Novel silicon-based OLED packaging structure
By introducing a flexible barrier film into the silicon-based OLED packaging structure, replacing the traditional cover glass, the problems of prone to cracking and thicker thickness are solved, and a more stable and thinner packaging structure is achieved.
Patent Information
- Application Number
- CN202422068463.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-26
AI Technical Summary
When packaging silicon-based OLED, the cover glass is prone to crack after collision and the thickness is too thick, resulting in problems such as instability and thickness increase in the packaging structure.
A novel silicon-based OLED packaging structure is designed, and by adding a new flexible barrier film to the packaging structure, replacing the traditional cover glass, the risk of cover layer rupture and the overall thickness is reduced.
In silicon-based OLED packages, the effect of not being easy to break after collision is achieved, while reducing the overall thickness and improving the stability and reliability of the packaging structure.
Smart Images
Figure CN222954336U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of film materials, and in particular to a novel silicon-based OLED packaging structure. Background Art
[0002] Silicon-based organic light-emitting diode display is a display made of solid-state, self-luminous devices of current injection type using organic materials. This display uses organic materials to achieve self-luminescence by current injection, so as to display various information such as text, graphics, images, animation videos, and recordings. Compared with traditional display screens, silicon-based organic light-emitting diode displays have higher flexibility and customizability. They can not only be folded and rolled, but can even be worn on the wrist or on the body, which makes them have broad application prospects in portable devices, wearable technology and other fields. OLED, also known as organic electric laser display and organic light-emitting semiconductor, is a current-type organic light-emitting device. Silicon-based OLED is a display technology that combines semiconductor process technology and OLED technology. It uses single-crystal silicon wafers as the substrate to prepare OLED devices. This technology achieves higher display effects by replacing the glass substrate of traditional OLED with a single-crystal silicon substrate and using organic light-emitting technology;
[0003] At present, silicon-based organic light-emitting diode displays such as Figure 1 As shown, due to the high PPI (>1000), which exceeds the FMM (precision metal mask) limit, the current practice is to perform evaporation of white light OLEDs without FMM, and then match them with CF (color filter) to achieve a full-color effect. At this time, in order to protect CF, CF will be packaged with CG (cover glass). After the cover glass is matched with the outer ring frame glue, although the water barrier can meet the requirements (WVTR≦8E-1 g / m2-day), the cover glass is easy to break after collision. In order to reduce the probability of cover glass breakage, the cover glass thickness is generally 0.5mm. Reducing the thickness of the cover glass will greatly increase the risk of glass breakage.
[0004] Therefore, in order to address the problem that the cover glass is easy to break after collision and is too thick during the above-mentioned silicon-based OLED packaging, a novel silicon-based OLED packaging structure can be designed. By adding a new flexible barrier film to the packaging structure, the risk of the cover layer breaking can be reduced and the overall thickness can be reduced. Utility Model Content
[0005] In order to overcome the problem that the cover glass is easy to break after collision and is too thick during silicon-based OLED packaging.
[0006] The technical solution of the utility model is: a novel silicon-based OLED packaging structure, including a silicon wafer, an organic light-emitting diode driving circuit is arranged on the upper end of the silicon wafer, a white light organic light-emitting diode is arranged on the upper end of the organic light-emitting diode driving circuit, a thin film packaging layer is arranged on the upper end of the white light organic light-emitting diode, a color filter is arranged on the upper end of the thin film packaging layer, an OCA adhesive layer is arranged on the upper end of the color filter, and a flexible barrier film layer is arranged on the upper end of the OCA adhesive layer.
[0007] Preferably, the organic light emitting diode driving circuit is manufactured by a yellow light process with a silicon wafer as a substrate, and the white light organic light emitting diode is arranged on the upper end of the organic light emitting diode driving circuit by a vapor deposition process. After the silicon wafer is cleaned, the organic light emitting diode driving circuit is manufactured by a yellow light process (photoresist coating, exposure, development, etching), and then the white light organic light emitting diode is evaporated between different cavities to realize the manufacturing and forming of the organic light emitting diode driving circuit and the white light organic light emitting diode.
[0008] Preferably, the thin film encapsulation layer comprises a lower silicon nitride layer, an epoxy resin layer is disposed on the upper end of the lower silicon nitride layer, and an upper silicon nitride layer is disposed on the upper end of the epoxy resin layer.
[0009] Preferably, the lower silicon nitride layer and the upper ends of the silicon wafer, the organic light-emitting diode driving circuit, and the white light organic light-emitting diode are adapted to each other, and preliminary packaging protection of the organic light-emitting diode driving circuit and the white light organic light-emitting diode is achieved through the thin film packaging layer packaging process of the lower silicon nitride layer, epoxy resin layer, and upper silicon nitride layer structure.
