Three-dimensional heat dissipation device
By designing a three-dimensional heat dissipation device, using hollow fin sets and loose heat exchange auxiliary gain structures, the problems of bloated body size and reduced heat exchange performance of traditional radiators are solved, and efficient heat dissipation under miniaturized design is achieved.
Patent Information
- Application Number
- CN202422063330.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-23
AI Technical Summary
Traditional radiators are bloated in size, take up a large space, and their heat exchange performance is reduced after shrinking the volume, resulting in failure of heat dissipation performance.
A three-dimensional heat dissipation device is designed, including a base, a fin set, a cover plate and a heat exchange auxiliary gain structure. The fin set is a hollow structure, the heat exchange auxiliary gain structure is a loose structure, the surface is rough and there are many irregular holes in the interior, which are used to improve heat exchange performance.
It realizes the maintenance or improvement of heat exchange performance under a miniaturized design, solves the problem of large space occupancy of traditional radiators, and achieves rapid heat dissipation.
Smart Images
Figure CN222965638U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a three-dimensional heat dissipation device. Background Art
[0002] With the development of the electronic industry, the computing speed of electronic components such as central processing units has increased significantly, and the heat generated by them has also increased sharply. In order to ensure the normal operation of electronic components, a heat dissipation device is usually installed on them to dissipate the heat of the electronic components.
[0003] However, traditional radiators are bulky and occupy a large space. Under the premise that the volume of electronic products is developing towards being thinner, lighter and smaller, traditional radiators cannot adapt to this miniaturization development. If the volume of the traditional radiator is simply reduced accordingly, the heat exchange performance of the radiator will be reduced, resulting in the problem of the failure of the heat dissipation efficiency of the radiator.
[0004] Therefore, how to design a three-dimensional heat dissipation device that can solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, while improving the heat exchange performance and realizing rapid heat dissipation. Summary of the Utility Model
[0005] Aiming at the deficiencies of the prior art, the utility model provides a three-dimensional heat dissipation device, which can solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, while improving the heat exchange performance and realizing rapid heat dissipation.
[0006] The purpose of the utility model is achieved by the following technical solutions:
[0007] A three-dimensional heat dissipation device, which includes: a base, a fin group, a cover plate and a heat exchange auxiliary gain structure. A cavity is opened on the base, the cover plate is covered on the cavity of the base, the fin group is arranged on the cover plate, and the heat exchange auxiliary gain structure is accommodated in the cavity;
[0008] The fin group includes a plurality of heat dissipation fins arranged side by side. A hollow thin cavity is opened in the heat dissipation fin. The hollow thin cavity forms an access port at the edge of the heat dissipation fin. The hollow thin cavity is communicated with the cavity through the access port;
[0009] Working liquid is arranged in the cavity and the hollow thin cavity;
[0010] The heat exchange auxiliary gain structure is a porous structure, its surface is rough and there are several irregularly shaped holes inside.
[0011] In one embodiment, the heat exchange auxiliary gain structure is an aluminum powder plate structure.
[0012] In one embodiment, the thickness of the heat exchange auxiliary gain structure is 2-3 mm, the mesh size is 30-50, and the diameter of the hole is 0.24-0.69 mm.
[0013] In one embodiment, the heat exchange auxiliary gain structure is a hollow mesh metal plate structure, and the material of the heat exchange auxiliary gain structure is an aluminum-based alloy or a copper-based alloy.
[0014] In one of the embodiments, the heat exchange auxiliary gain structure is a nickel foam structure.
[0015] In one of the embodiments, a protrusion is provided at the connecting port of the heat sink fin. During assembly, the protrusion passes through the cover plate and extends into the cavity. The protrusion and the heat exchange auxiliary gain structure are abutted against each other, and the heat exchange auxiliary gain structure is pressed against the inner wall of the cavity.
[0016] In one of the embodiments, a plurality of supporting bosses are provided in the cavity of the base, and the cover plate is pressed on the supporting bosses; a through hole adapted to the supporting bosses is opened on the heat exchange auxiliary gain structure, and during assembly, the supporting bosses pass through the through holes of the heat exchange auxiliary gain structure.
