Cooling plate

By forming a recess between the top end of the heat transfer part of the cooling plate and the surface on the side of the heat medium flow space in the cover plate, the top end of the heat transfer part is inserted to eliminate gaps, and the problems of low cooling efficiency and large-scale thickness direction of the existing cooling plate are solved, thereby achieving high efficiency cooling and optimization of space and materials.

CN222954276UActive Publication Date: 2025-06-06FURUKAWA ELECTRIC CO LTD
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Patent Information

Application Number
CN202421773055.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2023-07-31
Filing Date
2024-07-25
Publication Date
2025-06-06
Estimated Expiration
2034-07-25

AI Technical Summary

Technical Problem

There is a gap between the top end of the heat transfer section and the surface on the side of the heat medium circulation space in the cover plate, which causes the heat medium to fail to absorb heat sufficiently and the cooling efficiency is not high. At the same time, the thickness direction dimension of the cooling plate is increased, which may reduce the cooling capacity.

Method used

By forming a recess between the top end of the heat transfer portion and the surface on the side of the heat medium flow space in the cover plate, the top end of the heat transfer portion can be inserted into the recess, thereby eliminating gaps, increasing the flow rate of the heat medium between the heat transfer portions, and improving cooling efficiency.

Benefits of technology

The cooling efficiency is effectively improved, the flow of the heat medium on the cover plate side is reduced, the flow of the heat medium between the heat transfer parts is increased, and the size of the thickness direction is avoided, and space saving, material reduction and lightweight are achieved.

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Abstract

The utility model provides a cooling plate which can restrain enlargement in the thickness direction and improve cooling efficiency. The heat medium circulation space (2) is formed between the heat dissipation surface (13) of the bottom plate (10) and the cover plate (20). The bottom plate (10) has a plurality of heat transfer sections (14) that are provided so as to protrude from the heat dissipation surface (13) toward the cover plate (20), and transfer heat released from the heat dissipation surface (13) to the heat medium circulating in the heat medium circulation space (2). Recesses (22) into which at least some of the tip ends of the plurality of heat transfer sections (14) are inserted are formed in the surface of the cover plate (20) on the heat medium circulation space (2) side.
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Description

Technical Field

[0001] The utility model relates to a cooling plate used for cooling cooling objects such as electronic equipment and a manufacturing method of the cooling plate. Background Art

[0002] As shown in Patent Document 1, a known conventional cooling plate is a cooling plate that has a heat medium circulation space formed therein for the circulation of a heat medium, and releases the heat released by a cooling object to the heat medium circulating in the heat medium circulation space. The cooling plate comprises: a bottom plate, one surface of which is provided with a heat absorbing surface, and the other surface of which is provided with a heat dissipating surface, the heat absorbing surface absorbs the heat released by the cooling object, and the heat dissipating surface releases the heat absorbed by the heat absorbing surface to the heat medium circulating in the heat medium circulation space; and a cover plate that covers the heat dissipating surface of the bottom plate. The bottom plate has a plurality of heat transfer parts, which are provided to protrude from the heat dissipating surface toward the cover plate, and transfer the heat released by the heat dissipating surface to the heat medium circulating in the heat medium circulation space.

[0003] In the cooling plate described in Patent Document 1, when a gap is formed between the top end of the plurality of heat transfer parts and the surface of the cover plate on the heat medium circulation space side, the heat medium flowing in the heat medium circulation space is more likely to flow in the gap between the top end of the plurality of heat transfer parts and the cover plate than in the gap between the heat transfer parts. Therefore, in the cooling plate described in Patent Document 1, the heat medium flowing in the heat medium circulation space flows out of the heat medium circulation space without fully absorbing heat from the heat transfer parts, and the cooling efficiency cannot be improved.

[0004] Therefore, in the cooling plate described in Patent Document 2, a docking piece is arranged between the top end portions of the plurality of heat transfer parts and the surface on the heat medium flow space side in the cover plate, thereby restricting the flow of the heat medium in the gap between the top end portions of the plurality of heat transfer parts and the surface on the heat medium flow space side in the cover plate, thereby improving the cooling efficiency.

