Backlight source heat dissipation structure, backlight source and backlight module

Abstract

The utility model discloses a backlight heat dissipation structure, a backlight and a backlight module, and relates to the field of backlight modules, the backlight heat dissipation structure comprises an iron frame, the backlight and a radiator, the backlight is fixedly connected with the radiator through a heat conduction gel layer, and the radiator penetrates through the iron frame; the heat conduction gel layer is coated on the surface of the radiator, the heat conduction gel layer and the backlight source are bonded and fixed, heat generated by the backlight source can be rapidly and evenly transmitted to the radiator through the heat conduction gel layer, the uniformity of heat dissipation is improved, the heat dissipation effect of the light source is guaranteed, and the service life of the light source is prolonged. The backlight source is in direct contact with the radiator, the radiator penetrates through the iron frame, heat is conveniently transmitted to the outer side of the backlight source, the heat is rapidly dissipated out through the fan assembly in the module structure, the purpose of rapid heat dissipation is achieved, and therefore the heat dissipation effect is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight modules, in particular to a backlight heat dissipation structure, a backlight source and a backlight module. Background Art

[0002] The LED backlight mainly consists of LED lights, a light guide plate, optical films, a plastic frame, etc. The backlight has the characteristics of high brightness, long life, uniform light emission, etc. A large amount of heat is generated during the light emission of the LED lights on the light bar, and the generated heat will also cause the screen to heat up, shortening the screen display life and affecting the user experience. Therefore, a radiator will be added to the backlight module to improve the heat dissipation effect. For example, the patent application number CN200710176414.X discloses a backlight source, which includes: a light source for generating backlight rays; a radiator connected to the light source for dissipating the heat generated by the light source; a back plate connected to the radiator; in this solution, a radiator is provided on the back side of the light source to timely dissipate the heat generated by the light source; another example is the patent application number CN201520646323.8, which discloses a backlight heat dissipation structure and a backlight source, which includes a light bar, a backlight fixing frame, a light-shielding double-sided adhesive, and a backlight assembly located above the light-shielding double-sided adhesive. The light bar is located between the backlight fixing frame and the light-shielding double-sided adhesive, and the non-welding light surface of the flexible circuit board is fixedly connected to the backlight fixing frame through a heat-dissipating double-sided adhesive; this solution adjusts the light bar structure between the backlight fixing frame and the light-shielding double-sided adhesive, and connects the flexible circuit board to the backlight fixing frame. This structure has the following advantages: 1) It is beneficial to the full heat dissipation of the backlight source; 2) The position of the light bar can be well fixed, the dimensional consistency is good, and the yield rate in the production process is improved; 3) The light rays of the lamp have no blockage and loss, and the uniformity of the backlight source can be improved; 4) The assembly is convenient, which is convenient for automatic machine production and improves the production efficiency of the product;

[0003] In the above solutions, the following defects exist: 1) Using a radiator to directly contact the light source, although the heat dissipation effect can be achieved, due to the dispersion of the light source, the heat dissipation is uneven, and the heat dissipation effect at the light source position is not good; 2) Using a heat-dissipating double-sided adhesive to bond and fix the flexible circuit board to the backlight fixing frame, the backlight source is not directly in contact with the heat-dissipating double-sided adhesive, and the flexible circuit board arranged in the middle will also hinder heat dissipation, affecting the heat dissipation effect and the heat dissipation is slow; Therefore, the utility model discloses a backlight heat dissipation structure, a backlight source and a backlight module to solve the above problems. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a backlight heat dissipation structure, a backlight, and a backlight module for the above technical problems. By applying a layer of thermal gel layer on the surface of the radiator, the backlight is adhesively fixed to the radiator through the thermal gel layer. The thermal gel layer can quickly and evenly transfer the heat generated by the backlight to the radiator, improving the uniformity of heat dissipation, ensuring the heat dissipation effect of the light source, and directly contacting the backlight with the radiator. The radiator passes through the iron frame, facilitating the transfer of heat to the outside of the backlight, and using the fan assembly inside the module structure to quickly dissipate the heat, achieving the purpose of rapid heat dissipation, thereby further improving the heat dissipation effect.

[0005] To solve the above technical problems, the present utility model adopts the following technical solutions:

[0006] A backlight heat dissipation structure includes an iron frame, a backlight, and a radiator. The backlight is fixedly connected to the radiator through a thermal gel layer, and the radiator passes through the iron frame.

[0007] As a preferred embodiment of the backlight heat dissipation structure provided by the present utility model, the radiator includes a heat dissipation substrate. A plurality of parallel fins are provided on one side of the heat dissipation substrate, and the fins pass through the iron frame. The other side of the heat dissipation substrate is adhesively bonded to the backlight through a thermal gel layer.

