Multi-station independent temperature control chip test seat

Abstract

The utility model relates to a multi-station independent temperature control chip test seat, belongs to the technical field of chip aging test equipment, and aims to solve the problems of low test efficiency and high test cost caused by the temperature control problem of an aging oven when the conventional chip test seat adopts a single station to carry out chip aging test. The device comprises a carrying seat, a pressure head assembly and a temperature control assembly, the carrying seat is provided with an upper seat and a base, the base is provided with a test plate, and the base is provided with a plurality of chip mounting stations; the pressure head assembly is mounted on the upper seat and is provided with pressure heads in one-to-one correspondence with the mounting grooves; the temperature control assembly comprises a heating element and a cooling element, the heating element is installed on the pressing head and used for heating the chip, the cooling element is electrically connected with the testing plate and used for cooling the chip, and the temperature control assembly conducts aging test temperature control on the chip by controlling the heating element and the cooling element. The test bench is high in test efficiency, good in chip temperature control and low in test cost.

Description

Technical Field

[0001] The utility model relates to an independent temperature-controlled chip test socket with multiple working positions, belonging to the technical field of chip aging test equipment. Background Technique

[0002] Chip aging test is a method for testing chips during the production process, aiming to detect the performance and stability of chips under different environmental conditions. This test simulates the long-term operation of chips under certain temperature conditions to detect the changes in their performance and stability. In this way, it can be ensured that the produced chips can work reliably under different environmental conditions, avoiding product failures or quality problems caused by chip failures. In addition, the aging test can also predict the service life of products, eliminate defective products, avoid waste of packaging costs, and ensure that the products sold to users have high reliability and fewer problems.

[0003] Currently, in the existing technology, the common chip testing method adopted by chip manufacturing enterprises is to place the chip on the test socket and then put the test socket into the aging furnace for simulation testing. The existing test sockets are all single-station, and only one chip can be tested by one test socket, resulting in low test efficiency. In addition, when testing different types of chips, new test sockets will be set up to be applicable to different chips. Such new test sockets have not been tested in the furnace and are in the verification stage. Due to the small quantity, if they are put into the furnace, the utilization rate of the aging furnace is not high. Moreover, when manufacturing single-station test sockets, a relatively large number of test boards need to be made adaptively, resulting in a large amount of test board material consumption and increased overall cost. Therefore, an independent temperature-controlled chip test socket with multiple working positions is needed to solve the problems of low test efficiency and high test cost caused by the temperature control problem of the aging furnace when the existing chip test socket uses a single station for chip aging test. Content of the Utility Model

[0004] The purpose of the utility model is to provide an independent temperature-controlled chip test socket with multiple working positions to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: An independent temperature-controlled chip test socket with multiple working positions includes a carrier seat, a pressure head assembly, and a temperature control assembly. The carrier seat is provided with an upper seat and a lower seat. The lower seat is provided with a test board and has a plurality of mounting grooves to form a plurality of chip mounting stations; the pressure head assembly is installed on the upper seat and is provided with pressure heads corresponding to the mounting grooves one by one; the temperature control assembly includes a heating element and a cooling element. The heating element is installed on the pressure head to heat the chip, and the cooling element is electrically connected to the test board to cool the chip. The upper seat covers the lower seat. After the two are combined, the chip is pressed by the pressure head and abuts against the test board. The temperature control assembly controls the heating element and the cooling element to perform temperature control for the chip aging test.

[0006] Specifically, the upper seat includes an upper seat main block, a punch mounting seat, and a driving member; an installation through-hole is provided on the upper seat main block, the punch mounting seat slides in the installation through-hole, and one end thereof is connected to the driving member; both ends of the punch mounting seat extend to the outside of the installation through-hole respectively, constituting an upper extension end and a lower extension end; a cooling element is installed on the upper extension end, and a punch is installed on the lower extension end.

[0007] Specifically, the driving member includes a knob and a rotating rod; the knob is rotatably installed on the upper opening side of the installation through-hole of the upper seat main block, and it is provided with an internal threaded hole communicating with the installation through-hole. The outer side of the punch mounting seat is provided with an external thread, and the punch mounting seat is threadedly connected with the internal thread of the internal threaded hole of the knob through the external thread and slides radially in the installation through-hole; an installation hole is provided on the outer side of the knob, and the rotating rod is detachably installed in the installation hole for driving the knob to rotate.

