Thermal management device and vehicle thermal management system
By designing a thermal management device with a compact structure in the vehicle thermal management system, the problem of the not compact manifold structure in the existing system is solved, and more efficient thermal management is achieved, which meets the thermal management needs of electric vehicles.
Patent Information
- Application Number
- CN202421977488.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-14
AI Technical Summary
The manifold structure in the existing vehicle thermal management system is not compact, resulting in limited layout space and it is difficult to meet the thermal management needs of electric vehicles.
A thermal management device is designed, including a manifold with an internal runner, a multi-way valve and a fluid management element. The sub-mounted surface of the manifold is located between the main mounting surface and the bottom surface, the multi-way valve and the fluid management element are located respectively on the main mounting surface and the sub-mounted surface, the proximal opening of the internal flow passage is formed on the main mounting surface, and the distal opening is formed on the secondary mounting surface and/or the bottom surface.
Through this design, the structure of the manifold is more compact, and the thermal management device and vehicle thermal management system have the advantages of compact structure, which meets the thermal management needs of electric vehicles.
Smart Images
Figure CN222959557U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a thermal management device and a vehicle thermal management system. Background Art
[0002] Due to the large thermal management requirements of electric vehicles and the limited layout space available for the vehicle thermal management system, the vehicle thermal management system is developing towards integration.
[0003] The manifolds in existing vehicle thermal management systems are generally roughly plate-shaped, and the internal flow channels of the manifolds can only extend around in the plane where the manifolds are located, resulting in a non-compact structure of the manifolds. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a thermal management device, which has the advantage of a compact structure.
[0005] The purpose of the utility model is also to provide a vehicle thermal management system, which includes the above-mentioned thermal management device.
[0006] The thermal management device for achieving the above purpose is used to distribute a heat transfer fluid, and the thermal management device includes
[0007] a manifold having an internal flow channel, a main mounting surface, a secondary mounting surface and a bottom surface; the secondary mounting surface is located between the main mounting surface and the bottom surface and is respectively transverse to the main mounting surface and the bottom surface; the internal flow channel has a proximal opening and a distal opening, and the proximal opening is formed on the main mounting surface;
[0008] a multi-way valve mounted on the main mounting surface; the multi-way valve has a spool flow channel; the spool flow channel is used to connect at least two of the proximal openings;
[0009] a fluid management element mounted on the secondary mounting surface.
[0010] In a specific embodiment, the secondary mounting surface is respectively perpendicular to the main mounting surface and the bottom surface.
[0011] In a specific embodiment, the main mounting surface has a main body area and a sunken area; the sunken area is closer to the bottom surface than the main body area; the proximal opening is formed in the sunken area, and the multi-way valve is fixedly connected to the main body area.
[0012] In a specific embodiment, the secondary mounting surface includes a first mounting surface, a second mounting surface, a third mounting surface and a fourth mounting surface; the fluid management element includes a first element, a second element, a third element and a fourth element;
[0013] The first component is mounted on the first mounting surface, the second component is mounted on the second mounting surface, the third component is mounted on the third mounting surface, and the fourth component is mounted on the fourth mounting surface.
[0014] In a specific embodiment, the first component is a water-cooled condenser; and / or the second component is an internal heat exchanger; and / or the third component is an electronic expansion valve; and / or the fourth component is a gas-liquid separator.
[0015] In a specific embodiment, among the plurality of sub-mounting surfaces, two adjacent sub-mounting surfaces are perpendicular to each other, and two opposite sub-mounting surfaces are parallel to each other.
[0016] In a specific embodiment, the sub-mounting surfaces include the second mounting surface and the fourth mounting surface arranged opposite to each other; the fluid management component includes a second component mounted on the second mounting surface; the fluid management component further includes a fourth component mounted on the fourth mounting surface;
[0017] The manifold further has a connecting flow channel that extends from the second mounting surface to the fourth mounting surface to penetrate the manifold;
[0018] The connecting flow channel is used to connect the second component and the fourth component.
[0019] In a specific embodiment, the fourth mounting surface has a proximal region and a distal region arranged parallel to each other; the proximal region is closer to the second mounting surface than the distal region;
[0020] The connecting flow channel extends from the second mounting surface to the proximal region; the fourth component is connected to the distal region.
[0021] In a specific embodiment, the distal opening is formed on the sub-mounting surface and / or the bottom surface.
[0022] In a specific embodiment, the manifold has a mounting cavity on the main mounting surface; wherein, the sunken region forms the bottom wall of the mounting cavity, and the main body region defines the opening of the mounting cavity;
[0023] At least a part of the multi-way valve is located in the mounting cavity.
