Probe puncture circuit detection structure

Abstract

The utility model discloses a probe puncture circuit detection structure, comprising a protection cover plate comprising a visible area and a non-visible area; the thin film sensing layer is arranged on the back face of the protective cover plate, the thin film sensing layer is bonded with the protective cover plate through OCA glue, and the upper surface of the thin film sensing layer is plated with an ITO circuit layer; the tip of the probe is inserted into the ITO circuit layer to be conducted; the probe is externally connected with a universal meter to measure the open-circuit and short-circuit conditions. The tip of the probe is inserted into the touch control layer to be in contact conduction with the ITO circuit layer, the capacitive touch screen ITO circuit layer is effectively and rapidly analyzed, and large-area damage and secondary damage to products are avoided.

Description

Technical Field

[0001] The utility model relates to the field of external TP structures for wearable display screens, in particular to a probe puncture circuit detection structure. Background Art

[0002] At present, the cost competitiveness in the wearable electronic product industry is increasing, and the defect analysis in the early stage of the product is also a concern of the customer terminal; among them, the TP analysis of the external module is one of them. When it is necessary to analyze the open and short circuit problems of the TP, the Film layer needs to be torn off from the OCA glue to measure the circuit layer on the Film. The process is complex and it is easy to cause secondary damage to the circuit layer. Content of the Utility Model

[0003] In order to solve the above deficiencies of the prior art, the utility model provides a probe puncture circuit detection structure. By inserting the tip of the probe into the touch layer to contact and conduct with the ITO circuit layer, it can effectively and quickly analyze the ITO circuit layer of the capacitive touch screen without tearing the touch layer from the protection cover plate, and will not cause large-area damage and secondary damage to the product.

[0004] The technical problem to be solved by the utility model is realized through the following technical solutions: A probe puncture circuit detection structure includes a protection cover plate, which includes a visible area and a non-visible area;

[0005] A touch layer is arranged on the back of the protection cover plate. The touch layer includes a thin film sensing layer, and an ITO circuit layer is plated on the upper surface of the thin film sensing layer;

[0006] A probe, the tip of the probe is inserted into the thin film sensing layer and then contacts and conducts with the ITO circuit layer; the probe is externally connected to a multimeter to measure the open and short circuit conditions of the ITO circuit layer.

[0007] As a preferred embodiment of the probe puncture circuit detection structure provided by the utility model, a coating layer is arranged on the upper surface of the protection cover plate.

[0008] As a preferred embodiment of the probe puncture circuit detection structure provided by the utility model, the coating layer is one or a combination of two or more of an AG layer, an AR layer, and an AF layer.

[0009] As a preferred embodiment of the probe puncture circuit detection structure provided by the utility model, the touch layer includes at least one thin film sensing layer, and the thin film sensing layer is electrically connected to a flexible circuit board.

[0010] As a preferred embodiment of the probe puncture circuit detection structure provided by the utility model, the touch layer includes two thin film sensing layers, each thin film sensing layer is respectively arranged on the upper surface of the film film, the upper surface of the upper film film is bonded to the lower bottom surface of the protective cover plate by OCA, and the lower film film is bonded to the upper film film by OCA.

[0011] As a preferred implementation of the probe puncture circuit detection structure provided by the utility model, the touch layer is an ITO bridge touch pattern.

[0012] As a preferred implementation of the probe puncture circuit detection structure provided by the utility model, the probe includes a positive probe and a negative probe, the positive probe is connected to the positive pole of the multimeter, and the negative probe is connected to the negative pole of the multimeter.

[0013] As a preferred implementation of the probe puncture circuit detection structure provided by the utility model, an antistatic rubber ring is provided on the back of the non-display area of ​​the outer ring of the protective cover plate.

[0014] As a preferred implementation of the probe puncture circuit detection structure provided by the utility model, the thickness of the antistatic rubber ring is 0.2 mm.

[0015] As a preferred implementation of the probe puncture circuit detection structure provided by the utility model, the upper surface of the antistatic rubber ring and the lower surface of the protective cover are fixed by gluing.

[0016] The utility model has the following beneficial effects: a probe puncture circuit detection structure, including a protective cover plate, including a visible area and a non-visible area; a touch layer, arranged on the back of the protective cover plate, the touch layer including a thin film sensing layer, the upper surface of the thin film sensing layer is plated with an ITO circuit layer; a probe, the tip of the probe is inserted into the thin film sensing layer and then contacts and conducts with the ITO circuit layer; the probe is externally connected to a multimeter to measure the open and short circuit conditions of the ITO circuit layer. The present application effectively and quickly analyzes the ITO circuit layer of the capacitive touch screen by inserting the tip of the probe into the touch layer and contacting and conducting with the ITO circuit layer, without tearing the touch layer off the protective cover plate, and without large-scale damage or secondary damage to the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1Detection schematic diagram of the probe puncture circuit detection structure provided by the present utility model;

[0019] Figure 2 Structural schematic diagram of the probe puncture circuit detection structure provided by the present utility model;

[0020] Figure 3 Structural schematic diagram of the thin film sensing layer of the probe puncture circuit detection structure provided by the present utility model;

[0021] Figure 4 Another structural schematic diagram of the thin film sensing layer of the probe puncture circuit detection structure provided by the present utility model;

[0022] Figure 5 Schematic diagram of the antistatic rubber ring of the probe puncture circuit detection structure provided by the present utility model.

