Laser cutting positioning device and laser cutting equipment

Abstract

The utility model provides a laser cutting positioning device and laser cutting equipment, and relates to the technical field of laser cutting. The laser cutting positioning device comprises a reference platform and a limiting baffle, the reference platform is provided with a reference surface used for containing a to-be-machined ceramic plate, and a plurality of vacuum adsorption holes distributed at intervals are formed in the reference surface; the limiting baffle is fixed to the reference platform and provided with a positioning face used for being attached to the side face of the to-be-machined ceramic plate, and the positioning face is perpendicular to the reference face. According to the positioning device, the to-be-machined ceramic plate is adsorbed and fixed to the reference platform in a vacuum adsorption mode, the position of the to-be-machined ceramic plate is firm, the to-be-machined ceramic plate is not prone to displacement during laser cutting, and the laser cutting efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of laser cutting, and particularly relates to a laser cutting positioning device and a laser cutting equipment. Background Technique

[0002] Ceramics have many excellent properties such as various functions, stable physical and chemical properties, good processing performance and uniformity, and are widely used in industries such as optoelectronic detection, light-emitting devices, and electronic packaging. In practical applications, ceramic wafers or particles of different sizes are required, so the ceramic wafers need to be cut into small pieces or small blocks by diamond tools or diamond wires for subsequent processing and packaging. Ceramics are typical hard and brittle materials that are difficult to process. During the cutting of small-volume ceramics, due to vibration or displacement generated by traditional processing, problems such as burrs, chipping, and poor flatness of the cutting surface are likely to occur on the cutting edge. At the same time, it is difficult to further process the surface of small-particle ceramics. In the prior art, there is a fixture for positioning ceramic wafer plates. Due to unreasonable design, during the cutting process, under the mechanical action of tools and the like, the ceramic material is prone to produce fine movement on the fixture, affecting the cutting accuracy. Therefore, the above problems seriously affect the surface quality and processing efficiency of small-volume ceramic materials. Content of the Utility Model

[0003] The purpose of the utility model is to provide a laser cutting positioning device and a laser cutting equipment, which can improve the positioning accuracy and the cutting quality.

[0004] The embodiments of the utility model are implemented as follows:

[0005] In a first aspect, the utility model provides a laser cutting positioning device, including:

[0006] A reference platform and a limit baffle. The reference platform has a reference surface for placing the ceramic plate to be processed, and a plurality of vacuum adsorption holes are arranged at intervals on the reference surface; the limit baffle is fixed on the reference platform, and the limit baffle has a positioning surface for fitting with the side surface of the ceramic plate to be processed, and the positioning surface is perpendicular to the reference surface.

[0007] In an optional embodiment, a plurality of fixing holes for bolts to pass through are arranged on the reference platform, and the plurality of vacuum adsorption holes are located in the area surrounded by the plurality of fixing holes.

[0008] Based on the above scheme, after the reference platform is placed on the laser cutting platform, bolts are passed through the fixing holes and tightened on the laser cutting platform to fix the reference platform to the laser cutting platform. The position of the reference platform relative to the laser cutting platform is firm and reliable. When replacing the ceramic plate to be processed, it is not easy for the reference platform to be displaced relative to the laser cutting platform, so that there is no need for repeated positioning multiple times, which reduces the difficulty of cutting and improves construction efficiency.

[0009] In an optional embodiment, the fixing hole is configured as a stepped hole, the fixing hole having a first hole segment and a second hole segment that are connected, the hole diameter of the first hole segment is larger than the hole diameter of the second hole segment, and the end surface of the first hole segment away from the second hole segment is located on the reference plane.

[0010] Based on the above scheme, the bolt is screwed into the stepped hole, and the head of the bolt is embedded in the first hole section. The head of the bolt will not protrude from the reference surface, thereby not forming a protruding structure on the base plane, and it is not easy to block the ceramic sheet to be processed. The ceramic sheet to be processed is easy to place on the reference surface and is not easily damaged by collision.

[0011] In an optional embodiment, the plurality of vacuum adsorption holes are arranged in a rectangular array.

[0012] Based on the above scheme, during laser cutting, multiple continuous cuts are performed along the arrangement direction of the vacuum adsorption holes, which is beneficial to the cutting of ceramics. After the cutting is completed, multiple square blocks of ceramics can be obtained by bending along the cutting line.