[0005] Patent Document 1: Japanese Patent Application No. 2013-506996

[0006] Patent Document 2: Japanese Patent Application Publication No. 2019-186297

[0007] However, in the cooling plate described in Patent Document 2, since a butt joint is arranged between the top end of the plurality of heat transfer parts and the surface of the cover plate on the side of the heat medium circulation space, the height of the plurality of heat transfer parts becomes smaller, and the contact area between the heat transfer parts and the heat medium circulating in the heat medium circulation space becomes smaller, so the cooling capacity may be reduced. In addition, in the cooling plate described in Patent Document 2, if the height of the heat transfer part is set to a height that can exert the necessary cooling capacity, the dimension of the entire cooling plate in the thickness direction becomes larger. Utility Model Content

[0008] An object of the present invention is to provide a cooling plate and a method for manufacturing the cooling plate, which can suppress enlargement in the thickness direction and can improve cooling efficiency.

[0009] The cooling plate of the utility model is a cooling plate that has a heat medium circulation space formed inside for heat medium circulation, and releases heat absorbed from a cooling object to the heat medium circulating in the heat medium circulation space. The cooling plate comprises: a bottom plate, a surface having a heat absorbing surface that absorbs heat released from the cooling object and a surface having a heat dissipating surface that releases heat absorbed by the heat absorbing surface to the heat medium circulating in the heat medium circulation space; and a cover plate that covers the heat dissipating surface of the bottom plate. The heat medium circulation space is formed between the heat dissipating surface of the bottom plate and the cover plate, the bottom plate has a plurality of heat transfer parts, the heat transfer parts are arranged to protrude from the heat dissipating surface to the cover plate, and transfer heat released from the heat dissipating surface to the heat medium circulating in the heat medium circulation space, and a recessed portion is formed on the surface of the cover plate on the heat medium circulation space side, into which the top ends of at least a part of the plurality of heat transfer parts are inserted.

[0010] In addition, preferably, the top end side of the heat transfer portion of the cooling plate of the present invention is tapered.

[0011] In addition, preferably, the plurality of heat transfer parts of the cooling plate of the present invention are fins extending along a flow direction of the heat medium flowing in the heat medium flow space.

[0012] In addition, preferably, the cooling plate of the present invention has a bottom plate side joint portion extending along the outer circumference and joined to the cover plate, and the heat dissipation surface protrudes further toward the cover plate than the bottom plate side joint portion.

[0013] In addition, the manufacturing method of the cooling plate of the utility model is a manufacturing method for forming a heat medium circulation space inside which a heat medium circulates, and releasing the heat absorbed from the cooling object to the heat medium circulating in the heat medium circulation space, wherein the manufacturing method of the cooling plate comprises: a plate stacking step, stacking a cover plate on a bottom plate, in which a heat absorbing surface for absorbing the heat released from the cooling object is arranged on one side of the bottom plate, and a heat dissipation surface for releasing the heat absorbed by the heat absorbing surface to the heat medium circulating in the heat medium circulation space is arranged on the other side of the bottom plate, a plurality of heat transfer parts are arranged to protrude from the heat dissipation surface, transfer the heat released by the heat dissipation surface to the heat medium circulating in the heat medium circulation space, and the cover plate covers the heat dissipation surface; a plate pressing step, in a state where the cover plate is stacked on the bottom plate by the plate stacking step, pressing the bottom plate and the cover plate against each other, so that the top ends of at least a part of the plurality of heat transfer parts are embedded in the surface of the cover plate facing the heat dissipation surface and are located in the recess formed on the surface of the cover plate facing the heat dissipation surface.

[0014] In addition, preferably, the method for manufacturing a cooling plate of the present invention includes: a heat transfer portion forming step of forming a tip end side of the heat transfer portion into a tapered shape.

[0015] In addition, preferably, the method for manufacturing a cooling plate of the present invention includes: a heat transfer portion forming step of forming the heat transfer portion into a fin shape extending along a flow direction of the heat medium flowing in the heat medium flow space.

