Integrated grinding device for wafer ring

Abstract

A grinding assembly comprises a grinding machine head, a positioning cylinder and a connecting base, the grinding machine head is arranged in the positioning cylinder, the positioning cylinder is provided with a lateral opening, the lateral opening corresponds to a cutter of the grinding machine head, the positioning cylinder is arranged on the connecting base, the connecting base is provided with a through hole, the cutter is located above the through hole, and the grinding machine head is arranged on the connecting base. The positioning assembly comprises a limiting plate, a guide plate and a positioning plate, the limiting plate is provided with a plate body, upper folding parts and lower folding parts are arranged on the peripheral side of the plate body, the plate body is provided with an annular groove corresponding to the through hole, the connecting base is arranged between the lower folding parts and locked through a first locking piece, and the limiting plate and the positioning cylinder are locked through a second locking piece of the upper folding part; the guide plate is arranged below the limiting plate and connected with the limiting plate, the positioning plate is arranged below the guide plate and rotationally connected with the guide plate, and the positioning plate is provided with an annular groove and a clamping jaw corresponding to the matching hole. According to the utility model, the wafer ring can be conveniently positioned, and meanwhile, the inner wall of the hole of the wafer ring can be ground.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal ring processing, and particularly relates to an integrated grinding device for crystal rings. Background Art

[0002] A crystal ring usually refers to a device used in the process of wafer cutting. It helps to keep the wafer stable during the cutting process and prevent it from being damaged due to vibration and impact during the cutting process. The cutting ring is usually made of hard materials and has certain elasticity and toughness to adapt to various stresses generated during the cutting process. During the processing of crystal rings, they need to be polished by a grinding device. For example, the patent with the publication number CN214817722U discloses a rapid grinding device for wafer patch rings. One of the rotating shafts is driven to rotate by a driving motor in cooperation with a second transmission wheel and a transmission belt, and the rotating shaft drives the wafer patch ring to rotate through a driving roller. The above technical solution solves the problem of grinding the surface of the wafer patch ring, but it cannot grind the side wall of the hole in the middle of the wafer patch ring. Summary of the Utility Model

[0003] In order to solve the problems of the prior art, the utility model provides an integrated grinding device for crystal rings that can grind the side wall of the hole and facilitate positioning operations.

[0004] The specific technical solution is as follows: An integrated grinding device for crystal rings includes a grinding assembly and a positioning assembly. The grinding assembly includes a grinding head, a positioning cylinder, and a connecting seat. The grinding head is arranged in the positioning cylinder. The positioning cylinder has a lateral opening, and the lateral opening is correspondingly arranged with the cutting tool of the grinding head. The positioning cylinder is arranged on the connecting seat, and the connecting seat has a through hole. The cutting tool is located above the through hole. The positioning assembly includes a limiting plate, a guiding plate, and a positioning plate. The limiting plate has a plate body. The peripheral side of the plate body is provided with an upper folding part and a lower folding part. The plate body is provided with an annular groove corresponding to the through hole. The connecting seat is arranged between the lower folding parts and locked by a first locking member. The limiting plate and the positioning cylinder are locked by a second locking member on the upper folding part. The guiding plate is arranged below the limiting plate and connected to the limiting plate. The positioning plate is arranged below the guiding plate and rotatably connected to the guiding plate. The positioning plate is provided with an annular groove and a clamping claw corresponding to the mating hole.

[0005] In some embodiments, a plurality of fixing holes are provided on the plate body.

[0006] In some embodiments, the side surface of the positioning cylinder is provided with a notch part, and the notch part is connected by a third locking member.

[0007] In some embodiments, the lower folding parts are oppositely arranged on both sides of the plate body, and the connecting seat is rectangular.

[0008] In some embodiments, the positioning cylinder is vertically arranged on the connecting seat.

[0009] In some embodiments, the positioning plate and the guiding plate are connected by a pivot, and the pivot is located in the middle of the positioning plate.

[0010] In some embodiments, there are at least two claws, and the claws are movably connected to the positioning plate.

[0011] Technical effects of the present utility model: An integrated grinding device for crystal rings of the present utility model can facilitate the positioning of crystal rings, and at the same time can grind the inner wall of the holes of crystal rings; and the positioning component and the grinding component are assembled into one body, which is convenient for picking and placing operations. Description of the Drawings

[0012] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0013] Figure 1 It is a schematic diagram of an integrated grinding device for crystal rings in this embodiment of the present utility model.

[0014] Figure 2 It is a perspective view of the grinding component in this embodiment of the present utility model.

[0015] Figure 3 It is a schematic diagram of the crystal ring in this embodiment of the present utility model.

[0016] Figure 4 It is a schematic diagram of the limiting plate in this embodiment of the present utility model. Detailed Embodiments

[0017] The following will clearly and completely describe the technical solutions of the present utility model in conjunction with the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present utility model.

[0018] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0019] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0020] The following will describe in detail the specific embodiments of the present utility model with reference to the drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present utility model and are not used to limit the present utility model.

