Press-fit type independent temperature control chip aging test seat
By designing a press-fit independent temperature-controlled chip aging test seat, the problems of difficulty in pressing, poor heat dissipation and high height in the BGA chip test seat in the existing technology are solved, efficient chip aging test and accurate temperature control are achieved, and testing efficiency and accuracy are improved.
Patent Information
- Application Number
- CN202421858283.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-02
AI Technical Summary
When performing BGA chip aging test, existing chip test seats have problems such as difficult to press the test seat, poor heat dissipation and large height of the test seat, resulting in low testing efficiency and low testing accuracy.
A press-fit independent temperature control chip aging test seat is designed, using the structure of a carrier, a press-fit and a temperature control component. The press-fit is used to achieve the power-saving pressure of the chip, and the metal indenter and aluminum heat dissipation blocks are used to effectively dissipate heat, and the chip temperature is accurately controlled through an independent temperature control system.
It realizes efficient aging test of large BGA chips, reduces the overall height of the test seat, improves space utilization and testing efficiency, ensures efficient heat dissipation and testing accuracy of the chips, and reduces customer testing costs.
Smart Images
Figure CN222965283U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a press-fit type independent temperature control chip aging test socket, belonging to the technical field of chip aging test equipment. Background Art
[0002] Chip aging test is a method for testing chips during the production process, aiming to detect the performance and stability of chips under different environmental conditions. This test simulates the working state of the chip for a long time under certain temperature conditions to detect the changes in its performance and stability. In this way, it can be ensured that the produced chips can work reliably under different environmental conditions, avoiding product failures or quality problems caused by chip failures. In addition, the aging test can also predict the service life of the product, eliminate defective products, avoid waste of packaging costs, and ensure that the products sold to users have high reliability and fewer problems.
[0003] Currently, in the prior art, the common chip testing method adopted by chip manufacturing enterprises is to place the chip on a test socket and then put the test socket into an aging furnace for simulation testing. When aging testing BGA chips in the prior art, for large BGA chips, due to the large number of chip probes and large elastic force, if a direct-pressure type test socket is used, it will be very laborious to close the upper cover of the test socket, and it is very difficult to press the cover; if a traditional lever-type pressing rod structure is used, it will cause an increase in the overall height of the test socket, resulting in a large overall occupied space of the test socket. When conducting a single test, the space utilization rate in the aging furnace is not high, and the number of test sockets placed is small, requiring multiple tests, which increases the testing cost for customers. In addition, due to the low self-heat dissipation of the existing test socket, during the test, there are heat concentration points in the chip, resulting in damage to the chip due to poor heat dissipation during the aging test. Moreover, the heat distribution in the existing aging furnace is uneven, resulting in uneven temperature rise of the test sockets at different positions in the furnace, affecting the test effect. Therefore, a chip aging test socket is needed to solve the problems of difficult pressing of the test socket, poor heat dissipation, and large height of the test socket when using the existing chip test socket to test BGA chips, resulting in low test efficiency and low test accuracy. Content of the Utility Model
[0004] The purpose of the utility model is to provide a press-fit type independent temperature control chip aging test socket to solve the problems raised in the above background art.
[0005] To achieve the above object, the present utility model provides the following technical solution: A press-fit type independent temperature control chip aging test socket, comprising a carrier base, a press head and a temperature control component. The carrier base is provided with an upper seat and a lower seat, and the lower seat is provided with a test board to form a mounting groove for the chip; the press head is slidably mounted on the upper seat, and the upper seat is provided with a pressing member; the temperature control component includes a heat dissipation element and a heating element, and the heating element is mounted on the press head; the upper seat is covered on the lower seat, one end of the press head abuts against the chip, and the other end is connected to the heat dissipation element for dissipating heat of the chip; one end of the pressing member is rotatably connected to the upper seat, and its pressing end moves towards the position of the press head around the rotation connection point, pushing the press head towards the chip direction to press and stop the chip against the test board.
[0006] Specifically, a groove is formed at a position on the outer side wall of the lower seat corresponding to the mounting groove where the chip is located. One end of the groove extends to the chip mounting groove. After the upper seat and the lower seat are combined, the groove forms a heat dissipation channel for the chip.
