Quick-release heat dissipation assembly and electronic equipment

Abstract

The utility model discloses a quick-release heat dissipation assembly and electronic equipment, which are used for solving the technical problem of low assembly efficiency of the heat dissipation assembly caused by the fact that the existing heat dissipation assembly needs to be fixed on a heating element in a screw locking manner. The heat dissipation device comprises a heat dissipation substrate used for being attached to a heating element, buckle seats fixed to a circuit board and located on the two opposite sides of the heat dissipation substrate, and an elastic buckle piece. The buckle piece is fixed on the heat dissipation substrate, two opposite ends of the buckle piece are provided with buckle parts, and the buckle piece is clamped on the buckle seat through the buckle parts. By means of the design, when an operator assembles the heat dissipation assembly, the heat dissipation assembly can be fixedly installed only by clamping the buckling part on the buckling piece to the buckling base, the assembling efficiency of the heat dissipation assembly is effectively improved, and the operation difficulty of the operator is greatly reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation component design, in particular to a quick-detachable heat dissipation component and electronic equipment. Background Art

[0002] Heat dissipation components are widely used in electronic devices, and are mainly used to dissipate heat from heat-generating components on electronic devices, such as central processing units (CPUs) or graphics processing units (GPUs).

[0003] The traditional installation method of heat dissipation components is to manually attach the heat dissipation substrate to the heating element, and then screw the connecting piece of the heat dissipation substrate into the threaded hole of the circuit board or bracket to complete the installation of the heat dissipation component. Due to the thinness of some electronic devices, the operating space of the operator is limited, and the operation of screwing becomes very inconvenient. Therefore, the assembly efficiency of the traditional heat dissipation component is relatively low, which is not conducive to the mass production of electronic equipment.

[0004] Therefore, finding a technical solution that can solve the above technical problems has become an important topic studied by technical personnel in this field. Utility Model Content

[0005] The utility model discloses a quick-detachable heat dissipation assembly and electronic equipment, which are used to solve the technical problem that the existing heat dissipation assembly needs to be fixed on a heating element by screw locking, thus resulting in low assembly efficiency of the heat dissipation assembly.

[0006] The utility model provides a quick-release heat dissipation assembly, which is used to dissipate heat from a heating element fixed on a circuit board. The quick-release heat dissipation assembly includes a heat dissipation substrate for bonding with the heating element, a buckle seat fixed on the circuit board and located on opposite sides of the heat dissipation substrate, and an elastic buckle member;

[0007] The buckle member is fixed on the heat dissipation substrate, buckle parts are arranged at opposite ends of the buckle member, and the buckle member is buckled on the buckle seat through the buckle parts.

[0008] Optionally, the buckle seat includes a flat plate portion and a vertical plate portion vertically arranged on the flat plate portion;

[0009] The flat plate portion is provided with a first engaging protrusion protruding upward, and the upper end of a side surface of the vertical plate portion away from the heat dissipation substrate is provided with a second engaging protrusion, the first engaging protrusion and the second engaging protrusion constitute a slot engaged with the buckle portion, and the buckle portion is engaged in the slot.

[0010] Optionally, a first positioning portion and a second positioning portion are provided on a side surface of the vertical plate portion away from the heat dissipation substrate;

[0011] The first positioning portion and the second positioning portion are located on two opposite side surfaces of the second engaging protrusion, and the first positioning portion and the second positioning portion constitute a positioning groove for limiting the buckle portion from moving in a horizontal direction.

[0012] Optionally, the side surface of the first engaging protrusion facing the vertical plate portion is an arc surface, and the side surface of the second engaging protrusion away from the vertical plate portion is an inclined surface, and the inclined surface is inclined downward toward the direction of the first engaging protrusion.

[0013] Optionally, the buckle portion is formed by bending the end of the buckle piece multiple times;

[0014] The buckle portion is an S-shaped structure.

[0015] Optionally, the snap fastener is a metal spring.

[0016] Optionally, the clip is connected to the heat dissipation substrate by riveting or welding or by screw locking.

[0017] Optionally, the heat dissipation substrate is a metal plate, and a plurality of heat dissipation fins are arranged on the heat dissipation substrate.

[0018] Optionally, the buckle seat is covered with a silicone pad or a rubber pad.

