Novel radiator

Abstract

The utility model discloses a novel radiator, which comprises a uniform temperature plate mechanism, a connecting seat, a radiating pipe and a radiating fin group, through the mode, according to the novel radiator, the radiating pipe, the radiating fins and the uniform temperature plate which are provided with increased contact surfaces are combined, so that the radiating effect of the radiator is improved, and the service life of the radiator is prolonged. According to the radiator, the air resistance, the heat dissipation capacity and the contact area of the heat dissipation pipe and the heat dissipation fins are neutralized, the air resistance coefficient can be reduced to the maximum extent, the uniformity and the high efficiency of heat conduction are improved, and therefore the heat dissipation strength and the heat dissipation efficiency of the radiator are better improved.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a novel radiator. Background Art

[0002] Vapor chamber (VC) is a common fast heat conduction / heat dissipation mechanism, which is widely used in electronic products. In recent years, with the advancement of technology, the application of three-dimensional multi-angle vapor chamber (hereinafter referred to as 3DVC) has gradually become a trend.

[0003] However, although the heat dissipation efficiency of the existing 3DVC can meet the power requirements, it is obviously insufficient in terms of wind resistance and pressure drop, especially the 3DVC using round tubes. Although the circular appearance of the heat dissipation tube can reduce the production defect rate to a certain extent, with the increase of radiator power and the limitation of appearance specifications, the distance between the densely arranged copper tubes and fins will decrease, resulting in increasing wind resistance, flow resistance and pressure drop, which cannot fully meet the current usage requirements. Utility Model Content

[0004] In order to solve the above technical problems, a technical solution adopted by the utility model is:

[0005] A novel radiator is provided, which comprises: a temperature averaging plate mechanism, a heat dissipation pipe, and a heat dissipation fin group.

[0006] The temperature equalizer mechanism comprises a temperature equalizer shell, a temperature equalizer top plate, a connecting seat, an evaporation chamber, and a heat conduction port. The temperature equalizer top plate is arranged on the top surface of the temperature equalizer base to form a temperature equalizer body. The temperature equalizer body is provided with the evaporation chamber. The temperature equalizer top plate is provided with the heat conduction port connected with the evaporation chamber, and the caliber of the heat conduction port gradually decreases from bottom to top, so that the caliber of the top of the heat conduction port is the same as the caliber of the bottom of the heat conduction cavity in the heat dissipation pipe. The connecting seat is arranged on the temperature equalizer top plate outside the top opening of the heat conduction port, and a distance is arranged between the inner wall of the connecting seat and the heat conduction port.

[0007] A heat-conducting cavity with an opening downward is arranged in the heat dissipation pipe, and the lower part of the heat dissipation pipe is connected to the connecting seat and the top plate of the temperature-averaging plate, so that the bottom surface of the heat dissipation pipe is flush with the bottom surface of the top plate of the temperature-averaging plate, and the inner wall of the heat-conducting port and the side wall of the heat-conducting cavity are located on the same plane, and one or more heat dissipation contact planes extending to the top and bottom ends of the heat dissipation pipe are axially / inclinedly arranged on the outer wall of the heat dissipation pipe to increase the contact surface between the pipe and the heat dissipation fin group,

[0008] The heat dissipation fin group is provided with a heat dissipation channel corresponding to the heat dissipation pipe, so that the heat dissipation fin group is sleeved on the heat dissipation pipe, and the top surface of the connecting seat contacts the bottom surface of the heat dissipation fin group, and the inner wall of the heat dissipation channel contacts the outer peripheral wall of the heat dissipation pipe and / or the heat dissipation contact plane.

[0009] In a preferred embodiment of the present invention, a liquid inlet communicating with the evaporation chamber is disposed on the side of the temperature equalizing plate body.

[0010] In a preferred embodiment of the present invention, a plurality of rows of heat dissipation tubes are relatively arranged on the temperature homogenizing plate body, and the heat dissipation tubes are arranged in an elliptical or flat structure.

[0011] In a preferred embodiment of the present invention, the lower portion of the heat dissipation pipe is plugged, fixed or integrally connected to the connection seat.

[0012] In a preferred embodiment of the present invention, the temperature homogenizing plate base and the temperature homogenizing plate top plate are an integrated structure.

[0013] In a preferred embodiment of the present invention, the temperature equalizing plate top plate and the connecting seat are an integrated structure.

[0014] In a preferred embodiment of the present invention, a support is provided in the evaporation chamber, the top of the support is connected to the top plate of the temperature homogenizing plate, and the bottom of the support is connected to the base of the temperature homogenizing plate.

[0015] In a preferred embodiment of the utility model, when multiple heat dissipation contact planes are arranged along the axial direction, a heat dissipation pipe with a waist-shaped or rectangular cross-section is formed; when multiple heat dissipation contact planes are arranged obliquely, a heat dissipation pipe with a conical structure is formed.

[0016] In a preferred embodiment of the present invention, the heat dissipation pipe is made of copper pipe, aluminum pipe, stainless steel pipe or plastic pipe.