[0008] As a preferred embodiment of the backlight heat dissipation structure provided by the present utility model, the backlight includes a printed circuit board. A plurality of LED lights are connected to one side of the printed circuit board, and the other side of the printed circuit board is adhesively bonded to the thermal gel layer. The printed circuit board is connected to a flexible circuit board.

[0009] As a preferred embodiment of the backlight heat dissipation structure provided by the present utility model, positioning protrusions are provided on the heat dissipation substrate, and positioning grooves are provided on the circuit board. The positioning protrusions and the positioning grooves are matched.

[0010] As a preferred embodiment of the backlight heat dissipation structure provided by the present utility model, a rubber frame is provided inside the iron frame, and a reflector and a light guide plate are sequentially arranged from bottom to top inside the iron frame. The flexible circuit board is adhesively fixed to the rubber frame and the light guide plate through double-sided tape.

[0011] As a preferred embodiment of the backlight heat dissipation structure provided by the present utility model, the side of the light guide plate close to the backlight is inclined upward toward the backlight side.

[0012] As a preferred embodiment of the backlight source heat dissipation structure provided by the present utility model, a diffusion film, a lower brightness enhancement film, and an upper brightness enhancement film are sequentially stacked on the upper surface of the light guide plate. A light-shielding film is disposed on the upper brightness enhancement film, and the light-shielding film covers the flexible circuit board.

[0013] As a preferred embodiment of the backlight source heat dissipation structure provided by the present utility model, one end faces of the upper brightness enhancement film and the lower brightness enhancement film close to the backlight source are aligned, and diffusers are disposed on the diffusion film on the corresponding side.

[0014] The present utility model also provides a backlight source, and this backlight source includes the above-mentioned backlight source heat dissipation structure.

[0015] In order to achieve a backlight effect, the present utility model also provides a backlight module, and this backlight module includes the above-mentioned backlight source.

[0016] Compared with the prior art, the present utility model has the following beneficial effects:

[0017] 1. For a backlight source heat dissipation structure, a backlight source, and a backlight module provided by the present utility model, a layer of thermal conductive gel layer is applied on the surface of the radiator. The backlight source is adhesively fixed through the thermal conductive gel layer. The thermal conductive gel layer can quickly and evenly transfer the heat generated by the backlight source to the radiator, improving the uniformity of heat dissipation, ensuring the heat dissipation effect of the light source, directly contacting the backlight source with the radiator, and the radiator passes through the iron frame, facilitating the transfer of heat to the outside of the backlight, and using the fan assembly inside the module structure to quickly dissipate the heat, achieving the purpose of rapid heat dissipation, thereby further improving the heat dissipation effect.

[0018] 2. For a backlight source heat dissipation structure, a backlight source, and a backlight module provided by the present utility model, the fins on the radiator are used to quickly conduct the heat transferred by the backlight source to the outside of the iron frame. At the same time, the positioning protrusions and positioning grooves are used to position the position of the backlight source, facilitating the rapid assembly of the backlight source and improving the work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the solutions in the present utility model, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the following-described drawings are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0021] Figure 2 It is a schematic diagram of the connection between the backlight source and the radiator of the present utility model;

[0022] Figure 3 is Figure 2 a schematic diagram of decomposition.

[0023] The markings in the figure are explained as follows:

[0024] 1. Iron frame; 2. Backlight; 201. Printed circuit board; 202. LED lamp; 203. Positioning groove; 3. Heat sink; 301. Heat dissipation substrate; 302. Fins; 303. Positioning protrusion; 4. Thermal gel layer; 5. Rubber frame; 6. Reflective sheet; 7. Light guide plate; 8. Double-sided tape; 9. Diffusion film; 10. Lower brightness enhancement film; 11. Upper brightness enhancement film; 12. Light-shielding film; 13. Diffuser; 14. Flexible circuit board. Specific embodiments

[0025] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0026] As described in the background art, 1) directly contacting the heat sink with the light source can achieve a heat dissipation effect, but since the light source is dispersed, heat dissipation is uneven, and the heat dissipation effect at the light source position is not good; 2) using heat-dissipating double-sided tape to bond and fix the flexible circuit board to the backlight fixing frame, the backlight is not in direct contact with the heat-dissipating double-sided tape, and the flexible circuit board arranged in the middle will also hinder heat dissipation, affecting the heat dissipation effect and resulting in slow heat dissipation.

[0027] To solve this technical problem, the present invention provides a backlight heat dissipation structure, a backlight, and a backlight module, which are applied to the field of backlight modules.

