Cooling device, computing equipment, equipment framework, computing assembly and data center

Abstract

The embodiment of the utility model provides a cooling device, computing equipment, an equipment frame, a computing assembly and a data center, and the cooling device comprises a body which is provided with a cooling cavity and a bearing cavity in a limited manner, and the cooling cavity is used for accommodating a cooling working medium and a server module; a pipeline module is mounted in the bearing cavity, one end of the pipeline module is connected to the cooling cavity, and the other end of the pipeline module is connected to cold source equipment; the pipeline module is used for guiding the cooling working medium to be cooled out of the cooling cavity to the cold source equipment and conveying the cooled cooling working medium to the cooling cavity from the cold source equipment. According to the technology, the integration level of the cooling device is improved, the installation space of the cooling device is reduced, and integrated deployment of the data center is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of computing equipment, and in particular to a cooling device, computing equipment, equipment frame, computing assembly and data center. Background Art

[0002] With the increase in computing power and the improvement in the manufacturing process of electronic components such as chips in recent years, the power density of electronic equipment is getting higher and higher, and traditional air cooling methods are becoming increasingly difficult to meet the heat dissipation needs of electronic equipment.

[0003] In the related art, an immersion liquid cooling heat dissipation method is proposed, which has the advantages of high heat transfer efficiency, small impact of dust on electronic equipment, high heat utilization rate and high site utilization rate. However, the immersion liquid cooling equipment in the related art usually has low equipment integration and large size, resulting in large space occupation, which is not conducive to the integrated deployment of data centers. Utility Model Content

[0004] Embodiments of the present application provide a cooling device, computing equipment, equipment frame, computing assembly and data center to solve or alleviate one or more technical problems in the prior art.

[0005] In a first aspect, an embodiment of the present application provides a cooling device, comprising:

[0006] The main body is defined with a cooling cavity and a bearing cavity, the cooling cavity is used to accommodate the cooling medium and the server module; a pipeline module is installed in the bearing cavity, one end of the pipeline module is connected to the cooling cavity, and the other end of the pipeline module is connected to the cold source device; the pipeline module is used to guide the cooling medium to be cooled from the cooling cavity to the cold source device, and to transport the cooled cooling medium from the cold source device to the cooling cavity.

[0007] In one embodiment, the cooling cavity and the bearing cavity are distributed in a horizontal direction.

[0008] In one embodiment, a side of the support cavity remote from the cooling cavity is open.

[0009] In one embodiment, the body includes a carrying plate, and the carrying cavity is formed on an upper side of the carrying plate.

[0010] In one embodiment, the carrying plate is provided with a through hole.

[0011] In one embodiment, the cooling device further comprises:

[0012] The heat exchange module has a first heat exchange flow path and a second heat exchange flow path inside. The cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to cool the cooling medium.

[0013] In one embodiment, each cooling device is provided with a corresponding heat exchange module, and the heat exchange module is installed in the bearing cavity.

[0014] In one embodiment, a plurality of cooling devices are each provided with a heat exchange module, and the heat exchange module is independently installed outside the cooling device.

[0015] In one embodiment, the pipeline module includes a first pipeline group, which is connected between the cooling cavity and the heat exchange module and is used for circulating the cooling medium between the cooling cavity and the first heat exchange flow path.

[0016] In one embodiment, the first pipeline group includes a first delivery pipe and a second delivery pipe, the first delivery pipe is connected between the input end of the first heat exchange flow path and the output port of the cooling chamber, and the second delivery pipe is connected between the output end of the first heat exchange flow path and the input port of the cooling chamber.

[0017] In one embodiment, the pipeline module further includes a power module, which is installed in the bearing cavity and arranged in the first pipeline group, and is used to provide power for the circulation of the cooling medium between the cooling cavity and the heat exchange module.

[0018] In one embodiment, the power module includes a first pump body disposed on a first delivery pipe of the first pipeline group and / or a second pump body disposed on a second delivery pipe of the first pipeline group.

[0019] In one embodiment, the pipeline module further includes a second pipeline group, and the second pipeline group is connected between the heat exchange module and the cold source device.

[0020] In one embodiment, the second pipeline group includes a third delivery pipe and a fourth delivery pipe, the third delivery pipe is connected between the input end of the second heat exchange flow path and the heat exchange medium delivery pipe of the cold source equipment, and the fourth delivery pipe is connected between the output end of the second heat exchange flow path and the heat exchange medium return pipe of the cold source equipment.

[0021] In one embodiment, a quick-connect valve is provided at the input end of the third delivery pipe and / or the output end of the fourth delivery pipe.

[0022] In one embodiment, an input port and an output port are formed on a wall of the cooling cavity adjacent to a side of the bearing cavity, and a height of the input port in the vertical direction is smaller than a height of the output port in the vertical direction.

[0023] In one embodiment, the input port is disposed adjacent to the bottom of the cooling cavity, and the output port is disposed adjacent to the top of the cooling cavity.

[0024] In one embodiment, the side wall of the main body is further provided with a handle for a user to hold to apply an external force to the cooling device and drive the cooling device to move.

[0025] In one embodiment, the body further includes a wire harness storage portion, and the wire harness storage portion and the bearing cavity are located on the same side of the cooling cavity.

[0026] In one embodiment, the wire harness storage portion is located on an upper side of the cooling cavity.

[0027] In one embodiment, the wire harness storage portion has a storage groove with an open top, and the storage groove is used to store the power distribution unit.

[0028] In one embodiment, a first through hole is provided on a wall of the storage slot adjacent to a side of the cooling cavity, and the first through hole is used for a power cord of the server module to pass through and be electrically connected to the power distribution unit.

[0029] In one embodiment, the liquid level of the coolant in the cooling chamber is greater than or equal to the top height of the computing unit of the server module; the harness storage portion is located on the upper side of the top of the cooling chamber so that the height of the first via hole is greater than the liquid level of the coolant in the cooling chamber.

[0030] In one embodiment, a second through hole is provided on the wall of the receiving slot adjacent to the bearing cavity, and the second through hole is used for a power line of a power module of the pipeline module to pass through and be electrically connected to the power distribution unit.

[0031] In one embodiment, a third through hole is provided on the wall of the storage slot, and the third through hole is used for the power transmission line to pass through and be electrically connected to the power distribution unit in the storage slot.

[0032] In one embodiment, a support plate for supporting the server module is provided inside the cooling cavity, and the support plate is provided with flow-guiding holes for allowing the cooling medium to flow upward.

[0033] In one embodiment, there are multiple server modules, and the support plate includes multiple diversion areas corresponding to the multiple server modules. The flow area and / or arrangement density of the diversion holes in the diversion areas are positively correlated with at least one of the computing power, heat dissipation and heat dissipation requirements of the corresponding server modules.

[0034] In a second aspect, an embodiment of the present application provides a computing device, comprising at least one server module and a cooling device according to any one of the above-mentioned embodiments of the present application.

[0035] In one embodiment, there are multiple server modules, and the multiple server modules are arranged in at least one row along the first direction.

[0036] In one embodiment, an interface for connecting a wiring harness is disposed on the top of the server module, and the interface is disposed adjacent to the bearing cavity.

[0037] In a third aspect, an embodiment of the present application provides a device framework, including:

[0038] A frame body, the frame body defining at least one accommodating cavity;

[0039] At least one cooling device of any one of the above embodiments of the present application can be slidably disposed on the frame to slide into or out of the accommodating cavity.

[0040] In one embodiment, there are a plurality of accommodating cavities arranged at intervals along the vertical direction, and there are a plurality of cooling devices arranged corresponding to the plurality of accommodating cavities.

[0041] In a fourth aspect, an embodiment of the present application provides a computing assembly, including at least one server module and the device framework of the above-mentioned embodiment of the present application.

[0042] In a fifth aspect, an embodiment of the present application provides a data center, comprising a cooling device according to any one of the above-described embodiments of the present application.

[0043] In a sixth aspect, an embodiment of the present application provides a container data center, including:

[0044] The first container body has a cooling device arranged therein.