[0008] Specifically, the cooling element includes a fan adapter plate, a fan, and a fan protection cover; the fan is fixedly connected to the upper extension end of the punch mounting seat through the fan adapter plate, and the fan protection cover is fixedly installed on the inlet side of the fan.

[0009] Specifically, the seat body of the punch mounting seat has a cavity structure with openings at both ends and a hollow interior, and a partition is provided at the opening on the lower extension end side to form a plurality of mutually separated installation cavities. Punches are installed in the installation cavities, and a cooling element is installed at the opening on the upper extension end side.

[0010] Specifically, the heating element is a heating rod; an installation hole is provided on the punch for installing the heating rod.

[0011] Specifically, the punch is made of a metal material; the punch mounting seat is made of a plastic material.

[0012] Specifically, the temperature control component further includes a temperature sensor, and the temperature sensor is fixedly installed inside the punch, and one end thereof extends to the outside of the punch along the punch toward the chip side to form an induction end.

[0013] Specifically, the fan is an adjustable-speed fan.

[0014] Specifically, one end of the upper seat is hinged to the base through a hinge member, and a buckle is provided at the other end far from the hinge point. When the upper seat is closed on the base, it is snap-connected to the base through the buckle to form a whole.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] 1. In the present application, a plurality of mounting grooves are provided on the base of the carrier seat to form a plurality of chip mounting stations. The upper seat of the carrier seat is provided with a plurality of press heads corresponding to the mounting grooves one by one, and a heating element is installed on the press head. The upper seat is also provided with a cooling element. When the test seat is in use, a plurality of chips can be placed on the base, each chip is held by the press head and abuts against the test board. By controlling the heating element and the cooling element, the temperature of the chip can be controlled. The test seat of the present application has high test efficiency. The multi-station test seat occupies relatively less space on the PCB test board, can save the space and quantity of the test board, and can greatly reduce the test cost.

[0017] 2. On the basis of the above, the upper seat of the present application includes an upper seat main block and a press head mounting seat. The press head mounting seat is used to mount the press head, and the press head mounting seat is slidably mounted on the upper seat main block through a driving member, so as to drive the press head mounting seat to slide along the upper seat main block towards the chip through the driving member to hold and abut against the chip. At the same time, by using the press head to slide and abut against the chip, the test seat of the present application can be applicable to chips of different types or specifications and sizes, and has high product applicability.

[0018] 3. On the basis of the above, the seat body of the press head mounting seat of the present application is provided with a cavity structure with openings at both ends and a hollow interior. A partition is provided at the opening on the side of the lower extension end to form a plurality of mutually separated mounting cavities. The press head is installed in the mounting cavity to make each press head independent. The heating element of the present application is a heating rod, and the cooling element is a fan. In addition, by setting a temperature sensor on the press head and combining with the electrical connection of the PCB test board, an independent press head temperature control system can be formed, which can simulate the environment in the aging furnace and is suitable for the aging test seat with a small number of chips in the verification stage.

[0019] 4. On the basis of the above, the press head of the present application is made of a metal material, and the metal press head is installed on the press head mounting seat made of a plastic material, so that the independent temperature control systems between the stations do not interfere with each other, and the test effect is good.

[0020] 5. On the basis of the above, the fan of the present application is an adjustable-speed fan. During the heating stage of the test process, the fan can be controlled to stop or run at a low speed, which can ensure that the chip can quickly reach the test temperature. After reaching the set temperature, the fan is controlled to operate at a high speed to avoid burning the chip due to excessive temperature. Description of the Drawings

[0021] Figure 1 Exploded view of the structure of the multi-station independent temperature control chip test seat for the embodiment;

[0022] Figure 2 Cross-sectional view of the structure of the multi-station independent temperature control chip test seat for the embodiment;

[0023] Figure 3Schematic structural diagram of a multi-station independent temperature control chip test socket for embodiments. Specific embodiments

[0024] In order to make the purpose and advantages of the present utility model clearer, the present utility model will be specifically described below in conjunction with embodiments. It should be understood that the following text only describes one or several specific implementation manners of the present utility model, and does not strictly limit the scope of protection specifically claimed for the present utility model.

