Water cooling assembly and electronic device with same

Abstract

A water cooling assembly is used for solving the problem that a pipeline of an existing water cooling assembly is affected by heat conduction and is poor in heat dissipation efficiency. The water cooling plate is provided with a heat absorption area, a cold water area and a heat insulation part located between the heat absorption area and the cold water area, and the outer surface of the heat absorption area is connected with a heat source; and the pump module is provided with an inlet end communicated with the cold water area and an outlet end communicated with the heat absorption area, the pump module is used for driving a working liquid to flow from the cold water area to the heat absorption area through the pump module, and the working liquid absorbs heat energy generated by the heat source. The utility model further discloses an electronic device with the water cooling assembly. Therefore, the effect of improving the heat dissipation efficiency can be achieved.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module, in particular to a water cooling component which blocks heat between cold and hot water pipes to improve the cooling efficiency, and an electronic device having the water cooling component. Background Art

[0002] Existing lightweight, compact and high-performance electrical products, such as laptops, are prone to overheating and crashing when used for a long time or running at high efficiency, and even damage electrical components and shorten their service life. In order to dissipate heat in a limited installation space, a heat conductive plate is usually attached to the surface of the heating element with a heat conductive adhesive or a heat conductive medium, and then a fan module and the heat conductive plate are connected through a heat conductive pipe, so that the heat energy generated by the heating element is conducted through the heat conductive plate and the heat conductive pipe, and finally the fan module discharges the heat energy. Another existing heat dissipation method uses a water cooling module, which promotes the circulation of liquid and transfers heat energy through a pump, and can take away more heat energy than air cooling under the same conditions to improve heat dissipation efficiency.

[0003] The above-mentioned existing water-cooling assembly combines a copper tube along the shape of the heat-conducting plate and the heat-conducting tube, and then drives the coolant to flow in the copper tube by a pump to absorb and take away heat energy. In addition, the inlet and outlet ends of the copper tube can be externally connected to a water tank, a fan, a water-cooling radiator or other heat dissipation device, and the heat dissipation device cools the high-temperature coolant so that the low-temperature coolant can re-enter the copper tube for circulation and heat absorption. However, in electrical appliances with limited installation space, the copper tube of the existing water-cooling assembly must be flattened and tightly arranged to compress the thickness of the water-cooling assembly and increase the heat conduction area. In this way, the front and rear sections of the copper tube will be compressed in the same space without being separated and insulated, resulting in the heat energy absorbed by the copper tube being heat-conducted to the lower temperature section of the copper tube before being released for cooling, thereby reducing the heat energy that can be taken away by the copper tube, and reducing the heat dissipation efficiency of the existing water-cooling assembly.

[0004] In view of this, the existing water cooling components still need to be improved. Utility Model Content

[0005] In order to solve the above problems, the purpose of the utility model is to provide a water cooling component that can improve the heat dissipation efficiency.

[0006] Another object of the present invention is to provide a water cooling assembly that can save installation space.

[0007] Another object of the present invention is to provide an electronic device that can achieve better heat dissipation efficiency in a limited space.

[0008] As used throughout this utility model, directional terms or their approximate terms, such as "upper (top)", "inner", "outer", "side", etc., mainly refer to the direction of the attached drawings. Each directional term or its approximate term is only used to assist in the explanation and understanding of the embodiments of this utility model, and is not used to limit this utility model.

[0009] Throughout this utility model, the quantifier "a" is used for the components and elements described, only for convenience and to provide the general meaning of the scope of this utility model; in this utility model, it should be interpreted as including one or at least one, and the concept of a single one also includes the case of multiple ones, unless it clearly means otherwise.

[0010] As used throughout this utility model, approximate terms such as "combined", "assembled", or "assembled together" mainly include forms where the components can still be separated without being damaged after connection, or forms where the components cannot be separated after connection. Those skilled in the art can choose according to the material of the components to be connected or the assembly requirements.