[0013] In an optional embodiment, the limit baffle includes a first plate body and a second plate body connected to each other, the positioning surface includes a first positioning surface located on the plate surface of the first plate body and a second positioning surface located on the second plate body, and the first positioning surface, the second positioning surface and the reference surface are arranged vertically in pairs.

[0014] Based on the above scheme, the two side surfaces of the ceramic plate to be processed are respectively fitted with the first positioning surface and the second positioning surface, so that the first positioning surface and the second positioning surface can cooperate to determine the unique position of the ceramic plate to be processed on the reference surface, so that the ceramic plate to be processed can be quickly positioned on the reference platform, and the operation is convenient and fast, and the positioning effect is good. After the positioning of the ceramic plate to be processed is completed, the ceramic sheet to be processed is adsorbed on the reference surface using multiple vacuum adsorption holes, and the position of the ceramic plate to be processed is not easy to change during the laser cutting process, and the cutting quality is high.

[0015] In an alternative embodiment, the reference platform includes a top plate and a base. The reference plane is located on the top plate, and the plurality of vacuum suction holes penetrate through the top plate. A mixing chamber and a connection port are provided on the base, the top plate is fixedly connected to the base, and all the vacuum suction holes communicate with the mixing chamber. The connection port is used to connect to a vacuum pump.

[0016] Based on the above solution, the top plate and the base are processed separately, with low processing difficulty. After processing, the two are spliced together and connected to the vacuum pump through the connection port. After the vacuum pump is started, negative pressure can be generated at the plurality of vacuum suction holes through the mixing chamber, without the need to connect a pipeline to the vacuum pump at each vacuum suction hole, reducing the connecting pipelines, simplifying the structure, and reducing costs.

[0017] In an alternative embodiment, a sealing ring is provided between the top plate and the base, and the mixing chamber and all the vacuum suction holes are located within the area surrounded by the sealing ring.

[0018] Based on the above solution, the sealing performance around the connection position of the top plate and the base is high, leakage is not likely to occur, energy consumption is reduced, and cutting costs are saved.

[0019] In an alternative embodiment, a thickening portion is provided around the reference platform, and the thickening portion protrudes from the reference plane to increase the weight of the reference platform.

[0020] Based on the above solution, by providing a thickening portion around the reference platform, the weight of the reference platform can be increased, making it not easy to move when placed on the laser cutting platform, and the position of the reference platform is more stable during the laser cutting process, improving the cutting quality. At the same time, materials can be saved and costs can be reduced.

[0021] In a second aspect, the present invention provides a laser cutting device, which includes:

[0022] A laser cutting platform and the laser cutting positioning device according to any one of the foregoing embodiments, and the reference platform is installed on the laser cutting platform.

[0023] In an alternative embodiment, the laser cutting device further includes a vacuum pump, and the vacuum pump communicates with the plurality of vacuum suction holes.

[0024] Based on the above solution, when the vacuum pump is started, the vacuum pump can generate negative pressure at the plurality of vacuum suction holes, thereby adsorbing and positioning the ceramic plate to be processed on the reference plane. The positioning effect between the ceramic plate to be processed and the reference plane is good, and it is not easy to shift during the subsequent cutting process, and the cutting quality is high.

[0025] The beneficial effects of the embodiments of the present invention are:

[0026] In summary, for the laser cutting positioning device provided in this embodiment, before the cutting operation, the reference platform is first placed on the laser cutting platform to fix the reference platform relative to the laser cutting platform. Multiple loading and unloading operations will not cause the position of the reference platform to change. The reference platform always remains in the position of the initial positioning, and subsequent repeated positioning is not required, reducing the operation difficulty and improving the operation efficiency. Then, the ceramic plate to be processed is placed on the reference surface, and the side surface of the ceramic plate to be processed contacts the positioning surface. The accuracy of the position of the ceramic plate to be processed is ensured by the cooperation of the reference surface and the positioning surface. Then, the ceramic plate to be processed is firmly adsorbed on the reference surface by the negative pressure generated at multiple vacuum adsorption holes. During the subsequent process of laser cutting the ceramic plate to be processed, the position of the reference platform is stable, and the position of the ceramic plate to be processed relative to the reference platform is stable, thereby improving the quality of laser cutting. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 Schematic diagram of the laser cutting positioning device for the embodiment of the present invention;

[0029] Figure 2 Cross-sectional view of the laser cutting positioning device for the embodiment of the present invention;

[0030] Figure 3 Schematic diagram of a modified example of the reference platform for the embodiment of the present invention.