[0025] Please refer to Figures 1 - 3 , a multi-station independent temperature control chip test socket, including a carrier base, a pressure head assembly and a temperature control assembly. The carrier base is provided with an upper seat and a lower seat. The lower seat is provided with a test board (not shown), and it is provided with two installation grooves to form two chip installation stations; the pressure head assembly is installed on the upper seat, and it is provided with pressure heads 11 corresponding to the installation grooves one by one; the temperature control assembly includes a heating element, a cooling element and a temperature sensor 10. The temperature sensor 10 is fixedly installed inside the pressure head 11, and one end of it extends along the pressure head towards the chip side to the outside of the pressure head, forming an induction end. The heating element is installed on the pressure head for heating the chip, and the cooling element is electrically connected to the test board for cooling the chip. One end of the upper seat is hingedly connected to the lower seat through a hinge, and the other end far from the hinge point is provided with a buckle. When the upper seat covers the lower seat, it is integrally connected to the lower seat through the buckle. After the two are combined, the chip is pressed by the pressure head and abuts against the test board, and the temperature control assembly controls the heating element and the cooling element to perform temperature control for the aging test of the chip.

[0026] The upper seat of this embodiment includes an upper seat main block 7, a pressure head mounting seat 8 and a driving member; the upper seat main block 7 is provided with an installation through hole, the pressure head mounting seat 8 slides in the installation through hole, and one end of it is connected to the driving member; both ends of the pressure head mounting seat extend to the outside of the installation through hole, forming an upper extension end and a lower extension end; the upper extension end is installed with a cooling element, and the lower extension end is installed with a pressure head.

[0027] Furthermore, the driving member of this embodiment includes a knob 70 and a rotating rod 13; the knob 70 includes a seat body and a knob body. The seat body is fixedly installed on the upper opening side of the installation through hole of the upper seat main block through a connecting bolt 9, and the knob body is rotatably installed on the seat body. The knob body is provided with an internal threaded hole communicating with the installation through hole. The pressure head mounting seat is provided with an external thread. The pressure head mounting seat 8 is threadedly connected to the internal threaded hole of the knob body through the external thread and slides radially in the installation through hole; an installation hole is provided on the outside of the knob body, and the rotating rod 13 is detachably installed in the installation hole for driving the knob body to rotate.

[0028] The cooling element of this embodiment includes a fan adapter board 6, a fan 4, and a fan guard 2; among them, the fan 4 is a variable-speed fan. The fan is fixedly connected to the fan adapter board 6 through a connecting bolt 3, and the fan adapter board 6 is fixedly connected to the upper extension end of the collet mounting seat through a connecting bolt 5. The fan guard 2 is fixedly installed on the inlet side of the fan. The heating element of this embodiment is a heating rod 16; the collet is provided with a mounting hole for installing the heating rod, and the heating rod 16 fixes the collet 11 to the mounting hole through a mounting bolt 15. The temperature sensor 10, the heating rod 16, and the fan 4 of this embodiment are respectively provided with connection joints that extend to the outside of the test seat for external electrical connection with the test board. Among them, the connection joint 1 of the fan 4 is installed on the side of the fan, while the connection joints 14 of the heating rod 16 and the temperature sensor 10 are installed on the side of the collet mounting seat.

[0029] In addition, the seat body of the collet mounting seat 8 of this embodiment is provided with a cavity structure with both ends open and hollow inside, and a partition is provided at the opening on the lower extension end side to form a plurality of mutually separated mounting cavities. The collet 11 is installed in the mounting cavity through a mounting bolt 12, and a cooling element is installed at the opening on the upper extension end side.

[0030] Working principle: Before using the multi-station independent temperature control chip test seat of this embodiment, the tester can connect the connection joints of the fan, temperature sensor, and heating rod to the PCB test board to control the fan and heating rod and display the chip temperature. During testing, the test seat does not need to be placed in an aging furnace. During operation, the tester places the chips with the corresponding number of stations in the supporting base, closes the upper seat, and rotates the knob to the test state through the rotating rod. During the rotation process, the metal collet moves downward until it presses the chips tightly. At the same time, the temperature sensor also presses the chips, and the temperatures of the two chips can be detected and fed back in real time; the two heating rods can heat the corresponding chips simultaneously, stop heating after reaching the specified temperature, and start heating when the temperature is lower than the specified temperature, so as to continuously cycle in this way to ensure the test temperature of each chip, and the heating rods and temperature sensors are independently controlled.

[0031] In addition, in order to prevent the chip from being damaged due to the continuous rise of the test temperature, the fan of this embodiment can be adjusted in real time according to the chip temperature and the test stage, so as to heat up or cool down and dissipate heat faster.

