Cleaning device in wafer cleaning equipment

Abstract

The utility model provides a cleaning device in wafer cleaning equipment, belongs to the technical field of wafer production, and solves the technical problem that residual chemical liquid in a nozzle and a pipeline drips after a single-chip wet process machine finishes a cleaning task. The cleaning device comprises a swing arm and a bearing table, a nozzle is arranged at one end of the swing arm above the bearing table, the cleaning device further comprises a containing device, the containing device is installed on one side of the nozzle, and a first driving mechanism for driving the containing device to slide up and down is arranged on the swing arm. The output end of the first driving mechanism is provided with a second driving mechanism which drives the containing device to rotate to the position under the nozzle and to be straightened. The cleaning device provided by the utility model can effectively prevent liquid from dropping on the surface of the wafer, and improves the yield of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer production, and more specifically, it relates to a cleaning device in a wafer cleaning equipment. Background Art

[0002] The working process of the current mainstream single-piece wet cleaning machine in the industry is as Figure 2 shown. The swing arm 2 moves the nozzle 12 above the wafer 15 for cleaning. After the cleaning is completed, the swing arm 2 moves the nozzle 12 away from the wafer 15. In the actual working process, when the single-piece wet cleaning machine completes the cleaning task, during the process of moving the nozzle away, the residual cleaning liquid in the nozzle is likely to drip onto the wafer, resulting in the surface of the wafer 15 produced by the single-piece wet cleaning machine often having a whirlwind-like defect A (SpinMap), as Figure 1 shown.

[0003] Currently, the conventional method in the industry for dealing with liquid dripping is mainly to strengthen daily inspections and perform machine debugging in a timely manner after discovering the dripping. The traditional method relies on manual detection, with poor effects and is prone to overlooking the occurrence of dripping. If the machine operator fails to notice the dripping of the chemical cleaning liquid from the nozzle, it may cause contamination of multiple wafers, seriously affecting the yield. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is in view of the above deficiencies of the prior art. The purpose of the utility model is to provide a cleaning device in a wafer cleaning equipment, which can effectively prevent liquid from dripping onto the wafer surface and improve the wafer yield.

[0005] The technical solution of the utility model is: a cleaning device in a wafer cleaning equipment, the cleaning device includes a swing arm and a carrier. One end of the swing arm above the carrier is provided with a nozzle, and further includes a catcher. The catcher is installed on one side of the nozzle. The swing arm is provided with a first driving mechanism for driving the catcher to slide up and down. The output end of the first driving mechanism is provided with a second driving mechanism for driving the catcher to rotate to directly below the nozzle and straighten.

[0006] As a further improvement, the catcher is a spoon-shaped structure with a concave middle.

[0007] Further, the cleaning device further includes a DIW nozzle and an N 2 nozzle for cleaning the catcher. The DIW nozzle and the N 2 nozzle are installed in the catcher.

[0008] Further, the DIW nozzle and the N 2 nozzle are both rotatably installed in the catcher. The catcher is provided with a driving mechanism for driving the DIW nozzle and the N 2The third driving mechanism for the rotation of the nozzle.

[0009] Further, the third driving mechanism includes a driving motor or a hydraulic motor, the driving motor or the hydraulic motor is installed on the receiver, and the DIW nozzle, N 2 The nozzle is connected to the output end of the driving motor or the hydraulic motor.

[0010] Further, the first driving mechanism and the second driving mechanism are both linear telescopic elements; the first driving mechanism is installed on the inner side of one end of the swing arm, the second driving mechanism is hinged to the output end of the first driving mechanism, one end of the receiver is hinged to the output end of the first driving mechanism, and the output end of the second driving mechanism is hinged to the middle of the receiver.

[0011] Further, the first driving mechanism includes a slide rail and a pulley. The slide rail is vertically installed on the inner side of one end of the swing arm. The outer wall of the pulley is closely attached to the bottom of the groove of the slide rail, and the pulley is rotatably connected to the slide rail. The pulley is driven by a motor to rotate.