[0007] Specifically, the upper seat includes an upper seat main block; an installation cavity penetrating the block body in the radial direction is provided on the upper seat main block, the press head is slidably mounted in the installation cavity, and one end of it extends upward to the outside of the upper seat main block to form an upper extension end, and the other end extends downward to the outside of the upper seat main block to form a lower abutting end.
[0008] Specifically, the shape of the press head is adapted to the shape of the installation cavity, and the upper extension end of the press head is connected to the heat dissipation element, while the lower abutting end abuts against the chip; several sliding rods are provided on the side of the press head facing the upper seat main block, and sliding rod mounting holes are provided at positions on the upper seat main block corresponding to the sliding rods. The press head is mounted on the sliding rod mounting holes through the sliding rods and is slidably connected to the upper seat main block, and a spring is sleeved on the sliding rod between the press head and the upper seat main block.
[0009] Specifically, the heat dissipation element includes an aluminum heat dissipation block; several heat dissipation fins are evenly distributed at intervals on the heat dissipation block; bolt holes are formed on the heat dissipation block, and threaded holes are formed at positions on the upper extension end of the press head corresponding to the bolt holes. The heat dissipation block is mounted on the bolt holes through connecting bolts and is threadedly connected to the threaded holes, and is fixedly connected to the upper extension end of the press head.
[0010] Specifically, the pressing member is a pull rod; the pull rod is of a U-shaped structure, and the two end parts of its U-shaped structure are respectively rotatably connected to the upper seat, and the U-shaped end forms an operation part for driving the rotation of the pull rod; the two ends of the U-shaped structure of the pull rod respectively protrude outward, that is, a pressing end for pushing the press head to move is formed, and the shape of the pressing end is a cam-shaped structure.
[0011] Specifically, pin holes are respectively formed in the rod bodies at both ends of the U-shaped structure of the pull rod. Elastic pins are slidably installed at positions on both sides of the main block of the upper seat corresponding to the pin holes. When driving the pull rod to press the pressure head, the pull rod is sleeved in the elastic pins through the pin holes, and the driving pressing end abuts the pressure head against the chip; positions on the pressure head corresponding to the pressing end respectively extend outward to form an extension end; a gasket is fixedly installed on the extension end for the pressing end to abut against.
[0012] Specifically, the pressure head is made of a metal material; the heating element is a heating rod, and the temperature control component is further provided with a temperature sensor. The temperature sensor is installed inside the pressure head, and one end of it extends along the pressure head towards the chip direction to the outside of the pressure head to form an induction end.
[0013] Specifically, one end of the upper seat is hingedly connected to the base through a hinge, and a buckle is provided at the other end far from the hinge point. When the upper seat covers the base, it is integrally connected to the base through the buckle.
[0014] Specifically, the base is further provided with a support plate. The support plate is integrally connected to the base through a connecting bolt, and an installation cavity for the test plate is formed therebetween.
[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0016] 1. In this application, a pressing member is provided on the upper seat of the carrier. One end of the pressing member is rotatably connected to the upper seat, and its pressing end moves towards the pressure head position around the rotation connection point, pushing the pressure head towards the chip direction to press and abut the chip against the test plate. To solve the problem that when aging testing large BGA chips, it is laborious to press the upper seat due to the large pressure of the BGA chip. The pressure head in this application is slidably installed on the upper seat, and through the pressing of the pressing member, the chip can be pressed labor-savingly.
[0017] 2. On the basis of the above, the pressure head in this application is made of a metal material, and its upper part is connected to the heat dissipation element, and the lower part abuts against the chip, so as to realize that during the test, the heat of the chip is transferred to the heat dissipation element through the metal pressure head for heat dissipation, avoiding heat concentration points on the chip. The heat dissipation element in this application is an aluminum heat dissipation block, and a plurality of heat dissipation fins are provided on its block body, with a large heat dissipation area and good heat dissipation effect. At the same time, since the chip is placed in the installation groove, in order to improve the heat dissipation effect, this application also opens a heat dissipation channel on the side of the upper seat, so that during the test, the blowing in the aging furnace can directly blow to both sides of the chip through the heat dissipation channel, which is beneficial to the overall heat dissipation of the chip, and can further increase the heat dissipation of the chip, avoiding chip damage caused by insufficient heat dissipation during the test.