[0032] The test seat of this embodiment can measure multiple chips simultaneously, solving the problem of low test efficiency. It has an independent temperature control structure, which can meet the requirements of the aging test and verification stage of most current chips. It does not need to be put into an aging furnace, reducing the test cost in the verification stage; it has a variable-speed fan that can be adjusted in real time to ensure that the chip can quickly reach the test temperature and prevent the chip from being burned due to excessive temperature.

[0033] The embodiments of the present utility model have been described in detail in combination with the above embodiments. However, the present utility model is not limited to the above embodiments. For those of ordinary skill in the art of this technology, after learning the content recorded in the present utility model, without departing from the principle of the present utility model, several equivalent transformations and substitutions can still be made, and these equivalent transformations and substitutions should also be regarded as belonging to the protection scope of the present utility model.

Claims

1. A multi-station independent temperature control chip test seat, comprising a carrier, a pressure head assembly and a temperature control assembly, characterized in that: The carrier is provided with an upper seat and a base, the base is provided with a test board, and is provided with a plurality of mounting grooves to form a plurality of chip mounting stations; the pressure head assembly is installed on the upper seat, and is provided with pressure heads corresponding to the mounting grooves one by one; the temperature control assembly includes a heating element and a cooling element, the heating element is installed on the pressure head for heating the chip, the cooling element is electrically connected to the test board for cooling the chip, the upper seat is covered on the base, and after the two are combined, the chip is pressed by the pressure head and stopped on the test board, and the temperature control assembly performs aging test temperature control of the chip by controlling the heating element and the cooling element.

2. The multi-station independent temperature control chip test socket according to claim 1, characterized in that: The upper seat includes an upper seat main block, a pressure head mounting seat and a driving member; a mounting through hole is provided on the upper seat main block, the pressure head mounting seat slides in the mounting through hole, and one end thereof is connected to the driving member; the two ends of the pressure head mounting seat respectively extend to the outside of the mounting through hole, forming an upper extension end and a lower extension end; a cooling element is installed on the upper extension end, and the pressure head is installed on the lower extension end.

3. The multi-station independent temperature control chip test socket according to claim 2, characterized in that: The driving member includes a knob and a rotary rod; the knob is rotatably mounted on the upper opening side of the mounting through hole of the upper seat main block, and is provided with an internal threaded hole connected to the mounting through hole, the outer side of the pressure head mounting seat is provided with an external thread, and the pressure head mounting seat is threadedly connected with the internal thread of the internal threaded hole of the knob through the external thread, and is radially slidably mounted in the mounting through hole; a mounting hole is provided on the outer side of the knob, and the rotary rod is detachably mounted in the mounting hole, and is used to drive the knob to rotate.

4. The multi-station independent temperature control chip test socket according to claim 2, characterized in that: The cooling element comprises a fan adapter plate, a fan and a fan protective cover; the fan is fixedly connected to the upper extension end of the pressure head mounting seat through the fan adapter plate, and the fan protective cover is fixedly installed on the inlet side of the fan.

5. The multi-station independent temperature control chip test socket according to claim 2, characterized in that: The seat body of the pressure head mounting seat is provided with openings at both ends and an internal hollow cavity structure, and the opening located on the lower extension end side is provided with a partition to form a plurality of installation cavities separated from each other. The pressure head is installed in the installation cavity, and a cooling element is installed at the opening located on the upper extension end side.

6. The multi-station independent temperature control chip test socket according to claim 1, characterized in that: The heating element is a heating rod; the pressure head is provided with a mounting hole for mounting the heating rod.

7. The multi-station independent temperature control chip test socket according to claim 2, characterized in that: The pressure head is made of metal material; the pressure head mounting seat is made of plastic material.

8. The multi-station independent temperature control chip test socket according to claim 1, characterized in that: The temperature control component also includes a temperature sensor, which is fixedly installed inside the pressure head, and one end of the temperature sensor extends along the pressure head toward the chip side to the outside of the pressure head to form a sensing end.

9. The multi-station independent temperature control chip test socket according to claim 4, characterized in that: The fan is a speed-adjustable fan.

10. The multi-station independent temperature control chip test socket according to claim 1, characterized in that: One end of the upper seat is hingedly connected to the base through a hinge, and the other end away from the hinge point is provided with a buckle. When the upper seat is covered with the base, the upper seat is buckled and connected to the base as a whole through the buckle.

Images