[0017] In one of the embodiments, the cover plate is provided with a positioning hole adapted to the access port. During assembly, the heat sink fin is plugged into the positioning hole, and the heat sink fin is welded to the cover plate.
[0018] In one of the embodiments, two receiving ports are provided on the same heat sink fin, and the two receiving ports are distributed at different heights. During operation, the working liquid covers the receiving port at the lower position.
[0019] In summary, the three-dimensional heat dissipation device of the present invention can solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, while improving the heat exchange performance and achieving rapid heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0021] Figure 1 It is a structural schematic diagram of the three-dimensional heat dissipation device of the utility model;
[0022] Figure 2 It is an exploded schematic diagram of the three-dimensional heat dissipation device of the utility model;
[0023] Figure 3 for Figure 2 The schematic diagram of the structure of the base, cover plate and heat exchange auxiliary gain structure shown;
[0024] Figure 4 is Figure 2 a schematic structural view of the heat dissipation fins shown;
[0025] Figure 5 is a schematic plan view of the three-dimensional heat dissipation device before assembly;
[0026] Figure 6 is a schematic partial state view of the three-dimensional heat dissipation device during use. Specific embodiments
[0027] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. It should be noted that the structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limited conditions under which the present utility model can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present utility model can produce and the purposes that can be achieved, should still fall within the scope covered by the technical content disclosed in the present utility model. At the same time, the terms such as "upper", "lower", "left", "right", and "middle" used in this specification are only for the convenience of clear narration, and are not used to limit the scope under which the present utility model can be implemented. The change or adjustment of their relative relationship. Without substantial change in the technical content, it should also be regarded as the scope within which the present utility model can be implemented.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the specification of the present utility model herein are only for the purpose of describing specific embodiments, and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0029] The present utility model provides a three-dimensional heat dissipation device 1, as Figure 1 and Figure 2 shown, which includes: a base 100, a fin group 200, a cover plate 300, and a heat exchange auxiliary gain structure 400. A cavity 110 is formed on the base 100. The cover plate 300 is covered on the cavity 110 of the base 100. The fin group 200 is arranged on the cover plate 300. The heat exchange auxiliary gain structure 400 is received in the cavity 110.
[0030] Among them, as Figure 2As shown, the fin group 200 includes a plurality of heat dissipation fins 210 arranged side by side. A hollow thin cavity (not shown in the figure) is formed inside the heat dissipation fin 210. That is to say, the heat dissipation fin 210 is a hollow structure. And, the hollow thin cavity forms an access port 211 at the edge of the heat dissipation fin 210 (as Figure 4 shown), and the hollow thin cavity is connected to the cavity 110 through the access port 211. A working liquid such as pure water or refrigerant is provided in the cavity 110 and the hollow thin cavity. During use, the working liquid will conduct heat in the form of two-phase flow between the cavity 110 and the hollow thin cavity, that is, the working liquid will change between liquid and gas states, so as to achieve rapid heat dissipation (its working principle will be described below).
[0031] The heat exchange auxiliary gain structure 400 is a loose and porous structure, its surface is rough and there are several irregularly shaped holes inside. The heat exchange auxiliary gain structure 400 is provided to change the surface roughness of the inner wall of the cavity 110. The number of effective nucleation sites increases with the increase of the surface roughness, and at the same time the boiling heat transfer coefficient also increases. The heat exchange auxiliary gain structure 400 can help increase the number of effective nucleation sites, thereby promoting the circulation of the working liquid and improving the heat dissipation rate.
[0032] In this embodiment, as Figure 3 shown, the cover plate 300 is provided with a positioning hole 310 adapted to the access port 211. During assembly, the heat dissipation fin 210 is inserted into the positioning hole 310, and the heat dissipation fin 210 is welded to the cover plate 300. Preferably, two access ports 211 are provided on the same heat dissipation fin, and the two access ports 211 are distributed at different heights. During operation, the working liquid covers the access port 211 at the lower position.
