Gas shielded welding gun
By setting an annular water jacket and water circulation module outside the conductive nozzle of the gas protection welding gun, and using a semiconductor refrigeration sheet for cooling and heat dissipation, the problem of poor heat dissipation of the conductive nozzle is solved, and the service life and welding efficiency of the welding gun are significantly improved.
Patent Information
- Application Number
- CN202422119128.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-30
AI Technical Summary
When the existing gas protective welding torch is working, the conductive nozzle generates a lot of heat and cannot be dissipated for a long time, which affects the service life of the welding torch.
A gas protective welding gun was designed, with an annular water jacket on the outside of the conductive nozzle, and cooling and heat dissipation is achieved through the water circulation assembly and semiconductor refrigeration sheet to ensure that the conductive nozzle is always in a low temperature state.
It effectively improves the heat dissipation efficiency of the conductive nozzle, extends the service life of the equipment, and ensures efficient operation during welding.
Smart Images

Figure CN222957685U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of welding torch equipment, in particular to a gas shielded welding torch. Background Art
[0002] Gas shielded welding is an arc welding method that uses gas as the arc medium and protects the arc and the welding area, which is called gas shielded arc welding, or simply gas shielded welding for short. It is a welding method using protective gases such as CO2. In terms of application, it is easy to operate and suitable for automatic welding and all-round welding. Because of its low cost and easy production of carbon dioxide gas, gas shielded welding is widely used in various large and small enterprises. Compared with other welding methods, gas shielded welding has the following characteristics: good visibility of the arc and molten pool, during the welding process, the welding parameters can be adjusted according to the situation of the molten pool, the welding process is easy to operate, there is no slag or very little slag, and basically no slag cleaning is required after welding. The arc heat is concentrated under the compression of the protective gas flow, the welding speed is relatively fast, the molten pool is small, the heat affected zone is narrow, the deformation of the welded part after welding is small, which is conducive to the mechanization and automation of the welding process, especially the mechanized welding in the spatial position. It can weld magnesium, aluminum, titanium and their alloys with strong chemical activity and easy to form high melting point oxide films, and can weld thin plates. When working outdoors, a wind shielding device needs to be set up, otherwise the gas shielding effect is not good, or even very poor. The light radiation of the arc is very strong, the welding equipment is relatively complex, the price is higher than that of the shielded metal arc welding equipment, and because the gas shielded welding has a large current density, strong arc light and high temperature, high-concentration harmful gases are generated under the action of high-temperature arc and strong ultraviolet rays, so special attention should be paid to ventilation. A gas shielded welding torch is a device that can perform arc welding under the condition of gas shielding.
[0003] During the operation of the existing gas shielded welding torch, a large amount of heat will be generated on the contact tip of the welding torch. If these heats cannot be dissipated for a long time, it will greatly affect the service life of the welding torch. In view of the above problems, in order to increase the heat dissipation effect of the contact tip and extend its service life, the utility model proposes a gas shielded welding torch. Summary of the Invention
[0004] In order to solve the problems pointed out in the background art, the utility model proposes a gas shielded welding torch, in which the heat of the contact tip is continuously taken away, and the contact tip is always in a low-temperature state, so as to achieve the purpose of protecting the contact tip from burning and deforming, and effectively improving the heat dissipation efficiency of the contact tip.
[0005] In order to achieve the above purpose, the technical solution of the utility model is as follows:
[0006] A gas shielded welding torch includes a handle. A gun barrel is provided at the front end of the handle. A conductive nozzle is provided at the end of the gun barrel away from the handle. An annular water jacket is sleeved outside the conductive nozzle. A water circulation assembly is provided at the end of the annular water jacket close to the handle. A cooling water tank is provided at the end of the gun barrel close to the handle. The cooling water tank and the annular water jacket are connected and communicated through the water circulation assembly. The water circulation assembly includes a water inlet assembly and a water outlet assembly. The water inlet assembly is provided behind the annular water jacket. The water outlet assembly is provided in front of the annular water jacket. The cooling water tank is connected and communicated with the water inlet assembly through a water inlet pipe, and the cooling water tank is connected and communicated with the water outlet assembly through a water outlet pipe;
[0007] A semiconductor refrigerating sheet is installed on the side wall of the cooling water tank close to the handle. The semiconductor refrigerating sheet includes a refrigerating end and a heating end. A cooling fin is connected to the refrigerating end of the semiconductor refrigerating sheet. One end of the cooling fin away from the semiconductor refrigerating sheet is inserted into the cooling water tank. The heating end of the semiconductor refrigerating sheet is connected with a heat dissipation fin through heat-conducting silica gel. A heat dissipation box is provided between the cooling water tank and the handle. One end of the heat dissipation fin away from the semiconductor refrigerating sheet is inserted into the heat dissipation box.