[0016] In addition, preferably, the manufacturing method of the cooling plate of the utility model includes: a bottom plate side joint portion forming step, forming a bottom plate side joint portion that is arranged to extend along the outer peripheral side of the bottom plate, the bottom plate side joint portion protruding less than the heat dissipation surface toward the cover plate side, and the bottom plate side joint portion joins the cover plate; and a joining step, joining the cover plate to the bottom plate side joint portion.

[0017] According to the utility model, since the gap between the top end of the heat transfer part and the surface of the cover plate on the heat medium circulation space side can be eliminated, the flow rate of the heat medium on the cover plate side of the heat medium circulation space can be reduced, and the flow rate of the heat medium between adjacent heat transfer parts can be increased, thereby improving the cooling efficiency. In addition, since the enlargement in the thickness direction can be suppressed, the installation space can be saved, and the use of materials can be reduced and lightened. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall three-dimensional view of a cooling plate according to one embodiment of the present invention.

[0019] Figure 2This is an exploded perspective view of the cooling plate viewed from the cover plate side according to one embodiment of the present invention.

[0020] Figure 3 This is an exploded perspective view of a cooling plate viewed from the bottom plate side according to an embodiment of the present invention.

[0021] Figure 4 It is a side cross-sectional view of a cooling plate according to one embodiment of the present invention.

[0022] Figure 5 It is a side view of a bottom plate according to one embodiment of the present invention.

[0023] Figure 6 It is a side view of the main parts of the bottom plate of one embodiment of the utility model.

[0024] Figure 7 It is a side cross-sectional view of the main part of the cooling plate according to one embodiment of the present invention.

[0025] Figure 8 This is a side cross-sectional view for explaining a method for manufacturing a cooling plate according to an embodiment of the present invention.

[0026] Fig. 9 (a) and Fig. 9 (b) is a side cross-sectional view of a main part for explaining a method for manufacturing a cooling plate according to an embodiment of the present invention.

[0027] Fig.10 (a) to Fig.10 (e) is a side sectional view of a cooling plate according to another embodiment of the present invention.

[0028] Description of Reference Numerals

[0029] 1 Cooling Plate

[0030] 2Heat medium circulation space

[0031] 10 Bottom Plate

[0032] 11 Bottom plate side joint

[0033] 12Heat absorbing surface

[0034] 13 heat dissipation surface

[0035] 14Heat transfer unit

[0036] 20 Cover

[0037] 22 concavities DETAILED DESCRIPTION

[0038] Hereinafter, embodiments will be described with reference to the drawings.

[0039] [First embodiment]

[0040] Figures 1 to 9 This shows an embodiment of the present invention. Figure 1 This is the overall three-dimensional diagram of the cooling plate. Figure 2 This is an exploded perspective view of the cooling plate viewed from the cover plate side. Figure 3 This is an exploded perspective view of the cooling plate viewed from the bottom plate side. Figure 4 is a side cross-sectional view of the cooling plate. Figure 5 is a side view of the base plate. Figure 6 This is the side view of the main part of the bottom plate. Figure 7 This is a side sectional view of the main part of the cooling plate. Figure 8 is a side sectional view illustrating a method for manufacturing a cooling plate, Fig. 9 (a) and Fig. 9 (b) is a side sectional view of the manufacturing method of the cooling plate.

[0041] The cooling plate 1 of this embodiment is used to cool a cooling object such as an electronic device that generates heat. Figure 1 and Figure 4 As shown, the cooling plate 1 is provided with a heat medium inlet 2a for allowing the heat medium to flow into the heat medium circulation space 2 formed inside, and a heat medium outlet 2b for allowing the heat medium flowing in the heat medium circulation space 2 to flow out. The cooling plate 1 is used in a state where a heat medium supply pipe (not shown) is connected to the heat medium inlet 2a, and a heat medium discharge pipe (not shown) is connected to the heat medium outlet 2b. The cooling plate 1 allows the cooled heat medium to flow into the heat medium circulation space 2 through the heat medium inlet 2a, and allows the heat medium to absorb the heat released by the cooling object in the heat medium circulation space 2, and allows the heat medium that has absorbed the heat in the heat medium circulation space 2 to flow out from the heat medium circulation space 2 through the heat medium outlet 2b. Here, water can be used as the heat medium, for example.