[0012] Further, the swing arm is provided with a DIW pipeline and N 2 pipelines. Valves are provided on both the DIW pipeline and the N 2 pipelines. One end of the swing arm is provided with gas-liquid pipeline interfaces for connecting the DIW pipeline, the N 2 pipeline to the DIW nozzle and the N 2 nozzle respectively.

[0013] Further, the swing arm is provided with a cleaning liquid pipeline, the cleaning liquid pipeline is communicated with the nozzle, and a valve is provided on the cleaning liquid pipeline.

[0014] Further, the cleaning device further includes a receiving cup, the receiving cup is installed on one side of the carrier table, and the receiving cup is located below the nozzle.

[0015] Compared with the prior art, the advantages of the present utility model are as follows:

[0016] 1. In the cleaning device of the present utility model, by arranging a receiver that can slide up and down and rotate on one side of the nozzle, when the machine is spraying chemical liquid during normal operation, the receiver is located in the inner area of the drooping section of the swing arm. After each spraying of the chemical liquid, the first driving mechanism drives the receiver to move downward to one side of the nozzle, and then the second driving mechanism drives the receiver to rotate to directly below the nozzle to catch the chemical liquid that may drip, completely preventing the possibility of chemical liquid dripping, effectively preventing the liquid from dripping onto the wafer surface, and improving the wafer yield; at the same time, the receiver can swing back to the initial position together with the swing arm, and the second driving mechanism then drives the receiver to rotate and straighten to pour out and drain the caught liquid together, avoiding the accumulation of chemical liquid in the receiver.

[0017] 2. The cleaning device of the present utility model adds a DIW nozzle and an N 2 nozzle in the receptacle to keep the receptacle clean and tidy. When the receptacle and the swing arm swing back to the cup-holding position together, the DIW nozzle sprays cleaning water to clean the chemical liquid in the receptacle. After the cleaning is completed, the N 2 nozzle sprays nitrogen to dry the receptacle and keep it clean for subsequent use.

[0018] 3. In the cleaning device of the present utility model, the DIW nozzle and the N 2 nozzle are rotatably installed. When the receptacle swings back to the initial position together with the swing arm, the DIW nozzle and the N 2 nozzle can be driven by the third driving mechanism to spray obliquely upward, directly cleaning the lower side plane of the swing arm, mainly flushing the chemical liquid splashed on this surface, preventing the chemical liquid from aggregating and dripping or forming crystals here, keeping the nozzle clean, and avoiding irrelevant particles from affecting the yield. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of a cyclone-shaped defect on the surface of a wafer;

[0020] Figure 2 It is a schematic structural diagram of a traditional technical solution;

[0021] Figure 3 It is a schematic structural diagram of the present utility model;

[0022] Figure 4 It is a schematic diagram of a partially enlarged structure of the present utility model;

[0023] Figure 5 It is a three-dimensional structural diagram of the receptacle in the present utility model;

[0024] Figure 6 It is a schematic diagram when the DIW nozzle in the present utility model is cleaning;

[0025] Figure 7 It is a schematic diagram of the working process of the receptacle in the present utility model.

[0026] Among them: 1 - receptacle, 2 - swing arm, 3 - slide rail, 4 - pulley, 5 - second driving mechanism, 6 - DIW nozzle, 7 - N 2 nozzle, 8 - DIW pipeline, 9 - N 2 pipeline, 10 - gas-liquid pipeline interface, 11 - carrier, 12 - nozzle, 13 - cup, 14 - cleaning liquid pipeline, 15 - wafer. Specific Embodiments

[0027] The following further describes the present utility model with specific embodiments in the drawings.

