Wafer cutting device

Abstract

The wafer cutting device comprises a machine body, the inner walls of the two sides of the machine body are each provided with two sliding grooves, the interiors of the four sliding grooves are each connected with a sliding block in a sliding mode, and a containing table is jointly and fixedly connected between the two sliding blocks on the same side; rotary adjusting assemblies are installed in the two containing tables correspondingly, and Archimedes spiral grooves are formed in the movable ends of the two rotary adjusting assemblies correspondingly. According to the utility model, through the arrangement of the rotation adjusting assembly, the placing table, the Archimedes spiral groove, the positioning block, the sliding groove, the sliding block, the synchronous driving assembly and the lead screw, various wafers with different outer diameters can be limited, so that the overall universality is improved, meanwhile, the overall double-station design is adopted, and when cutting operation is carried out at one station, the working efficiency is greatly improved. And wafer replacement operation can be carried out at the other station, so that the time consumed by wafer replacement can be compressed within the time required by cutting, and the cutting efficiency of the wafer can be obviously improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting, in particular to a wafer cutting device. Background Art

[0002] The main function of wafer cutting is to divide a complete wafer into individual die, which is crucial for the subsequent manufacture of integrated circuits. Specifically, wafer cutting not only involves cutting the entire wafer into individual die, but also includes scribing the traces of the cutting tool on the complete wafer to facilitate the subsequent separation of the die. In addition, wafer cutting also allows for the excision of die with poor electrical performance, ensuring that only qualified die are used in the subsequent integrated circuit manufacturing process.

[0003] A semiconductor wafer laser cutting device and method with the publication number of CN115458468B in the prior art includes a housing. Inside the housing, there is a laser head for cutting the semiconductor wafer. The laser head can be lifted and moved left and right. Inside the bottom groove of the housing, there is a slide table for placing the wafer. The slide table moves back and forth under the action of a first screw rod to enter and exit the housing for loading and unloading. And when the slide table enters the housing, negative pressure is generated inside the slide table to adsorb and fix the wafer.

[0004] When this wafer laser cutting device is in use, since the size of its limiting ring is fixed, when cutting and processing wafers with different outer diameters, corresponding sized limiting rings need to be replaced, resulting in poor versatility. At the same time, due to its single-station operation, each time during processing, it is necessary to wait for the previous wafer cutting to be completed before replacing the wafer. After waiting for the replacement to be completed, the wafer can be cut again. The time consumed for wafer replacement cannot be compressed within the time consumed for wafer cutting, resulting in low efficiency of wafer cutting and processing. Therefore, improvements are proposed. Summary of the Utility Model

[0005] The utility model is a wafer cutting device proposed to solve the drawbacks existing in the prior art.

[0006] To achieve the above object, the utility model adopts the following technical scheme: A wafer cutting device includes a machine body. Two chutes are opened on both inner walls of the machine body. Four sliders are slidably connected inside the four chutes. A placement table is fixedly connected between the two sliders on the same side.

[0007] Rotary adjustment components are installed inside the two placement tables. The movable ends of the two rotary adjustment components are provided with Archimedean spiral grooves. Four positioning blocks are meshed and connected to the tops of the two Archimedean spiral grooves, and the positioning blocks penetrate through the placement table.

[0008] Adsorption holes penetrating to the bottom are formed at the centers of the two placement platforms, and piston assemblies are installed in the two adsorption holes;

[0009] An installation cavity is formed inside the machine body. A synchronous drive assembly is jointly installed between the installation cavity and the machine body. Two movable ends of the synchronous drive assembly are fixedly connected with lead screws. The lead screws penetrate through the installation cavity and extend into adjacent sliding grooves and are rotatably connected with the machine body. The two lead screws are in threaded connection with the adjacent sliders.

[0010] Furthermore, each of the two rotation adjustment assemblies includes an adjustment motor, and the adjustment motor is fixedly installed at the inner bottom of the placement platform. The drive end of the adjustment motor is fixedly connected with a driving gear. A toothed ring is meshed on the outer surface of the driving gear. The top of the toothed ring is fixedly connected with an annular disc, and an Archimedes spiral groove is formed on the top of the annular disc. The annular disc is rotatably connected with the placement platform. The placement platform has a supporting effect on the annular disc, which is beneficial to the installation of the annular disc.