[0023] 1. Protection cover plate; 11. Coating; 2. Touch layer; 21. Thin film sensing layer; 22. Film; 23. OCA; 3. Probe; 31. Positive probe; 32. Negative probe; 4. ITO circuit layer; 5. Flexible circuit board; 6. Multimeter; 7. Antistatic rubber ring. Specific embodiments

[0024] The present utility model will be described in detail below with reference to the accompanying drawings and embodiments. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model and should not be construed as limiting the present utility model.

[0025] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

[0026] In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Embodiment 1

[0029] like Figure 1 and Figure 2 As shown, a probe puncture circuit detection structure is characterized by comprising a protective cover plate 1, including a visible area and a non-visible area;

[0030] A touch layer 2 is disposed on the back of the protective cover plate 1, and the touch layer 2 includes a thin film sensing layer 21, and an ITO circuit layer 4 is plated on the upper surface of the thin film sensing layer 21;

[0031] The probe 3 , the tip of which is inserted into the thin film sensing layer 21 and then in contact with the ITO circuit layer 4 ; the probe 3 is externally connected to a multimeter 6 to measure the open and short circuit conditions of the ITO circuit layer 4 .

[0032] When the utility model performs an open-short circuit analysis on the ITO circuit layer 4, the tip of the probe 3 is inserted into the thin film sensing layer 21 to contact and conduct with the ITO circuit layer 4, and the probe 3 is connected to the multimeter 6 at the same time. By setting the measurement mode of the multimeter 6 to the resistance mode or the continuity detection mode, the ITO circuit layer can be directly measured. When the circuit is in an open circuit state, the resistance value displayed by the multimeter 6 will be very large or infinite; when the circuit is in a short circuit state, the multimeter 6 will display a resistance value close to zero. In this way, the open and short circuit conditions of the circuit can be quickly and accurately determined, thereby helping to locate and solve circuit faults, and effectively quickly analyze the capacitive touch screen ITO circuit layer 4 without tearing the touch layer off the protective cover, and without large-scale damage and secondary damage to the product.

[0033] Furthermore, the probe 3 includes a positive probe 31 and a negative probe 32 , the positive probe 31 is connected to the positive pole of the multimeter 6 , and the negative probe 32 is connected to the negative pole of the multimeter 6 .

[0034] In another preferred implementation manner of this embodiment, a coating layer 11 is provided on the upper surface of the protective cover plate 1 .

[0035] Among them, the coating layer 11 can be one of an AG layer (anti-glare layer), an AR layer (anti-reflection and anti-glare layer), and an AF layer (anti-fingerprint layer), or a combination of two or more of them. When used in combination, they can be arranged in an upper and lower stacked manner or in a sub-frame structure.

[0036] It should be noted that the AG layer (anti-glare layer): The AG layer is a coating that can reduce the reflected light of the screen, effectively reducing the reflection and glare of the screen and improving the visibility of the screen in outdoor or strong light environments. The AR layer (anti-reflection and anti-glare layer): The AR layer is a coating that can reduce the reflected light on the surface, effectively reducing the reflectivity of the screen, improving the light transmittance and clarity of the screen, and making the display image clearer and more delicate. The AF layer (anti-fingerprint layer): The AF layer is a coating that can reduce fingerprint marks, effectively reducing fingerprints and stains on the screen, keeping the screen clean, and improving the smoothness and comfort of touch operations. When in use, a single coating or a combination of multiple coatings can be selected according to specific needs to achieve better visual effects and user experiences. At the same time, according to the requirements of product design and manufacturing processes, different coating stacking methods or sub-frame structures can be adopted to achieve more flexible and diverse applications.

[0037] Embodiment 2

[0038] In this embodiment, the touch layer 2 includes at least one thin film sensing layer 21. The thin film sensing layer 21 is electrically connected to the flexible circuit board 5. The touch layer 2 is adhesively bonded to the back surface of the protection cover plate 1 to form a touch panel.

[0039] Furthermore, the touch panel can adopt the OGS technology. For example, Figure 3 as shown, the touch layer 2 adopts a single thin film sensing layer 21. The thin film sensing layer 21 is an ITO bridging touch pattern, and the thin film sensing layer 21 is electrically connected to the flexible circuit board 5 to achieve the touch function. The thin film sensing layer 21 is directly fabricated on the protection cover plate 1, reducing the thickness of the display screen and facilitating preparation.