[0011] The water cooling component of this utility model includes: a water cooling plate having a heat absorption area, a cold water area, and a heat insulation part located between the heat absorption area and the cold water area, with a heat source connected to the outer surface of the heat absorption area; and a pump module having an inlet end communicating with the cold water area and an outlet end communicating with the heat absorption area. The pump module drives a working liquid to flow from the cold water area through the pump module to the heat absorption area, and the working liquid absorbs the heat energy generated by the heat source.

[0012] Therefore, for the water cooling component of this utility model and the electronic device having the water cooling component, by forming the heat insulation part between the heat absorption area and the cold water area of the water cooling plate, the heat conduction phenomenon between the heat absorption area and the cold water area can be blocked, avoiding the transfer of heat energy from the higher-temperature heat absorption area to the lower-temperature cold water area, and enabling the heat energy absorbed by the heat absorption area to be effectively discharged outside the water cooling component, thus having the effect of improving the heat dissipation efficiency.

[0013] Among them, the cooled working liquid enters the cold water area through a water inlet of the cold water area, absorbs heat energy in the heat absorption area, and is discharged through a water drainage port of the heat absorption area. In this way, the working liquid can absorb the heat energy generated by the heat source, release the heat energy outside the water cooling plate, and then return to the circulation channel of the water cooling plate again, having the effect of cooling by using the circulation of the working fluid.

[0014] Among them, the distance between the heat absorption area and the cold water area is a first width, and the distance of the heat insulation part from the end adjacent to the heat absorption area to the end adjacent to the cold water area is a second width. The second width is less than or equal to the first width, and the second width is greater than or equal to one-fourth of the first width. In this way, the heat insulation part can separate the heat absorption area and the cold water area, having the effect of reducing the transfer of heat energy in the water cooling plate.

[0015] Among them, the heat insulation part includes a plurality of spacer units, the plurality of spacer units are distributed between the heat absorption area and the cold water area, and the total area of the plurality of spacer units is greater than or equal to one-fourth of the area of the water cooling plate between the heat absorption area and the cold water area. In this way, the plurality of spacer units can cooperate with the shapes and configurations of the heat absorption area and the cold water area, and can also form a multi-layer heat insulation structure, which has the effects of improving the heat insulation effect and increasing the space applicability.

[0016] Among them, the heat insulation part is an air layer or a vacuum layer. In this way, air or vacuum can block the transfer of heat energy, which has the effect of improving the heat insulation performance.

[0017] Among them, the heat insulation part is a heat insulation layer filled with a heat insulating material, and the heat insulating material is a material with low thermal conductivity. In this way, the heat insulating material can reduce the thermal conductivity of the heat insulation part, which has the effect of improving the heat insulation performance.

[0018] Among them, the heat insulation part is at least one through hole on the water cooling plate. In this way, the at least one through hole can be located between the heat absorption area and the cold water area, which has the effect of reducing the transfer of heat energy in the water cooling plate.

[0019] Among them, the at least one through hole is an independent hollow hole. In this way, the area of the water cooling plate can be reduced, which has the effect of reducing the weight of the water cooling plate.

[0020] Among them, the at least one through hole is a groove notch extending inward from the edge of the water cooling plate. In this way, the occupied space of the water cooling plate can be reduced, which has the effect of improving the installation convenience.

[0021] The water cooling component of the present utility model may further include a heat conducting member, and the water cooling plate is connected to the heat source through the heat conducting member. In this way, the heat energy generated by the heat source can be indirectly transferred to the working liquid in the water cooling plate through the heat conducting member, which has the effects of enabling the heat energy to be transferred through the heat conducting member and increasing the heat transfer range.

[0022] Among them, the heat conducting member has a heat conducting tube and a heat conducting plate. The first end of the heat conducting tube is attached to the surface of the water cooling plate and corresponds to the position of the heat absorption area, and the heat conducting plate is connected to the second end of the heat conducting tube exposed outside the water cooling plate range, and the heat source is attached to the heat conducting plate. In this way, the heat conducting tube can extend the heat transfer distance, and the heat conducting plate can increase the heat transfer area, which has the effects of increasing the heat dissipation positions and the number of heat dissipations.