[0018] 3. On the basis of the above, the pressing member of the present application is a pull rod, and a cam-shaped pressing end is provided on the pull rod. The pull rod is rotatably connected to the upper seat, driving the cam-shaped pressing end to press the pressing head towards the chip direction and lock with the elastic pin of the upper seat. The pressing process is labor-saving, and the pressing member with a pull rod structure is used to press the chip, effectively reducing the overall height of the test socket, improving the space utilization rate in the aging furnace, increasing the number of test sockets placed, improving the test efficiency, and reducing the customer's test cost at the same time.
[0019] 4. On the basis of the above, the test socket of the present application is equipped with a heating rod and a temperature sensor. The test socket is connected to the control system of the aging furnace through a test board, and the temperature of each chip can be accurately controlled individually, improving the accuracy of chip testing.
[0020] 5. On the basis of the above, a support plate is installed at the position corresponding to the pressing end of the pull rod on the upper seat of the present application, which is used for the pressing end to abut against the pressing head, facilitating the transmission of the pressing force, reducing the wear between the pressing end and the pressing head at the same time, and prolonging the service life of the test socket.
[0021] 6. On the basis of the above, the base of the present application is also provided with a support plate, which can effectively support and reinforce the PCB test board, preventing the PCB test board from deforming during the test and causing poor chip contact. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 is a schematic structural diagram of the press-fit type independent temperature control chip aging test socket of this embodiment (the upper seat is in the closed state);
[0023] Figure 2 is a schematic structural diagram of the press-fit type independent temperature control chip aging test socket of this embodiment (the upper seat is in the open state);
[0024] Figure 3 is an exploded view of the structure of the press-fit type independent temperature control chip aging test socket of this embodiment;
[0025] Figure 4 is a schematic structural diagram of the press-fit type independent temperature control chip aging test socket of this embodiment (the pull rod is in the non-pressed state);
[0026] Figure 5 is a schematic structural diagram of the press-fit type independent temperature control chip aging test socket of this embodiment (the pull rod is in the pressed state). DETAILED DESCRIPTION OF THE EMBODIMENTS
[0027] In order to make the purpose and advantages of the present utility model clearer, the following describes the present utility model in detail with reference to the embodiments. It should be understood that the following text is only used to describe one or several specific implementation manners of the present utility model, and does not strictly limit the scope of protection specifically claimed by the present utility model.
[0028] Please refer to Figures 1-5 Figures 1-5 , a press-fit type independent temperature control chip aging test socket, including a carrier base, a press head 15 and a temperature control component. The carrier base is provided with an upper seat 8 and a base 16. The base is provided with a support plate 17. The support plate is integrally connected to the base through a connecting bolt 18, forming an installation cavity for a test board. A test board (not shown) is installed in the installation cavity to form an installation slot for the chip; the press head is slidably installed on the upper seat, and the upper seat is provided with a pressing component; the temperature control component includes a heat dissipation element and a heating element, and the heating element is installed on the press head; one end of the upper seat 8 of this embodiment is hingedly connected to the base through a hinge component, and the other end far from the hinge point is provided with a buckle 9. When the upper seat covers the base, it is integrally connected to the base through the buckle. After the upper seat covers the base, one end of the press head abuts against the chip, and the other end is connected to the heat dissipation element for heat dissipation of the chip; one end of the pressing component is rotatably connected to the upper seat, and its pressing end moves towards the press head position around the rotation connection point, pushing the press head towards the chip direction to press and abut the chip against the test board.
[0029] A groove is opened at a position on the outer side wall of the base of this embodiment corresponding to the installation slot where the chip is located. One end of the groove extends to the chip installation slot. After the upper seat and the base are combined, the groove forms a heat dissipation channel for the chip.
