Non-brazed 3DVC radiator

Abstract

The utility model relates to the technical field of 3DVC radiators, and discloses a non-brazing type 3DVC radiator which comprises a blade piece and a VC substrate, the blade piece is arranged in a flat shape, a blade cavity is formed in the blade piece, a plate cavity is formed in the VC substrate, the lower portion of the blade piece is in butt joint with the VC substrate in a diffusion welding mode, and the upper portion of the blade piece is arranged in an extending mode in the direction away from the VC substrate. And the blade cavity is communicated with the plate cavity. Due to the fact that the blade piece and the VC substrate are in butt joint through diffusion welding, welding flux is not needed, cost is reduced, manufacturing is convenient, meanwhile, during heat dissipation, through communication of the blade cavity and the plate cavity, the VC substrate absorbs heat and conducts the heat to the blade piece, under the action of the blade piece, the heat interaction area is greatly increased, the heat can be conveniently dissipated into air, and heat dissipation efficiency is improved. Therefore, the heat dissipation effect and the heat dissipation efficiency are improved.

Description

Technical Field

[0001] The utility model patent relates to the technical field of 3DVC radiators, and more specifically, to a non-brazed 3DVC radiator. Background Art

[0002] When a computer host is working, a large amount of heat will be generated. If this heat is not dissipated in time, it will cause the computer to freeze at best and burn the components of the host at worst. Therefore, a radiator needs to be set up to dissipate the heat of the internal components of the host, and the commonly used VC radiator can meet the heat dissipation requirements.

[0003] VC radiators are generally divided into 2D VC radiators and 3D VC radiators. The 2D VC radiator is a plate-type radiator that realizes heat conduction on a two-dimensional plane. The 3D VC radiator has heat pipes embedded in the radiator, evenly distributing heat on the radiator substrate or fins. At the same time, the heat pipes are connected to the fins, so that heat can be more effectively dissipated into the air through the entire radiator, realizing heat conduction on a three-dimensional plane.

[0004] For example, the prior patent with the publication number CN117712062A discloses a 3D VC radiator and its manufacturing method, including a housing composed of a VC upper cover and a VC lower cover. The lower surface of the VC upper cover is provided with a recess, and a reserved hole is opened in the center of the recess. The heat pipe extends out of the reserved hole and is fixed to the recess through an abutting part at the bottom of the heat pipe. The inner wall surfaces of the heat pipe and the VC upper cover are provided with an integrated capillary structure layer.

[0005] In the prior art, the heat pipe is assembled and cooperated with the VC upper cover to achieve heat dissipation. Multiple heat pipes need to be arranged, which is inconvenient for assembly, and the heat dissipation area of the heat pipe is small, resulting in poor heat dissipation effect. Summary of the Utility Model

[0006] The purpose of the present utility model is to provide a non-brazed 3DVC radiator, aiming to solve the problem of poor heat dissipation effect of 3DVC radiators in the prior art.

[0007] The non-brazed 3DVC radiator of the present utility model is realized as follows. It includes a blade part and a VC substrate. The blade part is arranged in a flat shape, a blade cavity is formed inside the blade part, a plate cavity is formed inside the VC substrate. The lower part of the blade part is butt-jointed with the VC substrate by diffusion welding. The upper part of the blade part extends in a direction away from the VC substrate, and the blade cavity is communicated with the plate cavity.

[0008] Further, the blade member includes an upper blade cover and a lower blade cover. The upper blade cover and the lower blade cover are butted by diffusion welding, and a blade cavity is formed between the upper blade cover and the lower blade cover. The upper blade cover and the lower blade cover are respectively arranged in a flat shape, and the upper blade cover and the lower blade cover are respectively used for heat interaction.

[0009] Further, the blade member includes an upper blade capillary layer and a lower blade capillary layer. The upper blade capillary layer is laid on the inner wall of the upper blade cover, and the lower blade capillary layer is laid on the inner wall of the lower blade cover. The upper blade capillary layer and the lower blade capillary layer are butted and integrally formed, and the upper blade capillary layer and the lower blade capillary layer are respectively used for conducting heat.

[0010] Further, the blade member includes a plurality of blade support columns. Each of the blade support columns is arranged at intervals correspondingly, and both ends of the blade support column are butted with the upper blade cover and the lower blade cover respectively.

[0011] Further, the VC substrate includes an upper board cover, and the upper board cover has a board cover surface which is arranged horizontally. A blade upper surface is formed at the bottom of the upper blade cover, and a blade lower surface is formed at the bottom of the lower blade cover. The blade upper surface and the blade lower surface are respectively laid flat and butted by diffusion welding with the board cover surface.