[0028] Specifically, please refer to Figures 1 - 3 , the backlight heat dissipation structure includes an iron frame 1, a backlight 2, and a heat sink 3. The backlight 2 is fixedly connected to the heat sink 3 through a thermal gel layer 4, and the heat sink 3 passes through the iron frame 1.

[0029] The backlight 2 includes the above-mentioned backlight heat dissipation structure.

[0030] The backlight module includes the above-mentioned backlight 2.

[0031] A backlight heat dissipation structure, a backlight 2 and a backlight module provided by the utility model can quickly and evenly transfer the heat generated by the backlight 2 to the radiator 3 by applying a layer of thermal gel layer 4 on the surface of the radiator 3 and bonding and fixing the backlight 2 through the thermal gel layer 4, improving the uniformity of heat dissipation, ensuring the heat dissipation effect of the light source, directly contacting the backlight 2 with the radiator 3, passing the radiator 3 through the iron frame 1, facilitating the transfer of heat to the outside of the backlight, and quickly dissipating the heat by using the fan assembly inside the module structure, achieving the purpose of rapid heat dissipation, and further improving the heat dissipation effect.

[0032] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

[0033] It should be noted that, without conflict, the embodiments in the present utility model and the features and technical solutions in the embodiments may be combined with each other.

[0034] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0035] Embodiment 1

[0036] Please refer to Figures 1 - 3 , which provides a backlight heat dissipation structure, including an iron frame 1, a backlight 2 and a radiator 3. The backlight 2 is fixedly connected to the radiator 3 through a thermal gel layer 4. The radiator 3 passes through the iron frame 1. During assembly, first apply the thermal gel on the contact surface between the radiator 3 and the backlight 2 to form the thermal gel layer 4, then bond the backlight 2 and the radiator 3, and finally fix the radiator 3 on the iron frame 1 to complete the assembly.

[0037] In this example, a backlight 2 is also provided, and the backlight 2 includes the above-mentioned backlight heat dissipation structure.

[0038] In order to achieve the backlight effect, this embodiment also provides a backlight module, and the backlight module includes the above-mentioned backlight 2.

[0039] A backlight heat dissipation structure, a backlight 2 and a backlight module provided by the utility model, by applying a layer of thermal gel layer 4 on the surface of the radiator 3, bonding and fixing with the backlight 2 through the thermal gel layer 4, and using the thermal gel layer 4 to quickly and evenly transfer the heat generated by the backlight 2 to the radiator 3, improving the uniformity of heat dissipation, ensuring the heat dissipation effect of the light source, and directly contacting the backlight 2 with the radiator 3. The radiator 3 passes through the iron frame 1, facilitating the transfer of heat to the outside of the backlight, and using the fan assembly inside the module structure to quickly dissipate the heat, achieving the purpose of rapid heat dissipation, thereby further improving the heat dissipation effect.

[0040] Embodiment 2

[0041] Further optimize the backlight heat dissipation structure, backlight 2 and backlight module provided in Embodiment 1, as Figures 2 - 3 shown. Specifically, the radiator 3 includes a heat dissipation substrate 301. A plurality of parallel fins 302 are provided on one side of the heat dissipation substrate 301. The distance between the fins 302 is 2 - 10 mm. The fins 302 pass through the iron frame 1. The other side of the heat dissipation substrate 301 is bonded to the backlight 2 through the thermal gel layer 4.

[0042] Furthermore, the backlight 2 includes a printed circuit board 201. A plurality of LED lights 202 are connected to one side of the printed circuit board 201. The LED lights 202 are arranged at equal intervals. The other side of the printed circuit board 201 is bonded to the thermal gel layer 4. The printed circuit board 201 is connected to the flexible circuit board 14.

[0043] Furthermore, positioning protrusions 303 are provided on the heat dissipation substrate 301, and positioning grooves 203 are provided on the circuit board. The positioning protrusions 303 and the positioning grooves 203 are arranged in a matching manner. Specifically, four positioning protrusions 303 are provided, respectively located at the four corners of the heat dissipation substrate 301. At the same time, four positioning grooves 203 are also provided, located at the four corners of the printed circuit board.

[0044] Through the above structural design, the fins 302 on the radiator 3 quickly conduct the heat transferred by the backlight 2 to the outside of the iron frame 1. At the same time, the positioning protrusions 303 and the positioning grooves 203 are used to position the position of the backlight 2, facilitating the rapid assembly of the backlight 2 and improving the work efficiency.