[0028] Refer to Figure 3 and Figure 4 For a cleaning device in a wafer cleaning equipment of the present utility model, the cleaning device includes a swing arm 2 and a carrier 11. The carrier 11 is used to support a wafer 15. The swing arm 2 is a component in the existing wafer cleaning equipment and is used to drive a nozzle 12 to reciprocate. At one end of the swing arm 2 above the carrier 11, there is a nozzle 12, and the nozzle 12 is used to spray a chemical cleaning liquid onto the wafer 15. The cleaning device further includes a catcher 1. Since the nozzle 12 sucks back the chemical cleaning liquid on the way back to the initial state, air bubbles may be sucked in during the back suction, or the back suction pressure at the factory end may be abnormal, resulting in an imbalance in the chemical cleaning liquid pressure difference in the nozzle 12 and the drooping pipeline. And because the outlet of the nozzle 12 faces downward, the residual chemical liquid in the nozzle 12 and its connected drooping pipeline will naturally drip along the edge of the nozzle due to its own gravity and the fluidity of the liquid, causing the residual liquid to drip out from the nozzle, forming a dripping phenomenon. The catcher 1 can be used to catch the chemical cleaning liquid that may drop from the nozzle 12, thereby preventing the liquid from dripping onto the wafer 15. Specifically, the catcher 1 is installed on one side of the nozzle 12, and a first driving mechanism for driving the catcher 1 to slide up and down is provided on the swing arm 2. In the initial state, the catcher 1 is hidden inside the drooping section of the swing arm 2. When it is necessary to catch the chemical cleaning liquid, it slides downward. A second driving mechanism 5 for driving the catcher 1 to rotate to directly below the nozzle 12 and straighten is provided at the output end of the first driving mechanism. When the catcher 1 rotates to directly below the nozzle 12, the chemical cleaning liquid dropped by the nozzle can be caught by the catcher 1, and when the catcher 1 rotates and straightens, the received chemical cleaning liquid can be poured out.

[0029] For the cleaning device of the present utility model, by providing a catcher 1 that can slide up and down and rotate on one side of the nozzle 12, when the machine is spraying chemical liquid during normal operation, the catcher 1 is located in the inner area of the drooping section of the swing arm. After each spraying of the chemical liquid, the first driving mechanism drives the catcher 1 to move downward to one side of the nozzle 12, and then the second driving mechanism drives the catcher 1 to rotate to directly below the nozzle 12 to catch the chemical liquid that may drip, completely preventing the possibility of chemical liquid dripping, effectively preventing the liquid from dripping onto the surface of the wafer 15, and avoiding the problem of the occurrence of a cyclone-like defect A on the wafer 15 (the generation of the cyclone-like defect A: mainly, the liquid droplets dripping on the wafer surface will, under the action of centrifugal force, slide across the wafer surface during the process of the wafer rotating and drying, and where they reach, they will continue to react with the wafer surface, thereby generating the cyclone-like defect, and this cyclone-like defect is very likely to cause a scrapped wafer and reduce the product yield), improving the wafer yield; at the same time, the catcher 1 can swing back to the initial position together with the swing arm 2, and the second driving mechanism then drives the catcher to rotate and straighten to pour out and drain away the received liquid, avoiding the accumulation of chemical liquid in the catcher 1.

[0030] In one embodiment, the receiver 1 is a spoon-shaped structure with a concave middle. The receiver 1 in the spoon-shaped structure can hold more chemical cleaning liquid.

[0031] As Figure 5 shown, in one embodiment, the cleaning device further includes a DIW nozzle 6 and an N 2 nozzle 7 for cleaning the receiver 1. The DIW nozzle 6 and the N 2 nozzle 7 are installed inside the receiver 1. Among them, the DIW nozzle 6 can spray cleaning water, and the N 2 nozzle 7 can spray nitrogen.

[0032] In this embodiment, to keep the inside of the receiver 1 clean and tidy, two nozzles, namely the DIW nozzle 6 and the N 2 nozzle 7, are added inside the receiver 1. Referring to Figure 3 , when the receiver 1 and the swing arm 2 swing back to the cup 13 together, the DIW nozzle sprays cleaning water to clean the chemical liquid inside the receiver 1. After the cleaning is completed, the N 2 nozzle 7 sprays nitrogen to dry the receiver 1 and keep the receiver 1 clean for subsequent use.