[0010] Preferably, the lower surface of the color filter and the upper surface of the upper silicon nitride layer are attached and connected, and the upper surface of the color filter and the flexible barrier film layer are attached and connected through an OCA adhesive layer, and the advantages of OCA adhesive such as high cleanliness, high transmittance, low haze, high adhesion, no crystal points, no bubbles, water resistance, high temperature resistance, and UV resistance are utilized to form a protective layer with good water and oxygen barrier properties, and the color filter and the flexible barrier film layer are attached and fixed.
[0011] Preferably, the flexible barrier film layer is a PET polyester film, and a metal oxide film is provided on the upper surface of the flexible barrier film layer. A high-density barrier layer is formed by the metal oxide film, so that the flexible barrier film layer replaces the cover glass to achieve the effect of not being easy to break after collision and reducing the overall thickness.
[0012] Beneficial effects of the utility model:
[0013] 1. This novel silicon-based OLED packaging structure, after the silicon-based organic light-emitting diode process is completed, when the silicon-based OLED is packaged on the outermost layer, a flexible barrier film layer is used to replace the original cover glass for subsequent bonding, so as to achieve the effect of not being easy to break after collision and reducing the overall thickness;
[0014] 2. This novel silicon-based OLED packaging structure utilizes the advantages of OCA glue such as high cleanliness, high transmittance, low haze, high adhesion, no crystal points, no bubbles, water resistance, high temperature resistance, and UV resistance to form a protective layer with good water and oxygen barrier properties to attach and fix the color filter and flexible barrier film layer. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 The display shows a silicon-based organic light-emitting diode display encapsulated with cover glass;
[0016] Figure 2 Shown is a schematic diagram of the novel silicon-based OLED packaging structure of the utility model;
[0017] Figure 3 Shown is a schematic diagram of the cross-sectional structure of the thin film encapsulation layer of the utility model;
[0018] Figure 4 What is shown is a schematic diagram of the three-dimensional structure of the novel silicon-based OLED packaging structure of the present utility model.
[0019] Explanation of the reference numerals: 1. silicon wafer; 2. organic light emitting diode driving circuit; 3. white light organic light emitting diode; 4. thin film encapsulation layer; 41. lower silicon nitride layer; 42. epoxy resin layer; 43. upper silicon nitride layer; 5. color filter; 6. OCA adhesive layer; 7. flexible barrier film layer; 71. metal oxide thin film. DETAILED DESCRIPTION
[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments.
[0021] Please refer to ( Figure 2-Figure 4 ), the utility model provides an embodiment: a novel silicon-based OLED packaging structure, including a silicon wafer 1, an organic light-emitting diode driving circuit 2 is arranged on the upper end of the silicon wafer 1, a white light organic light-emitting diode 3 is arranged on the upper end of the organic light-emitting diode driving circuit 2, a thin film packaging layer 4 is arranged on the upper end of the white light organic light-emitting diode 3, a color filter 5 is arranged on the upper end of the thin film packaging layer 4, an OCA adhesive layer 6 is arranged on the upper end of the color filter 5, and a flexible barrier film layer 7 is arranged on the upper end of the OCA adhesive layer 6.
[0022] Please refer to ( Figure 2-Figure 3), in this embodiment, the organic light emitting diode driving circuit 2 is manufactured by a yellow light process with a silicon wafer 1 as a substrate, the white light organic light emitting diode 3 is arranged on the upper end of the organic light emitting diode driving circuit 2 by an evaporation process, the thin film encapsulation layer 4 includes a lower silicon nitride layer 41, an epoxy resin layer 42 is arranged on the upper end of the lower silicon nitride layer 41, an upper silicon nitride layer 43 is arranged on the upper end of the epoxy resin layer 42, the lower silicon nitride layer 41 and the upper ends of the silicon wafer 1, the organic light emitting diode driving circuit 2, and the white light organic light emitting diode 3 are mutually adapted, and the silicon wafer 1 is cleaned, and the organic light emitting diode driving circuit 2 is manufactured by using a yellow light process (photoresist coating, exposure, development, etching), and then the white light organic light emitting diode 3 is evaporated between different cavities to realize the manufacturing and forming of the organic light emitting diode driving circuit 2 and the white light organic light emitting diode 3, and then the thin film packaging layer 4 packaging process of the lower silicon nitride layer 41, the epoxy resin layer 42, and the upper silicon nitride layer 43 is performed to realize the preliminary packaging protection of the organic light emitting diode driving circuit 2 and the white light organic light emitting diode 3.