[0045] In a seventh aspect, an embodiment of the present application provides a container data center, including:

[0046] A first container body, wherein a cooling device is arranged in the first container body;

[0047] The second container body has a cold source device arranged in the second container body. The cold source device is used to cool the heat exchange medium. The heat exchange medium is used to perform heat exchange with the cooling medium.

[0048] According to the cooling device of the embodiment of the present application, a cooling cavity and a bearing cavity are arranged on the main body. The cooling cavity is used to accommodate a server module and a cooling medium so as to realize immersion cooling of the server module through the cooling medium. The bearing cavity is used to carry a pipeline module, for example, it can carry at least part of the pipelines of the pipeline module and a power module. As a result, the integration of the cooling device is improved, the installation space of the cooling device is reduced, and it is beneficial to the integrated deployment of the data center.

[0049] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0051] Figure 1 A schematic diagram showing the structure of a cooling device according to an embodiment of the present application is shown;

[0052] Figure 2 A side view of a cooling device according to an embodiment of the present application is shown;

[0053] Figure 3 Another side view of a cooling device according to an embodiment of the present application is shown;

[0054] Figure 4 A top view showing an example of a computing device according to an embodiment of the present application;

[0055] Figure 5 A perspective view showing a device frame according to an embodiment of the present application;

[0056] Figure 6 A rear view of a device frame according to an embodiment of the present application is shown;

[0057] Figure 7 A side view showing an example of a device frame according to an embodiment of the present application;

[0058] Figure 8 A side view showing another example of a device frame according to an embodiment of the present application;

[0059] Fig. 9 A schematic diagram showing the structure of a container data center according to an embodiment of the present application is shown;

[0060] Fig.10 A schematic structural diagram of a container data center according to another embodiment of the present application is shown.

[0061] Description of reference numerals:

[0062] Equipment frame 1;

[0063] Cooling device 100;

[0064] Body 10; cooling chamber 11; input port 111; output port 112; bearing chamber 12; bearing plate 13; harness storage portion 14; storage slot 14a; first through hole 141; third through hole 143;

[0065] Pipeline module 20; power module 21; first pipeline group 22; first delivery pipe 221; second delivery pipe 222; second pipeline group 23; third delivery pipe 231; fourth delivery pipe 232; quick-connect valve 23a;

[0066] Heat exchange module 30;

[0067] Handle 40;

[0068] Frame 200; Accommodating chamber 200a;

[0069] Server module 2; interface 2a;

[0070] Container data center 1000 ; first container body 1001 ; second container body 1002 ; cold source equipment 1003 . DETAILED DESCRIPTION

[0071] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0072] Refer to the following Figures 1 to 3 A cooling device 100 according to an embodiment of the present application is described.

[0073] Figure 1 FIG. 1 is a schematic diagram showing the structure of a cooling device 100 according to an embodiment of the present application. Figure 1 As shown, the cooling device 100 includes a body 10 and a pipe module 20. Specifically, the body 10 defines a cooling cavity 11 and a bearing cavity, and the cooling cavity 11 is used to accommodate the cooling medium and the server module 2. The bearing cavity is installed with a pipe module 20, one end of the pipe module 20 is connected to the cooling cavity 11, and the other end of the pipe module 20 is connected to the cold source device 1003; the pipe module 20 is used to guide the cooling medium to be cooled from the cooling cavity 11 to the cold source device 1003, and to transport the cooled cooling medium from the cold source device 1003 to the cooling cavity 11.

[0074] In the embodiment of the present application, the cooling device 100 can be used in a data center, specifically for installing a server module 2 and providing cooling for the server module 2 .

[0075] In the embodiment of the present application, the cooling method of the cooling device 100 adopts immersion liquid cooling. Immersion liquid cooling refers to directly immersing the server module 2 in a cooling medium with electrical insulation properties, so that the heat generated by the server module 2 during operation can be directly transferred to the cooling medium, thereby achieving cooling of the server module 2. By adopting the immersion liquid cooling method, the heat generated by the server module 2 can be directly and effectively transferred to the cooling medium. Compared with the air cooling or water cooling cooling methods commonly used in related technologies, there is no need to set up thermal interface materials, radiators, fans and other components, which significantly improves the cooling efficiency of the server module 2 and is also beneficial to energy saving and environmental protection.

[0076] In order to ensure that the server module 2 immersed in the cooling medium can work normally, the cooling medium must have insulating properties and certain anti-corrosion properties to avoid damage to the packaging of the server module 2, and the cooling medium must also meet the conditions of being non-flammable, non-toxic and easy to clean. For example, the cooling medium can be an electronic fluorinated liquid.

[0077] In other examples of the present application, the cooling medium may also be cooling oil.

[0078] In one example, the cooling medium can specifically adopt GTL (Gas to Liquid, natural gas synthesis) base oil. GTL base oil is a base oil synthesized from hydrocarbons as raw materials. GTL base oil has a high saturated hydrocarbon content, basically contains no nitrogen and sulfur, no aromatics, is 100% isoparaffin, has excellent oxidation stability and low-temperature performance, low volatility, and a very high viscosity index. Therefore, by adopting GTL base oil as the cooling medium, the stability of the cooling medium in a low-temperature state can be improved, thereby improving the working reliability of the cooling device 100.

[0079] In another example, transformer oil can also be used as the cooling medium. Transformer oil is a fractionation product of petroleum, and its main components are compounds such as alkanes, cycloalkanes, and aromatic unsaturated hydrocarbons. It is commonly known as square shed oil, a light yellow transparent liquid with a relative density of 0.895. The freezing point is <-45°C. Transformer oil is a mineral oil obtained by distillation and refining of natural petroleum. It is a mixture of pure, stable, low-viscosity, good insulation, and good cooling liquid natural hydrocarbons obtained by acid-base refining of the lubricating oil fraction in petroleum. By using transformer oil as a cooling medium, the stability of the cooling medium in low temperature can also be improved, and it has good insulation performance, which can improve the reliability of computing equipment during operation.

[0080] The above is only an example, and the present application does not limit the specific material of the cooling medium.

[0081] In addition, in some embodiments, the server module 2 is waterproof, in which case the cooling medium may also be water. For example, the shell of the server module 2 is waterproof, and the heat generated by the electronic device is transferred to the shell, and then transferred to the water through the shell.

[0082] According to whether there is a phase change in the cooling medium, immersion liquid cooling can also be divided into single-phase immersion liquid cooling and phase change immersion liquid cooling. Among them, in the single-phase immersion liquid cooling method, the server module 2 is directly immersed in the cooling medium, and the heat generated by the server module 2 is transferred to the cooling medium, and then the high-temperature cooling medium after absorbing the heat is transported to the heat exchanger through the circulating pump. The high-temperature cooling medium is cooled in the heat exchanger and then flows back to the cooling chamber 11. In this process, the cooling medium always remains in a liquid state. In the phase change immersion liquid cooling, the server module 2 is directly immersed in the dielectric cooling medium in the cooling chamber 11, and the heat generated by the server module 2 is transferred to the cooling medium, so that part of the cooling medium is converted from liquid to gas. The gaseous cooling medium condenses on the condenser in the cooling chamber 11 and then converts to liquid. In this process, the phase change of the cooling medium can exponentially improve the heat transfer efficiency of the cooling medium. The cooling device 100 of the embodiment of the present application may specifically adopt a cooling method of single-phase immersion liquid cooling or phase change immersion liquid cooling, which is not specifically limited in the embodiment of the present application.

[0083] It is understandable that the cooling medium in the cooling chamber 11 exchanges heat with the server module 2, that is, after cooling the server module 2, the heat generated by the server module 2 is transferred to the cooling medium, causing the temperature of the cooling medium to rise. Based on this, it is necessary to transfer the heat of the cooling medium to the outside to cool the cooling medium. In the embodiment of the present application, the cold source device 1003 is used to provide a cold source for cooling the cooling medium. The pipeline module 20 is connected between the cooling chamber 11 and the cold source device 1003, and is used to guide the cooling medium to be cooled in the cooling chamber 11, and to transport the cooled cooling medium to the cooling chamber 11.