[0033] As Figure 6 shown, in one embodiment, both the DIW nozzle 6 and the N 2 nozzle 7 are rotatably installed inside the receiver 1. A third driving mechanism for driving the rotation of the DIW nozzle 6 and the N 2 nozzle 7 is provided inside the receiver 1. Preferably, the rotation range of the DIW nozzle 6 and the N 2 nozzle 7 can be within 30° - 150°. The swinging structure can achieve cleaning and drying at multiple positions. Further, the third driving mechanism includes a driving motor or a hydraulic motor. The driving motor or the hydraulic motor is installed on the receiver 1, and the DIW nozzle 6 and the N 2 nozzle 7 are connected to the output end of the driving motor or the hydraulic motor. The DIW nozzle 6 and the N 2 nozzle 7 are driven to rotate simultaneously by the driving motor or the hydraulic motor. In a specific embodiment, the third driving mechanism is a micro motor. The output end of the micro motor is simultaneously connected to the DIW nozzle 6 and the N 2 nozzle 7. A waterproof cover is arranged around the micro motor to protect the micro motor.

[0034] In this embodiment, the DIW nozzle 6 and the N 2 nozzle 7 are rotatably installed. When the receiver 1 swings back to the initial position together with the swing arm 2, the DIW nozzle 6 and the N 2The nozzle 7 can be driven by the third driving mechanism to spray obliquely upward, directly cleaning the lower plane of the swing arm 2, mainly flushing the chemical liquid splashed on this surface to prevent the chemical liquid from aggregating and dripping or forming crystals here. It can also directly flush the nozzle 12 to keep the nozzle clean and avoid irrelevant particles affecting the yield.

[0035] As Figure 4 shown, in one embodiment, the first driving mechanism and the second driving mechanism 5 are both linear telescopic elements. Among them, the first driving mechanism is installed inside one end of the swing arm 2, the second driving mechanism 5 is hinged to the output end of the first driving mechanism, one end of the receiver 1 is hinged to the output end of the first driving mechanism, and the output end of the second driving mechanism 5 is hinged to the middle of the receiver 1. To realize the up and down movement and rotation of the receiver 1. Preferably, the first driving mechanism includes a slide rail 3 and a pulley 4. Among them, the slide rail 3 is vertically installed inside one end of the swing arm 2, the outer wall of the pulley 4 closely adheres to the bottom of the groove of the slide rail 3, and the pulley 4 is rotatably connected to the slide rail 3 to form a rolling friction contact. The pulley 3 is driven by a motor to rotate, and this motor can be a micro motor. It should be noted that in this embodiment, the friction force between the pulley 4 and the slide rail 3 should be greater than the weight of the receiver 1, the second driving mechanism 5, and the DIW nozzle 6 and N 2 nozzle 7 and the possible chemical cleaning liquid that can be caught, so that the pulley 4 will not slide relative to the slide rail 3 without rotating. In this embodiment, when the micro motor rotates, it drives the pulley 4 to rotate relative to the slide rail 3. At this time, the micro motor, the receiver 1, and the second driving mechanism can slide up and down along the slide rail 3. In other embodiments, the first driving mechanism can also be a gear-rack transmission mechanism. The rack is equivalent to the slide rail 3, and the gear is equivalent to the pulley 4. The gear is meshed with the rack, and when the gear rotates relative to the rack, it can drive the micro motor, the receiver 1, and the second driving mechanism 5 to slide up and down along the slide rail 3. Obviously, the gear-rack transmission mechanism makes the first driving mechanism more stable. In one embodiment, the second driving mechanism 5 can be an electric push rod, a cylinder or a hydraulic cylinder. An installation plate is provided at the output end of the first driving mechanism. The motor corresponding to the first driving mechanism is installed on the installation plate. One end of the receiver 1 is hinged to the installation plate, and the electric push rod, the cylinder or the hydraulic cylinder is hinged to the installation plate. Such a structure enables the first driving mechanism to drive the micro motor, the receiver 1, and the second driving mechanism 5 to slide up and down along the slide rail 3 when working.