[0042] like Figure 2 to Figure 4 As shown, the cooling plate 1 has a base plate 10 and a cover plate 20 which are overlapped with each other and are joined together by brazing or the like.

[0043] The bottom plate 10 is a substantially rectangular plate-shaped member made of a metal with high thermal conductivity, such as copper, copper alloy, aluminum, stainless steel, etc. Figure 2 and Figure 3 As shown, the bottom plate 10 has: a bottom plate side joint portion 11, which is joined to the cover plate 20; a heat absorbing surface 12, which absorbs heat released by the cooling object; a heat dissipation surface 13, which releases the heat absorbed by the heat absorbing surface 12 to the heat medium flowing in the heat medium circulation space 2; and a plurality of heat transfer portions 14, which are arranged to protrude from the heat dissipation surface 13 and are used to transfer the heat released from the heat dissipation surface 13 to the heat medium flowing in the heat medium circulation space 2.

[0044] The bottom plate side joint portion 11 is formed along the entire circumference of the outer peripheral side of the surface of the bottom plate 10 on the cover plate 20 side.

[0045] The heat absorbing surface 12 is a surface on which a cooling target is placed, and is provided on the outer side of the bottom plate 10 in the stacking direction.

[0046] The heat dissipation surface 13 is a flat surface located on the inner peripheral side of the bottom plate side joint portion 11 , and the entire surface protrudes toward the cover plate 20 side relative to the bottom plate side joint portion 11 .

[0047] The plurality of heat transfer parts 14 are formed together with the heat dissipation surface 13 by, for example, performing a skiving process on the surface of the bottom plate 10 on the cover plate 20 side. The plurality of heat transfer parts 14 are fins that protrude from the heat dissipation surface 13 and extend along the flow direction of the heat medium flowing in the heat medium flow space 2. Figure 4 As shown, for example, the height dimension H of each of the plurality of heat transfer parts 14 is 3 mm, the thickness dimension T is 0.1 mm, and the interval G between adjacent heat transfer parts 14 is 0.1 mm. In addition, the top end side of each of the plurality of heat transfer parts 14 is tapered in the flow direction of the entire heat medium as the thickness dimension T decreases toward the top end. In addition, the height dimension H of each of the plurality of heat transfer parts 14 includes a small error of, for example, 0.05 mm.

[0048] The cover plate 20 is formed of a plate-shaped member made of a metal with high thermal conductivity, such as copper, copper alloy, aluminum, stainless steel, etc. The cover plate 20 has a cover plate side joint portion 21, which is provided to extend along the outer peripheral side of the cover plate 20 and is joined to the bottom plate 10 in a state of overlapping with the bottom plate 10, and the inner side of the cover plate side joint portion 21 is formed in a concave shape. When the bottom plate side joint portion 11 and the cover plate side joint portion 21 are joined to each other, a heat medium flow space 2 is formed between the heat dissipation surface 13 of the bottom plate 10 and the cover plate 20. In addition, a heat medium inlet 2a is formed on one side of the cover plate 20 in the longitudinal direction, and a heat medium outlet 2b is formed on the other side of the cover plate 20 in the longitudinal direction.

[0049] In addition, in a state where the bottom plate side joint portion 11 and the cover plate side joint portion 21 are joined to each other, as shown in FIG. Figure 7 As shown, the top ends of the plurality of heat transfer parts 14 are inserted into the recessed portion 22, and the recessed portion 22 is provided on the surface of the cover plate 20 on the side of the heat medium circulation space 2. The recessed portion 22 is formed by pressing the top ends of the plurality of heat transfer parts 14 against the surface of the cover plate 20 facing the heat dissipation surface 13 and inserting them. The recessed portion 22 does not need to be provided at a position corresponding to all the top ends of the plurality of heat transfer parts 14 in the cover plate 20, and it only needs to be provided at a position corresponding to the top ends of at least a part of the plurality of heat transfer parts 14.

[0050] In the cooling plate 1 constructed as described above, when the cooling object is placed on the heat absorption surface 12 of the bottom plate 10, the heat medium flows into the heat medium circulation space 2 through the heat medium inlet 2a, and the heat medium flowing in the heat medium circulation space 2 flows out of the heat medium circulation space 2 through the heat medium outlet 2b.