[0084] In the embodiment of the present application, the cold source device 1003 can directly cool the cooling medium or indirectly cool the cooling medium.

[0085] In one example, the pipeline module 20 directly transports the cooling medium to be cooled to the cold source device 1003, so that the cooling medium directly undergoes heat exchange at the cold source device 1003, thereby realizing that the cold source device 1003 directly cools the cooling medium. The cold source device 1003 can specifically adopt one or more of a cooling tower, a condenser, a dry cooler, and a cooling fan, and this application does not limit this.

[0086] In another example, a heat exchange module 30 is arranged between the pipeline module 20 and the cold source device 1003. The pipeline module 20 transports the cooling medium to be cooled to the heat exchange module 30. At the same time, the cold source device 1003 transports the low-temperature heat exchange medium to the heat exchange module 30. The cooling medium to be cooled and the low-temperature heat exchange medium exchange heat in the heat exchange module 30, so that the heat of the cooling medium to be cooled is transferred to the low-temperature heat exchange medium, thereby realizing that the cold source device 1003 indirectly cools the cooling medium.

[0087] It should be noted that the cold source device 1003 can be integrated with the cooling device 100, for example, it can be arranged in the bearing cavity of the main body 10, and the cold source device 1003 can also be non-integrated with the cooling device 100, for example, the cold source device 1003 can be arranged outside the bearing cavity and separated from the main body 10.

[0088] In the embodiment of the present application, the pipeline module 20 includes, in addition to the pipeline for conveying low-temperature cooling medium to the cooling chamber 11 and for outputting the cooling medium to be cooled from the cooling chamber 11, a power module 21, which is used to provide power for the input and / or output of the cooling medium to realize the circulation of the cooling medium between the cooling chamber 11 and the outside. The power module 21 and the pipeline connected between the power module 21 and the cooling chamber 11 can be integrated and deployed in the bearing chamber.

[0089] According to the cooling device 100 of the embodiment of the present application, a cooling chamber 11 and a bearing chamber are arranged on the main body 10. The cooling chamber 11 is used to accommodate the server module 2 and the cooling medium so as to achieve immersion cooling of the server module 2 through the cooling medium. The bearing chamber is used to carry the pipeline module 20, for example, it can carry at least part of the pipelines of the pipeline module 20 and the power module 21. As a result, the integration of the cooling device 100 is improved, and the installation space of the cooling device 100 is reduced, which is conducive to the integrated deployment of the data center.

[0090] In one embodiment, if Figure 2 As shown, the cooling cavity 11 and the bearing cavity are distributed in the horizontal direction.

[0091] In the embodiment of the present application, the horizontal direction refers to any direction perpendicular to the vertical direction, for example, the front-to-back direction or the left-to-right direction of the cooling device 100 after installation in the data center, which is not specifically limited in the embodiment of the present application.

[0092] In a specific example, the cooling device 100 can be installed in a rack 200 of a data center, and the cooling device 100 is slidably connected to the rack 200, so that the cooling device 100 can slide into or out of the receiving cavity 200a of the rack 200 in a horizontal direction. The cooling cavity 11 and the bearing cavity can be distributed in the horizontal sliding direction of the cooling device 100 relative to the rack 200.

[0093] In another specific example, the cooling cavity 11 and the bearing cavity may also be distributed in a horizontal direction perpendicular to the horizontal sliding direction of the frame 200 .

[0094] Through the above-mentioned implementation, in the process of assembling the server module 2 and the pipeline module 20 to the cooling cavity 11 and the carrying cavity respectively, the cooling cavity 11 and the carrying cavity will not interfere with each other. For example, the server module 2 and the pipeline module 20 can be assembled from the upper side of the cooling cavity 11 and the upper side of the carrying cavity respectively, thereby improving the convenience of assembly.

[0095] In one embodiment, a side of the support cavity away from the cooling cavity 11 is open.

[0096] It is understandable that the side of the bearing cavity away from the cooling cavity 11 is open to form an opening, so that the bearing cavity can be connected to the outside through the opening. In this way, the pipeline of the pipeline module 20 installed in the bearing cavity can extend through the opening and be connected to the cold source equipment 1003 of the data center, which is also convenient for the staff to install or repair the pipeline module 20.

[0097] In some examples, the bearing cavity has two opposite sides in the first direction, one side of which is adjacent to the cooling cavity 11 and the other side is disposed away from the cooling cavity 11. The bearing cavity has two opposite sides in the second direction, and the second direction is perpendicular to the first direction. Figure 1 As shown, in addition to setting an opening on the side of the bearing cavity away from the cooling cavity 11, openings can also be set on two opposite sides of the bearing cavity in the second direction to further improve the convenience for the staff to install or repair the pipeline module 20.

[0098] In some other examples, baffles may be installed on two opposite sides of the bearing cavity in the second direction, so that the bearing cavity is open only on one side away from the cooling cavity 11 .

[0099] Optionally, the body 10 includes a carrying plate 13 , and the carrying cavity is formed on an upper side of the carrying plate 13 .

[0100] Exemplarily, the body 10 includes a semi-enclosed shell and a bearing plate 13 , the interior of the semi-enclosed shell defines a bearing cavity and is open at the top, the bearing plate 13 is connected to the bottom end of the side of the semi-enclosed shell, and the bearing cavity is defined by the upper side of the bearing plate 13 .

[0101] Therefore, the structure of the main body 10 is simplified and the installation convenience of the pipeline module 20 in the bearing cavity is improved.

[0102] Optionally, the carrying plate 13 is provided with a through hole (not shown in the figure), and the through hole communicates with the upper side surface and the lower side surface of the carrying plate 13 .

[0103] For example, there may be multiple through holes, which are evenly distributed on the carrier plate 13. Those skilled in the art may flexibly set the aperture of the through holes, the spacing between adjacent through holes, and the number of through holes according to actual conditions, and the present application embodiment does not specifically limit this.

[0104] With such arrangement, when cooling medium is accumulated in the bearing cavity, the cooling medium can be drained to the outside of the cooling cavity through the through hole, thereby preventing the cooling medium from being retained in the bearing cavity.

[0105] In one embodiment, if Figures 1 to 3 As shown, the cooling device 100 also includes a heat exchange module 30, and a first heat exchange flow path and a second heat exchange flow path are provided inside the heat exchange module 30. The cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to cool the cooling medium.

[0106] In an embodiment of the present application, the heat exchange module 30 is respectively connected to the cooling chamber 11 and the cold source device 1003 through the pipeline module 20, so that the cooling medium circulates between the cooling chamber 11 and the first heat exchange flow path, and the heat exchange medium circulates between the cold source device 1003 and the second heat exchange flow path.

[0107] Exemplarily, the heat exchange module 30 can adopt any form of heat exchanger. Preferably, the heat exchange module 30 can specifically adopt a plate heat exchanger. It can be understood that the plate heat exchanger has the advantages of high heat transfer coefficient, small space occupation, light weight and low cost. As a result, the heat exchange efficiency of the server module 2 can be improved, the load of the body 10 of the cooling device 100 can be reduced, the outer dimensions of the cooling device 100 can be reduced to reduce the space occupation, and it is also beneficial to reduce the cost of the cooling device 100.

[0108] According to the above-mentioned embodiment, by setting up a heat exchange module 30 and using the heat exchange medium output by the cold source device 1003 to cool the cooling medium by heat exchange, compared with using the cold source device 1003 to directly cool the cooling medium, the flow path of the cooling medium circulation cooling is shortened, and the cooling medium is avoided from absorbing heat and heating up during the transportation along the longer flow path, thereby improving the efficiency and reliability of cooling the server module 2.

[0109] In one embodiment, each cooling device 100 is correspondingly provided with a heat exchange module 30 , and the heat exchange module 30 is installed in the bearing cavity.