[0033] Combined with the above, the working principle of the three-dimensional heat dissipation device 1 of the present invention will be described with reference to Figure 5 and Figure 6 :
[0034] A working liquid is provided in the cavity 110 and the hollow thin cavity. The working liquid only occupies part of the space. For the convenience of subsequent description, the area occupied by the working liquid in the hollow thin cavity is now called the evaporation area, and the area without the working liquid is called the condensation area. The evaporation area is located below the condensation area;
[0035] During operation, an external heat source is attached to the base 100. The external heat source heats the base 100, and the base 100 then transfers the heat to the heat exchange auxiliary enhancement structure 400, and there is a working liquid within the heat exchange auxiliary enhancement structure 400. Subsequently, due to the porous characteristics of the heat exchange auxiliary enhancement structure 400, the effects of pool boiling and nucleate boiling are generated, which increases the boiling efficiency of the working liquid changing from liquid to gas state. The gaseous working liquid rises to the condensation area of the hollow thin cavity, and the heat is quickly dissipated to the outside through the heat dissipation fins 210. After heat release, the gaseous working liquid condenses back into the liquid working liquid within the heat dissipation fins 210, and the liquid working liquid then drips back to the evaporation area within the cavity 110 under the action of gravity and then flows back, thus realizing the cycle.
[0036] The heat exchange auxiliary enhancement structure 400 is closely attached to the inner wall of the evaporation area of the cavity 110. The heat absorbed by the base 100 will be preferentially transferred to the evaporation area. Since the liquid working liquid within the cavity 110 has infiltrated the heat exchange auxiliary enhancement structure 400 (the working liquid penetrates into the internal porous heat exchange auxiliary enhancement structure 400), the evaporation area is changed from the original smooth surface to a rough surface with a plurality of pores through the heat exchange auxiliary enhancement structure 400. The plurality of small holes of the heat exchange auxiliary enhancement structure 400 can individually and quickly heat the working liquid in contact with it, by means of the heat exchange efficiency of generating pool boiling and nucleate boiling; therefore, the number of effective nucleation points is increased through the roughness of the heat exchange auxiliary enhancement structure 400, making the working liquid boil more violently when absorbing heat, and its boiling heat transfer coefficient also increases accordingly. The gaseous working liquid formed after boiling can quickly evaporate and diffuse towards the condensation area, thus rising and entering the condensation area of the hollow thin cavity. It can be seen that the heat exchange auxiliary enhancement structure 400 improves the boiling rate and boiling heat transfer coefficient of the working liquid, enhances the heat dissipation efficiency of the internal circulation, and thus enables the three-dimensional heat dissipation device 1 to obtain a good heat dissipation effect.
[0037] In this embodiment, the heat exchange auxiliary enhancement structure 400 is an aluminum powder plate structure, and the aluminum powder is sintered into a plate shape to form a fluffy and porous loose structure. Preferably, the mesh number of the heat exchange auxiliary enhancement structure 400 is 30 - 50, the porosity is about 75%, the aperture size of the holes is 0.24 - 0.69 mm, and the thickness of the heat exchange auxiliary enhancement structure 400 is 2 - 3 mm. After testing, the heat exchange auxiliary enhancement structure 400 of this structure can reduce the thermal resistance by about 0.039 °C / W, and its heat gain in the boiling state is about 3 °C.
[0038] In other embodiments, the heat exchange auxiliary enhancement structure 400 is a hollow reticulated metal plate structure, and its material is an aluminum-based alloy or a copper-based alloy. Of course, the heat exchange auxiliary enhancement structure 400 can also be an existing nickel foam structure, which all have the characteristics of being fluffy and porous and can have an adsorption effect on the working liquid.
