High-frequency miniature high-voltage capacitor

Abstract

The utility model relates to the technical field of capacitors, and discloses a high-frequency miniature high-voltage capacitor, which comprises a first electrode, a second electrode and a base film, a first metal spraying layer is arranged on the left side edge of the base film, a second metal spraying layer is arranged on the right side edge of the base film, the first metal spraying layer is connected with the first electrode, and the second metal spraying layer is connected with the second electrode; a plurality of edge metal coating belts, a plurality of middle metal coating belts and a plurality of non-coating belts are arranged on the base layer film; the edge metal coating strip is provided with a first thickening layer, and the middle metal coating strip is provided with a second thickening layer. By arranging the first thickening area, the contact area between the edge coating belt and the first metal spraying layer is increased, and the conductivity of the edge metal coating belt is improved. And by arranging the second thickening area, the conductivity of the middle metal coating belt is improved. Therefore, the reliability of the capacitor is integrally improved, and the voltage endurance capability of the capacitor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, and particularly relates to a high-frequency micro high-voltage capacitor. Background Art

[0002] For some micro capacitors, they sometimes need to withstand a large voltage. In the actual product application process, existing capacitors are prone to breakdown of the thin film or the electrode plate in a high-frequency and high-voltage environment. When this situation occurs locally in a small area, the capacitance of the capacitor will be reduced. When this situation occurs over a large area, a short-circuit situation will occur. Therefore, how to improve the reliability of the capacitor and avoid high-voltage breakdown is an urgent research topic in the industry. Content of the Utility Model

[0003] The purpose of the utility model is to provide a high-frequency micro high-voltage capacitor to solve one or more technical problems existing in the prior art, and at least provide a beneficial choice or create conditions.

[0004] The solution of the utility model to solve its technical problems is: providing a high-frequency micro high-voltage capacitor, including: a first electrode, a second electrode, and a base film; a first metal sputtered gold layer is arranged on the left edge of the base film, a second metal sputtered gold layer is arranged on the right edge of the base film, the first metal sputtered gold layer is connected to the first electrode, and the second metal sputtered gold layer is connected to the second electrode;

[0005] On the base film, there are provided: a plurality of edge metal plating belts, a plurality of intermediate metal plating belts, and a plurality of non-plated belts; the edge metal plating belts are connected to the first metal gold plating layer or the second metal gold plating layer, and there is a non-plated belt between the edge metal plating belts and the intermediate metal plating belts; there is at least one non-plated belt between the intermediate metal plating belts and the first metal gold plating layer, and there is at least one non-plated belt between the intermediate metal plating belts and the second metal gold plating area; the edge metal plating belts have a first thickening layer, and the intermediate metal plating belts have a second thickening layer.

[0006] Further, the first electrode is a copper material component.

[0007] Further, the second electrode is a copper material component.

[0008] Further, there is one edge metal plating belt, one intermediate metal plating belt, and two non-plated belts arranged on the base film.

[0009] Further, the thickness of the first thickening layer is between 1 times and 2 times the metal plating thickness of the edge metal plating belt.

[0010] Further, the thickness of the second thickened layer is the metal plating thickness of the intermediate metal plating band between 1 times and 2 times.

[0011] Further, the base material of the base film is a polypropylene material component.

[0012] Further, the difference between the effective contact area of the edge metal plating band and the effective contact area of the intermediate metal plating band is 0% to 5%.

[0013] Further, the metal plating of the edge metal plating band is an aluminum material plating.

[0014] Further, the metal plating of the intermediate metal plating band is an aluminum material plating.

[0015] The beneficial effects of the present utility model are as follows: By setting the first thickened area, the strength of the edge metal plating band is improved, the contact area between the edge plating band and the first metal spraying layer is increased, and the conductivity of the edge metal plating band is enhanced. By setting the second thickened area, the strength of the intermediate metal plating band is improved, and the conductivity of the intermediate metal plating band is enhanced. Thus, the reliability of the capacitor is overall improved, and the voltage resistance of the capacitor is increased. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly describe the drawings required for the description of the embodiments. Obviously, the described drawings are only a part of the embodiments of the present utility model, rather than all the embodiments. Without creative efforts, those skilled in the art can also obtain other design solutions and drawings based on these drawings.