[0012] Further, the VC substrate includes an upper board capillary layer. The upper board capillary layer is laid on the inner wall of the upper board cover, and the upper board capillary layer is used for conducting heat. The upper board capillary layer is synchronously butted with the upper blade capillary layer and the lower blade capillary layer and integrally formed.

[0013] Further, the VC substrate includes a lower board cover and a lower board capillary layer. The upper board cover and the lower board cover are butted by diffusion welding in the up-down direction. The lower board capillary layer is laid on the inner wall of the lower board cover, and the lower board capillary layer is used for conducting heat. The upper board capillary layer and the lower board capillary layer are butted and integrally formed.

[0014] Further, the VC substrate includes a plurality of board support columns. Each of the board support columns is arranged at intervals correspondingly, and both ends of the board support column are butted with the upper board cover and the lower board cover respectively.

[0015] Further, the non-brazed 3D VC heat sink includes a plurality of copper tubes. Each of the copper tubes is arranged at intervals correspondingly along both sides of the blade member. The lower part of the copper tube is butted with the upper board cover, and the upper part of the copper tube extends in a direction away from the upper board cover. A tube cavity is formed inside the copper tube, and the tube cavity is communicated with the board cavity.

[0016] Further, a capillary layer is provided on the inner wall of the copper tube. The capillary layer is used for conducting heat, and the capillary layer on the tube is in continuous butt joint and integrally formed with the capillary layer on the plate.

[0017] Compared with the prior art, for the non-brazed 3DVC radiator provided by the present invention, since the blade part and the VC substrate are butt-jointed by diffusion welding, there is no need to use solder, which reduces the cost and is convenient for manufacturing. At the same time, during heat dissipation, through the connection between the blade cavity and the plate cavity, the VC substrate absorbs heat and conducts it to the blade part. Under the action of the blade part, the heat interaction area is greatly increased, which is convenient for dissipating heat into the air, thereby improving the heat dissipation effect and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic cross-sectional view of the non-brazed 3DVC radiator provided by the present invention;

[0019] Figure 2 is an enlarged schematic view of part A of the non-brazed 3DVC radiator provided by the present invention;

[0020] Figure 3 is a three-dimensional schematic view of the non-brazed 3DVC radiator provided by the present invention;

[0021] Figure 4 is a three-dimensional schematic view of an embodiment of the blade part and the copper tube combination of the non-brazed 3DVC radiator provided by the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0023] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0024] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0025] Refer to Figures 1-4As shown, it is a preferred embodiment provided by the present utility model.

[0026] The non-brazed 3DVC radiator includes a blade member 1 and a VC substrate 2. The blade member 1 is arranged in a flat shape, a blade cavity is formed inside the blade member 1, a plate cavity is formed inside the VC substrate 2. The lower part of the blade member 1 is in diffusion welding butt joint with the VC substrate 2. The upper part of the blade member 1 extends in a direction away from the VC substrate 2, and the blade cavity is in communication with the plate cavity.

[0027] For the above non-brazed 3DVC radiator, since the blade member 1 and the VC substrate 2 are in diffusion welding butt joint without using solder, the cost is reduced and it is convenient for manufacturing. At the same time, during heat dissipation, through the communication between the blade cavity and the plate cavity, the VC substrate 2 absorbs heat and conducts it to the blade member 1. Under the action of the blade member 1, the area of heat interaction is greatly increased, which is convenient for dissipating heat into the air, thereby improving the heat dissipation effect and efficiency.

[0028] The blade cavity and the plate cavity are filled with a working medium, which is convenient for the transfer and release of heat, and improves the heat dissipation and cooling effect.

[0029] The working medium can be a refrigerant or a liquid such as water.

[0030] The blade member 1 includes an upper blade cover 11 and a lower blade cover 12. The upper blade cover 11 and the lower blade cover 12 are in diffusion welding butt joint, and a blade cavity is formed between the upper blade cover 11 and the lower blade cover 12. In this way, the production of the blade member 1 does not require solder, reducing the production cost of the blade member 1 and facilitating the manufacturing of the blade member 1.

[0031] The upper blade cover 11 and the lower blade cover 12 are respectively arranged in a flat shape and are respectively used for heat interaction. In this way, the contact area between the upper blade cover 11 and the lower blade cover 12 and the outside is increased, thereby increasing the area of heat interaction and improving the heat dissipation effect of the upper blade cover 11 and the lower blade cover 12.

[0032] The blade member 1 includes an upper blade capillary layer 13 and a lower blade capillary layer 14. The upper blade capillary layer 13 is laid on the inner wall of the upper blade cover 11, the lower blade capillary layer 14 is laid on the inner wall of the lower blade cover 12. The upper blade capillary layer 13 and the lower blade capillary layer 14 are in butt joint and integrally formed, and the upper blade capillary layer 13 and the lower blade capillary layer 14 are respectively used for conducting heat.