[0023] Among them, a groove is formed on the surface of the water cooling plate, and the first end of the heat conducting tube is embedded in the groove. In this way, the heat conduction area between the water cooling plate and the heat conducting member can be increased, and the laminated thickness can also be reduced, which has the effects of improving the heat dissipation efficiency and saving the installation space.

[0024] The electronic device of the present utility model is provided with the above-mentioned water cooling assembly. The heat absorption area of the water cooling plate is used to connect to a heat source, which is a heating element of the electronic device. In this way, after the heat absorption area absorbs the heat energy of the heating element, the heat insulation part can prevent the heat energy from being transferred to the cold water area, thereby improving the heat dissipation efficiency of the electronic device and saving the installation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 : Exploded perspective view of the first embodiment of the present utility model;

[0026] Figure 2 : Combined top view of the first embodiment of the present utility model;

[0027] Figure 3 : Cross-sectional view taken along the A-A line of Figure 2 ;

[0028] Figure 4 : Another sectional view of the embodiment as shown in Figure 3 ;

[0029] Figure 5 : Combined top view of the second embodiment of the present utility model;

[0030] Figure 6 : Combined top view of the third embodiment of the present utility model;

[0031] Figure 7 : Another top view of the embodiment as shown in Figure 6 ;

[0032] Figure 8 : Exploded perspective view of the fourth embodiment of the present utility model;

[0033] Figure 9 : Combined top view of the fourth embodiment of the present utility model.

[0034] Description of the reference numerals:

[0035] 1: Water cooling plate

[0036] 1a: Substrate

[0037] 1b: Cover plate

[0038] 1c: Groove

[0039] 11: Heat absorption area

[0040] 11a: Drainage port

[0041] 12: Cold water area

[0042] 12a: Water inlet

[0043] 13: Heat insulation part

[0044] 131: Spacing unit

[0045] 2: Pump module

[0046] 21: Inlet end

[0047] 22: Outlet end

[0048] 23: Impeller

[0049] 24: Housing

[0050] 3: Heat conducting member

[0051] 31: Heat conducting tube

[0052] 31a: First end

[0053] 31b: Second end

[0054] 32: Heat conducting plate

[0055] H: Heat source

[0056] W1: First width

[0057] W2: Second width

[0058] S: Accommodating space. Detailed implementation manners

[0059] To make the above and other objects, features and advantages of the present utility model more obvious and understandable, the following specifically gives preferred embodiments of the present utility model and makes detailed descriptions in conjunction with the accompanying drawings; in addition, the same symbols marked in different drawings are regarded as the same and their descriptions will be omitted.

[0060] Please refer to Figure 1 and Figure 2 As shown, it is the first embodiment of the water cooling assembly of the present utility model, including a water cooling plate 1 and a pump module 2. The pump module 2 is communicated with the flow channel of the water cooling plate 1 to drive the working liquid to flow inside the water cooling plate 1.

[0061] The water cooling plate 1 has a heat absorption area 11 and a cold water area 12. The heat absorption area 11 and the cold water area 12 respectively form part of the flow channels in the water cooling plate 1. The heat absorption area 11 and the cold water area 12 respectively have liquid storage spaces for accommodating working liquid and allowing the working liquid to flow. For example, a heat source H is attached to the surface of the water cooling plate 1 with a heat-conducting adhesive or heat-conducting medium and at a position corresponding to the heat absorption area 11, so that the heat energy generated by the heat source H is transferred to the working liquid in the heat absorption area 11. The heat absorption area 11 can be connected to an external radiator (not shown) through a drain port 11a to send the working liquid that absorbs heat energy in the heat absorption area 11 to the radiator for cooling; and the cold water area 12 can be connected to the radiator through a water inlet 12a to allow the cooled working liquid to enter the cold water area 12. Among them, the heat source H can be a heating element of an electronic device, and the water cooling plate 1 is installed on the electronic device.