[0017] Figure 1 is a schematic structural diagram of the cross-sectional structure of a high-frequency micro high-voltage capacitor;

[0018] Figure 2 is a schematic three-dimensional structural diagram of a high-frequency micro high-voltage capacitor;

[0019] Figure 3 is a schematic structural diagram of a layer of base film. Detailed Embodiments

[0020] In order to make the objectives, technical solutions and advantages of the present application more clear, the following further details the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application.

[0021] It should be noted that although the functional modules are divided in the system schematic diagram and the logical sequence is shown in the flowchart, in some cases, the steps shown or described can be executed in a different module division in the system or a different order in the flowchart. Terms such as "first" and "second" in the description, claims, and the above-mentioned drawings are used to distinguish similar objects and do not necessarily describe a specific order or sequence.

[0022] Reference Figure 1 、 Figure 2 and Figure 3 . Among them, Figure 1 is a schematic structural diagram of the cross-section of a high-frequency micro high-voltage capacitor; Figure 2 is a three-dimensional structural schematic diagram of a high-frequency micro high-voltage capacitor; Figure 3 is a schematic structural diagram of a single-layer base film.

[0023] This high-frequency micro high-voltage capacitor mainly provides a reasonable structure so that the capacitor has reliable compressive resistance and improves the reliability of the product.

[0024] To achieve this technical goal, the present application provides a high-frequency micro high-voltage capacitor, including: a first electrode 101, a second electrode 102, and a base film 200.

[0025] Among them, the first electrode 101 and the second electrode 102 serve as the plates of the capacitor, which play the role of connecting the outside and the base film 200.

[0026] A first metal sputtered gold layer 110 is provided on the left edge of the base film 200, and a second metal sputtered gold layer 120 is provided on the right edge of the base film 200.

[0027] The first metal sputtered gold layer 110 is connected to the first electrode 101, and the second metal sputtered gold layer 120 is connected to the second electrode 102.

[0028] On the base film 200, there are provided: a plurality of edge metal plating bands, a plurality of intermediate metal plating bands, and a plurality of non-plated bands; the edge metal plating bands are connected to the first metal gold plating layer or the second metal gold plating layer, and there are non-plated bands between the edge metal plating bands and the intermediate metal plating bands; there is at least one non-plated band between the intermediate metal plating bands and the first metal gold plating area, and there is at least one non-plated band between the intermediate metal plating bands and the second metal gold plating area; the edge metal plating bands have a first thickened layer, and the intermediate metal plating bands have a second thickened layer.

[0029] In the actual production process, two layers of base films 200 are used to form a capacitor core by shaft winding. Reference Figure 1 , Figure 1It is a structural schematic diagram of the cross-sectional structure of a high-frequency micro high-voltage capacitor.

[0030] In Figure 1 it, on the left side of the base film 200 is the first metal sputtered gold layer 110, and on the right side of the base film 200 is the second metal sputtered gold layer 120.

[0031] The base film 200 is provided with a first edge metal plating strip 210, a first middle metal plating strip 230, a first non-plated strip 220 and a second non-plated strip 240. Among them, one end of the first edge metal plating strip 210 is connected to the first metal sputtered gold layer 110. The other end of the first edge metal plating strip 210 is connected to one end of the first non-plated strip 220, one end of the first non-plated strip 220 is connected to one end of the first middle metal plating strip 230, the other end of the first middle metal plating strip 230 is connected to one end of the second non-plated strip 240, and the other end of the second non-plated strip 240 is connected to the second metal sputtered gold layer 120.

[0032] The base film 200 can be considered to be composed of at least two capacitors connected in series. The first edge metal plating strip 210 and the middle metal plating strip form one capacitor, and the middle metal plating strip and the second metal sputtered gold layer 120 form another capacitor. Of course, the first metal sputtered gold layer 110 and the second metal sputtered gold layer 120 can also be considered to form one capacitor. This will not be elaborated here in detail. Through the capacitor core formed by such multi-capacitor series connection, a higher withstand voltage can be achieved.

[0033] Of course, during the working process, since the metal plating strips of the capacitor core will carry a relatively large current, therefore, the first edge metal plating strip 210 has a first thickened layer, and the first middle metal plating strip 230 has a second thickened layer. By setting the first thickened layer, the material strength of the first edge metal plating strip 210 is increased, and the conductivity of the first edge metal plating strip 210 is improved. By setting the second thickened layer, the material strength of the first middle metal plating strip 230 is increased, and the conductivity of the first middle metal plating strip 230 is improved.