[0045] Embodiment 3

[0046] Further optimize a backlight heat dissipation structure, a backlight 2 and a backlight module provided in Embodiment 2, as Figure 1As shown in the figure, specifically, a rubber frame 5 is arranged inside the iron frame 1, and a reflector 6 and a light guide plate 7 are sequentially arranged in the iron frame 1 from bottom to top. The flexible circuit board 14 is bonded and fixed to the rubber frame 5 and the light guide plate 7 through double-sided tape 8, ensuring the stability of the contact between the flexible circuit board 14 and the backlight 2. Moreover, the side of the light guide plate 7 close to the backlight 2 is inclined upward toward the backlight 2, improving the light guiding amount and ensuring the backlight effect.

[0047] And a diffusion film 9, a lower brightness enhancement film 10 and an upper brightness enhancement film 11 are sequentially stacked on the upper surface of the light guide plate 7. A light-shielding film 12 is arranged on the upper brightness enhancement film 11, and the light-shielding film 12 covers the flexible circuit board 14. One end faces of the upper brightness enhancement film 11 and the lower brightness enhancement film 10 close to the backlight 2 are aligned, and a diffuser 13 is arranged on the corresponding side of the diffusion film 9.

[0048] The working principle of a backlight heat dissipation structure, a backlight 2 and a backlight module provided by the present utility model: By applying a layer of thermal gel layer 4 on the surface of the radiator 3 and bonding and fixing the radiator 3 to the backlight 2 through the thermal gel layer 4, the thermal gel layer 4 can quickly and evenly transfer the heat generated by the backlight 2 to the radiator 3, improving the heat dissipation uniformity and ensuring the light source heat dissipation effect. And the backlight 2 is in direct contact with the radiator 3, and the radiator 3 passes through the iron frame 1, facilitating the transfer of heat to the outside of the backlight, and using the fan assembly inside the module structure to quickly dissipate the heat, achieving the purpose of rapid heat dissipation, thereby further improving the heat dissipation effect. The fins 302 on the radiator 3 quickly conduct the heat transferred by the backlight 2 to the outside of the iron frame 1. At the same time, the positioning protrusion 303 and the positioning groove 203 are used to position the position of the backlight 2, facilitating the rapid assembly of the backlight 2 and improving the work efficiency.

[0049] In the present utility model, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0050] Obviously, the embodiments described above are only a part of the embodiments of the present utility model, rather than all of them. The preferred embodiments of the present utility model are shown in the accompanying drawings, but they do not limit the patent scope of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structure made by using the content of the specification and drawings of the present utility model, directly or indirectly applied in other related technical fields, is similarly within the scope of patent protection of the present utility model.

Claims

1. A backlight source heat dissipation structure, comprising an iron frame, a backlight source and a radiator, characterized in that: The backlight source is fixedly connected to the radiator through a thermally conductive gel layer, the radiator passes through an iron frame, the radiator includes a heat dissipation substrate, one side of the heat dissipation substrate is provided with a plurality of parallel fins, the fins pass through the iron frame, and the other side of the heat dissipation substrate is bonded to the backlight source through a thermally conductive gel layer.

2. The backlight source heat dissipation structure according to claim 1, characterized in that: The backlight source comprises a printed circuit board, one side of the printed circuit board is connected with a plurality of LED lamps, the other side of the printed circuit board is bonded with a heat-conducting gel layer, and the printed circuit board is connected with a flexible circuit board.

3. The backlight source heat dissipation structure according to claim 2, characterized in that: The heat dissipation substrate is provided with a positioning protrusion, the printed circuit board is provided with a positioning groove, and the positioning protrusion is matched with the positioning groove.

4. The backlight source heat dissipation structure according to claim 2, characterized in that: A glue frame is arranged inside the iron frame, and a reflective sheet and a light guide plate are arranged in sequence from bottom to top in the iron frame. The flexible circuit board is bonded and fixed to the glue frame and the light guide plate by double-sided adhesive.

5. The backlight source heat dissipation structure according to claim 4, characterized in that: The side of the light guide plate close to the backlight source is tilted upward toward the backlight source.

6. The backlight source heat dissipation structure according to claim 5, characterized in that: A diffusion film, a lower brightness enhancement film and an upper brightness enhancement film are sequentially stacked on the upper surface of the light guide plate, a light shielding film is arranged on the upper brightness enhancement film, and the light shielding film covers the flexible circuit board.

7. The backlight source heat dissipation structure according to claim 6, characterized in that: The upper brightness enhancement film and the lower brightness enhancement film are aligned with each other at one end close to the backlight source, and a diffuser is arranged on the diffusion film at the corresponding side.

8. A backlight source, characterized in that: The backlight source comprises the backlight source heat dissipation structure according to any one of claims 1 to 7.

9. A backlight module, characterized in that: The backlight module comprises the backlight source described in claim 8.

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