[0011] Furthermore, four guiding grooves penetrating to the inside are formed at the tops of the two placement platforms, and both inner walls on both sides of the guiding grooves are slidably connected with the adjacent positioning blocks. The guiding grooves have a limiting effect on the positioning blocks and can ensure the stability of the movement of the positioning blocks.

[0012] Furthermore, each of the two piston assemblies includes an electric push rod, and the electric push rod is fixedly installed on one inner wall of the adsorption hole. The movable end of the electric push rod is fixedly connected with a piston body, and the piston body is in abutting sliding connection with the inner wall of the adsorption hole. The electric push rod can drive the piston body to move.

[0013] Furthermore, the synchronous drive assembly includes a drive motor, and the drive motor is fixedly installed on one outer wall of the machine body. The drive motor is the basis for the electric drive of the drive assembly.

[0014] Furthermore, the synchronous drive assembly further includes two large gears, and the two large gears are symmetrically and rotatably installed on one inner wall of the installation cavity. The drive shaft of the drive motor penetrates through the machine body and is fixedly connected with the adjacent large gear. One side of the outer surface of each of the two large gears is meshed with a small gear, and the small gear is fixedly sleeved on the outer surface of the lead screw, which can make the rotation directions of the two lead screws opposite.

[0015] Furthermore, an XYZ moving platform is fixedly installed inside the machine body, and a laser cutting head is fixedly installed at the installation end of the XYZ moving platform, which can drive the laser cutting head to move in three directions of X, Y, and Z.

[0016] The beneficial effects of the present utility model:

[0017] When the utility model is in use, for a wafer cutting device, through the arranged rotation adjustment component, placing table, Archimedes spiral groove, positioning block, sliding groove, slider, synchronous drive component and lead screw, wafers with different outer diameters can be limited, thereby improving the overall versatility. At the same time, the overall design adopts a double-station design. When one station is performing cutting operations, the other station can perform wafer replacement operations, and the time consumed for wafer replacement can be compressed within the time required for cutting, which can significantly improve the cutting efficiency of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the present utility model, the drawings required for use in the following description of the specific embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0019] Figure 1 : The three-dimensional view of the present utility model;

[0020] Figure 2 : The sectional view of the present utility model;

[0021] Figure 3 : The partial sectional view of the body of the present utility model;

[0022] Figure 4 : The sectional view of the placing table of the present utility model.

[0023] The reference numerals in the drawings are as follows:

[0024] 1, body; 2, XYZ moving platform; 3, laser cutting head; 4, placing table; 5, positioning block; 6, drive motor; 7, sliding groove; 8, slider; 9, lead screw; 10, installation cavity; 11, small gear; 12, large gear; 13, guiding groove; 14, piston body; 15, electric push rod; 16, adsorption hole; 17, Archimedes spiral groove; 18, tooth ring; 19, driving gear; 20, adjusting motor; 21, annular disc. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0026] As Figures 1 to 4As shown in the figure, it relates to a wafer cutting device, including a machine body 1. Both inner walls of the machine body 1 are provided with two sliding grooves 7. Four sliding blocks 8 are slidably connected inside the four sliding grooves 7. A placing table 4 is fixedly connected between the two sliding blocks 8 on the same side. The sliding grooves 7 play a limiting role on the sliding blocks 8, which can ensure the stability of the movement of the sliding blocks 8.