[0021] As Figures 1 to 4As shown in the figure, a grinding device for an integrated crystal ring in this embodiment includes a grinding assembly 1 and a positioning assembly 2. The positioning assembly 2 is used to position the crystal ring, and the grinding assembly 1 is used to grind the side wall 101 of the holes in the crystal ring 100. The grinding assembly 1 includes a grinding head 3, a positioning cylinder 4, and a connecting seat 5. The grinding head 3 is arranged inside the positioning cylinder 4, and the grinding head is fixed by the positioning cylinder 4. The grinding head 3 can adopt an existing grinding device. The positioning cylinder 4 has a lateral opening 41, and the lateral opening 41 is correspondingly arranged with the cutting tool 31 of the grinding head 3, so that the grinding condition of the cutting tool 31 can be observed through the lateral opening 41. The positioning cylinder 4 is arranged on the connecting seat 5, and the connecting seat 5 has a through hole 51. The cutting tool 31 is located above the through hole 51, so that the cutting tool 31 can pass through the through hole 51. The positioning assembly 2 includes a limiting plate 21, a guide plate 22, and a positioning plate 23. The limiting plate 21 has a plate body 211, and the peripheral side of the plate body 211 is provided with an upper folding part 212 and a lower folding part 213. The plate body 211 is provided with a mating hole 214 corresponding to the through hole 51. The connecting seat 5 can be positioned through the lower folding part 213, and the upper folding part 212 is convenient for assembling with the positioning cylinder 4. The connecting seat 5 is arranged between the lower folding parts 213 and is locked by a first locking member 10. The limiting plate 21 and the positioning cylinder 4 are locked by a second locking member 20 of the upper folding part 212. The first and second locking members are both bolts. The guide plate 22 is arranged below the limiting plate 21 and is connected to the limiting plate 21. The positioning plate 23 is arranged below the guide plate 22 and is rotatably connected to the guide plate 22. The positioning plate 23 is provided with an annular groove 231 and a claw 6 corresponding to the mating hole 214. In the above technical solution, the crystal ring 100 is clamped by the claw 6 of the positioning plate 23, the cutting tool 31 of the grinding assembly 1 abuts against the side wall 101 of the crystal ring, and then by rotating the guide plate 22, the cutting tool of the grinding assembly 1 is driven to move along the annular groove 231 to grind the hole. Through the above technical solution, it is convenient to position the crystal ring, and at the same time, the inner wall of the hole of the crystal ring can be ground; and the positioning assembly and the grinding assembly are assembled into one body, which is convenient for taking and placing operations.

[0022] In this embodiment, a plurality of fixing holes 214 are provided on the plate body 21. Through the fixing holes 214, the plate body 21 and the tool plate 22 can be detachably connected by screws. A notch portion 42 is provided on the side surface of the positioning cylinder 4. The notch portion 42 is connected by a third locking member 30, so that the grinding head 3 can be inserted into the positioning cylinder 4, facilitating installation and positioning. The downward folding portions 213 are oppositely arranged on both sides of the plate body 21. The connecting seat 5 is rectangular, so that the connecting seat 5 can be clamped between the downward folding portions 213. The positioning cylinder 4 is vertically arranged on the connecting seat 5. The positioning plate 23 and the guide plate 22 are connected by a pivot 40. The pivot 40 is located in the middle of the positioning plate 23, so that the guide plate 22 can rotate relative to the positioning plate 23. There are at least two claw members 6. The claw members 6 are movably connected to the positioning plate 23, so that the claw members 6 can slide relative to the positioning plate 23. The claw members 6 can be abutted by a spring in the positioning plate 23, or can be driven by existing devices such as air cylinders.

[0023] A crystal ring integrated grinding device according to this embodiment can facilitate the positioning of the crystal ring, and at the same time can grind the inner wall of the holes of the crystal ring; and the positioning component and the grinding component are assembled into one body, facilitating the picking and placing operation.

[0024] The above has described a crystal ring integrated grinding device of the present invention. However, the present invention is not limited to the above specific embodiments. As long as it does not deviate from the scope of the claims, various deformations or changes can be made. The present invention includes various deformations and changes within the scope of the claims.

[0025] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer ring integrated grinding device, comprising a grinding assembly and a positioning assembly, characterized in that: The grinding assembly includes a grinding head, a positioning cylinder and a connecting seat, the grinding head is arranged in the positioning cylinder, the positioning cylinder has a lateral opening, and the lateral opening is arranged corresponding to the tool of the grinding head, the positioning cylinder is arranged on the connecting seat, the connecting seat has a through hole, and the tool is located above the through hole. The positioning assembly includes a limit plate, a guide plate and a positioning plate, the limit plate has a plate body, an upper folding part and a lower folding part are arranged on the circumference of the plate body, the plate body is provided with an annular groove corresponding to the through hole, the connecting seat is arranged between the lower folding parts and is locked by a first locking piece, the limit plate and the positioning cylinder are locked by a second locking piece of the upper folding part, the guide plate is arranged below the limit plate and connected to the limit plate, the positioning plate is arranged below the guide plate and is rotatably connected to the guide plate, and the positioning plate is provided with an annular groove and a claw corresponding to the matching hole.

2. The wafer ring integrated grinding device according to claim 1, characterized in that: The plate body is provided with a plurality of fixing holes.

3. The wafer ring integrated grinding device according to claim 2, characterized in that: A notch portion is provided on the side of the positioning cylinder, and the notch portion is connected via a third locking piece.

4. The wafer ring integrated grinding device according to claim 3, characterized in that: The downward folding parts are relatively arranged on two sides of the plate body, and the connecting seat is rectangular.

5. The wafer ring integrated grinding device according to claim 4, characterized in that: The positioning cylinder is vertically arranged on the connecting seat.

6. The wafer ring integrated grinding device according to claim 5, characterized in that: The positioning plate and the guide plate are connected via a pivot, and the pivot is located in the middle of the positioning plate.

7. The wafer ring integrated grinding device according to claim 6, characterized in that: There are at least two clamping claws, which are movably connected to the positioning plate.

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