[0110] Exemplarily, each cooling device 100 is provided with a corresponding heat exchange module 30, and the heat exchange module 30 is fixedly mounted on the upper surface of the carrier plate 13. The heat exchange module 30 may be plate-shaped and placed horizontally on the upper surface of the carrier plate 13. The heat exchange module 30 may be fixedly connected to the carrier plate 13 by other means such as fasteners. In addition, the cooling device 100 of the embodiment of the present application may be a plurality of integrated arrangements, and the heat exchange modules 30 of the plurality of cooling devices 100 are respectively connected to the cold source device 1003 through the corresponding pipeline modules 20, so as to connect the heat exchange medium output by the cold source device 1003 to the heat exchange module 30 of each cooling device 100.

[0111] Thus, each cooling device 100 is provided with a corresponding heat exchange module 30, thereby ensuring sufficient cooling capacity of the cooling device 100 and further improving the cooling efficiency of the cooling medium. In addition, the heat exchange module 30 is integrated in the bearing cavity, which is conducive to ensuring the integration of the cooling device 100, thereby improving the deployment convenience of the cooling device 100.

[0112] In one embodiment, if Figure 2 and Figure 3 As shown, the pipeline module 20 includes a first pipeline group 22, which is connected between the cooling chamber 11 and the heat exchange module 30, and is used for circulating the cooling medium between the cooling chamber 11 and the first heat exchange flow path.

[0113] Preferably, the first pipeline group 22 and the heat exchange module 30 can be deployed together in the bearing cavity to shorten the flow path of the first pipeline group 22 and reduce the occupation of the external space.

[0114] Optionally, the first pipeline group 22 includes a first delivery pipe 221 and a second delivery pipe 222, the first delivery pipe 221 is connected between the input end of the first heat exchange flow path and the output port 112 of the cooling chamber 11, and the second delivery pipe 222 is connected between the output end of the first heat exchange flow path and the input port 111 of the cooling chamber 11.

[0115] It can be understood that the first delivery pipe 221 is used to deliver the high-temperature cooling medium after absorbing heat in the cooling chamber 11 to the first heat exchange flow path. During the flow of the high-temperature cooling medium along the first heat exchange flow path, it exchanges heat with the heat exchange medium in the second heat exchange flow path, and forms a low-temperature cooling medium after releasing heat, and then flows back to the cooling chamber 11 through the second delivery pipe 222, thereby circulating.

[0116] Exemplarily, the first delivery pipe 221 and the second delivery pipe 222 can be in the shape of multiple bends, and can be specifically arranged according to the relative position relationship between the input end of the first heat exchange flow path and the output port 112 of the cooling chamber 11, and the relative position relationship between the output end of the first heat exchange flow path and the input port 111 of the cooling chamber 11. The embodiment of the present application does not make specific limitations on this.

[0117] Optionally, an input port 111 and an output port 112 are formed on a wall of the cooling cavity 11 adjacent to the bearing cavity, and a height of the input port 111 in the vertical direction is smaller than a height of the output port 112 in the vertical direction.

[0118] For example, after the coolant is transported from the input port 111 into the cooling chamber 11, the liquid level of the coolant gradually rises and submerges the server module 2, and when the coolant overflows to the output port 112, it is discharged from the output port 112. In other words, the coolant enters the cooling chamber 11 from the input port 111 at a lower height and flows upward, and then flows out from the output port 112 at a higher height.

[0119] Further, the input port 111 is disposed adjacent to the bottom of the cooling cavity 11 , and the output port 112 is disposed adjacent to the top of the cooling cavity 11 .

[0120] Exemplarily, the height positions of the output port 112 and the input port 111 can be set accordingly according to the height size of the server module 2. For example, the height position of the output port 112 can be level with the top of the server module 2 or located on the upper side of the top of the server module 2. The height position of the input port 111 can be level with the bottom of the server module 2 or located on the lower side of the bottom of the server module 2. In this way, it can be ensured that the coolant in the cooling chamber 11 immerses the server module 2.

[0121] Optionally, the pipeline module 20 further includes a power module 21 , which is installed in the bearing cavity and arranged in the first pipeline group 22 , and is used to provide power for the circulation of the cooling medium between the cooling cavity 11 and the heat exchange module 30 .

[0122] In some examples, the power module 21 includes a first pump body disposed on the first delivery pipe 221 of the first pipeline group 22 and / or a second pump body disposed on the second delivery pipe 222 of the first pipeline group 22 .

[0123] In a specific example, the power module 21 includes a first pump body disposed on a first delivery pipe 221 of the first pipeline group 22. The first delivery pipe 221 includes a first pipe section and a second pipe section, the two ends of the first pipe section are respectively connected between the output port 112 of the cooling chamber 11 and the input end of the first pump body, and the two ends of the second pipe section are respectively connected between the output end of the first pump body and the input end of the first heat exchange flow path. It can be understood that the first pump body is used to provide power for the flow of the cooling medium in the first delivery pipe 221.

[0124] In another specific example, the power module 21 includes a second pump body disposed on the second delivery pipe 222 of the first pipeline group 22. The second delivery pipe 222 includes a third pipe section and a fourth pipe section, the two ends of the third pipe section are respectively connected between the output end of the first heat exchange flow path and the input end of the second pump body, and the two ends of the fourth pipe section are respectively connected between the output end of the first pump body and the input port 111 of the cooling chamber 11. It can be understood that the second pump body is used to provide power for the flow of the cooling medium in the second delivery pipe 222.

[0125] In another specific example, the power module 21 includes a first pump body disposed on the first delivery pipe 221 of the first pipeline group 22 and a second pump body disposed on the second delivery pipe 222 of the first pipeline group 22. The first delivery pipe 221 and the second delivery pipe 222 can be disposed in the same manner as in the above example, and will not be described in detail here.

[0126] In one embodiment, each cooling device 100 is correspondingly provided with a heat exchange module 30 , and the heat exchange module 30 and the power module 21 are deployed together in the bearing cavity.

[0127] In one example, the power module 21 includes a first pump body arranged on a first delivery pipe 221 of the first pipeline group 22. The output port 112 and the input port 111 of the cooling chamber 11 are arranged at intervals in the horizontal direction, and accordingly, the first pump body and the heat exchange module 30 are arranged at intervals in the bearing chamber. Among them, the output port 112 of the cooling chamber 11 is arranged directly opposite to the input end of the first pump body, the output end of the first pump body is arranged adjacent to the input end of the heat exchange module 30, and the output end of the heat exchange module 30 is arranged directly opposite to the input port 111 of the cooling chamber 11. As a result, the length of the first pipe section connected between the input port 111 of the cooling chamber 11 and the input end of the first pump body, the second pipe section connected between the output end of the first pump body and the input end of the first heat exchange flow path, and the second delivery pipe 222 connected between the output end of the first heat exchange flow path and the input port 111 of the cooling chamber 11 can be shortened, thereby shortening the circulation flow path of the cooling medium and improving the circulation efficiency and heat exchange efficiency of the cooling medium.

[0128] In another example, the power module 21 includes a second pump body arranged on the second delivery pipe 222 of the first pipeline group 22. The input port 111 and the input port 111 of the cooling chamber 11 are arranged at intervals in the horizontal direction, and accordingly, the second body 10 and the heat exchange module are arranged at intervals in the bearing chamber. Among them, the input port 111 of the cooling chamber 11 is arranged opposite to the output end of the second pump body, the input end of the second pump body is arranged adjacent to the output end of the first heat exchange flow path of the heat exchange module 30, and the input end of the first heat exchange flow path is arranged opposite to the output port 112 of the cooling chamber 11. As a result, the length of the first delivery pipe 221 connected between the output port 112 of the cooling chamber 11 and the input end of the first heat exchange flow path, the third pipe section connected between the output end of the first heat exchange flow path and the input end of the second pump body, and the fourth pipe section connected between the output end of the second pump body and the input port 111 of the cooling chamber 11 can be shortened, thereby shortening the circulation flow path of the cooling medium and improving the circulation efficiency and heat exchange efficiency of the cooling medium.