[0027] Two rotation adjustment components are installed inside both placing tables 4. The movable ends of the two rotation adjustment components are both provided with Archimedes spiral grooves 17. Four positioning blocks 5 are meshed and connected to the tops of the two Archimedes spiral grooves 17. The four positioning blocks 5 located on the same placing table 4 are centered and distributed, and the positioning blocks 5 penetrate through the placing table 4. Both rotation adjustment components include adjustment motors 20, and the adjustment motors 20 are fixedly installed at the inner bottom of the placing table 4. The driving end of the adjustment motor 20 is fixedly connected with a driving gear 19. The outer surface of the driving gear 19 is meshed and connected with a toothed ring 18. The top of the toothed ring 18 is fixedly connected with an annular disc 21, and the Archimedes spiral groove 17 is opened on the top of the annular disc 21. The annular disc 21 is rotatably connected with the placing table 4. Four guiding grooves 13 penetrating to the inside are opened on the tops of both placing tables 4. The four guiding grooves 13 on the same placing table 4 are evenly distributed, and the inner walls on both sides of the guiding groove 13 are slidably connected with the adjacent positioning blocks 5. The adjustment motor 20 drives the driving gear 19 to rotate. The driving gear 19 can drive the toothed ring 18 to rotate. The toothed ring 18 drives the Archimedes spiral groove 17 to rotate through the annular disc 21, so as to synchronously drive the four positioning blocks 5 to approach each other along the guiding groove 13 until the positioning blocks 5 move to the set position.

[0028] Adsorption holes 16 penetrating to the bottom are opened at the centers of both placing tables 4. Piston components are installed in both adsorption holes 16. Both piston components include electric push rods 15, and the electric push rods 15 are fixedly installed on one inner wall of the adsorption holes 16. The movable ends of the electric push rods 15 are fixedly connected with piston bodies 14. The electric push rods 15 can push the piston bodies 14 to move.

[0029] An installation cavity 10 is provided inside the machine body 1. A synchronous drive assembly is jointly installed between the installation cavity 10 and the machine body 1. Both movable ends of the synchronous drive assembly are fixedly connected with lead screws 9. The lead screws 9 penetrate through the installation cavity 10 and extend into the adjacent sliding grooves 7 and are rotatably connected with the machine body 1. Both lead screws 9 are in threaded connection with the adjacent sliders 8. The synchronous drive assembly includes a drive motor 6, and the drive motor 6 is fixedly installed on the outer wall of one side of the machine body 1. The synchronous drive assembly further includes two large gears 12, and the two large gears 12 are symmetrically and rotatably installed on the inner wall of one side of the installation cavity 10. The drive shaft of the drive motor 6 penetrates through the machine body 1 and is fixedly connected with the adjacent large gear 12. One side of the outer surface of both large gears 12 is meshed with a small gear 11, and the small gear 11 is fixedly sleeved on the outer surface of the lead screw 9. The drive motor 6 can drive the large gear 12 connected thereto to rotate, and the large gear 12 drives the other large gear 12 to rotate, so as to synchronously drive the two small gears 11 to rotate. The small gear 11 drives the lead screw 9 connected thereto to rotate, and the lead screw 9 drives the slider 8 connected thereto to move, and the upper and lower sliders 8 move in opposite directions.

[0030] An XYZ moving platform 2 is fixedly installed inside the machine body 1. A laser cutting head 3 is fixedly installed at the installation end of the XYZ moving platform 2. During laser cutting, the XYZ moving platform 2 drives the laser cutting head 3 to move.

[0031] Working principle: When the wafer at the bottom of the laser cutting head 3 is cut, the two workstations are switched with each other. The drive motor 6 drives the large gear 12 connected thereto to rotate, and the large gear 12 drives the other large gear 12 to rotate, so as to synchronously drive the two small gears 11 to rotate. The two small gears 11 respectively drive the lead screws 9 connected thereto to rotate. The two lead screws 9 respectively drive the sliders 8 connected thereto to move. Since the two lead screws 9 rotate in opposite directions, the upper and lower sliders 8 move in opposite directions. The slider 8 moving out drives the placement table 4 connected thereto to move outwards, and the slider 8 moving inwards drives the placement table 4 connected thereto to move inwards until the wafer to be processed moves below the laser cutting head 3, and then the laser cutting operation is started, and at the same time, the wafer that has been cut is replaced. The electric push rod 15 pushes the piston body 14 upwards until the piston body 14 moves to the opening position of the adsorption hole 16 to release the adsorption of the wafer, and then the wafer replacement operation is carried out. After the wafer to be processed is placed on the placement table 4, the adjustment motor 20 drives the driving gear 19 to rotate, the driving gear 19 drives the toothed ring 18 to rotate, and the toothed ring 18 drives the Archimedes spiral groove 17 to rotate through the annular disc 21, so as to synchronously drive the four positioning blocks 5 to approach the wafer to be processed along the guide groove 13 until the positioning of the wafer to be processed is completed. Then the electric push rod 15 drives the piston body 14 to move downwards to increase the space above the adsorption hole 16 until the wafer to be processed is adsorbed and fixed.