[0031] Reference Signs:

[0032] 001 - Ceramic plate to be processed; 100 - Reference platform; 101 - Reference surface; 102 - Vacuum adsorption hole; 110 - Fixing hole; 111 - First hole section; 112 - Second hole section; 120 - Top plate; 130 - Base; 131 - Mixing cavity; 132 - Connection port; 140 - Sealing ring; 200 - Limit baffle; 210 - First plate body; 211 - First positioning surface; 220 - Second plate body; 221 - Second positioning surface. Detailed Embodiments

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. The components of the embodiments of the present utility model described and illustrated herein can be arranged and designed in various different configurations.

[0034] Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model claimed, but merely represents selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0035] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0036] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0037] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0038] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0039] In the prior art, when a ceramic plate is laser cut, a fixture is used for positioning. The fixture clamps the ceramic plate. In order to avoid damage to the ceramic plate caused by excessive clamping, the clamping force between the fixture and the ceramic plate cannot be designed too large. As a result, the probability of the position change of the ceramic plate relative to the fixture during the laser cutting process increases, affecting the laser cutting quality.

[0040] In view of this, the designer provides a laser cutting positioning device, which improves the stability of the position of the ceramic plate by means of vacuum adsorption, ensures that the ceramic plate is not easily displaced during the laser cutting process, and thus improves the laser cutting quality.

[0041] Please refer to Figure 1 , in the figure, the to-be-processed ceramic plate 001 shows the state after cutting. In this embodiment, the laser cutting positioning device includes a reference platform 100 and a limit baffle 200. The reference platform 100 has a reference surface 101 for placing the to-be-processed ceramic plate 001, and a plurality of vacuum adsorption holes 102 arranged at intervals are provided on the reference surface 101; the limit baffle 200 is fixed on the reference platform 100, and the limit baffle 200 has a positioning surface for fitting with the side surface of the to-be-processed ceramic plate 001, and the positioning surface is perpendicular to the reference surface 101.

[0042] As described above, the working principle of the laser cutting positioning device provided in this embodiment is as follows:

[0043] Before the cutting operation, first place the reference platform 100 on the laser cutting platform so that the reference platform 100 is fixed relative to the laser cutting platform. Multiple loading and unloading operations will not cause the position change of the reference platform 100. The reference platform 100 always remains in the initially positioned position, and subsequent repeated positioning is not required, reducing the operation difficulty and improving the operation efficiency. Then, place the to-be-processed ceramic plate 001 on the reference surface 101, and the side surface of the to-be-processed ceramic plate 001 contacts the positioning surface. Relying on the cooperation of the reference surface 101 and the positioning surface to ensure the accuracy of the position of the to-be-processed ceramic plate 001, and then use the negative pressure generated at the plurality of vacuum adsorption holes 102 to firmly adsorb the to-be-processed ceramic plate 001 on the reference surface 101. During the subsequent process of laser cutting the to-be-processed ceramic plate 001, the position of the reference platform 100 is stable, and the position of the to-be-processed ceramic plate 001 relative to the reference platform 100 is stable, thereby improving the laser cutting quality.

[0044] The following embodiments will illustrate the details of the laser cutting positioning device provided in the present application by way of examples.

[0045] In this embodiment, the laser cutting positioning device includes a reference platform 100 and a limit baffle 200. The limit baffle 200 is installed on the base platform, and the two cooperate to position the to-be-processed ceramic plate 001. The to-be-processed ceramic plate 001 can be a rectangular plate.

[0046] Please combine Figure 1 and Figure 2 , optionally, the reference platform 100 is set as a rectangular parallelepiped plate, the top surface and the bottom surface of the reference platform 100 are oppositely arranged and can both be square surfaces. The top surface of the reference platform 100 can also be called the reference surface 101, and the bottom surface of the reference platform 100 is used to fit on the laser cutting platform. A plurality of vacuum adsorption holes 102 and a plurality of fixing holes 110 are arranged on the top surface of the reference platform 100. The plurality of vacuum adsorption holes 102 can be arranged in a rectangular array, and each vacuum adsorption hole 102 can be a circular hole. The fixing holes 110 can be stepped holes, and the number of the fixing holes 110 can be four. The four fixing holes 110 are respectively corresponding to the four corners of the reference surface 101, and all the vacuum adsorption holes 102 are located within the area surrounded by the four fixing holes 110.