[0129] In one embodiment, if Figure 2 and Figure 3 As shown, the pipeline module 20 also includes a second pipeline group 23 , and the second pipeline group 23 is connected between the heat exchange module 30 and the cold source device 1003 .

[0130] It can be understood that the second pipeline group 23 is used to connect the second heat exchange flow path of the heat exchange module 30 and the cold source device 1003, so that the heat exchange medium output by the cold source device 1003 enters the second heat exchange flow path, and then flows back to the cold source device 1003 after heat exchange with the cooling medium in the second heat exchange flow path, thereby realizing the circulation of the heat exchange medium between the cold source device 1003 and the second heat exchange flow path of the heat exchange module 30.

[0131] Optionally, the second pipeline group 23 includes a third delivery pipe 231 and a fourth delivery pipe 232, the third delivery pipe 231 is connected between the input end of the second heat exchange flow path and the heat exchange medium delivery pipe of the cold source equipment 1003, and the fourth delivery pipe 232 is connected between the output end of the second heat exchange flow path and the heat exchange medium return pipe of the cold source equipment 1003.

[0132] Exemplarily, the third delivery pipe 231 is used to deliver the heat exchange medium output from the cold source device 1003 to the second heat exchange flow path of the heat exchange module 30, the output end of the third delivery pipe 231 is connected to the input end of the second heat exchange flow path of the heat exchange module 30, and the input end of the third delivery pipe 231 is connected to the heat exchange medium delivery pipe of the cold source device 1003. The fourth delivery pipe 232 is used to deliver the heat exchange medium flowing out of the second heat exchange flow path of the heat exchange module 30 to the cold source device 1003, the input end of the fourth delivery pipe 232 is connected to the output end of the second heat exchange flow path of the heat exchange module 30, and the output end of the fourth delivery pipe 232 is connected to the heat exchange medium return pipe of the cold source device 1003.

[0133] In some specific examples, the cooling device 100 of the embodiment of the present application can be a plurality of groups of integrated settings, and the data center includes a plurality of racks 200 for installing the plurality of groups of cooling devices 100, and each group of cooling devices 100 is correspondingly installed on the corresponding rack 200. The heat exchange medium delivery pipe of the cold source equipment 1003 includes a main delivery pipe and a branch delivery pipe, and the heat exchange medium return pipe includes a main return pipe and a branch return pipe. The main delivery pipe and the main return pipe are respectively connected to the output end and the return end of the cold source equipment 1003, and the main delivery pipe and the main return pipe pass through each group of cooling devices 100. There are multiple branch delivery pipes and branch return pipes corresponding to each group of cooling devices 100, and each branch delivery pipe and branch return pipe is respectively connected to the third delivery pipe 231 and the fourth delivery pipe 232 of the corresponding cooling device 100, wherein the branch delivery pipe is used to transport the heat exchange medium in the main delivery pipe to the second heat exchange flow path of the corresponding heat exchange module 30 through the third delivery pipe 231, and the branch return pipe is used to supply the heat exchange medium in the second heat exchange flow path of the corresponding heat exchange module 30 to flow back to the cold source equipment 1003 through the fourth delivery pipe 232.

[0134] Furthermore, a quick valve 23a is provided at the input end of the third delivery pipe 231 and / or the output end of the fourth delivery pipe 232 .

[0135] Exemplarily, the quick valve 23a at the input end of the third delivery pipe 231 is used to connect to the heat exchange medium delivery pipe of the cold source device 1003, specifically to connect to the branch delivery pipe of the heat exchange medium delivery pipe. The quick valve 23a at the output end of the fourth delivery pipe 232 is used to connect to the heat exchange medium return pipe of the cold source device 1003, specifically to connect to the branch return pipe of the heat exchange medium return pipe.

[0136] With such an arrangement, the third delivery pipe 231 and the fourth delivery pipe 232 can be quickly connected to the cold source equipment 1003, and when the cooling device 100 needs to be moved, for example, when the cooling device 100 is slid out of the frame 200, the third delivery pipe 231 and the fourth delivery pipe 232 can be disconnected from the cold source equipment 1003 through the quick valve 23a, so that the staff can inspect and repair the cooling device 100.

[0137] In one embodiment, each of the plurality of cooling devices 100 is provided with a heat exchange module 30 , and the heat exchange module 30 is independently installed outside the cooling device 100 .

[0138] Exemplarily, the cooling chambers 11 of the multiple cooling devices 100 are respectively connected to the heat exchange module 30 through the corresponding pipe module 20, so as to share a heat exchange module 30 to cool the cooling medium of the multiple cooling devices 100. The heat exchange module 30 can be deployed at any location in the data center, and the embodiment of the present application does not specifically limit this.

[0139] In some examples, the data center may adopt a containerized data center, which includes a first container body 1001 and a second container body 1002. The heat exchange module 30 may be deployed together with the cooling device 100 in the first container body 1001, and the cold source device 1003 may be deployed in the second container body 1002; or, the cooling device 100 may be deployed in the first container body 1001, and the heat exchange module 30 and the cold source device 1003 may be deployed together in the second container body 1002. It is understandable that by deploying the heat exchange module 30 and the cooling device 100 in the first container body 1001, it is helpful to shorten the pipeline between the cooling device 100 and the heat exchange module 30, thereby shortening the circulation flow path of the cooling medium between the cooling device 100 and the heat exchange module 30, which is helpful to reduce the cooling loss of the cooling medium. By deploying the heat exchange module 30 in the second container body 1002, it is helpful to shorten the pipeline between the cold source device 1003 and the heat exchange module 30, thereby shortening the circulation flow path of the heat exchange medium between the heat exchange module 30 and the cold source device 1003, which is helpful to reduce the cold loss of the heat exchange medium. Those skilled in the art can specifically select the setting position of the heat exchange module 30 according to actual conditions, and the embodiment of the present application does not specifically limit this.

[0140] The above implementation is helpful to reduce the number of heat exchange modules 30 when multiple cooling devices 100 are centrally deployed, thereby simplifying the overall structural complexity and reducing equipment costs.

[0141] In one embodiment, if Figures 1 to 3 As shown, the body 10 further includes a wire harness storage portion 14 , and the wire harness storage portion 14 and the bearing cavity are located on the same side of the cooling cavity 11 .

[0142] In the embodiment of the present application, the wire harness storage portion 14 is used to store wire harnesses of other components such as the server module 2 and / or the power module 21 .

[0143] Optionally, the harness storage portion 14 is located on the upper side of the cooling cavity 11 .

[0144] Exemplarily, the harness storage portion 14 is disposed at the top of the wall of the body 10 between the storage cavity and the cooling cavity 11, and is located on the upper side of the cooling cavity 11 and covers the top of the cooling cavity 11. The harness storage portion 14 can be detachably connected to the body 10, or can be an integrally formed structure.

[0145] Through the above implementation, the space on the upper side of the cooling cavity 11 can be fully utilized, which is also conducive to the mutual isolation of the wiring harness and the cooling cavity 11, thereby improving the power supply safety.

[0146] Optionally, the harness storage portion 14 has a storage groove 14 a with an open top, and the storage groove 14 a is used to store the power distribution unit.

[0147] Exemplarily, the wire harness storage portion 14 includes a bottom plate and four side plates connected to the outer edge of the bottom plate, the four side plates include two first side plates arranged opposite to each other in the length direction of the bottom plate and two second side plates arranged opposite to each other in the width direction of the bottom plate, the bottom plate, the two first side plates and the two second side plates jointly define a storage slot 14a with a top opening, and the power distribution unit is suitable for being installed in the storage slot 14a through the top opening.

[0148] In the embodiment of the present application, the power distribution unit can adopt any scheme.