[0036] As Figure 3 shown, in one embodiment, a DIW pipeline 8 and N 2 pipeline 9 are provided on the swing arm 2. Among them, valves are provided on both the DIW pipeline 8 and the N 2 pipeline 9 to control the on-off states of the DIW nozzle 6 and the N 2 nozzle 7. At one end of the swing arm 2, the DIW pipeline 8 and the N 2Pipeline 9 and DIW nozzle 6, N 2 The nozzles 7 are respectively connected to the gas-liquid pipeline interface 10 to achieve gas-liquid communication. 2 The nozzle 7 is connected to the gas and liquid pipeline interface 10 through a hose to avoid the DIW nozzle 6, N 2 The problem of interference occurs when the nozzle 7 moves. In this embodiment, the DIW nozzle 6, N 2 The pipeline corresponding to the nozzle 7 is integrated and installed on the swing arm 2, which reasonably optimizes the layout of the pipeline, makes installation more convenient, and is more convenient to operate when cleaning the wafer. Preferably, a cleaning liquid pipeline 14 is provided on the swing arm 2, and the cleaning liquid pipeline 14 is connected to the nozzle 12. A valve is provided on the cleaning liquid pipeline 14, and the switch of the nozzle 12 is controlled by the valve to provide the nozzle 12 with chemical cleaning liquid.

[0037] like Figure 3 As shown, in one embodiment, the cleaning device also includes a cup 13 for receiving the poured chemical cleaning liquid or the cleaning water of the cleaning nozzle 12 and the receiver 1. The cup 13 is installed on one side of the supporting platform 11, that is, at the initial position of the nozzle 12, and the cup 13 is located below the nozzle 12.

[0038] In this embodiment, by setting the cup 13 at the initial position of the nozzle 12, after the wafer 15 is cleaned, the swing arm 2 moves the nozzle 12 away from the wafer 15 and returns it to the top of the cup 13, the receiver 1 is straightened, and the received chemical cleaning liquid is poured into the cup 13, which plays the role of recycling the chemical cleaning liquid and prevents the chemical cleaning liquid from polluting the working environment; and when cleaning the swing arm 2, the nozzle 12 and the receiver 1, the cup 13 can also receive the cleaning water produced by cleaning, which is more convenient to use.

[0039] The working process of the cleaning device in the wafer cleaning equipment:

[0040] like Figure 7 As shown, when the wafer 15 is placed on the carrier 11 and the cleaning device of the wafer cleaning equipment sprays chemical liquid, the receiver 1 is hooked on the inner area of ​​the hanging section of the swing arm 2 (such as Figure 7 (shown in a);

[0041] After each spraying of the chemical liquid, the receiver 1 will slide down along the slide rail 3, and at the same time, the receiver 1 (such as Figure 7 As shown in b), the chemical liquid that may drip can be caught to completely prevent the possibility of chemical liquid dripping;

[0042] Then the receiver 1 and the swing arm 2 are swung back to the cup 13, and the receiver 1 is straightened (such as Figure 7 As shown in c), the liquid received in the container 1 is poured into the cup 13 and drained away;

[0043] In order to keep the inside of the receiver 1 clean and tidy, two nozzles, DIW and N2, are installed on the receiver 1. DIW is sprayed to clean the chemical liquid dripping from the nozzle. After cleaning, N2 is sprayed to dry the receiver to keep it clean and tidy. After rinsing, the receiver is raised to the initial state (such as Figure 7 d), completing a cleaning process.