[0008] Preferably, a channel is penetrated through the center of the heat dissipation box. One end of the channel is an air inlet, and the other end of the heat dissipation box is an air outlet. An air inlet fan is provided in the air inlet of the heat dissipation box, and an air outlet fan is provided in the air outlet of the heat dissipation box. The air outlet direction of the air inlet fan is the same as the air outlet direction of the air outlet fan.
[0009] Preferably, protective nets are installed on the sides of the air inlet fan and the air outlet fan facing away from each other. The two protective nets are respectively fixedly connected in the air inlet and the air outlet of the heat dissipation box.
[0010] Preferably, the annular water jacket extends along the length direction of the conductive nozzle. The annular water jacket is threadedly connected to the conductive nozzle. A water channel is provided between the annular water jacket and the conductive nozzle. A sealing ring I is provided at the left end of the annular water jacket, and a sealing ring II is provided at the right end of the annular water jacket.
[0011] Preferably, the water inlet assembly includes a water injection port, a water inlet tank and a water inlet joint. The water injection port is provided at the upper end of the water inlet tank. The water inlet joint is provided on the side of the water inlet tank close to the annular water jacket. The water channel and the water inlet tank are connected and communicated through the water inlet joint, and the water inlet pipe is connected to the water inlet tank.
[0012] Preferably, the water outlet assembly includes a water outlet joint and a buffer tank. The water outlet joint is provided on the side of the buffer tank close to the annular water jacket. The water channel and the buffer tank are connected and communicated through the water outlet joint, and the water outlet pipe is connected to the buffer tank. A water pump is provided at one end of the water outlet pipe close to the cooling water tank.
[0013] Preferably, a water inlet tank cover is provided on the water injection port.
[0014] Preferably, a plurality of the cooling fins and the heat dissipation fins are provided, and the plurality of cooling fins and the plurality of heat dissipation fins are spaced apart in the vertical direction.
[0015] Preferably, the cooling water tank and the heat dissipation tank are both fixedly connected to the gun barrel, and two baffles are symmetrically distributed up and down between the cooling water tank and the heat dissipation tank, and the semiconductor refrigeration sheet is located between the two baffles.
[0016] The beneficial effects of the present utility model are as follows:
[0017] A gas shielded welding torch proposed by the present utility model, by arranging an annular water jacket and a water circulation component, during the welding operation, the cooling water stored in the inner cavity of the cooling water tank flows into the water inlet pipe, and then the water flow sequentially passes through the water inlet tank, the water through-flow tank and the buffer tank, and finally enters the inner cavity of the cooling water tank via the water outlet pipe, thereby completing the circulation of the cooling water. And by arranging a semiconductor refrigeration sheet, the water flowing out of the water outlet pipe can be cooled again and then re-flowed into the water through-flow tank through the water inlet pipe, achieving the purpose of recycling. Thus, the heat of the conducting nozzle is continuously removed. At the same time, by arranging cooling fins and heat dissipation fins, the intake fan and the exhaust fan form a forced air duct on the heat dissipation fins to dissipate heat from the heat dissipation fins, accelerating the heat dissipation speed of the heating end of the semiconductor refrigeration sheet, making the heat dissipation effect better, and keeping the conducting nozzle at a low temperature all the time, thereby achieving the purpose of protecting the conducting nozzle from burning and deforming, effectively improving the heat dissipation efficiency of the conducting nozzle and prolonging the service life of the equipment. Description of the Drawings
[0018] Figure 1 is a three-dimensional view of a gas shielded welding torch of the present utility model Figure 1 .
[0019] Figure 2 is a three-dimensional view of a gas shielded welding torch of the present utility model Figure 2 .
[0020] Figure 3 is a front view of a gas shielded welding torch of the present utility model.
[0021] Figure 4 is a cross-sectional view of the cooling water tank and the heat dissipation tank in a gas shielded welding torch of the present utility model.
[0022] Figure 5 is a schematic diagram of the inside of the heat dissipation tank in a gas shielded welding torch of the present utility model.
[0023] Figure 6 is a cross-sectional view of the annular water jacket in a gas shielded welding torch of the present utility model.