[0149] In one example, the power distribution unit can adopt a conventional solution, and the lower end of the incoming switch is directly electrically connected to the power distribution unit. In another example, the power distribution unit can adopt a circuit breaker wiring solution, that is, the lower end of the incoming switch is connected to the wiring terminal of the power distribution unit, and one end of the power cord of the server module 2 is directly pressed onto the divider at the lower end of the incoming switch. In another example, the power distribution unit can adopt a wiring terminal solution, the lower end of the incoming switch is connected to the wiring terminal, and one end of the power cord of the server module 2 is crimped with a pin and then connected to the terminal of the power distribution unit. In yet another example, the power distribution unit can adopt a mounting plate solution, that is, the lower end of the incoming switch is directly connected to the socket of the unit distribution unit, and the socket is mounted on the mounting plate.

[0150] In one embodiment, if Figure 1 As shown, the wall of the storage slot 14a adjacent to the cooling chamber 11 is provided with a first through hole 141, and the first through hole 141 is used for the power line of the server module 2 to pass through and be electrically connected to the power distribution unit. The wall of the storage slot 14a adjacent to the bearing chamber is provided with a second through hole, and the second through hole is used for the power line of the power module 21 of the pipeline module 20 to pass through and be electrically connected to the power distribution unit. The wall of the storage slot 14a is provided with a third through hole 143, and the third through hole 143 is used for the power transmission line to pass through and be electrically connected to the power distribution unit in the storage slot 14a.

[0151] Exemplarily, the front side wall of the storage slot 14a (i.e., the wall adjacent to the cooling chamber 11) is provided with a plurality of first vias 141, and the plurality of first vias 141 are arranged side by side in the horizontal direction. The first vias 141 are arranged through the front side wall of the storage slot 14a and connect the storage chamber and the cooling chamber 11, so that the plurality of wiring harnesses of the plurality of server modules 2 can pass through side by side and be electrically connected to the power distribution unit in the storage slot 14a. The width dimension of the first via 141 is greater than the height dimension, and the shape of the first via 141 can be any shape, for example, it can be set to an elliptical shape, and the embodiment of the present application does not specifically limit this. The bottom wall of the storage slot 14a is provided with a second via, and the second via passes through the bottom wall of the storage slot 14a and connects the storage chamber and the bearing chamber, so that the power cord of the power module 21 can pass through and be electrically connected to the power distribution unit in the storage slot 14a. A third through hole 143 connecting the storage cavity and the outside is provided on the left side wall or the right side wall of the storage slot 14a, for allowing the power transmission line to pass through and be electrically connected to the power distribution unit in the storage slot 14a.

[0152] Optionally, the liquid level of the coolant in the cooling chamber 11 is greater than or equal to the top height of the computing unit of the server module 2; the wire harness storage portion 14 is located on the upper side of the top of the cooling chamber 11, so that the height of the first through hole 141 is greater than the liquid level of the coolant in the cooling chamber 11.

[0153] Such a configuration, on the one hand, can ensure that the coolant in the cooling chamber 11 can immerse the computing unit of the server module 2, so that the coolant is in full contact with the computing unit of the server module 2, thereby improving the cooling efficiency and balance of the computing unit of the server module 2; on the other hand, by setting the liquid level of the coolant in the cooling chamber 11 to be less than the height of the first through hole 141, it is possible to prevent the coolant in the cooling chamber 11 from leaking to the outside of the cooling chamber 11 through the first through hole 141, and it is possible to prevent the coolant from contacting the power distribution unit in the storage slot 14a, thereby improving the safety of electricity use.

[0154] In a specific example, the portion of the harness storage portion 14 directly facing the power module 21 is provided with a relief portion protruding in a direction away from the bearing cavity, which is used to avoid the power module 21. Such a configuration can avoid interference between the harness storage portion 14 and the power module 21, and fully utilize the upper space of the bearing cavity, which is conducive to improving the structural compactness of the cooling device 100.

[0155] In one embodiment, a support plate for supporting the server module 2 is provided inside the cooling cavity 11 , and the support plate is provided with flow-guiding holes for allowing the cooling medium to flow upward.

[0156] Exemplarily, the support plate is arranged in the cooling cavity 11 in the horizontal direction to separate the cooling cavity 11 into an upper space and a lower space. A plurality of cooling modules are arranged in the upper space of the cooling cavity 11, the input port 111 is arranged in the lower space of the cooling cavity 11, and the output port 112 is arranged in the upper space of the cooling cavity 11. A plurality of flow guide holes are arranged in an array on the support plate. For example, a plurality of flow guide holes can be arranged in a plurality of groups at intervals in the first direction, and a plurality of flow guide holes in each group are arranged at intervals in the second direction. It can be understood that after the cooling medium is input into the lower space of the cooling cavity 11 from the input port 111, the cooling medium can enter the upper space of the cooling cavity 11 through the plurality of flow guide holes on the support plate, thereby immersing the plurality of cooling modules located in the upper space. The embodiment of the present application does not specifically limit the fixing method of the support plate in the cooling cavity 11. For example, it can be fixed by fastener connection or by snap-fit ​​connection.

[0157] Optionally, there are multiple server modules 2, and the support plate includes multiple diversion areas corresponding to the multiple server modules 2, and the flow area and / or arrangement density of the diversion holes in the diversion areas are positively correlated with at least one of the computing power, heat dissipation and heat dissipation requirements of the corresponding server modules 2.

[0158] In an embodiment of the present application, multiple diversion areas correspond to multiple server modules 2. One diversion area may correspond to several server modules 2, or several diversion areas may correspond to one server module 2, or each diversion area may correspond to one server module 2.

[0159] In one example, the plurality of guide areas of the support plate correspond one to one with the plurality of server modules 2, and each guide area is arranged vertically opposite to the corresponding server module 2. For example, the plurality of server modules 2 may be arranged adjacent to each other along a first direction, and the plurality of guide areas are also arranged adjacent to each other along the first direction, and each guide area is located directly below the corresponding server module 2.

[0160] For different flow diversion areas, the flow area and / or arrangement density of the diversion holes in the flow diversion areas may be set accordingly according to the different computing capabilities of the corresponding server modules 2 .

[0161] For example, the flow areas of the diversion holes in different diversion areas may be the same, and the arrangement density of the diversion holes in the diversion area is positively correlated with the computing power of the server module 2 corresponding to the diversion area. For another example, the arrangement density of the diversion holes in different diversion areas may be the same, and the flow areas of the diversion holes in the diversion area are positively correlated with the computing power of the server module 2 corresponding to the diversion area. For another example, the flow areas and arrangement density of the diversion holes in different diversion areas are positively correlated with the computing power of the server module 2 corresponding to the diversion area.

[0162] It can be understood that the stronger the computing power of the server module 2 corresponding to the diversion area, the larger the flow area of ​​the diversion holes in the diversion area, and / or the greater the arrangement density of the diversion holes; the weaker the computing power of the server module 2 corresponding to the diversion area, the smaller the flow area of ​​the diversion holes in the diversion area, and / or the smaller the arrangement density of the diversion holes.

[0163] It should be noted that the flow area and arrangement density of the diversion holes in the diversion area will directly affect the flow rate of the cooling medium flowing through the diversion area to the server module 2 per unit time. The larger the flow area of ​​the diversion holes in the diversion area, the larger the flow rate of the cooling medium flowing through the diversion area to the corresponding server module 2 per unit time; conversely, the smaller the flow rate of the cooling medium flowing through the diversion area to the corresponding server module 2 per unit time. The larger the arrangement density of the diversion holes in the diversion area, the larger the flow rate of the cooling medium flowing through the diversion area to the corresponding server module 2 per unit time; conversely, the smaller the flow rate of the cooling medium flowing through the diversion area to the corresponding server module 2 per unit time. It can be understood that the larger the flow rate of the cooling medium flowing through the diversion area to the corresponding server module 2 per unit time, the higher the cooling efficiency of the server module 2; conversely, the lower the cooling efficiency of the server module 2.