[0032] The preferred embodiments of the present utility model disclosed above are only used to help illustrate the present utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the present utility model to only the specific embodiments. Obviously, according to the content of this specification, many modifications and variations can be made. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present utility model, so that those skilled in the relevant technical field can well understand and utilize the present utility model. The present utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A wafer cutting device, comprising a body (1), characterized in that: Two slide grooves (7) are provided on the inner walls of both sides of the machine body (1), and sliders (8) are slidably connected inside the four slide grooves (7), and a placement platform (4) is fixedly connected between the two sliders (8) on the same side; A rotation adjustment component is installed inside the two placement platforms (4), and the movable ends of the two rotation adjustment components are provided with Archimedean spiral grooves (17). The tops of the two Archimedean spiral grooves (17) are meshed and connected with four positioning blocks (5), and the positioning blocks (5) are arranged through the placement platforms (4); At the center of each of the two placement platforms (4), there is an adsorption hole (16) extending through the bottom, and piston assemblies are installed in each of the two adsorption holes (16); The body (1) is provided with an installation cavity (10) inside, and a synchronous drive assembly is installed between the installation cavity (10) and the body (1). The two movable ends of the synchronous drive assembly are fixedly connected to screw rods (9), and the screw rods (9) pass through the installation cavity (10) and extend into adjacent slide grooves (7) and are rotatably connected to the body (1). The two screw rods (9) are threadedly connected to adjacent sliders (8).

2. A wafer cutting device according to claim 1, characterized in that: The two rotary adjustment components each comprise an adjustment motor (20), and the adjustment motor (20) is fixedly mounted on the inner bottom of the placement table (4), a driving end of the adjustment motor (20) is fixedly connected to a driving gear (19), an outer surface of the driving gear (19) is meshingly connected to a gear ring (18), a top of the gear ring (18) is fixedly connected to an annular disk (21), an Archimedean spiral groove (17) is provided on the top of the annular disk (21), and the annular disk (21) is rotationally connected to the placement table (4).

3. The wafer cutting device according to claim 1, characterized in that: The tops of the two placement platforms (4) are each provided with four guide grooves (13) penetrating into the interior, and the inner walls on both sides of the guide grooves (13) are slidably connected to adjacent positioning blocks (5).

4. The wafer cutting device according to claim 1, characterized in that: The two piston assemblies each comprise an electric push rod (15), and the electric push rod (15) is fixedly mounted on an inner wall of one side of the adsorption hole (16), the movable end of the electric push rod (15) is fixedly connected to a piston body (14), and the piston body (14) abuts and slides against the inner wall of the adsorption hole (16).

5. The wafer cutting device according to claim 1, characterized in that: The synchronous drive assembly comprises a drive motor (6), and the drive motor (6) is fixedly mounted on an outer wall of one side of the machine body (1).

6. The wafer cutting device according to claim 5, characterized in that: The synchronous drive assembly also includes two large gears (12), and the two large gears (12) are symmetrically mounted on the inner wall of one side of the installation cavity (10) for rotation. The drive shaft of the drive motor (6) passes through the machine body (1) and is fixedly connected to adjacent large gears (12). One side of the outer surface of the two large gears (12) is meshed with a small gear (11), and the small gear (11) is fixedly sleeved on the outer surface of the screw rod (9).

7. The wafer cutting device according to claim 1, characterized in that: An XYZ movable platform (2) is fixedly mounted inside the machine body (1), and a laser cutting head (3) is fixedly mounted on the mounting end of the XYZ movable platform (2).

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