[0024] In a specific embodiment, the bottom surface has a first part and a second part arranged parallel to each other; the first part is closer to the main mounting surface than the second part;
[0025] The distal openings include a first distal opening and a second distal opening; the first distal opening is formed in the first part, and the second distal opening is formed in the second part.
[0026] A vehicle thermal management system for achieving the above object includes the thermal management device as described above.
[0027] The positive and progressive effects of the present utility model are as follows: Since the manifold has a secondary mounting surface located between the main mounting surface and the bottom surface, and the multi-way valve and the fluid management element are respectively located on the main mounting surface and the secondary mounting surface, wherein the proximal opening of the internal flow path is formed on the main mounting surface, and the distal opening of the internal flow path is formed on the secondary mounting surface and / or the bottom surface, the structure of the manifold is relatively compact, and further the thermal management device and the vehicle thermal management system also have the advantage of a compact structure. Description of the Drawings
[0028] The above and other features, properties, and advantages of the present utility model will become more apparent from the following description in conjunction with the drawings and embodiments, wherein:
[0029] Figure 1 is a schematic diagram of the thermal management device;
[0030] Figure 2 is a schematic exploded view of the thermal management device along the axis of the multi-way valve;
[0031] Figure 3 is a cross-sectional view of the thermal management device, showing the internal flow path;
[0032] Figure 4A and 4B is a cross-sectional view of the manifold, showing the connecting flow path;
[0033] Figure 5 is a cross-sectional view of the thermal management device, showing the connecting flow path communicating the second element and the fourth element;
[0034] Figure 6A and 6B is a schematic diagram of the manifold;
[0035] Figure 7 is a cross-sectional view of the thermal management device, showing the third flow path;
[0036] Figure 8 is a cross-sectional view of the thermal management device, showing the second flow path;
[0037] Figure 9 is a cross-sectional view of the thermal management device, showing the fourth flow path;
[0038] Figure 10 is a cross-sectional view of the thermal management device, showing the first flow path. Detailed Description of the Embodiments
[0039] The following discloses various different embodiments or examples of the implementation of the subject technical solutions. To simplify the disclosure, specific examples of each element and arrangement are described below. Of course, these are only examples and do not limit the protection scope of the present utility model. For example, the distribution of the first feature described subsequently in the specification over the second feature may include embodiments in which the first and second features are distributed by direct connection, and may also include embodiments in which additional features are formed between the first and second features, so that the first and second features may not be directly connected. In addition, the reference numerals and / or letters may be repeated in different examples in these contents. This repetition is for brevity and clarity and does not itself indicate the relationship between the various embodiments and / or structures to be discussed. Further, when the first element is described as being connected or combined with the second element, this description includes embodiments in which the first and second elements are directly connected or combined with each other, and also includes embodiments in which one or more other intervening elements are added to indirectly connect or combine the first and second elements.
[0040] It should be noted that Figures 1 to 10 they are only examples, not drawn under the condition of equal proportion, and should not be used to limit the actual protection scope required by the present utility model.
[0041] Figure 1 A thermal management device 900 in an embodiment of the present utility model is shown, including a block-shaped manifold 1, a multi-way valve 2, and a fluid management element 3. The manifold 1 has a main mounting surface 11, a secondary mounting surface 12, and a bottom surface 13. The secondary mounting surface 12 is located between the main mounting surface 11 and the bottom surface 13 and is respectively transverse to the main mounting surface 11 and the bottom surface 13. In a specific embodiment, the secondary mounting surface 12 is respectively perpendicular to the main mounting surface 11 and the bottom surface 13. The number of the secondary mounting surfaces 12 is four and they are connected in sequence. The manifold 1 can be made of a metal material. Adjacent secondary mounting surfaces 12 can be perpendicular to each other.
[0042] As Figure 2 、 3 shown, the manifold 1 has an internal flow channel 10; the internal flow channel 10 has a proximal opening 10a and a distal opening 10b, the proximal opening 10a is formed on the main mounting surface 11; the distal opening 10b is formed on the secondary mounting surface 12. The distal opening 10b can also be formed on the bottom surface 13.
[0043] The multi-way valve 2 is mounted on the main mounting surface 11; the multi-way valve 2 has a valve core flow channel 20; the valve core flow channel 20 is used to communicate at least two proximal openings 10a. The number of the valve core flow channels 20 can be two, and the number of the proximal openings 10a can be five. Specifically, as Figure 2As shown, the multi-way valve 2 includes a valve cover assembly 21 and a valve core 22; the valve core 22 has a valve core flow channel 20, and the valve cover assembly 21 is installed on the main installation surface 11. The valve core 22 is arranged to rotate along the axis X so that the valve core flow channel 20 can communicate with different proximal openings 10a. The direction where the axis X is located is the axial direction of the multi-way valve 2.