[0051] At this time, the heat released from the cooling object is absorbed by the heat absorbing surface 12 of the bottom plate 10, transferred from the heat absorbing surface 12 to the heat dissipating surface 13 and the plurality of heat transfer parts 14, and released to the heat medium flowing in the heat medium circulation space 2. Thus, the cooling object can release heat to the heat medium flowing in the heat medium circulation space 2, and can be continuously cooled.

[0052] The heat medium flowing into the heat medium circulation space 2 does not flow through the gaps between the top ends of the plurality of heat transfer parts 14 and the cover plate 20 , but flows between the heat transfer parts 14 , thereby effectively absorbing the heat released by the heat transfer parts 14 .

[0053] Furthermore, the method for manufacturing the cooling plate 1 includes the following steps.

[0054] Bottom plate side joint portion forming step: The bottom plate side joint portion 11 extending along the outer peripheral side of the bottom plate 10 is formed by cutting or the like, and the bottom plate side joint portion 11 protrudes less than the heat dissipation surface 13 .

[0055] Heat transfer part forming step: The heat dissipation surface 13 of the bottom plate and the plurality of heat transfer parts 14 are formed by slicing. In the heat transfer part forming step, each of the plurality of heat transfer parts 14 is formed into a fin shape extending along the flow direction of the heat medium flowing in the heat medium flow space, and the top end side is formed into a tapered shape in the flow direction of the entire heat medium.

[0056] Plate stacking step: The cover plate 20 is stacked on the bottom plate 10 on which the bottom plate side joint portion 11 is formed in the bottom plate side joint portion forming step and the heat dissipation surface 13 and the plurality of heat transfer portions 14 are formed in the heat transfer portion forming step.

[0057] Plate pressing process: Figure 8 and Fig. 9 As shown, the base plate 10 and the cover plate 20 stacked in the plate stacking process are pressed against each other in the stacking direction, so that the top ends of at least a portion of the plurality of heat transfer parts 14 are pressed against the surface of the cover plate 20 facing the heat dissipation surface 13 and embedded therein, thereby forming a recess 22.

[0058] Joining step: With the heat transfer portion 14 inserted into the recess 22 of the cover plate 20 formed in the plate pressing step and facing the heat dissipation surface 13 , the cover plate side joining portion 21 of the cover plate 20 and the bottom plate side joining portion 11 of the bottom plate 10 are joined by brazing.

[0059] As can be seen from the above, the cooling plate of the present embodiment is a cooling plate 1 that has a heat medium circulation space 2 formed therein for circulating a heat medium, and releases heat absorbed from a cooling object to the heat medium circulating in the heat medium circulation space 2, and includes: a bottom plate 10, a surface on which a heat absorbing surface 12 is provided on one side, and a surface on which a heat dissipating surface 20 is provided on the other side, the heat absorbing surface 12 absorbs heat released from the cooling object, and the heat dissipating surface 20 releases the heat absorbed by the heat absorbing surface 12 to the heat medium circulating in the heat medium circulation space 2; and a cover plate 20 that covers the heat dissipating surface 20 of the bottom plate 10. The heat medium circulation space 2 is formed between the heat dissipating surface 13 of the bottom plate 10 and the cover plate 20. The bottom plate 10 has a plurality of heat transfer portions 14 that are provided to protrude from the heat dissipating surface 13 toward the cover plate 20, and transfer heat released from the heat dissipating surface 13 to the heat medium circulating in the heat medium circulation space 2. A recessed portion 22 into which at least a part of the top ends of the plurality of heat transfer parts 14 are inserted is formed on the surface of the cover plate 20 on the heat medium circulation space 2 side.