[0033] Under the combined action of the upper blade capillary layer 13 and the lower blade capillary layer 14, it is convenient for heat absorption and dissipation. At the same time, the upper blade capillary layer 13 and the lower blade capillary layer 14 help to reduce the thermal resistance and facilitate the conduction of heat, thereby improving the heat conduction effect and further improving the heat dissipation effect.

[0034] The blade member 1 includes a plurality of blade support columns which are arranged at intervals correspondingly, and both ends of each blade support column are arranged in butt joint with the blade upper cover 11 and the blade lower cover 12 respectively; under the action of each blade support column, the bearing capacity of the blade upper cover 11 and the blade lower cover 12 is improved, thereby improving the deformation resistance of the blade upper cover 11 and the blade lower cover 12, and further improving the service life of the blade member 1.

[0035] The VC substrate 2 includes a board upper cover 21 which has a board cover surface arranged horizontally; it is convenient for the arrangement of the blade member 1 and the copper tube 3.

[0036] The bottom of the blade upper cover 11 forms a blade upper surface, and the bottom of the blade lower cover 12 forms a blade lower surface. The blade upper surface and the blade lower surface are respectively arranged in a tiled and diffusion welding butt joint with the board cover surface; in this way, since the blade upper cover 11 and the blade lower cover 12 are first butt-jointed by diffusion welding, and then the blade upper surface and the blade lower surface are butt-jointed with the board cover surface by diffusion welding, it is convenient for the assembly of the blade member 1 and the VC substrate 2. At the same time, for the welding between the blade member 1 and the VC substrate 2, no solder is required, reducing the production cost of the 3D VC heat sink and facilitating the manufacture of the 3D VC heat sink.

[0037] The VC substrate 2 includes a board upper capillary layer 23 which is laid on the inner wall of the board upper cover 21. The board upper capillary layer 23 is used for conducting heat, and the board upper capillary layer 23 is synchronously butted and integrally formed with the blade upper capillary layer 13 and the blade lower capillary layer 14.

[0038] In this way, under the action of the board upper capillary layer 23, it is convenient for the heat interaction between the board upper cover 21 and the blade member 1, facilitating the conduction of heat and improving the heat dissipation effect and efficiency.

[0039] The VC substrate 2 includes a board lower cover 22 and a board lower capillary layer 24. The board upper cover 21 and the board lower cover 22 are butted by diffusion welding in the up and down direction; in this way, the blade upper cover 11 and the blade lower cover 12 are first butted by diffusion welding, and then the blade upper cover 11 and the blade lower cover 12 are synchronously butted with the board upper cover 21 by diffusion welding. Finally, the board upper cover 21 and the board lower cover 22 are butted by diffusion welding; the whole welding and assembly does not require solder. At the same time, it is convenient for the arrangement of the blade upper capillary layer 13, the blade lower capillary layer 14, the board upper capillary layer 23 and the board lower capillary layer 24.

[0040] The board lower capillary layer 24 is laid on the inner wall of the board lower cover 22. The board lower capillary layer 24 is used for conducting heat, and the board upper capillary layer 23 and the board lower capillary layer 24 are butted and integrally formed; under the action of the board lower capillary layer 24, it is convenient to absorb the heat of the heat source and conduct the heat to the board upper cover 21 and then to the blade member 1, improving the heat dissipation effect on the heat source.

[0041] The VC substrate 2 includes a plurality of board support columns, and each board support column is arranged at intervals correspondingly. The two ends of the board support column are respectively arranged in butt joint with the upper board cover 21 and the lower board cover 22. In this way, under the action of the board support column, the bearing capacity of the upper board cover 21 and the lower board cover 22 is improved, so as to improve the deformation resistance of the upper board cover 21 and the lower board cover 22, and further improve the service life of the VC substrate 2.

[0042] The non-soldering type 3D VC heat sink includes a plurality of copper tubes 3, and each copper tube 3 is arranged at intervals correspondingly along both sides of the blade member 1. The lower part of the copper tube 3 is arranged in butt joint with the upper board cover 21, and the upper part of the copper tube 3 extends in the direction away from the upper board cover 21. A tube cavity is formed inside the copper tube 3, and the tube cavity is arranged in communication with the board cavity.

[0043] In this way, during heat dissipation, the VC substrate 2 absorbs heat and conducts it to the blade member 1 and each copper tube 3. Under the combined action of the blade member 1 and each copper tube 3, the heat dissipation paths are increased, and the heat interaction area is also increased, facilitating the dissipation of heat into the air, thereby improving the heat dissipation effect and efficiency.