[0044] The fluid management element 3 is installed on the secondary installation surface 12.
[0045] Since the manifold has a secondary installation surface between the main installation surface and the bottom surface, and the multi-way valve and the fluid management element are located on the main installation surface and the secondary installation surface respectively, wherein the proximal opening 10a of the internal flow channel 10 is formed on the main installation surface 11, and the distal opening 10b of the internal flow channel 10 is formed on the secondary installation surface 12 and / or the bottom surface 13, the structure of the manifold is relatively compact, and thus the thermal management device and the vehicle thermal management system also have the advantage of a compact structure.
[0046] In a specific embodiment, as shown in FIGS. 1, 2, 7, 8, 9, and 10, the secondary installation surface 12 includes a first installation surface 121, a second installation surface 122, a third installation surface 123, and a fourth installation surface 124; the fluid management element 3 includes a first element 31, a second element 32, a third element 33, and a fourth element 34; the internal flow channel 10 includes a first flow channel 101, a second flow channel 102, a third flow channel 103, and a fourth flow channel 104; the first element 31 is installed on the first installation surface 121, the second element 32 is installed on the second installation surface 122, the third element 33 is installed on the third installation surface 123, and the fourth element 34 is installed on the fourth installation surface 124; the first element 31 communicates with the first flow channel 101, the second element 32 communicates with the second flow channel 102, the third flow channel 103 communicates with the third element 33, and the fourth flow channel 104 communicates with the fourth element 34.
[0047] The fluid management element 3 can be one or more of a water-cooled condenser, an internal heat exchanger, an electronic expansion valve, and a gas-liquid separator. Specifically, the first element 31 can be a water-cooled condenser, the second element 32 can be an internal heat exchanger, the third element 33 can be an electronic expansion valve, and the fourth element 34 can be a gas-liquid separator.
[0048] To facilitate the installation of the multi-way valve 2, the main installation surface 11 has a main body area 110 and a sunken area 111; the sunken area 111 is closer to the bottom surface 13 than the main body area 110; the proximal opening 10a is formed in the sunken area 111, and the multi-way valve 2 is fixedly connected to the main body area 110. In a specific embodiment, as Figure 2 、 6AAs shown, the manifold 1 has an installation cavity 11a on the main installation surface 11; among them, the sunken area 111 forms the bottom wall of the installation cavity 11a, and the main body area 110 defines the opening 11a-1 of the installation cavity 11a; at least a part of the multi-way valve 2 is located in the installation cavity 11a. Specifically, the multi-way valve 2 includes a valve cover assembly 21 and a valve core 22, and the valve core 22 has two valve core flow channels 20. At least a part of the valve core 22 is arranged in the installation cavity 11a, and the valve cover assembly 21 is connected to the manifold 1 through fasteners 4, such as screws, and covers the installation cavity 11a. The valve cover assembly 21 is in driving connection with the valve core 22 to drive the valve core 22 to rotate.
[0049] As Figure 4A , 4B and Figure 5 shown, the secondary installation surface 12 includes a relatively arranged second installation surface 122 and a fourth installation surface 124; the fluid management element 3 includes a second element 32 installed on the second installation surface 122; the fluid management element 3 further includes a fourth element 34 installed on the fourth installation surface 124; the manifold 1 also has a connecting flow channel 100 that extends from the second installation surface 122 to the fourth installation surface 124 to penetrate the manifold 1; the connecting flow channel 100 is used to connect the second element 32 and the fourth element 34. Such a design makes the structure of the thermal management device more compact and helps to reduce the weight of the thermal management device.
[0050] As Figure 6A , as shown in 6B, the fourth installation surface 124 has a proximal region 1241 and a distal region 1242 arranged in parallel with each other; the proximal region 1241 is closer to the second installation surface 122 than the distal region 1242; the connecting flow channel 100 extends from the second installation surface 122 to the proximal region 1241; the fourth element 34 is connected to the distal region 1242.
[0051] As Figure 6B shown, the bottom surface 13 has a first part 131 and a second part 132 arranged in parallel with each other; the first part 131 is closer to the main installation surface 11 than the second part 132; the distal opening 10b includes a first distal opening 10b-1 and a second distal opening 10b-2; the first distal opening 10b-1 is formed on the first part 131, and the second distal opening 10b-2 is formed on the second part 132. Such a design makes the structure of the thermal management device more compact and helps to reduce the weight of the thermal management device.
[0052] Although the present utility model is disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make possible changes and modifications without departing from the spirit and scope of the present utility model. All contents that do not depart from the technical solution of the present utility model, any modification, equivalent change and modification made to the above embodiments according to the technical essence of the present utility model, shall fall within the protection scope defined by the claims of the present utility model.