[0047] Specifically, the fixing hole 110 includes a first hole section 111 and a second hole section 112 which are communicated and coaxially arranged. Both the first hole section 111 and the second hole section 112 are circular hole sections. The end of the first hole section 111 far from the second hole section 112 is located on the reference surface 101, that is, one end of the second hole section 112 far from the first hole section 111 is located on the bottom surface of the reference platform 100. After the reference platform 100 is placed on the laser cutting platform, a bolt is inserted into the fixing hole 110. The bolt penetrates from the first hole section 111 into the second hole section 112 and is screwed on the laser cutting platform. The head of the bolt is embedded in the first hole section 111 and will not protrude from the reference surface 101. The head of the bolt is not likely to interfere with the ceramic plate 001 to be processed, and the positioning of the ceramic plate 001 to be processed is more convenient and safe. The reference platform 100 is fixed on the laser cutting platform through the bolt, the position of the reference platform 100 is firm and reliable, it is not easy to shift during the laser cutting process, and the laser cutting quality of the ceramic plate is high.

[0048] It should be understood that in other embodiments, the number of the fixing holes 110 is not limited to four.

[0049] In addition, in other embodiments, the arrangement pattern of the vacuum adsorption holes 102 is not limited to a rectangular array.

[0050] In other embodiments, optionally, the reference platform 100 can be provided with thickening parts around it, and the thickening parts protrude from the reference surface 101 to increase the weight of the reference platform 100. By providing the thickening parts around the reference platform 100, the weight of the reference platform 100 can be increased, so that the reference platform 100 is not easy to move its position when placed on the laser cutting platform, the position of the reference platform 100 is more firm during the laser cutting process, and the cutting quality is improved; at the same time, materials can be saved and the cost can be reduced.

[0051] Please combine Figure 3, in other embodiments, optionally, the reference platform 100 is provided as a split structure, which is conducive to processing and manufacturing. For example, the reference platform 100 includes a top plate 120, a base 130, and a sealing ring 140. The reference plane 101 is located on the top plate 120, and a plurality of vacuum suction holes 102 penetrate through the top plate 120; a connected mixing chamber 131 and a connection port 132 are provided on the base 130. The top plate 120 is fixedly connected to the base 130, and all the vacuum suction holes 102 communicate with the mixing chamber 131. The sealing ring 140 is between the top plate 120 and the base 130, and can seal the peripheral gaps between the top plate 120 and the base 130, thereby improving the sealing performance, avoiding air leakage around the connection position between the top plate 120 and the base 130, and reducing energy consumption. The connection port 132 is used to connect to a vacuum pump, eliminating the need to connect pipes to the vacuum pump at each vacuum suction hole 102, reducing the number of connecting pipes, simplifying the structure, and reducing costs.

[0052] Furthermore, the periphery of the base 130 protrudes from the periphery of the top plate 120, and four fixing holes 110 are provided at the position where the base 130 protrudes from the top plate 120. The top plate 120 and the base 130 can be fixedly connected by structural members such as bolts.

[0053] In this embodiment, optionally, the limiting baffle 200 includes a connected first plate body 210 and a second plate body 220. The positioning surface includes a first positioning surface 211 on the plate surface of the first plate body 210 and a second positioning surface 221 on the second plate body 220. The first positioning surface 211, the second positioning surface 221, and the reference plane 101 are perpendicular to each other in pairs. The limiting plate can be provided as an integral structure, and the first plate body 210 and the second plate body 220 are formed by bending a rectangular plate, with high structural strength and long service life. The limiting plate can be fixedly connected to the reference platform 100 by means such as bonding and bolts.

[0054] It should be understood that after the ceramic plate 001 to be processed is placed on the reference plane 101, two adjacent side surfaces of the ceramic plate 001 to be processed are respectively attached to the first positioning surface 211 and the second positioning surface 221. In this way, through the cooperation of the first positioning surface 211 and the second positioning surface 221, the unique position of the ceramic plate 001 to be processed on the reference plane 101 can be determined, so that the ceramic plate 001 to be processed can be quickly positioned on the reference platform 100, with convenient and fast operation and good positioning effect. After the ceramic plate 001 to be processed is positioned, the ceramic plate to be processed is adsorbed on the reference plane 101 by a plurality of vacuum suction holes 102, and the position of the ceramic plate 001 to be processed is not easily changed during the laser cutting process, and the cutting quality is high.