[0030] Furthermore, the upper seat of this embodiment includes an upper seat main block 8; an installation cavity penetrating the block body in the radial direction is provided on the upper seat main block. The press head 15 is slidably installed in the installation cavity, and one end of it extends upward to the outside of the upper seat main block, forming an upper extension end, and the other end extends downward to the outside of the upper seat main block, forming a lower abutting end. The shape of the press head is adapted to the shape of the installation cavity, and the upper extension end of the press head is connected to the heat dissipation element, while the lower abutting end abuts against the chip; several sliding rods are provided on the side of the press head facing the upper seat main block. The sliding rods of this embodiment are shoulder bolts 6. Slide rod installation holes are opened at positions on the upper seat main block corresponding to the sliding rods. The press head is installed in the slide rod installation holes through the sliding rods and is slidably connected to the upper seat main block. A spring 7 is sleeved on the sliding rod between the press head and the upper seat main block.
[0031] The heat dissipation element of this embodiment includes an aluminum heat dissipation block 2; heat dissipation fins are evenly distributed on the heat dissipation block at intervals; bolt holes are opened on the heat dissipation block. Threaded holes are opened at positions on the upper extension end of the press head corresponding to the bolt holes. The heat dissipation block is installed in the bolt holes through connecting bolts 1 and is threadedly connected to the threaded holes to be fixedly connected to the upper extension end of the press head.
[0032] In addition, the pressing member in this embodiment is a pull rod 3; the pull rod 3 has a U-shaped structure, and both ends of its U-shaped structure are rotatably connected to the upper seat through shoulder bolts 4 respectively, and the U-shaped ends form an operation part for driving the rotation of the pull rod; both ends of the U-shaped structure of the pull rod protrude outwards respectively, that is, a pressing end for pushing the movement of the pressing head is formed, and the shape of the pressing end is a cam-shaped structure. And pin holes are respectively formed on the rod bodies at both ends of the U-shaped structure of the pull rod, and elastic pins 5 are slidably installed at positions corresponding to the pin holes on both sides of the main block of the upper seat. When driving the pull rod to press the pressing head, the pull rod is sleeved in the elastic pin through the pin hole, and the driving pressing end abuts the pressing head against the chip; the positions corresponding to the pressing ends on the pressing head 15 extend outwards respectively to form an extension end; a gasket 12 is fixedly installed on the extension end through a mounting bolt 11 for the abutment of the pressing end.
[0033] In order to facilitate the transfer of the heat of the chip, the pressing head 15 in this embodiment is made of a metal material; the heating element is a heating rod 14, and the heating rod 14 is fixedly installed inside the pressing head through a fixing bolt 13. And the temperature control component in this embodiment is also provided with a temperature sensor 10, the temperature sensor 10 is installed inside the pressing head, and one end of it extends towards the chip direction along the pressing head to the outside of the pressing head to form an induction end.
[0034] Working principle: Before the multi-station pressing type independent temperature control chip aging test seat in this embodiment is used, the tester can connect the connection joints of the temperature sensor and the heating rod to the PCB test board to control the heating rod and display the chip temperature. During the test, the tester places the chip in the base assembly, closes the main block of the upper seat, first lets the buckle latch the base, and then rotates the pull rod to the test state. During the process of rotating the pull rod, the cam-shaped pressing end on the pull rod presses the pressing head down until the elastic pin snaps into the pin hole of the pull rod. The cam structure of the pressing end can make the pressing head easier to press, and it is relatively labor-saving in the case of a large number of balls. When the upper seat is in a tightened state, the pressing head presses the chip, and the metal pressing head and the heat dissipation block can accelerate the heat dissipation of the chip; the induction end of the temperature sensor inside the pressing head also presses the chip, and can detect and feedback the case temperature of the chip; the heating rod can heat the chip, stop heating after reaching the specified temperature, and start heating when the temperature is lower than the specified temperature, and continuously cycle to ensure the chip test temperature.
[0035] During operation, the test seat is placed in the aging furnace. The heat dissipation channels on the side of the test seat can allow the blowing of the aging furnace to pass through more smoothly, prevent heat accumulation, and make the chip dissipate heat faster. The test seat in this embodiment can more easily close the upper seat, can better dissipate heat, has an independent temperature control structure, and the height dimension of the test seat meets the placement requirements of the existing aging furnace, and can meet the aging test requirements of most current chip packaging factories.
[0036] The embodiments of the present utility model have been described in detail in combination with the above embodiments. However, the present utility model is not limited to the above embodiments. For those of ordinary skill in the art, after learning the content recorded in the present utility model, without departing from the principle of the present utility model, several equivalent transformations and substitutions can still be made, and these equivalent transformations and substitutions should also be regarded as belonging to the protection scope of the present utility model.