[0062] In addition, the water cooling plate 1 further has a heat insulation portion 13 located between the heat absorption area 11 and the cold water area 12. Among them, the interval distance between the heat absorption area 11 and the cold water area 12 is a first width W1, and the distance of the heat insulation portion 13 from one end adjacent to the heat absorption area 11 to the other end adjacent to the cold water area 12 is a second width W2. The second width W2 is less than or equal to the first width W1, and preferably the second width W2 is greater than or equal to one-fourth of the first width W1. In this way, the heat absorption area 11 and the cold water area 12 can accommodate working liquids at different temperatures, and the heat conduction phenomenon between the heat absorption area 11 and the cold water area 12 can be blocked by the heat insulation portion 13 to avoid the transfer of heat energy from the higher-temperature heat absorption area 11 to the lower-temperature cold water area 12 and reduce the water cooling efficiency. The heat insulation portion 13 has the effect of improving the heat dissipation performance of the water cooling plate 1. Since the heat absorption area 11, the cold water area 12 and the heat insulation portion 13 are all formed within the components of the water cooling plate 1, rather than forming additional pipeline components or spaces separately, the water cooling plate 1 can simplify the combined structure and reduce the volume.

[0063] Please refer to again Figure 3 and Figure 4 As shown, in this embodiment, the water cooling plate 1 is formed by relatively laminating a base plate 1a and a cover plate 1b. Multiple grooves can be formed on the base plate 1a, and the openings of the multiple grooves face the cover plate 1b; alternatively, multiple grooves are formed on the cover plate 1b, and the openings of the multiple grooves face the base plate 1a; or, multiple grooves corresponding in position and shape are respectively formed on the opposite surfaces of the base plate 1a and the cover plate 1b. When the base plate 1a and the cover plate 1b are laminated, a liquid storage space for the heat absorption area 11 and the cold water area 12, and an isolation space for the heat insulation portion 13 are formed between the base plate 1a and the cover plate 1b. However, the present invention is not limited to the form of the water cooling plate 1 in this embodiment.

[0064] In addition, as Figure 3 shown, the heat insulation portion 13 can be an air layer or a vacuum layer, or, as Figure 4 shown, the heat insulation portion 13 can be a heat insulation layer filled with heat insulating material, and the heat insulating material is a material with low thermal conductivity, such as: polyimide, glass fiber, aerogel or their composite materials, etc.

[0065] Please refer to Figure 1 and Figure 2 shown, the pump module 2 has an inlet end 21 communicating with the cold water area 12, and an outlet end 22 communicating with the heat absorption area 11, so that the heat absorption area 11 and the cold water area 12 are not directly communicated, but are indirectly communicated through the pump module 2 to form a complete flow channel for the working liquid to flow smoothly. An impeller 23 of the pump module 2 is located between the inlet end 21 and the outlet end 22. When the impeller 23 rotates, it can suck the cooling working liquid in the cold water area 12 through the inlet end 21, and then push the working liquid through the outlet end 22 into the heat absorption area 11. The pump module 2 can prevent the heat energy in the heat absorption area 11 from being transferred back to the cold water area 12 by means of convective heat transfer.