[0055] The laser cutting positioning device provided in this embodiment adsorbs and fixes the ceramic plate 001 to be processed on the reference platform 100 through a vacuum adsorption method. The position of the ceramic plate 001 to be processed is firm, and it is not easy to shift during laser cutting, so the laser cutting efficiency is high.

[0056] This embodiment also provides a laser cutting device, which includes a laser cutting platform, a vacuum pump, and the laser cutting positioning device of the above embodiment. The reference platform 100 is fixed on the laser cutting platform. An origin position can be set on the laser cutting platform. Aligning the reference platform 100 with the origin position can quickly realize the positioning of the laser cutting platform and the reference platform 100. The vacuum pump is connected to the connection port 132 through a pipeline. After the vacuum pump is started, negative pressure can be generated at multiple vacuum adsorption holes 102.

[0057] The structural design of this laser cutting device can improve the firmness of the ceramic plate 001 to be processed on the reference platform 100. The ceramic plate 001 to be processed is not easy to shift during laser cutting, and it is not easy to generate burrs, chipping, and edge reshaping, so the laser cutting quality is high.

[0058] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A laser cutting positioning device, characterized in that: include: A reference platform (100) and a limit baffle (200), wherein the reference platform (100) has a reference surface (101) for placing a ceramic plate (001) to be processed, and the reference surface (101) is provided with a plurality of vacuum adsorption holes (102) arranged at intervals; the limit baffle (200) is fixed on the reference platform (100), and the limit baffle (200) has a positioning surface for fitting with the side surface of the ceramic plate (001) to be processed, and the positioning surface and the reference surface (101) are perpendicular to each other; The reference platform (100) comprises a top plate (120) and a base (130); the reference surface (101) is located on the top plate (120); the plurality of vacuum adsorption holes (102) are all arranged through the top plate (120); the base (130) is provided with a mixing chamber (131) and a connecting port (132) that are connected; the top plate (120) is fixedly connected to the base (130), and all the vacuum adsorption holes (102) are connected to the mixing chamber (131); the connecting port (132) is used to connect to a vacuum pump; A sealing ring (140) is provided between the top plate (120) and the base (130), and the mixing chamber (131) and all the vacuum adsorption holes (102) are located within the area surrounded by the sealing ring (140).

2. The laser cutting positioning device according to claim 1, characterized in that: The reference platform (100) is provided with a plurality of fixing holes (110) for bolts to pass through, and the plurality of vacuum adsorption holes (102) are located in an area surrounded by the plurality of fixing holes (110).

3. The laser cutting positioning device according to claim 2, characterized in that: The fixing hole (110) is arranged as a stepped hole, and the fixing hole (110) comprises a first hole section (111) and a second hole section (112) which are connected to each other, the hole diameter of the first hole section (111) is larger than the hole diameter of the second hole section (112), and the end surface of the first hole section (111) away from the second hole section (112) is located on the reference surface (101).

4. The laser cutting positioning device according to claim 1, characterized in that: The plurality of vacuum adsorption holes (102) are arranged in a rectangular array.

5. The laser cutting positioning device according to claim 1, characterized in that: The limit baffle (200) comprises a first plate body (210) and a second plate body (220) connected to each other, the positioning surface comprises a first positioning surface (211) located on the plate surface of the first plate body (210) and a second positioning surface (221) located on the second plate body (220), and the first positioning surface (211), the second positioning surface (221) and the reference surface (101) are arranged vertically in pairs.

6. The laser cutting positioning device according to claim 1, characterized in that: Thickened portions are arranged around the reference platform (100), and the thickened portions are protruding from the reference surface (101) to increase the weight of the reference platform (100).

7. A laser cutting device, characterized in that: The laser cutting equipment comprises: A laser cutting platform and the laser cutting positioning device according to any one of claims 1 to 6, wherein the reference platform (100) is installed on the laser cutting platform.

8. The laser cutting device according to claim 7, characterized in that: The laser cutting equipment also includes a vacuum pump, which is connected to the plurality of vacuum adsorption holes (102).

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