[0017] In a preferred embodiment of the present invention, the heat dissipation fin group includes a plurality of heat dissipation fins stacked in sequence from top to bottom.

[0018] The beneficial effects of the utility model are as follows: by improving the heat dissipation tube into a flat or elliptical shape, the contact surface between the fin air duct and the heat dissipation tube, the heat dissipation fins and the temperature equalizing plate are combined, the wind resistance, heat dissipation capacity and the contact area between the heat dissipation tube and the heat dissipation fin are greatly improved, the wind resistance coefficient can be reduced to the maximum extent, the uniformity and efficiency of heat conduction can be improved, and the heat dissipation intensity and efficiency of the radiator can be better improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0020] Figure 1 It is a structural side view schematic diagram of a preferred embodiment of a novel radiator of the utility model;

[0021] Figure 2 This is a three-dimensional structural schematic diagram of a preferred embodiment of a new type of radiator of the utility model;

[0022] Figure 3 It is a cross-sectional structural schematic diagram of a preferred embodiment of a novel radiator of the utility model;

[0023] Figure 4 It is a partial structural schematic diagram of a temperature equalizing plate mechanism in a preferred embodiment of a novel radiator of the utility model. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] See also Figure 1-4 , the utility model embodiment includes:

[0026] A novel radiator comprises a temperature averaging plate mechanism 1, a heat dissipation pipe 2, a heat dissipation contact plane 21, a heat dissipation fin group 3, and a heat dissipation channel 31.

[0027] The temperature evaporating plate mechanism 1 comprises a temperature evaporating plate housing 11 , a temperature evaporating plate top plate 12 , a connecting seat 13 , an evaporation chamber 14 , and a heat conducting port 15 .

[0028] The temperature balancing plate top plate 12 is arranged on the top surface of the temperature balancing plate base 11 to form a temperature balancing plate body. An evaporation chamber 14 is arranged in the temperature balancing plate body. A liquid inlet 16 communicating with the evaporation chamber is arranged on the side of the temperature balancing plate body.

[0029] Two or more rows of heat conducting ports 15 connected to the evaporation chamber 14 are provided on the top plate 12 of the temperature homogenizing plate, and the diameter of the heat conducting ports 15 gradually decreases from bottom to top, that is, the diameter of the top of the heat conducting port 15 is the same as the diameter of the bottom of the heat conducting cavity 22 in the heat dissipation pipe (the inner diameter of the heat dissipation pipe), and the diameter of the bottom of the heat conducting port 15 is larger than the diameter of the bottom of the heat conducting cavity 22, so as to conduct heat more efficiently and accurately.

[0030] The temperature equalizing plate base 11 and the temperature equalizing plate top plate 12 are an integrated structure.

[0031] The temperature equalizing plate top plate 11, the connecting seat 13 and the heat dissipation pipe 2 are an integrated structure.

[0032] The evaporation chamber 14 is provided with a support, the top of the support is connected to the top plate of the temperature equalizing plate, and the bottom of the support is connected to the base of the temperature equalizing plate, so as to play the role of supporting and uniformly and accelerating heat conduction.

[0033] The hollow structure of the connecting seat 13 is arranged on the top plate 12 of the temperature equalizing plate at the outer periphery of the top end of the heat conducting port 15, so that the distance between the inner wall of the connecting seat 13 and the heat conducting port 15 can be consistent with the wall thickness of the heat dissipation pipe, which not only facilitates the setting of the heat dissipation pipe 2, but also can further ensure the matching connection between the heat conducting port 15 and the heat conducting cavity 22, thereby promoting heat conduction.

[0034] A heat-conducting cavity 22 with an opening facing downward is provided in the heat dissipation pipe. The lower part of the heat dissipation pipe 2 is plugged into, fixed to, or integrally connected with the connecting seat 13, so that the bottom surface of the heat dissipation pipe 2 is flush with the bottom surface of the temperature equalizing plate top plate 12, and the inner wall of the heat-conducting port 15 and the side wall of the heat-conducting cavity 22 are located on the same plane, so as to further ensure smooth heat conduction and improve heat conduction efficiency.

[0035] One or more heat dissipation contact planes 21 extending to the top and bottom ends of the heat dissipation pipe are axially / inclinedly arranged on the outer wall of the heat dissipation pipe 2. By setting the heat dissipation contact planes 21, the contact area between the pipe and the heat dissipation fin group can be increased, thereby improving the heat dissipation intensity and heat dissipation effect.

[0036] When multiple heat dissipation contact planes 21 are arranged along the axial direction, a heat dissipation pipe with a waist-shaped or rectangular cross section can be formed; when multiple heat dissipation contact planes 21 are arranged obliquely, a heat dissipation pipe with a conical cross section can be formed. The length of the heat dissipation pipe can be set according to demand.

[0037] The heat dissipation pipe 2 can be made of metal such as copper pipe, aluminum pipe, stainless steel pipe or other plastic pipe.