[0040] It should be noted that the ITO bridging touch pattern refers to a touch pattern made of ITO (indium tin oxide) material on a colorless transparent glass. ITO is a transparent conductive material that can be used to make touch screens. In the ITO bridging touch pattern, the ITO material is made into some small bridges, which connect different areas in the touch pattern to form a complete circuit. When a user touches the screen, the ITO material senses the touch signal and transmits the signal to the circuit, thus realizing the touch operation. In this embodiment, the thin film sensing layer 21 adopts the ITO bridging touch pattern, and the ITO material on the touch layer 2 is designed in a bridging form to achieve more accurate and sensitive touch operations. Through this design, the touch panel can better respond to the user's operations and provide a better touch experience.

[0041] In another preferred embodiment of this embodiment, the touch panel can also adopt the GFF structure, such as Figure 4 shown, that is, it includes two thin film sensing layers 21, and each thin film sensing layer 21 is respectively disposed on the upper surface of the film 22. The upper surface of the upper film 22 is adhered to the lower bottom surface of the protection cover plate 1 through the OCA 23, and the lower film 22 and the upper film 22 are adhered to each other through the OCA 23. The thin film sensing layer 21 is an ITO bridging touch pattern, and the thin film sensing layer 21 is electrically connected to the flexible circuit board 5 to realize the touch function.

[0042] Embodiment Three

[0043] such as Figure 5 shown, an antistatic rubber ring 7 is provided on the back of the non-display area of the outer circle of the protection cover plate 1.

[0044] In this embodiment, the upper surface of the antistatic rubber ring 7 is fixedly adhered to the back of the protection cover plate 1 through the adhesive glue, and the back and outer side surfaces of the antistatic rubber ring 7 are in contact with the customer's host. By sleeving the antistatic rubber ring 7 on the outside of the display component on the back of the protection cover plate 1 and then pasting the antistatic rubber ring 7 to the back of the protection cover plate 1 through the adhesive glue, the antistatic rubber ring 7 is firmly sleeved at the display component, and the other parts of the antistatic rubber ring 7 are in contact with the customer's host to achieve the effect of blocking static electricity. After testing, it can meet the customer's requirement for anti-external static electricity of up to 18 KV to 20 KV.

[0045] Furthermore, the thickness of the antistatic rubber ring 3 is 0.2 mm. In other embodiments, the thickness of the antistatic rubber ring 3 can also be selected according to actual needs.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention rather than to limit them. Although the embodiments of the present invention have been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the embodiments of the present invention can still be modified or equivalently replaced, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A probe puncture circuit detection structure, characterized in that: The protective cover (1) comprises a visible area and a non-visible area; A touch layer (2) is arranged on the back of the protective cover plate (1), the touch layer (2) comprising a thin film sensing layer (21), and an ITO circuit layer (4) is plated on the upper surface of the thin film sensing layer (21); A probe (3), wherein the tip of the probe (3) is inserted into the thin film sensing layer (21) and contacts and conducts with the ITO circuit layer (4); the probe (3) is externally connected to a multimeter (6) to measure the open and short circuit conditions of the ITO circuit layer (4).

2. The probe puncture circuit detection structure according to claim 1, characterized in that: The upper surface of the protective cover plate (1) is provided with a coating (11).

3. The probe puncture circuit detection structure according to claim 2, characterized in that: The coating (11) is one of an AG layer, an AR layer, and an AF layer, or a combination of two or more thereof.

4. The probe puncture circuit detection structure according to claim 1, characterized in that: The touch control layer (2) comprises at least one thin film sensing layer (21), and the thin film sensing layer (21) is electrically connected to the flexible circuit board (5).

5. The probe puncture circuit detection structure according to claim 4, characterized in that: The touch control layer (2) comprises two thin film sensing layers (21), each thin film sensing layer (21) is arranged on the upper surface of a film film (22), the upper surface of the upper film film (22) is bonded to the lower bottom surface of the protective cover plate (1) via OCA (23), and the lower film film (22) is bonded to the upper film film (22) via OCA (23).

6. The probe puncture circuit detection structure according to claim 4, characterized in that: The touch layer (2) is an ITO bridge touch pattern.

7. The probe puncture circuit detection structure according to claim 1, characterized in that: The probe (3) comprises a positive pole probe (31) and a negative pole probe (32); the positive pole probe (31) is connected to the positive pole of the multimeter (6), and the negative pole probe (32) is connected to the negative pole of the multimeter (6).

8. The probe puncture circuit detection structure according to claim 1, characterized in that: An antistatic rubber ring (7) is provided on the back of the non-display area of ​​the outer ring of the protective cover plate (1).

9. The probe puncture circuit detection structure according to claim 8, characterized in that: The thickness of the antistatic rubber ring (7) is 0.2 mm.

10. The probe puncture circuit detection structure according to claim 9, characterized in that: The upper surface of the antistatic rubber ring (7) and the lower surface of the protective cover plate (1) are fixed by gluing.

Images