[0044] The utility model provides a cleaning device in a wafer cleaning device, which is provided with a receiver that can slide up and down and swing to catch the chemical liquid that may drip, completely blocking the possibility of the chemical liquid dripping, and can effectively prevent the liquid from dripping onto the wafer surface, thereby improving the wafer yield; at the same time, the receiver can swing back to the initial position with the swing arm, pouring out the received liquid and draining it away, thereby avoiding the accumulation of chemical liquid in the receiver. The cleaning device is also equipped with a DIW nozzle and N 2 Nozzle Two nozzles can clean the chemical liquid in the cleaning container. After cleaning, N 2 The nozzle sprays nitrogen to dry the receiver and keep it clean for subsequent use.

[0045] The above are only preferred implementations of the utility model. It should be pointed out that for those skilled in the art, several modifications and improvements can be made without departing from the structure of the utility model, which will not affect the effect of the implementation of the utility model and the practicality of the patent.

Claims

1. A cleaning device in a wafer cleaning device, the cleaning device comprising a swing arm (2) and a carrier platform (11), a nozzle (12) being provided at one end of the swing arm (2) above the carrier platform (11), characterized in that: It also includes a receiver (1), the receiver (1) being mounted on one side of the nozzle (12), the swing arm (2) being provided with a first driving mechanism for driving the receiver (1) to slide up and down, and the output end of the first driving mechanism being provided with a second driving mechanism (5) for driving the receiver (1) to rotate to the position directly below the nozzle (12) and to be swung straight.

2. The cleaning device according to claim 1, characterized in that: The receiver (1) is a spoon structure with a concave center.

3. The cleaning device according to claim 1, characterized in that: The cleaning device further comprises a DIW nozzle (6) and a N2 nozzle (7) for cleaning the receiver (1); the DIW nozzle (6) and the N2 nozzle (7) are installed in the receiver (1).

4. The cleaning device according to claim 3, characterized in that: The DIW nozzle (6) and the N2 nozzle (7) are both rotatably mounted in the receiver (1), and a third driving mechanism for driving the DIW nozzle (6) and the N2 nozzle (7) to rotate is provided in the receiver (1).

5. The cleaning device according to claim 4, characterized in that: The third driving mechanism comprises a driving motor or a hydraulic motor, wherein the driving motor or the hydraulic motor is mounted on the receiver (1), and the DIW nozzle (6) and the N2 nozzle (7) are connected to the output end of the driving motor or the hydraulic motor.

6. The cleaning device according to claim 1, characterized in that: The first driving mechanism and the second driving mechanism (5) are both linear telescopic elements; the first driving mechanism is installed on the inner side of one end of the swing arm (2), and the second driving mechanism (5) is hingedly installed on the output end of the first driving mechanism; one end of the container (1) is hingedly connected to the output end of the first driving mechanism, and the output end of the second driving mechanism (5) is hingedly connected to the middle part of the container (1).

7. The cleaning device according to claim 6, characterized in that: The first driving mechanism comprises a slide rail (3) and a pulley (4); the slide rail (3) is vertically mounted on the inner side of one end of the swing arm (2); the outer wall of the pulley (4) is in close contact with the bottom of the groove of the slide rail (3); the pulley (4) is rotatably connected to the slide rail (3); and the pulley (4) is driven to rotate by a motor.

8. The cleaning device according to claim 3, characterized in that: The swing arm (2) is provided with a DIW pipeline (8) and a N2 pipeline (9), and the DIW pipeline (8) and the N2 pipeline (9) are both provided with valves. One end of the swing arm (2) is provided with a gas-liquid pipeline interface (10) for connecting the DIW pipeline (8) and the N2 pipeline (9) with the DIW nozzle (6) and the N2 nozzle (7) respectively.

9. The cleaning device according to any one of claims 1 to 8, characterized in that: The swing arm (2) is provided with a cleaning liquid pipeline (14), the cleaning liquid pipeline (14) is connected with the nozzle (12), and a valve is provided on the cleaning liquid pipeline (14).

10. The cleaning device according to claim 9, characterized in that: The cleaning device further comprises a cup (13), wherein the cup (13) is mounted on one side of the supporting platform (11), and the cup (13) is located below the nozzle (12).

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