[0034] The present utility model improves the strength of the edge metal plating strip by setting the first thickened area, increases the contact area between the edge plating strip and the first metal sputtered gold layer 110, and improves the conductivity of the edge metal plating strip. By setting the second thickened area, the strength of the middle metal plating strip is improved, and the conductivity of the middle metal plating strip is improved. Thus, the reliability of the capacitor is overall improved, and the withstand voltage capacity of the capacitor is increased.

[0035] Regarding the material selection of the first electrode 101, in some further specific embodiments, the first electrode 101 is a copper material component. The copper material component has a low resistivity. Setting the first electrode 101 as a copper material component can improve the conductivity of the first electrode 101.

[0036] Regarding the material selection of the second electrode 102, in some further specific embodiments, the second electrode 102 is a copper material component. The copper material component has a low resistivity. Setting the second electrode 102 as a copper material component can improve the conductivity of the second electrode 102.

[0037] Regarding the thickness of the first thickening layer, in some further specific embodiments, the thickness of the first thickening layer is between 1 times and 2 times the metal plating thickness of the edge metal plating band. It should be noted that in this application, the thickness of the first thickening layer being between 1 times and 2 times the metal plating thickness of the edge metal plating band includes: the case where the thickness of the first thickening layer is 1 times the metal plating thickness of the edge metal plating band, and the case where the thickness of the first thickening layer is 2 times the metal plating thickness of the edge metal plating band.

[0038] Regarding the thickness of the second thickening layer, in some further specific embodiments, the thickness of the second thickening layer is between 1 times and 2 times the metal plating thickness of the middle metal plating band. It should be noted that in this application, the thickness of the second thickening layer being between 1 times and 2 times the metal plating thickness of the middle metal plating band includes: the case where the thickness of the second thickening layer is 1 times the metal plating thickness of the middle metal plating band, and the case where the thickness of the second thickening layer is 2 times the metal plating thickness of the middle metal plating band.

[0039] Regarding the base material of the base film 200, in some further specific embodiments, the base material of the base film 200 is a polypropylene material component.

[0040] In some further specific embodiments, the difference between the effective contact area of the edge metal plating band and the effective contact area of the middle metal plating band is 0% to 5%. The metal plating of the edge metal plating band is an aluminum material plating. The metal plating of the middle metal plating band is an aluminum material plating.

[0041] The above has specifically described the preferred embodiments of the present utility model, but the utility model is not limited to the above embodiments. Those skilled in the art can also make various equivalent variations or substitutions without departing from the spirit of the present utility model, and these equivalent variations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A high-frequency miniature high-voltage capacitor, characterized in that: include: A first electrode (101), a second electrode (102) and a base film (200); a first metal spray-coated layer (110) is provided on the left edge of the base film (200), a second metal spray-coated layer (120) is provided on the right edge of the base film (200), the first metal spray-coated layer (110) is connected to the first electrode (101), and the second metal spray-coated layer (120) is connected to the second electrode (102); The base film (200) is provided with: a plurality of edge metal-plated bands, a plurality of intermediate metal-plated bands and a plurality of unplated bands; the edge metal-plated bands are connected to the first metal gold-plated layer or the second metal gold-plated layer, and an unplated band is provided between the edge metal-plated bands and the intermediate metal-plated bands; at least one unplated band is provided between the intermediate metal-plated bands and the first metal gold-plated layer, and at least one unplated band is provided between the intermediate metal-plated bands and the second metal gold-plated area; the edge metal-plated bands have a first thickened layer, and the intermediate metal-plated bands have a second thickened layer.

2. A high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The first electrode (101) is a copper component.

3. A high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The second electrode (102) is a copper component.

4. A high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The base film (200) is provided with: an edge metal-plated band, an intermediate metal-plated band and two unplated bands.

5. The high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The thickness of the first thickened layer is between 1 and 2 times the thickness of the metal coating of the edge metal coating strip.

6. A high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The thickness of the second thickened layer is between 1 and 2 times the thickness of the metal coating of the intermediate metal coating strip.

7. The high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The base material of the base film (200) is a polypropylene material component.

8. The high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The difference between the effective contact area of ​​the edge metal coating strip and the effective contact area of ​​the middle metal coating strip is 0% to 5%.

9. The high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The metal coating of the edge metal coating belt is an aluminum coating.

10. The high-frequency miniature high-voltage capacitor according to claim 1, characterized in that: The metal coating of the intermediate metal coating belt is an aluminum coating.

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