[0024] Figure 7The utility model is a schematic diagram of a water circulation component in a gas shielded welding gun. DETAILED DESCRIPTION
[0025] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments:
[0026] like Figures 1 to 7 As shown, a gas shielded welding gun comprises a handle 1, a barrel 2 is arranged at the front end of the handle 1, a conductive nozzle 3 is arranged at the end of the barrel 2 away from the handle 1, an annular water jacket 4 is sleeved on the outside of the conductive nozzle 3, a water circulation assembly is arranged at the end of the annular water jacket 4 close to the handle 1, a cooling water tank 5 is arranged at the end of the barrel 2 close to the handle 1, the cooling water tank 5 and the annular water jacket 4 are connected through the water circulation assembly, the water circulation assembly comprises a water inlet assembly and a water outlet assembly, the water inlet assembly is arranged at the rear of the annular water jacket 4, the water outlet assembly is arranged at the front of the annular water jacket 4, the cooling water tank 5 is connected to the water inlet assembly through a water inlet pipe 6, and the cooling water tank 5 is connected to the water outlet assembly through a water outlet pipe 7. By setting a water circulation component, the cooling water is introduced into the water groove 15 between the annular water jacket 4 and the conductive nozzle 3 after passing through the water inlet joint 20, and is discharged from the water outlet joint 21 after absorbing the heat of the conductive nozzle 3. Among them, the water inlet pipe 6 and the water outlet pipe 7 are both copper pipes, and the water inlet component is arranged at the rear of the annular water jacket 4, and the water outlet component is arranged in front of the annular water jacket 4, so that the entry and outflow of the cooling water will not affect each other.
[0027] Furthermore, a semiconductor refrigeration sheet 8 is installed on the side wall of the cooling water tank 5 near the handle 1. The semiconductor refrigeration sheet 8 uses direct current as a power source to work; the semiconductor refrigeration sheet 8 includes a cooling end and a heating end. The cooling end of the semiconductor refrigeration sheet 8 is connected to a cooling sheet 9. The end of the cooling sheet 9 away from the semiconductor refrigeration sheet 8 is inserted into the cooling water tank 5. The heating end of the semiconductor refrigeration sheet 8 is connected to a heat sink 10 through thermal conductive silicone. A heat sink 11 is provided between the cooling water tank 5 and the handle 1. The end of the heat sink 10 away from the semiconductor refrigeration sheet 8 is inserted into the heat sink 11. The gap between the cooling sheet 9 and the cooling water tank 5 and the gap between the heat sink fin 10 and the heat sink 11 are sealed by epoxy resin.
[0028] Please refer again Figure 5 A channel is provided through the center of the heat sink 11, one end of the channel is an air inlet, and the other end of the heat sink 11 is an air outlet. An air inlet fan 12 is provided in the air inlet of the heat sink 11, and an air outlet fan 13 is provided in the air outlet of the heat sink 11. The air outlet direction of the air inlet fan 12 is the same as that of the air outlet fan 13. The air inlet fan 12 and the air outlet fan 13 form a forced air duct on the heat sink fins 10 to dissipate heat from the heat sink fins 10.
[0029] As an implementation method, a protective net 14 is installed on the side of the air inlet fan 12 and the air outlet fan 13 facing away from each other. The two protective nets 14 are respectively fixedly connected to the air inlet and the air outlet of the heat sink 11. The protective net 14 is a metal net to prevent foreign objects from being drawn into the fan.
[0030] Please refer again Figure 6 The annular water jacket 4 is extended along the length direction of the conductive nozzle 3, the annular water jacket 4 is threadedly connected to the conductive nozzle 3, a water groove 15 is provided between the annular water jacket 4 and the conductive nozzle 3, a sealing ring 16 is provided at the left end of the annular water jacket 4, and a sealing ring 2 17 is provided at the right end of the annular water jacket 4. During installation, the annular water jacket 4 is rotated to move leftward on the conductive nozzle 3, thereby squeezing the sealing ring 1 16 and the sealing ring 2 17, so that the annular water jacket 4 fits the conductive nozzle 3 more closely to improve the sealing performance.
[0031] Please refer again Figure 7 The water inlet assembly includes a water injection port 18, a water inlet box 19 and a water inlet joint 20. The water injection port 18 is arranged at the upper end of the water inlet box 19. The water inlet joint 20 is arranged on a side of the water inlet box 19 close to the annular water jacket 4. The water trough 15 and the water inlet box 19 are connected through the water inlet joint 20, and the water inlet pipe 6 is connected to the water inlet box 19.