[0164] Through the above implementation, the corresponding flow rate of the cooling medium directed to the server module 2 is matched according to the different computing capabilities of the server module 2. For example, for a server module 2 with relatively strong computing capabilities, a cooling medium with a higher flow rate can be provided to the server module 2 through its corresponding flow guide area; for a server module 2 with relatively weak computing capabilities, a cooling medium with a lower flow rate can be provided to the server module 2 through its corresponding flow guide area. In this way, the cooling medium can be evenly distributed to different server modules 2 according to computing capabilities, thereby improving the uniformity of cooling the server modules 2 with different computing capabilities, reducing the probability of uneven temperature distribution of the cooling medium in the cooling chamber 11, and further reducing the probability of cooling medium reflux due to excessively high local cooling medium temperature, thereby improving the working stability and reliability of the server module 2.

[0165] In one embodiment, if Figure 3 As shown, the side wall of the main body 10 is further provided with a handle 40 for a user to hold to apply an external force to the cooling device 100 and drive the cooling device 100 to move.

[0166] Exemplarily, the handle 40 is provided on the front side wall of the body 10. The number of the handles 40 may be at least one, for example, the handles 40 may be two and arranged at intervals in the horizontal direction. The cooling device 100 of the embodiment of the present application may be deployed on the frame 200 and may slide relative to the frame 200, whereby the user applies a pulling force to the cooling device 100 through the handle 40, and may pull the cooling device 100 out of the accommodating cavity 200a on the frame 200, and then perform operations such as maintenance on the server module 2 or the pipeline module 20.

[0167] According to another aspect of the embodiments of the present application, a computing device is also provided. Figure 4 A top view of a computing device according to an embodiment of the present application is shown. Figure 4 As shown, the computing device includes at least one server module 2 and a cooling device 100 according to any one of the above embodiments of the present application.

[0168] The computing device of the embodiment of the present application may specifically be a server cluster or a data center, etc. The server module 2 may include at least one server with the same computing capability, and the computing capabilities of the servers included in different server modules 2 may be the same or different.

[0169] According to the computing device of the embodiment of the present application, by adopting the cooling device 100 of the above embodiment of the present application, the cooling effect for multiple server modules 2 is improved, it has better working stability and reliability, and is also beneficial to reducing the space occupied by the computing device.

[0170] In one embodiment, there are multiple server modules 2, and the multiple server modules 2 are arranged in at least one row along the first direction.

[0171] In the embodiment of the present application, the first direction may be a horizontal direction perpendicular to the arrangement direction of the cooling cavity 11 and the bearing cavity. For example, the cooling cavity 11 and the bearing cavity are arranged in the front-to-back direction of the cooling device 100, and the first direction may be the left-right direction of the cooling device 100.

[0172] In one example, if Figure 4 As shown, a plurality of server modules 2 can be arranged side by side in a row along a first direction, and an interface 2a for connecting a wiring harness is provided on the top of each server module 2, and the interface 2a is arranged on the server module 2 adjacent to the bearing cavity.

[0173] In another example, Figure 1 As shown, the multiple server modules 2 may include multiple rows arranged at intervals in a second direction perpendicular to the first direction, each row includes multiple server modules 2 arranged adjacent to each other along the first direction, and the multiple servers in each server module 2 are also arranged adjacent to each other along the first direction.

[0174] In one embodiment, if Figure 4 As shown, an interface 2a for connecting a wire harness is provided on the top of the server module 2, and the interface 2a is arranged adjacent to the bearing cavity.

[0175] Exemplarily, one side edge of the server module 2 extending in the width direction forms the interface 2a side, and the interface 2a is arranged on the interface 2a side. The interface 2a side may be provided with a variety of interfaces 2a, such as an RJ45 interface 2a, an SFP interface 2a, an SFP+ / SFP28 interface 2a, and a QSFP+ / QSFP28SFP interface 2a, etc. Among them, the interface 2a side of the server module 2 is arranged along a side adjacent to the bearing cavity.

[0176] Thus, the length of the power cord of the server module 2 can be shortened, and it is beneficial to arrange the wiring harnesses of multiple server modules 2.

[0177] According to another aspect of the embodiment of the present application, a device framework 1 is also provided. Figure 5 A perspective view showing a device frame according to an embodiment of the present application is shown, Figure 6 A rear view of the device frame 1 according to an embodiment of the present application is shown, as shown in FIG. Figure 5 and Figure 6 As shown, the equipment frame 1 includes a frame 200 and at least one cooling device 100 as any one of the above-mentioned embodiments of the present application. The frame 200 defines at least one accommodating cavity 200a, and the cooling device 100 can be slidably disposed on the frame 200 to slide into or out of the accommodating cavity 200a.

[0178] Exemplarily, the frame 200 includes a support portion, a column and a support beam, and the support portion and the support beam are connected between two columns. By combining the support portion, the column and the support beam, a storage space for accommodating the cooling device 100 is formed, and the stability of the frame 200 is reinforced by combining the vertical column and the support beam. The frame 200 is defined with at least one storage space. Figure 7 and Figure 8 As shown, the cooling device 100 can be slidably disposed on the frame 200 to slide into or out of the corresponding accommodation space. The computing module is carried on the cooling device 100, including a server module 2 and a cooling module, and the cooling module is used to cool the server module 2.

[0179] In the embodiment of the present application, the number of the accommodation spaces defined by the frame 200 may be one or more, and accordingly, the number of the cooling devices 100 may be one or more corresponding to at least one accommodation space. Each cooling device 100 is slidably disposed on the frame 200 and forms a sliding fit with the corresponding accommodation space, so that the cooling device 100 can slide into or out of the corresponding accommodation space.

[0180] In a specific example, if Figure 5 , Figures 6 to 8 As shown, there are a plurality of accommodating spaces arranged at intervals along the vertical direction, and a plurality of cooling devices 100 are arranged corresponding to the plurality of accommodating spaces.

[0181] The embodiment of the present application does not specifically limit the shape and size of the cooling device 100. The size of the frame 200 can be adapted to the size of the accommodation space. The upper wall surface of the cooling device 100 forms a bearing surface for bearing and fixing the computing module.

[0182] According to the device framework 1 of the embodiment of the present application, the device integration is improved, which is beneficial to reducing the space occupation, thereby reducing the external dimensions of the data center, and is beneficial to realizing the rapid deployment of the data center.

[0183] According to another aspect of an embodiment of the present application, a computing assembly is also provided, including at least one server module 2 and a device framework 1 as described in the above embodiment of the present application.

[0184] The computing assembly of the embodiment of the present application may specifically be a server cluster, etc. The server module 2 may include at least one server with the same computing capability, and the computing capabilities of the servers included in different server modules 2 may be the same or different.

[0185] According to the computing assembly of the embodiment of the present application, by adopting the cooling device 100 of the above embodiment of the present application, the cooling effect on multiple server modules 2 is improved, and it has good working stability and reliability, and the equipment integration is high, which is conducive to reducing the space occupied by the computing assembly, thereby realizing rapid deployment.

[0186] According to another aspect of an embodiment of the present application, a data center is further provided, comprising a cooling device 100 according to any one of the above-mentioned embodiments of the present application.

[0187] According to the data center of the embodiment of the present application, by utilizing the cooling device 100 according to the above embodiment of the present application, the cooling effect on the server module 2 is improved, thereby improving the working stability and facilitating the rapid deployment of the data center.

[0188] According to another aspect of the embodiment of the present application, a container data center 1000 is also provided. Fig. 9 A schematic diagram of the structure of a container data center 1000 according to an embodiment of the present application is shown. Fig. 9 As shown, the container data center 1000 includes a first container body 1001 , in which a cooling device 100 according to any of the above-mentioned embodiments of the present application is arranged.

[0189] According to the container data center 1000 of the embodiment of the present application, by utilizing the cooling device 100 of the above-mentioned embodiment of the present application, and the cooling device 100 is centrally deployed in the first container body 1001, a modular setting of multiple cooling devices 100 can be achieved to improve the convenience of transportation and delivery of the container data center 1000.