Claims
1. A thermal management device for distributing a heat transfer fluid, characterized in that: The thermal management device comprises: A manifold (1) comprises an internal flow channel (10), a main mounting surface (11), a secondary mounting surface (12) and a bottom surface (13); the secondary mounting surface (12) is located between the main mounting surface (11) and the bottom surface (13), and is transverse to the main mounting surface (11) and the bottom surface (13) respectively; the internal flow channel (10) comprises a proximal opening (10a) and a distal opening (10b), and the internal flow channel (10) is formed between the proximal opening (10a) and the distal opening (10b); wherein the proximal opening (10a) is formed on the main mounting surface (11); and the distal opening (10b) is formed on the secondary mounting surface (12) and / or the bottom surface (13); A multi-way valve (2) is installed on the main installation surface (11); the multi-way valve (2) has a valve core flow channel (20); the valve core flow channel (20) is used to connect at least two of the proximal openings (10a).
2. The thermal management device according to claim 1, characterized in that: The secondary mounting surface (12) is respectively perpendicular to the primary mounting surface (11) and the bottom surface (13).
3. The thermal management device according to claim 1, characterized in that: The main mounting surface (11) comprises a main body region (110) and a sinking region (111); the sinking region (111) is closer to the bottom surface (13) than the main body region (110); the proximal opening (10a) is formed in the sinking region (111), and the multi-way valve (2) is fixedly connected to the main body region (110).
4. The thermal management device according to claim 1, characterized in that: The thermal management device further comprises a fluid management element (3), wherein the fluid management element (3) is mounted on the secondary mounting surface (12) and is in communication with the internal flow channel (10).
5. The thermal management device according to claim 4, characterized in that: The auxiliary mounting surface (12) comprises a first mounting surface (121), a second mounting surface (122), a third mounting surface (123) and a fourth mounting surface (124); the fluid management element (3) comprises a first element (31), a second element (32), a third element (33) and a fourth element (34); the internal flow channel (10) comprises a first flow channel (101), a second flow channel (102), a third flow channel (103) and a fourth flow channel (104); The first element (31) is mounted on the first mounting surface (121), the second element (32) is mounted on the second mounting surface (122), the third element (33) is mounted on the third mounting surface (123), and the fourth element (34) is mounted on the fourth mounting surface (124); The first element (31) is in communication with the first flow channel (101), the second element (32) is in communication with the second flow channel (102), the third flow channel (103) is in communication with the third element (33), and the fourth flow channel (104) is in communication with the fourth element (34).
6. The thermal management device according to claim 5, characterized in that: The first element (31) is a water-cooled condenser; and / or the second element (32) is an internal heat exchanger; and / or the third element (33) is an electronic expansion valve; and / or the fourth element (34) is a gas-liquid separator.
7. The thermal management device according to claim 4, characterized in that: The auxiliary mounting surface (12) comprises a second mounting surface (122) and a fourth mounting surface (124) which are arranged opposite to each other; the fluid management element (3) comprises a second element (32) mounted on the second mounting surface (122); and the fluid management element (3) further comprises a fourth element (34) mounted on the fourth mounting surface (124); The manifold (1) further comprises a connecting flow channel (100), wherein the connecting flow channel (100) extends from the second mounting surface (122) to the fourth mounting surface (124) so as to penetrate the manifold (1); The connecting channel (100) is used to connect the second element (32) and the fourth element (34).
8. The thermal management device according to claim 7, characterized in that: The fourth mounting surface (124) has a proximal region (1241) and a distal region (1242) arranged parallel to each other; the proximal region (1241) is closer to the second mounting surface (122) than the distal region (1242); The connecting flow channel (100) extends from the second mounting surface (122) to the proximal region (1241); and the fourth element (34) is connected to the distal region (1242).
9. The thermal management device according to claim 3, characterized in that: The manifold (1) has a mounting cavity (11a) on the main mounting surface (11); wherein the sinking area (111) forms a bottom wall of the mounting cavity (11a), and the main body area (110) defines an opening (11a-1) of the mounting cavity (11a); At least a portion of the multi-way valve (2) is located in the installation cavity (11a).
10. The thermal management device according to claim 9, characterized in that: The bottom surface (13) comprises a first portion (131) and a second portion (132) which are arranged parallel to each other; the first portion (131) is closer to the main installation surface (11) than the second portion (132); The distal opening (10b) comprises a first distal opening (10b-1) and a second distal opening (10b-2); the first distal opening (10b-1) is formed in the first portion (131), and the second distal opening (10b-2) is formed in the second portion (132).
11. A vehicle thermal management system, characterized in that: The vehicle thermal management system comprises the thermal management device according to any one of claims 1 to 10.