[0066] Preferably, the pump module 2 shares the base plate 1a or the cover plate 1b with the water cooling plate 1, so that the pump module 2 can be integrated into the water cooling plate 1 to save the installation space occupied by the pump module 2. In this embodiment, the water cooling plate 1 can have a receiving space S, and the pump module 2 can have a housing 24. The housing 24 is combined with the opening of the receiving space S of the water cooling plate 1, so that the housing 24 covers the receiving space S of the water cooling plate 1. The receiving space S can communicate with the heat absorption area 11 and the cold water area 12 respectively, and the impeller 23 of the pump module 2 is located in the receiving space S. In addition, the impeller 23 can be a centrifugal impeller. After the cooling working liquid in the cold water area 12 enters the receiving space S, the impeller 23 will suck the working liquid axially and then introduce the working liquid into the heat absorption area 11 in the centrifugal direction. As Figure 1 shown, the opening of the receiving space S can be located on the cover plate 1b. However, the opening of the receiving space S can also be located on the base plate 1a on the other side of the water cooling plate 1, that is, the housing 24 can also be combined with the base plate 1a, or the housing 24 is integrally formed and connected with the water cooling plate 1. The present invention is not limited to the form of the pump module 2 in this embodiment.

[0067] Please refer to Figure 5As shown, this is the second embodiment of the water-cooling component of the present utility model. This embodiment is substantially the same as the above-mentioned first embodiment. In this embodiment, the heat insulation part 13 can be a plurality of spaced units 131 located in the water-cooling plate 1, and the plurality of spaced units 131 are distributed between the heat absorption area 11 and the cold water area 12. The shape and distribution position of each spaced unit 131 can be adjusted according to the shape and configuration of the heat absorption area 11 and the cold water area 12. And the heat insulation part 13 forms a multi-layer heat insulation structure through the plurality of spaced units 131, which can maximize the function of the heat insulation part 13 to block heat conduction. Among them, the total area of the plurality of spaced units 131 is preferably greater than or equal to one-fourth of the area of the water-cooling plate 1 between the heat absorption area 11 and the cold water area 12.

[0068] Please refer to Figure 6 and Figure 7 As shown, this is the third embodiment of the water-cooling component of the present utility model. This embodiment is substantially the same as the above-mentioned first embodiment. In this embodiment, the heat insulation part 13 can be at least one through hole on the water-cooling plate 1. A part of the block of the water-cooling plate 1 is hollowed out between the heat absorption area 11 and the cold water area 12 to form the at least one through hole. As Figure 6 shown, the at least one through hole can be an independent hollow hole; in addition, as Figure 7 shown, the at least one through hole can be a groove notch extending inward from the edge of the water-cooling plate 1.

[0069] Please refer to Figure 8 and Figure 9As shown, this is the fourth embodiment of the water-cooling component of the present utility model. This embodiment is substantially the same as the above-mentioned first embodiment. In this embodiment, there is also a heat-conducting member 3. The water-cooling plate 1 is connected to the heat source H through the heat-conducting member 3. The heat-conducting member 3 may include a heat-conducting tube 31 and a heat-conducting plate 32 made of a material with a high heat conductivity. One first end 31a of the heat-conducting tube 31 is attached to the surface of the base plate 1a or the cover plate 1b of the water-cooling plate 1 with heat-conducting glue or heat-conducting medium and corresponds to the position of the heat-absorbing area 11, or the first end 31a is directly welded to the water-cooling plate 1. Preferably, a groove 1c can be formed on the surface of the water-cooling plate 1 so that the first end 31a can be embedded in the groove 1c, which can increase the heat-conduction area between the water-cooling plate 1 and the heat-conducting member 3 and can also reduce the stacking thickness to save the installation space. In addition, the heat-conducting plate 32 is connected to a second end 31b of the heat-conducting tube 31 that exposes outside the water-cooling plate 1. The heat source H is attached to the heat-conducting plate 32 with heat-conducting glue or heat-conducting medium, so that the heat energy generated by the heat source H can be transferred to the working liquid in the heat-absorbing area 11 through the heat-conducting plate 32 and the heat-conducting tube 31. In this way, by selecting the extension and bending form of the heat-conducting tube 31, the heat source H located outside the range of the water-cooling plate 1 can be dissipated, and the heat-conducting plate 32 can increase the heat-dissipating area. Even if there are multiple heat sources H, it is not limited by the position and limited space of the heat-absorbing area 11 of the water-cooling plate 1. The heat-conducting member 3 has the functions of convenient installation and expanding the heat-dissipating application range.