[0019] The utility model provides an electronic device, comprising a circuit board, a heating element electrically connected to the circuit board and the above-mentioned quick-detachable heat dissipation assembly, wherein the quick-detachable heat dissipation assembly comprises a heat dissipation substrate, buckle seats located on opposite sides of the heat dissipation substrate and a buckle member with elasticity;

[0020] The heat dissipation substrate is fitted on the heating element, the buckle is fixed on the heat dissipation substrate, and the buckle seat is fixed on the circuit board; buckle parts are provided at opposite ends of the buckle, and the buckle is buckled on the buckle seat through the buckle parts.

[0021] Compared with the prior art, the utility model has the following beneficial effects:

[0022] In the quick-release heat dissipation assembly of the present embodiment, when assembling the heat dissipation assembly, the operator only needs to snap the snap portion on the snap member onto the snap seat to complete the fixed installation of the heat dissipation assembly, which effectively improves the assembly efficiency of the heat dissipation assembly and greatly reduces the operating difficulty for the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the structure of a quick-detachable heat dissipation assembly provided by the utility model;

[0025] Figure 2 A schematic diagram of the structure of a buckle seat in a quick-release heat dissipation assembly provided by the utility model;

[0026] Figure 3 A schematic diagram of the structure of a snap-on portion and a snap-on seat in a quick-release heat dissipation assembly provided by the utility model when they are snapped together;

[0027] Figure 4 A schematic diagram of the structure of a quick-release heat dissipation assembly provided by the utility model when the buckle portion is located in a positioning groove on the buckle seat;

[0028] Illustration: circuit board 1; heating element 2; heat dissipation substrate 3; snap member 4; snap portion 401; snap seat 5; flat plate portion 501; vertical plate portion 502; first snap protrusion 503; arc surface 5031; second snap protrusion 504; inclined surface 5041; first positioning portion 505; second positioning portion 506; slot 507; positioning slot 508. DETAILED DESCRIPTION

[0029] The utility model discloses a quick-detachable heat dissipation assembly and electronic equipment, which are used to solve the technical problem that the existing heat dissipation assembly needs to be fixed on a heating element by screw locking, thus resulting in low assembly efficiency of the heat dissipation assembly.

[0030] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 4The utility model provides a quick-release heat dissipation assembly for dissipating heat from a heating element 2 fixed on a circuit board 1. The quick-release heat dissipation assembly includes a heat dissipation substrate 3 for bonding with the heating element 2, a buckle seat 5 fixed on the circuit board 1 and located on opposite sides of the heat dissipation substrate 3, and an elastic buckle 4;

[0032] The buckle member 4 is fixed on the heat dissipation substrate 3 , and buckle portions 401 are disposed at opposite ends of the buckle member 4 , and the buckle member 4 is buckled on the buckle seat 5 via the buckle portions 401 .

[0033] In the quick-release heat dissipation assembly of the present embodiment, when assembling the heat dissipation assembly, the operator only needs to snap the snap portion 401 on the snap member 4 onto the snap seat 5 to complete the fixed installation of the heat dissipation assembly, thereby effectively improving the assembly efficiency of the heat dissipation assembly and greatly reducing the operating difficulty for the operator.

[0034] In addition, when the buckle member 4 needs to be disassembled, the operator only needs to press the buckle portion 401 to cause it to elastically deform, and then the buckle portion 401 can be separated from the buckle seat 5, thereby realizing the rapid removal of the buckle member 4.

[0035] Furthermore, the buckle seat 5 in this embodiment includes a flat plate portion 501 and a vertical plate portion 502 vertically arranged on the flat plate portion 501;

[0036] The flat plate portion 501 is provided with a first locking protrusion 503 protruding upward, and the upper end of a side surface of the vertical plate portion 502 away from the heat dissipation substrate 3 is provided with a second locking protrusion 504. The first locking protrusion 503 and the second locking protrusion 504 form a locking groove 507 that is locked with the buckle portion 401, and the buckle portion 401 is locked in the locking groove 507.

[0037] It should be noted that when the buckle part 401 is engaged with the slot 507, one side of the buckle part 401 abuts against the first engaging protrusion 503, and the second side of the buckle part 401 abuts against the second engaging protrusion 504. Through the above design, the stability of the buckle part 401 and the buckle seat 5 is ensured.

[0038] In addition, the buckle seat 5 in this embodiment is specifically an integrally formed structure, which can be fixed on the circuit board 1 by riveting or welding.