[0060] In addition, the manufacturing method of the cooling plate of the present embodiment is a manufacturing method for forming a heat medium circulation space 2 in which a heat medium circulates, and releasing the heat absorbed from the cooling object to the heat medium circulating in the heat medium circulation space 2, comprising: a plate laminating step of laminating a cover plate 20 on a base plate 10, wherein a heat absorbing surface 12 for absorbing the heat released from the cooling object is provided on one side of the base plate 10, and a heat dissipating surface 20 for releasing the heat absorbed by the heat absorbing surface 12 to the heat medium circulating in the heat medium circulation space 2 is provided on the other side of the base plate 10, The plurality of heat transfer parts 14 are arranged to protrude from the heat dissipation surface 13, and transfer the heat released from the heat dissipation surface 13 to the heat medium circulating in the heat medium circulation space 2, and the cover plate 20 covers the heat dissipation surface 13; the plate pressing process, through the plate stacking process, when the cover plate 20 is stacked on the base plate 10, the base plate 10 and the cover plate 20 are pressed against each other, so that the top ends of at least a part of the plurality of heat transfer parts 14 are embedded in the surface of the cover plate 20 facing the heat dissipation surface 13, and the top ends are located in the recessed portion 22 formed on the surface of the cover plate 20 facing the heat dissipation surface 13.

[0061] Thus, the gap between the top end of the heat transfer part 14 and the surface of the cover plate 20 on the heat medium circulation space 2 side can be eliminated, so that the flow rate of the heat medium on the cover plate 20 side in the heat medium circulation space 2 can be reduced, and the flow rate of the heat medium between the adjacent heat transfer parts 14 and the heat transfer parts 14 can be increased, and the cooling efficiency can be improved. In addition, since the enlargement in the thickness direction can be suppressed, the space of the installation space can be saved, and the reduction and weight of the used materials can be achieved. In addition, since the enlargement in the thickness direction can be suppressed, the space of the installation space can be saved, and the reduction and weight of the used materials can be achieved.

[0062] In addition, it is preferable that the top end side of the heat transfer portion 14 of the cooling plate of the present embodiment has a tapered shape.

[0063] In addition, the method for manufacturing the cooling plate of the present embodiment preferably includes a heat transfer portion forming step of forming the tip end side of the heat transfer portion 14 into a tapered shape.

[0064] Thus, the tip of the heat transfer portion 14 can be easily fitted into the surface of the cover plate 20 facing the heat dissipation surface 13 , and the tip of the heat transfer portion 14 can be more reliably positioned in the recess 22 .

[0065] In addition, it is preferable that each of the plurality of heat transfer portions 14 of the cooling plate of the present embodiment is a fin extending along the flow direction of the heat medium flowing in the heat medium flow space 2 .

[0066] Preferably, the method for manufacturing the cooling plate of the present embodiment includes a heat transfer portion forming step of forming the heat transfer portion 14 in a fin shape extending along a flow direction of the heat medium flowing in the heat medium flow space 2 .

[0067] Thus, since the heat transfer part 14 can be arranged in the entire flow direction of the heat medium in the heat medium flow space 2 , heat can be more efficiently transferred from the heat transfer part 14 to the heat medium.

[0068] In addition, preferably, in the cooling plate of this embodiment, the bottom plate 10 has a bottom plate side joint portion 11 extending along the outer circumference of the bottom plate 10 and joined to the cover plate 20 , and the heat dissipation surface 13 protrudes toward the cover plate 20 more than the bottom plate side joint portion 11 .

[0069] In addition, preferably, the manufacturing method of the cooling plate of the present embodiment includes: a bottom plate side joint portion forming step, forming a bottom plate side joint portion 11 which is arranged to extend along the outer peripheral side of the bottom plate 10, wherein the bottom plate side joint portion 11 protrudes less toward the cover plate 20 side than the heat dissipation surface 13, and the bottom plate side joint portion 11 joins the cover plate 20; and a joining step, joining the cover plate 20 to the bottom plate side joint portion 11.

[0070] Thus, when the cover plate 20 and the base plate 10 are joined by brazing, the brazing material can be restricted from flowing toward the heat dissipation surface 13 , and clogging of the heat medium flow space by the brazing material can be suppressed.

[0071] In addition, although the above embodiment shows that each of the plurality of heat transfer parts 14 is provided as a fin with a height dimension of 3 mm, a thickness dimension of 0.1 mm, and a spacing of 0.1 mm between adjacent heat transfer parts 14, it is not limited to this. Fig.10 (a) and Fig.10As shown in (b), the height dimension and thickness dimension of each of the plurality of heat transfer parts and the interval between adjacent heat transfer parts can be arbitrarily set.

