner bottom wall of the mounting groove is provided with evenly distributed heat dissipation holes, and the bottom ends of the heat dissipation holes pass through and extend to the bottom of the substrate, and a movable plate is slidably connected to the inner wall of the mounting groove, and the movable plate is provided with evenly distributed through holes, and an electromagnetic ring is installed on the inner wall of the mounting groove, and the bottom of the electromagnetic ring is magnetically connected to a magnetic ring, and the magnetic ring is installed on the top of the movable plate.

[0011] As a further description of the above technical solution: the through hole is located on the top of the heat dissipation hole and is staggered with the heat dissipation hole.

[0012] As a further description of the above technical solution: a guide block is fixedly connected to the movable plate, and the guide block is slidably connected to the inner wall of the installation groove.

[0013] As a further description of the above technical solution: a filter is arranged inside the heat dissipation hole, and the filter is detachably connected to the inner wall of the heat dissipation hole.

[0014] As a further description of the above technical solution: a rotating shaft is rotatably connected to the inner wall of the movable groove, the limiting seat is connected to the rotating shaft, and the rotating shaft is wrapped with sealant.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] In the utility model, the diffuser is packaged and connected by a rotatable limit seat, so that the connection of the diffuser with glue can be replaced, thereby improving the stability and durability of the diffuser connection, and at the same time, the heat dissipation inside the VCSEL laser is achieved through the heat dissipation holes. The coordinated use of the electromagnetic ring and the magnetic ring can not affect the heat dissipation when the VCSEL laser is in operation, and the heat dissipation holes can be blocked when the VCSEL laser is in a static state. The filter can be used to prevent dust or other factors from affecting the operation of the VCSEL laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model;

[0019] Figure 3 For the utility model Figure 2 The enlarged structural diagram at A in the middle;

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the movable plate of the utility model;

[0021] Figure 5 It is a schematic diagram of the top structure of the utility model.

[0022] Description of the numbers in the figure:

[0023] 1. Substrate; 2. Support seat; 3. VCSEL chip; 4. Reflective wall; 5. Diffuser; 6. Movable groove; 7. Limit seat; 8. Sealant; 9. Heat dissipation assembly; 901. Mounting groove; 902. Heat dissipation hole; 903. Movable plate; 904. Through hole; 905. Electromagnetic ring; 906. Magnetic ring; 10. Guide block; 11. Filter; 12. Rotating shaft. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0025] See also Figures 1 to 5 In the utility model, the VCSEL laser packaging structure includes a substrate 1 and a support seat 2, the support seat 2 is connected to the top of the substrate 1, a VCSEL chip 3 is integrated on the top of the substrate 1, a reflective wall 4 is connected to the inner wall of the support seat 2, a diffuser 5 is connected inside the support seat 2, the diffuser 5 is located on the top of the VCSEL chip 3, and evenly distributed movable grooves 6 are opened on the inner wall of the support seat 2. A limiting seat 7 is rotatably connected to the inner wall of the movable groove 6, and the limiting seat 7 is located on the top of the diffuser 5. The interior of the movable groove 6 is filled with sealant 8, and a heat dissipation component 9 is arranged at the bottom of the substrate 1.

[0026] The heat dissipation component 9 includes a mounting groove 901, which is opened at the top of the substrate 1. The inner bottom wall of the mounting groove 901 is provided with evenly distributed heat dissipation holes 902. The bottom end of the heat dissipation hole 902 passes through and extends to the bottom of the substrate 1. A movable plate 903 is slidably connected to the inner wall of the mounting groove 901. The movable plate 903 is provided with evenly distributed through holes 904. An electromagnetic ring 905 is installed on the inner wall of the mounting groove 901. The bottom of the electromagnetic ring 905 is magnetically connected to a magnetic ring 906. The magnetic ring 906 is installed on the top of the movable plate 903. The through hole 904 is located at the top of the heat dissipation hole 902 and is staggered with the heat dissipation hole 902. A filter screen 11 is arranged inside the heat dissipation hole 902, and the filter screen 11 is detachably connected to the inner wall of the heat dissipation hole 902.

[0027] A filter screen 11 is disposed inside the heat dissipation hole 902 , and the filter screen 11 is detachably connected to the inner wall of the heat dissipation hole 902 .