[0023] Please refer to ( Figure 2-Figure 4 ), in this embodiment, the lower surface of the color filter 5 and the upper surface of the upper silicon nitride layer 43 are attached and connected, and the upper surface of the color filter 5 and the flexible barrier film layer 7 are attached and connected through the OCA adhesive layer 6. The flexible barrier film layer 7 is a PET polyester film, and a metal oxide film 71 is provided on the upper surface of the flexible barrier film layer 7. The OCA adhesive layer 6 is coated on the surface of the flexible barrier film layer 7 and attached to the upper end of the color filter 5. The advantages of the OCA adhesive such as high cleanliness, high light transmittance, low haze, high adhesion, no crystal point, no bubble, water resistance, high temperature resistance, and ultraviolet resistance are utilized to form a protective layer with good water and oxygen barrier properties. A high-density barrier layer is formed through the metal oxide film 71, so that the flexible barrier film layer 7 replaces the cover glass to achieve the effect of not being easy to break after collision and reducing the overall thickness.
[0024] During packaging, after cleaning the silicon wafer 1, the organic light emitting diode driving circuit 2 is manufactured by using a yellow light process (photoresist coating, exposure, development, etching), and then the white light organic light emitting diode 3 is evaporated between different cavities to realize the manufacturing and molding of the organic light emitting diode driving circuit 2 and the white light organic light emitting diode 3, and then the thin film packaging layer 4 packaging process of the lower silicon nitride layer 41, the epoxy resin layer 42, and the upper silicon nitride layer 43 is performed to realize the packaging of the organic light emitting diode driving circuit 2 and the white light organic light emitting diode 3. 3 is initially packaged and protected, and then the color filter 5 is attached to the upper end of the thin film packaging layer 4. Finally, the OCA glue layer 6 is coated on the surface of the flexible barrier film layer 7 and attached to the upper end of the color filter 5. The advantages of OCA glue such as high cleanliness, high light transmittance, low haze, high adhesion, no crystal point, no bubbles, water resistance, high temperature resistance, and UV resistance are utilized to form a protective layer with good water and oxygen barrier properties. A high-density barrier layer is formed through the metal oxide film 71, so that the flexible barrier film layer 7 replaces the cover glass to achieve the effect of not being easily broken after collision and reducing the overall thickness.
[0025] Through the above steps, when the silicon-based OLED is packaged as the outermost layer, the flexible barrier film layer 7 replaces the original cover glass, and subsequent bonding is performed to achieve the effect of not being easy to break after collision and reducing the overall thickness, so as to solve the problem that the cover glass is easy to break after collision and is too thick when the silicon-based OLED is packaged.
Claims
1. A novel silicon-based OLED packaging structure, comprising a silicon wafer (1), characterized in that: An organic light emitting diode driving circuit (2) is arranged on the upper end of the silicon wafer (1); a white light organic light emitting diode (3) is arranged on the upper end of the organic light emitting diode driving circuit (2); a thin film encapsulation layer (4) is arranged on the upper end of the white light organic light emitting diode (3); a color filter (5) is arranged on the upper end of the thin film encapsulation layer (4); an OCA adhesive layer (6) is arranged on the upper end of the color filter (5); and a flexible barrier film layer (7) is arranged on the upper end of the OCA adhesive layer (6).
2. A novel silicon-based OLED packaging structure according to claim 1, characterized in that: The organic light emitting diode driving circuit (2) is manufactured by a yellow light process using a silicon wafer (1) as a substrate, and the white light organic light emitting diode (3) is arranged on the upper end of the organic light emitting diode driving circuit (2) by a vapor deposition process.
3. A novel silicon-based OLED packaging structure according to claim 1, characterized in that: The thin film encapsulation layer (4) comprises a lower silicon nitride layer (41), an epoxy resin layer (42) is arranged on the upper end of the lower silicon nitride layer (41), and an upper silicon nitride layer (43) is arranged on the upper end of the epoxy resin layer (42).
4. A novel silicon-based OLED packaging structure according to claim 3, characterized in that: The lower silicon nitride layer (41) and the upper ends of the silicon wafer (1), the organic light emitting diode driving circuit (2), and the white light organic light emitting diode (3) are mutually adapted.
5. A novel silicon-based OLED packaging structure according to claim 4, characterized in that: The lower surface of the color filter (5) and the upper surface of the upper silicon nitride layer (43) are attached and connected, and the upper surface of the color filter (5) and the flexible barrier film layer (7) are attached and connected via an OCA adhesive layer (6).
6. The novel silicon-based OLED packaging structure according to claim 1, characterized in that: The flexible barrier film layer (7) is a PET polyester film, and a metal oxide film (71) is provided on the upper surface of the flexible barrier film layer (7).