[0190] According to another aspect of the embodiment of the present application, a container data center 1000 is also provided. Fig.10 A schematic diagram of the structure of a container data center 1000 according to an embodiment of the present application is shown. Fig.10 As shown, the container data center 1000 includes a first container body 1001 and a second container body 1002. A cooling device 100 as in any of the above embodiments of the present application is arranged in the first container body 1001. A cold source device 1003 is arranged in the second container body 1002, and the cold source device 1003 is used to cool a heat exchange medium, and the heat exchange medium is used to perform heat exchange with a cooling medium.

[0191] According to the container data center 1000 of the embodiment of the present application, by setting the first container body 1001 and the second container body 1002, a modular setting of multiple cooling devices 100 and multiple cold source equipment 1003 can be achieved to improve the convenience of transportation and delivery of the container data center 1000.

[0192] Other components of the data center in the above embodiment may adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0193] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0194] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0195] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0196] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0197] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0198] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A cooling device, characterized in that: include: A body, wherein the body defines a cooling cavity and a bearing cavity; The cooling cavity is used to accommodate the cooling medium and the server module; A pipeline module is installed in the bearing cavity, one end of the pipeline module is connected to the cooling cavity, and the other end of the pipeline module is connected to the cold source equipment; The pipeline module is used to guide the cooling medium to be cooled from the cooling cavity to the cold source device, and to transport the cooled cooling medium from the cold source device to the cooling cavity.

2. The cooling device according to claim 1, characterized in that: The cooling cavity and the bearing cavity are distributed in a horizontal direction.

3. The cooling device according to claim 1, characterized in that: A side of the bearing cavity away from the cooling cavity is open.

4. The cooling device according to claim 3, characterized in that: The body comprises a bearing plate, and the bearing cavity is formed on the upper side of the bearing plate.

5. The cooling device according to claim 4, characterized in that: The carrying plate is provided with a through hole.

6. The cooling device according to claim 1, characterized in that: Also includes: The heat exchange module has a first heat exchange flow path and a second heat exchange flow path inside. The cooling medium in the first heat exchange flow path exchanges heat with the heat exchange medium in the second heat exchange flow path to cool the cooling medium.

7. The cooling device according to claim 6, characterized in that: Each cooling device is correspondingly provided with a heat exchange module, and the heat exchange module is installed in the bearing cavity.

8. The cooling device according to claim 6, characterized in that: Each of the plurality of cooling devices is provided with a corresponding heat exchange module, and the heat exchange module is independently installed outside the cooling device.

9. The cooling device according to claim 6, characterized in that: The pipeline module includes a first pipeline group, which is connected between the cooling cavity and the heat exchange module and is used for the cooling medium to circulate between the cooling cavity and the first heat exchange flow path.

10. The cooling device according to claim 9, characterized in that: The first pipeline group includes a first delivery pipe and a second delivery pipe, the first delivery pipe is connected between the input end of the first heat exchange flow path and the output port of the cooling chamber, and the second delivery pipe is connected between the output end of the first heat exchange flow path and the input port of the cooling chamber.

11. The cooling device according to claim 9, characterized in that: The pipeline module also includes a power module, which is installed in the bearing cavity and arranged in the first pipeline group, and is used to provide power for the circulation of the cooling medium between the cooling cavity and the heat exchange module.

12. The cooling device according to claim 11, characterized in that The power module includes a first pump body disposed on a first delivery pipe of the first pipeline group and / or a second pump body disposed on a second delivery pipe of the first pipeline group.

13. The cooling device according to claim 9, characterized in that: The pipeline module also includes a second pipeline group, and the second pipeline group is connected between the heat exchange module and the cold source equipment.

14. The cooling device according to claim 13, characterized in that: The second pipeline group includes a third delivery pipe and a fourth delivery pipe, the third delivery pipe is connected between the input end of the second heat exchange flow path and the heat exchange medium delivery pipe of the cold source equipment, and the fourth delivery pipe is connected between the output end of the second heat exchange flow path and the heat exchange medium return pipe of the cold source equipment.

15. The cooling device according to claim 14, characterized in that The input end of the third delivery pipe and / or the output end of the fourth delivery pipe are provided with a quick-connect valve.

16. The cooling device according to claim 1, characterized in that An input port and an output port are formed on a wall of the cooling cavity adjacent to one side of the bearing cavity, and a height of the input port in the vertical direction is smaller than a height of the output port in the vertical direction.

17. The cooling device according to claim 16, characterized in that The input port is disposed adjacent to the bottom of the cooling cavity, and the output port is disposed adjacent to the top of the cooling cavity.

18. The cooling device according to claim 1, characterized in that The side wall of the main body is also provided with a handle for a user to hold so as to apply an external force to the cooling device and drive the cooling device to move.

19. The cooling device according to any one of claims 1 to 18, characterized in that: The body further comprises a wire harness storage portion, and the wire harness storage portion and the bearing cavity are located on the same side of the cooling cavity.

20. The cooling device according to claim 19, characterized in that The wire harness storage portion is located on the upper side of the cooling chamber.

21. The cooling device according to claim 19, characterized in that The wire harness storage portion has a storage groove with an open top, and the storage groove is used to store the power distribution unit.

22. The cooling device according to claim 21, characterized in that A first through hole is provided on a wall of the storage slot adjacent to one side of the cooling cavity, and the first through hole is used for a power line of the server module to pass through and be electrically connected to the power distribution unit.

23. The cooling device according to claim 22, characterized in that The liquid level of the coolant in the cooling cavity is greater than or equal to the top height of the computing unit of the server module; the harness storage portion is located on the upper side of the top of the cooling cavity so that the height of the first through hole is greater than the liquid level of the coolant in the cooling cavity.

24. The cooling device according to claim 21, characterized in that A second through hole is provided on the wall of the receiving groove adjacent to one side of the bearing cavity, and the second through hole is used for allowing the power line of the power module of the pipeline module to pass through and be electrically connected to the power distribution unit.

25. The cooling device according to claim 21, characterized in that The wall of the storage slot is provided with a third through hole, and the third through hole is used for the power transmission line to pass through and be electrically connected to the power distribution unit in the storage slot.

26. The cooling device according to any one of claims 1 to 18, characterized in that: A support plate for supporting the server module is provided inside the cooling cavity, and the support plate is provided with a guide hole for allowing the cooling medium to flow upward.

27. The cooling device according to claim 26, characterized in that There are multiple server modules, and the support plate includes multiple diversion areas corresponding to the multiple server modules. The flow area and / or arrangement density of the diversion holes in the diversion areas are positively correlated with at least one of the computing power, heat dissipation and heat dissipation requirements of the corresponding server modules.

28. A computing device, characterized in that The invention comprises at least one server module and a cooling device as claimed in any one of claims 1 to 27.

29. The computing device of claim 28, wherein: There are a plurality of server modules, and the plurality of server modules are arranged in at least one row along a first direction.

30. The computing device of claim 29, wherein: An interface for connecting a wiring harness is disposed on the top of the server module, and the interface is disposed adjacent to the bearing cavity.

31. A device framework, characterized in that: include: A frame body, wherein the frame body defines at least one accommodating cavity; At least one cooling device as claimed in any one of claims 1 to 27, wherein the cooling device is slidably disposed on the frame to slide into or out of the accommodating cavity.

32. The equipment frame according to claim 31, characterized in that The accommodating cavities are multiple and spaced apart in a vertical direction, and the cooling devices are multiple and arranged corresponding to the multiple accommodating cavities.

33. A computing assembly, characterized in that: It comprises at least one server module and the device framework as claimed in claim 31 or 32.

34. A data center, characterized in that: A cooling device comprising the cooling device described in any one of claims 1 to 27.

35. A container data center, characterized in that: include: A first container body, wherein a cooling device according to any one of claims 1 to 27 is arranged in the first container body.

36. A container data center, characterized in that: include: a first container body, wherein a cooling device according to any one of claims 1 to 27 is arranged in the first container body; A second container body is provided with a cold source device in the second container body, the cold source device is used to cool a heat exchange medium, and the heat exchange medium is used to perform heat exchange with a cooling medium.

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