[0028] When installing the diffuser 5, the user can move the diffuser 5 to the top of the support seat 2, and then steadily engage the diffuser 5 inside the support seat 2. Then the user rotates the rotating shaft 12, and the limiting seat 7 fixedly connected to the rotating shaft 12 begins to rotate out from the inside of the movable groove 6. As the user continues to rotate the limiting seat 7 to a peak value, the bottom of the limiting seat 7 is now fitted with the top of the diffuser 5. Then the user fills the sealant 8 into the inside of the movable groove 6 to complete the limiting of the limiting seat 7. The diffuser 5 remains stable without affecting the sealing. When the VCSEL laser is operating, heat is generated inside, and the electromagnetic Ring 905 will generate current, so that the electromagnetic ring 905 generates a magnetic field to attract the magnetic ring 906 at the bottom. The magnetic ring 906 pulls the movable plate 903 upward, so that the movable plate 903 is separated from the top of the heat dissipation hole 902. Then the external airflow can enter the interior of the support base 2 through the heat dissipation hole 902, the installation groove 901 and the through hole 904, thereby completing the circulation of the airflow to achieve heat exchange, and the dust in the airflow will be blocked by the filter 11. After the VCSEL laser stops working, the electromagnetic ring 905 loses its magnetism and is affected by gravity. The movable plate 903 fits with the inner wall of the installation groove 901 and then blocks the heat dissipation hole 902, thereby achieving sealing.

[0029] In the utility model, the diffuser 5 is packaged and connected by a rotatable limit seat 7, so that the connection of the diffuser 5 with glue can be replaced, thereby improving the stability and durability of the connection of the diffuser 5. At the same time, the heat dissipation inside the VCSEL laser is achieved through the heat dissipation hole 902. The electromagnetic ring 905 and the magnetic ring 906 are used in combination to not affect the heat dissipation when the VCSEL laser is in operation, and the heat dissipation hole 902 is blocked when the VCSEL laser is in a stationary state. The filter 11 can be used to prevent dust or other factors from affecting the operation of the VCSEL laser.

[0030] See also Figure 4 , wherein: a guide block 10 is fixedly connected to the movable plate 903 , and the guide block 10 is slidably connected to the inner wall of the mounting groove 901 .

[0031] In the present invention, when the movable plate 903 moves inside the installation groove 901 , the guide block 10 will also move vertically, and the guide block 10 has a limiting effect on the movable plate 903 , so that the movable plate 903 always maintains stable movement in the vertical direction.

[0032] The above is only a preferred specific implementation of the utility model; however, the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and improved ideas of the utility model within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model.

Claims

1. A VCSEL laser packaging structure, comprising a substrate (1) and a support base (2), wherein the support base (2) is connected to the top of the substrate (1), and is characterized in that: A VCSEL chip (3) is integrated on the top of the substrate (1); a reflective wall (4) is connected to the inner wall of the support seat (2); a diffuser (5) is connected inside the support seat (2); the diffuser (5) is located on the top of the VCSEL chip (3); the inner wall of the support seat (2) is provided with evenly distributed movable grooves (6); a limit seat (7) is rotatably connected to the inner wall of the movable groove (6); the limit seat (7) is located on the top of the diffuser (5); the interior of the movable groove (6) is filled with sealant (8); and a heat dissipation component (9) is provided at the bottom of the substrate (1).

2. The VCSEL laser packaging structure according to claim 1, characterized in that: The heat dissipation assembly (9) comprises a mounting groove (901), the mounting groove (901) being provided at the top of the base plate (1), the inner bottom wall of the mounting groove (901) being provided with evenly distributed heat dissipation holes (902), the bottom ends of the heat dissipation holes (902) passing through and extending to the bottom of the base plate (1), a movable plate (903) being slidably connected to the inner wall of the mounting groove (901), the movable plate (903) being provided with evenly distributed through holes (904), an electromagnetic ring (905) being installed on the inner wall of the mounting groove (901), the bottom of the electromagnetic ring (905) being magnetically connected to a magnetic ring (906), the magnetic ring (906) being installed on the top of the movable plate (903).

3. The VCSEL laser packaging structure according to claim 2, characterized in that: The through hole (904) is located at the top of the heat dissipation hole (902) and is staggered with the heat dissipation hole (902).

4. The VCSEL laser packaging structure according to claim 2, characterized in that: A guide block (10) is fixedly connected to the movable plate (903), and the guide block (10) is slidably connected to the inner wall of the mounting groove (901).

5. The VCSEL laser packaging structure according to claim 2, characterized in that: A filter screen (11) is arranged inside the heat dissipation hole (902), and the filter screen (11) is detachably connected to the inner wall of the heat dissipation hole (902).

6. The VCSEL laser packaging structure according to claim 1, characterized in that: A rotating shaft (12) is rotatably connected to the inner wall of the movable groove (6), the limiting seat (7) is connected to the rotating shaft (12), and the rotating shaft (12) is wrapped with a sealant.

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