[0039] Furthermore, in order to ensure stable heat transfer between the heat exchange auxiliary gain structure 400 and the base 100, the heat exchange auxiliary gain structure 400 needs to be as close to the base 100 as possible, and welding can be used to achieve the connection and fit. However, in actual use, it is found that the welding connection method is easy to cause the heat exchange auxiliary gain structure 400 to break. For this reason, the utility model also makes a special design. Specifically, the heat sink fin 210 has a protrusion 212 (such as Figure 4 During assembly, the protrusion 212 passes through the cover plate 300 and extends into the cavity 110, the protrusion 212 and the heat exchange auxiliary enhancement structure 400 abut against each other, and the heat exchange auxiliary enhancement structure 400 is pressed against the inner wall of the cavity 110 (as shown in FIG. Figure 6 shown).
[0040] Preferably, in order to prevent the heat exchange auxiliary enhancement structure 400 from shaking, a plurality of supporting convex columns 111 (such as Figure 3 As shown in FIG. 1 , the cover plate 300 is pressed against the support boss 111. The heat exchange auxiliary gain structure 400 is provided with a through hole 401 adapted to the support boss 111. During assembly, the support boss 111 passes through the through hole 401 of the heat exchange auxiliary gain structure 400. In this way, the support boss 111 cooperates with the protrusion 212 to enable the heat exchange auxiliary gain structure 400 to be stably attached to the inner wall of the cavity 110 without shaking. At the same time, the support boss 111 can also support the cover plate 300 to prevent the cover plate 300 from deformation.
[0041] In summary, the three-dimensional heat dissipation device 1 of the present invention can solve the technical problems of the traditional heat dissipation device being bulky and occupying a large space, while improving the heat exchange performance and achieving rapid heat dissipation.
[0042] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A three-dimensional heat dissipation device, characterized in that: include: A base, a fin group, a cover plate, and a heat exchange auxiliary gain structure, wherein the base is provided with a cavity, the cover plate is arranged on the cavity of the base, the fin group is arranged on the cover plate, and the heat exchange auxiliary gain structure is accommodated in the cavity; The fin group includes a plurality of heat dissipation fins arranged side by side, a hollow thin cavity is opened in the heat dissipation fin, a connecting port is formed at the edge of the heat dissipation fin, and the hollow thin cavity is connected with the cavity through the connecting port; Working liquid is provided in the cavity and the hollow thin cavity; The heat exchange auxiliary gain structure is a loose structure with a rough surface and a plurality of irregularly shaped holes inside.
2. The three-dimensional heat dissipation device according to claim 1, characterized in that: The heat exchange auxiliary gain structure is an aluminum powder plate structure.
3. The three-dimensional heat dissipation device according to claim 2, characterized in that: The thickness of the heat exchange auxiliary gain structure is 2-3 mm, the mesh number is 30-50, and the diameter of the hole is 0.24-0.69 mm.
4. The three-dimensional heat dissipation device according to claim 1, characterized in that: The heat exchange auxiliary gain structure is a hollow mesh metal plate structure, and the material of the heat exchange auxiliary gain structure is an aluminum-based alloy or a copper-based alloy.
5. The three-dimensional heat dissipation device according to claim 1, characterized in that: The heat exchange auxiliary gain structure is a nickel foam structure.
6. The three-dimensional heat dissipation device according to claim 1, characterized in that: A protrusion is provided at the receiving port of the heat dissipation fin. During assembly, the protrusion passes through the cover plate and extends into the cavity. The protrusion and the heat exchange auxiliary gain structure abut against each other and press the heat exchange auxiliary gain structure onto the inner wall of the cavity.
7. The three-dimensional heat dissipation device according to claim 6, characterized in that: A plurality of supporting bosses are arranged in the cavity of the base, and the cover plate is pressed on the supporting bosses; through holes matching with the supporting bosses are opened on the heat exchange auxiliary gain structure, and during assembly, the supporting bosses pass through the through holes of the heat exchange auxiliary gain structure.
8. The three-dimensional heat dissipation device according to claim 1, characterized in that: The cover plate is provided with a positioning hole matched with the access port. During assembly, the heat dissipation fin is plugged into the positioning hole, and the heat dissipation fin is welded to the cover plate.
9. The three-dimensional heat dissipation device according to claim 8, characterized in that: Two receiving ports are arranged on the same heat sink fin, and the two receiving ports are distributed at different heights. When working, the working liquid covers the receiving port at a lower position.