[0039] Furthermore, a first positioning portion 505 and a second positioning portion 506 are provided on a side surface of the vertical plate portion 502 away from the heat dissipation substrate 3 in this embodiment;

[0040] The first positioning portion 505 and the second positioning portion 506 are located on two opposite side surfaces of the second engaging protrusion 504 , and the first positioning portion 505 and the second positioning portion 506 constitute a positioning groove 508 for limiting the buckle portion 401 from moving in a horizontal direction.

[0041] It should be noted that when the buckle portion 401 is not engaged with the slot 507, the buckle portion 401 is located in the positioning slot 508 to achieve a pre-positioning function. The buckle portion 401 is located in the positioning slot 508. Due to being restricted by the first positioning portion 505, the second positioning portion 506 and the vertical plate portion 502, the horizontal displacement (displacement in four directions, front, back, left, and right) of the buckle portion 401 is restricted.

[0042] After the operator has adjusted the installation position of the heat dissipation substrate 3 , the operator can press the buckle portion 401 downwards to make the buckle portion 401 engage with the slot 507 , thereby completing the installation of the heat dissipation assembly.

[0043] Through the above design, the quick-release heat dissipation assembly in this embodiment can not only be quickly disassembled and assembled, but also complete the pre-positioning function of the buckle portion 401, which can effectively meet the assembly positioning accuracy and improve the assembly efficiency of the heat dissipation assembly.

[0044] Furthermore, in this embodiment, the side of the first engaging protrusion 503 facing the vertical plate portion 502 is an arc surface 5031 , and the side of the second engaging protrusion 504 away from the vertical plate portion 502 is an inclined surface 5041 , and the inclined surface 5041 is inclined downward toward the direction of the first engaging protrusion 503 .

[0045] It should be noted that the design of the above-mentioned inclined surface 5041 can provide a guiding effect for the buckle part 401, so that the buckle part 401 can be more conveniently engaged in the slot 507; the design of the above-mentioned arc surface 5031 can make the contact between the buckle part 401 and the first positioning protrusion 503 smoother, so that the buckle part 401 can be more smoothly separated from the slot 507.

[0046] Furthermore, the buckle portion 401 in this embodiment is formed by bending the end of the buckle member 4 multiple times;

[0047] The buckle portion 401 is an S-shaped structure.

[0048] It should be noted that, in this embodiment, the end of the buckle member 4 is bent four times to form an S-shaped buckle portion 401 .

[0049] Furthermore, the fastener 4 in this embodiment is preferably a metal spring.

[0050] Furthermore, the clip 4 in this embodiment is connected to the heat dissipation substrate 3 by riveting or welding or by screw locking.

[0051] It should be noted that this embodiment does not limit the connection method between the clip 4 and the heat dissipation substrate 3 , and designers can select a suitable connection method according to actual conditions.

[0052] Furthermore, in order to improve the heat dissipation effect, the heat dissipation substrate 3 in this embodiment is a metal plate, preferably a metal copper plate, and a plurality of heat dissipation fins are arranged on the heat dissipation substrate 3. The design of the heat dissipation fins can further increase the heat dissipation area of ​​the heat substrate, thereby improving the heat dissipation effect of the heat dissipation substrate 3.

[0053] Furthermore, the buckle seat 5 in this embodiment is covered with a silicone pad or a rubber pad.

[0054] It should be noted that, through the above design, when the buckle part 401 is connected to the buckle seat 5, since the buckle seat 5 is covered with a silicone pad or a rubber pad, the hard contact between the buckle part 401 and the buckle seat 5 is changed to soft contact, which is more conducive to improving the buckling stability between the buckle part 401 and the buckle seat 5.

[0055] See also Figures 1 to 4 The utility model discloses an electronic device, comprising a circuit board 1, a heating element 2 electrically connected to the circuit board 1, and the above-mentioned quick-detachable heat dissipation assembly, wherein the quick-detachable heat dissipation assembly comprises a heat dissipation substrate 3, buckle seats 5 located on opposite sides of the heat dissipation substrate 3, and a buckle member 4 having elasticity;

[0056] The heat dissipation substrate 3 is fitted on the heating element 2, the clip 4 is fixed on the heat dissipation substrate 3, and the clip seat 5 is fixed on the circuit board 1; the clip 4 is provided with clip parts 401 at opposite ends, and the clip 4 is clipped on the clip seat 5 through the clip parts 401.