[0038] The heat dissipation fin group 3 is provided with a heat dissipation channel 31 corresponding to the heat dissipation pipe, so that the heat dissipation fin group can be sleeved on the heat dissipation pipe, and the top surface of the connecting seat 13 contacts the bottom surface of the heat dissipation fin group 3 to support and fix the heat dissipation fin group 3. The heat dissipation fin group 3 includes a plurality of heat dissipation fins stacked in sequence from top to bottom.

[0039] Part of the inner wall of the heat dissipation channel 31 is directly in contact with the outer peripheral wall of the heat dissipation tube 2, and the remaining inner wall is in contact with the heat dissipation contact plane 21. This not only facilitates the positioning and disassembly of the heat dissipation fins 3, but also increases the contact area between the heat dissipation fin group 3 and the heat dissipation tube 2, so as to further improve the heat dissipation efficiency of the radiator.

[0040] The beneficial effect of the new radiator of the utility model is that by combining the heat dissipation tubes, heat dissipation fins and temperature equalizing plates with increased contact surfaces, the wind resistance, heat dissipation capacity and the contact area between the heat dissipation tubes and the heat dissipation fins are neutralized, the wind resistance coefficient can be reduced to the maximum extent, the uniformity and efficiency of heat conduction can be improved, and the heat dissipation intensity and efficiency of the radiator can be better improved.

[0041] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A new type of radiator, characterized in that: include: Temperature balancing plate mechanism, heat pipe, heat dissipation fin group, The temperature equalizer mechanism comprises a temperature equalizer shell, a temperature equalizer top plate, a connecting seat, an evaporation chamber, and a heat conduction port. The temperature equalizer top plate is arranged on the top surface of the temperature equalizer base to form a temperature equalizer body. The temperature equalizer body is provided with the evaporation chamber. The temperature equalizer top plate is provided with the heat conduction port connected with the evaporation chamber, and the caliber of the heat conduction port gradually decreases from bottom to top, so that the caliber of the top of the heat conduction port is the same as the caliber of the bottom of the heat conduction cavity in the heat dissipation pipe. The connecting seat is arranged on the temperature equalizer top plate outside the top opening of the heat conduction port, and a distance is arranged between the inner wall of the connecting seat and the heat conduction port. A heat-conducting cavity with a downward opening is arranged in the heat dissipation pipe, and the lower part of the heat dissipation pipe is connected to the connecting seat and the top plate of the temperature-averaging plate, so that the bottom surface of the heat dissipation pipe is flush with the bottom surface of the top plate of the temperature-averaging plate, and the inner wall of the heat-conducting port and the side wall of the heat-conducting cavity are located on the same plane, and one or more heat dissipation contact planes extending to the top and bottom ends of the heat dissipation pipe are arranged axially / inclined on the outer wall of the heat dissipation pipe to increase the contact surface between the pipe and the heat dissipation fin group, The heat dissipation fin group is provided with a heat dissipation channel corresponding to the heat dissipation pipe, so that the heat dissipation fin group is sleeved on the heat dissipation pipe, and the top surface of the connecting seat contacts the bottom surface of the heat dissipation fin group, and the inner wall of the heat dissipation channel contacts the outer peripheral wall of the heat dissipation pipe and / or the heat dissipation contact plane.

2. The new radiator according to claim 1 is characterized in that: A liquid inlet communicating with the evaporation chamber is arranged on the side of the temperature equalizing plate body.

3. The new radiator according to claim 1 is characterized in that: A plurality of rows of heat dissipation tubes are relatively arranged on the main body of the temperature homogenizing plate, and the heat dissipation tubes are arranged in an elliptical or flat structure.

4. The new radiator according to claim 1 is characterized in that: The lower part of the heat dissipation pipe is plugged, fixed or integrally connected with the connection seat.

5. The new radiator according to claim 1 is characterized in that: The temperature homogenizing plate base and the temperature homogenizing plate top plate are an integrated structure.

6. The new radiator according to claim 1 is characterized in that: The temperature equalizing plate top plate and the connecting seat are an integrated structure.

7. The new radiator according to claim 1 is characterized in that: The evaporation chamber is provided with a support column, the top of the support column is connected to the top plate of the temperature homogenizing plate, and the bottom of the support column is connected to the base of the temperature homogenizing plate.

8. The new radiator according to claim 1 is characterized in that: When multiple heat dissipation contact planes are arranged along the axial direction, a heat dissipation pipe with a waist-shaped or rectangular cross-section is formed; when multiple heat dissipation contact planes are arranged obliquely, a heat dissipation pipe with a conical structure is formed.

9. The novel radiator according to claim 1 is characterized in that: The heat dissipation pipe is made of copper pipe, aluminum pipe, stainless steel pipe or plastic pipe.

10. The new radiator according to claim 1 is characterized in that: The heat dissipation fin group includes a plurality of heat dissipation fins stacked in sequence from top to bottom.

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