[0070] In summary, for the water-cooling component of the present utility model and the electronic device having the water-cooling component, by forming the heat-insulating portion between the heat-absorbing area and the cold-water area of the water-cooling plate, the heat-conduction phenomenon between the heat-absorbing area and the cold-water area can be blocked, so as to avoid the transfer of heat energy from the higher-temperature heat-absorbing area to the lower-temperature cold-water area, and make the heat energy absorbed by the heat-absorbing area be effectively discharged outside the water-cooling component, having the effect of improving the heat-dissipating efficiency.

[0071] Although the present utility model has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit the present utility model. Those skilled in the art can make various changes and modifications to the above-mentioned embodiments without departing from the spirit and scope of the present utility model, which still belong to the technical scope protected by the present utility model. Therefore, the protection scope of the present utility model should be defined by the claims.

Claims

1. A water cooling component, characterized in that: include: A water-cooled plate having a heat absorbing area, a cold water area and a heat insulating portion located between the heat absorbing area and the cold water area, wherein an outer surface of the heat absorbing area is connected to a heat source; and A pump module has an inlet end connected to the cold water zone and an outlet end connected to the heat absorption zone. The pump module is used to drive a working liquid to flow from the cold water zone through the pump module to the heat absorption zone, and the working liquid absorbs the heat energy generated by the heat source.

2. The water cooling assembly according to claim 1, characterized in that: The cooled working fluid enters the cold water zone through a water inlet of the cold water zone, and the working fluid absorbs heat energy in the heat absorption zone and is discharged through a drain outlet of the heat absorption zone.

3. The water cooling assembly according to claim 1, characterized in that: The spacing distance between the heat absorption zone and the cold water zone is a first width, and the distance between the heat insulation part from one end adjacent to the heat absorption zone to the other end adjacent to the cold water zone is a second width, the second width is less than or equal to the first width, and the second width is greater than or equal to one quarter of the first width.

4. The water cooling assembly according to claim 1, characterized in that: The heat insulation part includes a plurality of spacer units, which are distributed between the heat absorption zone and the cold water zone, and the total area of ​​the plurality of spacer units is greater than or equal to one quarter of the area of ​​the water cooling plate between the heat absorption zone and the cold water zone.

5. The water cooling assembly according to claim 1, characterized in that: The heat insulating portion is an air layer or a vacuum layer.

6. The water cooling assembly according to claim 1, characterized in that: The heat insulating part is a heat insulating layer filled with a heat insulating material, and the heat insulating material is a material with low thermal conductivity.

7. The water cooling assembly according to claim 1, characterized in that: The heat insulating portion is at least one through hole on the water cooling plate.

8. The water cooling assembly according to claim 7, characterized in that: The at least one through hole is an independent hollow hole.

9. The water cooling assembly according to claim 7, characterized in that: The at least one through hole is a groove notch extending inward from the plate edge of the water cooling plate.

10. The water cooling assembly according to any one of claims 1 to 9, characterized in that: A heat conducting member is also included, and the water cooling plate is connected to the heat source via the heat conducting member.

11. The water cooling assembly according to claim 10, characterized in that: The heat conducting member comprises a heat conducting pipe and a heat conducting plate. The first end of the heat conducting pipe is used to be attached to the surface of the water cooling plate and corresponds to the position of the heat absorption zone. The heat conducting plate is connected to the second end of the heat conducting pipe exposed from the water cooling plate. The heat source is attached to the heat conducting plate.

12. The water cooling assembly according to claim 11, characterized in that: A groove is formed on the surface of the water cooling plate, and the first end of the heat conducting pipe is embedded in the groove.

13. An electronic device having a water cooling assembly according to any one of claims 1 to 12, characterized in that: The heat source connected to the heat absorption area of ​​the water cooling plate is a heating element of the electronic device.

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