[0057] In the electronic device of this embodiment, when assembling the heat dissipation component, the operator only needs to snap the snap portion 401 on the snap member 4 onto the snap seat 5 to complete the fixed installation of the heat dissipation component, which effectively improves the assembly efficiency of the heat dissipation component and greatly reduces the operating difficulty of the operator.

[0058] Specifically, the heating element 2 in this embodiment may be a central processing unit or an image processor.

[0059] The above is a detailed introduction to a quick-detachable heat dissipation assembly and an electronic device provided by the present invention. For a person skilled in the art, according to the idea of ​​the embodiments of the present invention, there may be changes in the specific implementation method and the scope of application. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A quick-release heat dissipation assembly, used for dissipating heat from a heating element (2) fixed on a circuit board (1), characterized in that: The quick-detachable heat dissipation assembly comprises a heat dissipation substrate (3) for bonding with a heating element (2), a buckle seat (5) fixed on the circuit board (1) and located on two opposite sides of the heat dissipation substrate (3), and an elastic buckle member (4); The buckle component (4) is fixed on the heat dissipation substrate (3), buckle parts (401) are provided at opposite ends of the buckle component (4), and the buckle component (4) is buckled on the buckle seat (5) via the buckle parts (401).

2. The quick-release heat dissipation assembly according to claim 1, characterized in that: The buckle seat (5) comprises a flat plate portion (501) and a vertical plate portion (502) vertically arranged on the flat plate portion (501); The flat plate portion (501) is provided with a first locking protrusion (503) protruding upward, and the upper end of a side surface of the vertical plate portion (502) away from the heat dissipation substrate (3) is provided with a second locking protrusion (504), the first locking protrusion (503) and the second locking protrusion (504) form a locking groove (507) that is locked with the buckle portion (401), and the buckle portion (401) is locked in the locking groove (507).

3. The quick-release heat dissipation assembly according to claim 2, characterized in that: A first positioning portion (505) and a second positioning portion (506) are provided on a side surface of the vertical plate portion (502) away from the heat dissipation substrate (3); The first positioning portion (505) and the second positioning portion (506) are located on two opposite side surfaces of the second engaging protrusion (504), and the first positioning portion (505) and the second positioning portion (506) form a positioning groove (508) for limiting the movement of the buckle portion (401) in a horizontal direction.

4. The quick-release heat dissipation assembly according to claim 2, characterized in that: The side surface of the first engaging protrusion (503) facing the vertical plate portion (502) is an arc surface (5031), and the side surface of the second engaging protrusion (504) away from the vertical plate portion (502) is an inclined surface (5041), and the inclined surface (5041) is inclined downward in the direction of the first engaging protrusion (503).

5. The quick-release heat dissipation assembly according to claim 1, characterized in that: The buckle portion (401) is formed by bending the end of the buckle piece (4) multiple times; The buckle portion (401) is an S-shaped structure.

6. The quick-release heat dissipation assembly according to claim 1, characterized in that: The buckle (4) is a metal spring.

7. The quick-release heat dissipation assembly according to claim 1, characterized in that: The fastener (4) is connected to the heat dissipation substrate (3) by riveting or welding or by screw locking.

8. The quick-release heat dissipation assembly according to claim 1, characterized in that: The heat dissipation substrate (3) is a metal plate, and a plurality of heat dissipation fins are arranged on the heat dissipation substrate (3).

9. The quick-release heat dissipation assembly according to claim 1, characterized in that: The buckle seat (5) is covered with a silicone pad or a rubber pad.

10. An electronic device, characterized in that: Comprising a circuit board (1), a heating element (2) electrically connected to the circuit board (1), and a quick-detachable heat dissipation assembly according to any one of claims 1 to 8, wherein the quick-detachable heat dissipation assembly comprises a heat dissipation substrate (3), buckle seats (5) located on opposite sides of the heat dissipation substrate (3), and a buckle member (4) having elasticity; The heat dissipation substrate (3) is arranged in a fit on the heating element (2), the buckle (4) is fixed on the heat dissipation substrate (3), and the buckle seat (5) is fixed on the circuit board (1); buckle parts (401) are arranged at opposite ends of the buckle (4), and the buckle (4) is buckled on the buckle seat (5) through the buckle parts (401).

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