Claims
1. A press-fit independent temperature control chip aging test seat, comprising a carrier, a pressure head and a temperature control component, characterized in that: The carrier is provided with an upper seat and a base, and the base is provided with a test board to form a mounting groove for the chip; the pressure head is slidably installed on the upper seat, and the upper seat is provided with a pressing piece; the temperature control component includes a heat dissipation element and a heating element, and the heating element is installed on the pressure head; the upper seat is covered on the base, one end of the pressure head is against the chip, and the other end is connected to the heat dissipation element for heat dissipation of the chip; one end of the pressing piece is rotatably connected to the upper seat, and its pressing end moves around the rotating connection point toward the position of the pressure head, pushing the pressure head to move toward the chip, pressing the chip and stopping it on the test board.
2. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: A groove is provided on the outer side wall of the base at a position corresponding to the mounting groove where the chip is located, and one end of the groove extends to the chip mounting groove. After the upper seat and the base are combined, the groove forms a heat dissipation channel for the chip.
3. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: The upper seat includes an upper seat main block; the upper seat main block is provided with an installation cavity which radially penetrates the block body, the pressure head is slidably installed in the installation cavity, and one end of the pressure head extends upward to the outside of the upper seat main block to form an upper extension end, and the other end extends downward to the outside of the upper seat main block to form a lower abutment end.
4. The press-fit independent temperature control chip aging test socket according to claim 3, characterized in that: The shape of the pressing head is adapted to the shape of the mounting cavity, and the upper extending end of the pressing head is connected to the heat dissipation element, while the lower abutting end abuts against the chip; a plurality of sliding rods are provided on the side of the pressing head facing the upper seat main block, and a sliding rod mounting hole is provided on the upper seat main block at a position corresponding to the sliding rod, the pressing head is installed in the sliding rod mounting hole through the sliding rod, and is slidably connected to the upper seat main block, and a spring is sleeved on the sliding rod between the pressing head and the upper seat main block.
5. The press-fit independent temperature control chip aging test socket according to claim 3, characterized in that: The heat dissipation element includes an aluminum heat dissipation block; a plurality of heat dissipation fins are evenly spaced on the heat dissipation block; a bolt hole is provided on the heat dissipation block, and a threaded hole is provided at a position corresponding to the bolt hole at the upper extension end of the pressure head. The heat dissipation block is installed in the bolt hole through a connecting bolt and is threadedly connected to the threaded hole, and is fixedly connected to the upper extension end of the pressure head.
6. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: The pressing part is a pull rod; the pull rod is a U-shaped structure, and the two end portions of the U-shaped structure are respectively rotatably connected to the upper seat, and the U-shaped end constitutes an operating part that drives the pull rod to rotate; the two ends of the U-shaped structure of the pull rod protrude outward respectively, forming a pressing end that pushes the pressure head to move, and the shape of the pressing end is a cam-like structure.
7. The press-fit independent temperature control chip aging test socket according to claim 6, characterized in that: Pin holes are respectively provided on the rod body at both ends of the U-shaped structure of the pull rod, and elastic pins are slidably installed at positions corresponding to the pin holes on both sides of the upper seat main block. When the pull rod is driven to press the pressure head, the pull rod is sleeved in the elastic pin through the pin hole, and the pressing end is driven to press the pressure head against the chip; the positions on the pressure head corresponding to the pressing end extend outwards respectively to form an extended end; a gasket is fixedly installed on the extended end for the pressing end to press against.
8. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: The pressure head is made of metal; the heating element is a heating rod, and the temperature control component is also provided with a temperature sensor, which is installed inside the pressure head, and one end of the temperature sensor extends along the pressure head toward the chip to the outside of the pressure head, forming a sensing end.
9. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: One end of the upper seat is hingedly connected to the base through a hinge, and the other end away from the hinge point is provided with a buckle. When the upper seat is covered with the base, the upper seat is buckled and connected to the base as a whole through the buckle.
10. The press-fit independent temperature control chip aging test socket according to claim 1, characterized in that: The base is also provided with a support plate, and the support plate is connected to the base as a whole through connecting bolts, forming a mounting cavity for the test plate therebetween.