[0072] In addition, it is not necessary for all the top ends of the plurality of heat transfer parts 14 to be inserted into the recess 22 formed in the cover plate 20. It is sufficient as long as at least a portion of the top ends of the heat transfer parts 14 are inserted into the recess 22. Fig.10 As shown in (c), the thickness dimension of the cover plate 20 can be set so that the central portion side of the heat medium circulation space 2 in the width direction is formed thicker than the two outer sides in the width direction, and the top end of the heat transfer part 14 located in the central portion side in the width direction is inserted into the recess 22. In this cooling plate 1, the flow rate of the heat medium in the two outer sides in the width direction can be increased relative to the central portion side in the width direction of the heat medium circulation space 2. In addition, Fig.10 As shown in (d), the thickness dimension of the cover plate 20 may be set such that the outer sides in the width direction of the heat medium circulation space 2 are formed thicker than the central side in the width direction, and the top end of the heat transfer part 14 located at the outer sides in the width direction is inserted into the recess 22. In the cooling plate 1, the flow rate of the heat medium at the central side in the width direction can be increased compared with the outer sides in the width direction of the heat medium circulation space 2.

[0073] In addition, in the above embodiment, the heat transfer part 14 extending in a direction perpendicular to the heat dissipation surface 13 is shown, but it is not limited to this. As long as the heat transfer part 14 extends from the heat dissipation surface to the cover plate 20 side, for example, Fig.10 As shown in (e), the heat transfer portion 14 may extend obliquely from the heat dissipation surface 13 toward the cover plate 20 .

[0074] In addition, although water is shown as an example of the heat medium in the above embodiment, the heat medium is not limited thereto. For example, an antifreeze solution containing ethylene glycol, a refrigerant gas such as hydrofluorocarbon (HFC), etc. can be used as the heat medium.

[0075] In addition, although the above embodiment shows that each of the plurality of heat transfer parts 14 is provided as a fin extending along the flow direction of the heat medium in the heat medium flow space 2, the present invention is not limited thereto. The heat transfer part may be shaped so as to protrude from the heat dissipation surface toward the cover plate side in the heat medium flow space, for example, it may be a conical protrusion protruding from the heat dissipation surface toward the cover plate side.

[0076] In the above embodiment, the cover plate 20 and the base plate 10 are joined by brazing, but the present invention is not limited thereto. The cover plate 20 may be joined to the base plate 10 by diffusion welding, friction stir welding (FSW), or pressure welding.

Claims

1. A cooling plate having a heat medium circulation space formed therein for circulating a heat medium, and releasing heat absorbed from a cooling object to the heat medium circulating in the heat medium circulation space, wherein: The cooling plate has: a bottom plate having a heat absorbing surface disposed on one side for absorbing heat released from a cooling object and a heat dissipating surface disposed on the other side for releasing the heat absorbed by the heat absorbing surface to a heat medium circulating in the heat medium circulation space; and a cover plate, covering the heat dissipation surface of the base plate, The heat medium circulation space is formed between the heat dissipation surface of the bottom plate and the cover plate. The bottom plate has a plurality of heat transfer parts, which are arranged to protrude from the heat dissipation surface toward the cover plate and transfer heat released from the heat dissipation surface to the heat medium flowing in the heat medium circulation space. A recessed portion into which at least a portion of the top ends of the plurality of heat transfer parts are inserted is formed on a surface of the cover plate on the heat medium circulation space side.

2. The cooling plate according to claim 1, wherein: The top end side of the heat transfer portion has a tapered shape.

3. The cooling plate according to claim 1, wherein: The plurality of heat transfer parts are fins extending along a flow direction of the heat medium flowing in the heat medium flow space.

4. The cooling plate according to claim 1, wherein: The bottom plate has a bottom plate side engaging portion extending along the outer peripheral side and engaging the cover plate, The heat dissipation surface protrudes further toward the cover plate side than the bottom plate side joint portion.

Citation Information

Patent Citations

  • Cold plate with pins

    JP2013506996A

  • Cold plate

    JP2019186297A