[0032] Furthermore, the water outlet assembly includes a water outlet joint 21 and a buffer box 22, the water outlet joint 21 is arranged on a side of the buffer box 22 close to the annular water jacket 4, the water trough 15 and the buffer box 22 are connected through the water outlet joint 21, the water outlet pipe 7 is connected to the buffer box 22, and a water pump 23 is arranged on one end of the water outlet pipe 7 close to the cooling water tank 5.
[0033] The utility model sets a water inlet assembly and a water outlet assembly, and a water inlet port 18 is set at the upper end of the water inlet box 19 of the water inlet assembly. When adding water, water is added to the water circulation assembly through the water inlet port 18, and the water inlet port 18 is set away from the semiconductor refrigeration sheet 8 to prevent water from splashing onto the semiconductor refrigeration sheet 8 during the water adding process.
[0034] In addition, a water inlet tank cover 24 is provided on the water inlet 18. After the water is added, the water inlet tank cover 24 is provided to cover the water inlet 18 tightly, so that the cooling water in the water inlet tank 19 will not leak out, and the normal use of the gas shielded welding gun will not be affected.
[0035] Please refer again Figure 4 The cooling fins 9 and the heat dissipation fins 10 are both provided in plurality, and the plurality of cooling fins 9 and the plurality of heat dissipation fins 10 are distributed at intervals in the vertical direction.
[0036] It is worth mentioning that the cooling water tank 5 and the heat dissipation tank 11 are both fixedly connected to the barrel 2. There are two baffles 25 symmetrically distributed up and down between the cooling water tank 5 and the heat dissipation tank 11, and the semiconductor refrigeration sheet 8 is located between the two baffles 25. Through the above set structure, the baffle 25 can play a certain protective role for the semiconductor refrigeration sheet 8.
[0037] The usage method of this product is as follows:
[0038] During the welding process, in order to cool down the consumable tip 3 that continuously heats up due to continuous work, the water pump 23 on the water outlet pipe 7 needs to be turned on. During the operation of the water pump 23, the cooling water in the water inlet tank 19, the buffer tank 22, and the cooling water tank 5 will form a cycle under the push of the water pump 23. The specific process is as follows: Under the action of the water pump 23, the cooling water stored in the inner cavity of the cooling water tank 5 flows into the water inlet pipe 6, and then the water flow passes through the water inlet tank 19, the water trough 15, and the buffer tank 22 in sequence, and finally enters the inner cavity of the cooling water tank 5 through the water outlet pipe 7, thus completing the cycle of the cooling water.
[0039] During the process of the semiconductor refrigeration sheet 8 being powered on and starting to work, the water pump 23, the intake fan 12, and the exhaust fan 13 are started. The refrigerating end of the semiconductor refrigeration sheet 8 will absorb heat to lower the temperature of the cooling fin 9, and then produce a refrigerating effect on the cooling water in the inner cavity of the cooling water tank 5. Then, after the temperature of the cooling water decreases, it returns to the water trough 15 to absorb heat again, thus realizing the cycle, and the heat of the consumable tip 3 is continuously taken away. At the same time, the heating end of the semiconductor refrigeration sheet 8 will also release heat. Next, the heat of the heating end of the semiconductor refrigeration sheet 8 is diffused to the channel in the center of the heat dissipation tank 11 through the heat dissipation fins 10. The intake fan 12 and the exhaust fan 13 form a forced air duct on the heat dissipation fins 10 to dissipate heat from the heat dissipation fins 10, accelerating the heat dissipation speed of the heating end of the semiconductor refrigeration sheet 8 and making the heat dissipation effect better.
[0040] In summary, the present utility model can re-cool the water flowing out of the water outlet pipe 7 through the setting of the semiconductor refrigeration sheet 8, and then re-flow into the water trough 15 through the water inlet pipe 6 to achieve the purpose of recycling, so that the heat of the consumable tip 3 is continuously taken away.
[0041] The above embodiments are only the preferred embodiments of the present utility model, and do not limit the scope of implementation of the present utility model. Therefore, all equivalent changes or modifications made according to the structure, features, and principles described in the scope of the present utility model patent should be included in the scope of the patent application of the present utility model.