[0044] A tube capillary layer is laid on the inner wall of the copper tube 3, and the tube capillary layer is used for conducting heat. The tube capillary layer is arranged in coherent butt joint and integrally formed with the upper board capillary layer 23. Under the action of the tube capillary layer, it helps to reduce the thermal resistance and facilitate the conduction of heat, thereby improving the heat dissipation effect and efficiency.

[0045] The non-soldering type 3D VC heat sink includes a plurality of blade members 1, and each blade member 1 is respectively in diffusion welding butt joint with the VC substrate 2, and the blade cavities of each blade member 1 are synchronously arranged in communication with the board cavity. In this way, through the cooperation of each blade member 1, the heat interaction area is greatly increased, facilitating the dissipation of heat into the air, thereby improving the heat dissipation effect and efficiency.

[0046] The number of blade members 1 can be one, two, or three. Based on the heat dissipation requirements, different numbers of blade members 1 are selected.

[0047] Of course, a plurality of blade members 1 and copper tubes 3 can also be combined, increasing the heat dissipation paths and the heat interaction area, facilitating the dissipation of heat into the air, thereby improving the heat dissipation effect and efficiency.

[0048] The above are only the preferred embodiments of the present invention, and are not used to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. Non-soldering 3DVC heat sink, characterized in that: It includes a blade member and a VC substrate, the blade member is arranged in a flat shape, a blade cavity is formed inside the blade member, and a plate cavity is formed inside the VC substrate, the lower part of the blade member is diffusion-welded to the VC substrate, the upper part of the blade member is extended in a direction away from the VC substrate, and the blade cavity is connected to the plate cavity.

2. The non-soldering 3DVC heat sink according to claim 1, characterized in that: The blade component includes an upper cover and a lower cover, the upper cover and the lower cover are diffusion welded together, and the blade cavity is formed between the upper cover and the lower cover; the upper cover and the lower cover are respectively arranged in a flat shape, and the upper cover and the lower cover are respectively used for heat exchange.

3. The non-soldering 3DVC heat sink according to claim 2, characterized in that: The blade component includes an on-sheet capillary layer and a under-sheet capillary layer, the on-sheet capillary layer is paved on the inner wall of the upper cover, the under-sheet capillary layer is paved on the inner wall of the lower cover, the on-sheet capillary layer and the under-sheet capillary layer are butt-jointed and integrally formed, and the on-sheet capillary layer and the under-sheet capillary layer are respectively used for conducting heat.

4. The non-soldering 3DVC heat sink according to claim 2, characterized in that: The blade member comprises a plurality of blade support columns, each of which is arranged in a spaced-apart manner, and two ends of the blade support columns are respectively arranged to be butted with the upper blade cover and the lower blade cover.

5. The non-soldering 3DVC heat sink according to claim 3, characterized in that: The VC substrate comprises a plate upper cover having a plate cover surface, and the plate cover surface is arranged horizontally; the bottom of the upper plate cover forms a plate upper surface, and the bottom of the lower plate cover forms a plate lower surface, and the upper plate surface and the lower plate surface are respectively laid flat with the plate cover surface and are diffusion welded.

6. The non-soldering 3DVC heat sink according to claim 5, characterized in that: The VC substrate includes an on-board capillary layer, which is laid on the inner wall of the on-board cover and is used to conduct heat. The on-board capillary layer is synchronously connected with the on-chip capillary layer and the under-chip capillary layer and is arranged in an integral manner.

7. The non-soldering 3DVC heat sink according to claim 6, characterized in that: The VC substrate includes an under-board cover and an under-board capillary layer. The upper board cover and the under-board cover are butted together by diffusion welding in the up-down direction. The under-board capillary layer is laid on the inner wall of the under-board cover. The under-board capillary layer is used for conducting heat. The upper board capillary layer and the under-board capillary layer are butted together and arranged as an integral unit.

8. The non-soldering 3DVC heat sink according to claim 7, characterized in that: The VC substrate comprises a plurality of board support columns, each of which is arranged in a spaced relationship, and two ends of the board support columns are respectively butted with the board upper cover and the board lower cover.

9. The non-soldering 3DVC heat sink according to any one of claims 5 to 8, characterized in that: The non-soldering 3DVC heat sink includes a plurality of copper tubes, each of which is arranged at intervals and in correspondence along both sides of the blade member, the lower portion of the copper tube is butt-jointed with the plate cover, and the upper portion of the copper tube is extended in a direction away from the plate cover; a tube cavity is formed inside the copper tube, and the tube cavity is connected with the plate cavity.

10. The non-soldering 3DVC heat sink according to claim 9, characterized in that: The inner wall of the copper tube is paved with a tube capillary layer, the tube capillary layer is used to conduct heat, and the tube capillary layer is connected and connected with the capillary layer on the board and is arranged in an integral manner.

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