Claims
1. A gas shielded welding gun, comprising a handle (1), a barrel (2) being arranged at the front end of the handle (1), a conductive nozzle (3) being arranged at the end of the barrel (2) away from the handle (1), wherein: The conductive nozzle (3) is externally sleeved with an annular water jacket (4), a water circulation assembly is provided at one end of the annular water jacket (4) close to the handle (1), a cooling water tank (5) is provided at one end of the barrel (2) close to the handle (1), the cooling water tank (5) and the annular water jacket (4) are connected via the water circulation assembly, the water circulation assembly comprises a water inlet assembly and a water outlet assembly, the water inlet assembly is arranged at the rear of the annular water jacket (4), the water outlet assembly is arranged at the front of the annular water jacket (4), the cooling water tank (5) is connected to the water inlet assembly via a water inlet pipe (6), and the cooling water tank (5) is connected to the water outlet assembly via a water outlet pipe (7); A semiconductor refrigeration sheet (8) is installed on a side wall of the cooling water tank (5) close to the handle (1), the semiconductor refrigeration sheet (8) comprising a refrigeration end and a heating end, the refrigeration end of the semiconductor refrigeration sheet (8) is connected to a cooling sheet (9), an end of the cooling sheet (9) away from the semiconductor refrigeration sheet (8) is inserted into the cooling water tank (5), the heating end of the semiconductor refrigeration sheet (8) is connected to a heat dissipation fin (10) via heat-conducting silica gel, a heat dissipation box (11) is arranged between the cooling water tank (5) and the handle (1), and an end of the heat dissipation fin (10) away from the semiconductor refrigeration sheet (8) is inserted into the heat dissipation box (11).
2. A gas shielded welding gun according to claim 1, characterized in that: A channel is provided through the center of the heat sink (11); one end of the channel is an air inlet, and the other end of the heat sink (11) is an air outlet; an air inlet fan (12) is provided in the air inlet of the heat sink (11); an air outlet fan (13) is provided in the air outlet of the heat sink (11); and the air outlet direction of the air inlet fan (12) is the same as the air outlet direction of the air outlet fan (13).
3. A gas shielded welding gun according to claim 2, characterized in that: A protective net (14) is installed on the side of the air inlet fan (12) and the air outlet fan (13) facing away from each other, and the two protective nets (14) are respectively fixedly connected to the air inlet and the air outlet of the heat dissipation box (11).
4. A gas shielded welding gun according to claim 1, characterized in that: The annular water jacket (4) is arranged to extend along the length direction of the conductive nozzle (3); the annular water jacket (4) is threadedly connected to the conductive nozzle (3); a water groove (15) is arranged between the annular water jacket (4) and the conductive nozzle (3); a sealing ring 1 (16) is arranged at the left end of the annular water jacket (4); and a sealing ring 2 (17) is arranged at the right end of the annular water jacket (4).
5. A gas shielded welding gun according to claim 4, characterized in that: The water inlet assembly comprises a water injection port (18), a water inlet box (19) and a water inlet joint (20); the water injection port (18) is arranged at the upper end of the water inlet box (19); the water inlet joint (20) is arranged on a side of the water inlet box (19) close to the annular water jacket (4); the water trough (15) and the water inlet box (19) are connected via the water inlet joint (20); and the water inlet pipe (6) is connected to the water inlet box (19).
6. A gas shielded welding gun according to claim 4, characterized in that: The water outlet assembly comprises a water outlet joint (21) and a buffer box (22); the water outlet joint (21) is arranged on a side of the buffer box (22) close to the annular water jacket (4); the water trough (15) and the buffer box (22) are connected via the water outlet joint (21); the water outlet pipe (7) is connected to the buffer box (22); and a water pump (23) is arranged at one end of the water outlet pipe (7) close to the cooling water tank (5).
7. A gas shielded welding gun according to claim 5, characterized in that: The water inlet (18) is provided with a water inlet tank cover (24).
8. A gas shielded welding gun according to claim 1, characterized in that: A plurality of cooling fins (9) and a plurality of heat dissipation fins (10) are provided, and the plurality of cooling fins (9) and the plurality of heat dissipation fins (10) are distributed at intervals in the vertical direction.
9. A gas shielded welding gun according to claim 1, characterized in that: The cooling water tank (5) and the heat sink (11) are both fixedly connected to the gun barrel (2), and two baffles (25) symmetrically distributed up and down are arranged between the cooling water tank (5) and the heat sink (11), and the semiconductor cooling plate (8) is located between the two baffles (25).